CN113210841A - Laser processing equipment of ceramic substrate for circuit board - Google Patents
Laser processing equipment of ceramic substrate for circuit board Download PDFInfo
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- CN113210841A CN113210841A CN202110627664.0A CN202110627664A CN113210841A CN 113210841 A CN113210841 A CN 113210841A CN 202110627664 A CN202110627664 A CN 202110627664A CN 113210841 A CN113210841 A CN 113210841A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
According to the laser processing equipment for the ceramic substrate for the circuit board, provided by the invention, the two ends of the positioning push rod are respectively abutted against the first forward pushing assembly and the second forward pushing assembly, so that the positioning push rod can be pushed to a preset position of the jig plate stably in one step under the pushing of the positioning cylinder, and redundant steps are omitted. Through setting up the vacuum boss for ceramic substrate can hug closely on the tool board under the effect of atmospheric pressure difference, has avoided because vibrations lead to ceramic substrate to appear offset. Through setting up the equal altitude alignment of first optical fiber assembly and second optical fiber assembly, can ensure that the material loading height and the unloading height of going up unloading subassembly keep unanimous, and then guarantee the stability of going up unloading process. Through setting up height sensor, can accurately detect whether the ceramic substrate of placing at the processing station has the phenomenon of overlapping or slope to in time send out the police dispatch newspaper, remind the staff to clear up the barrier, ensure to process normally going on.
Description
Technical Field
The invention relates to the technical field of ceramic substrate processing, in particular to laser processing equipment of a ceramic substrate for a circuit board.
Background
The ceramic substrate is a composite substrate formed by directly bonding copper foil to the surface of a ceramic substrate at a high temperature. The ceramic substrate has the characteristics of good insulating property, high heat-conducting property, strong current-carrying capacity, high adhesion strength and the like, and various patterns can be etched according to actual requirements. Therefore, the ceramic substrate is widely applied to various industries, including the communication industry, the household appliance industry, the computer industry, the electronic component industry and the like.
Laser processing refers to cutting, welding, surface treatment, punching, or the like of a processing material by utilizing the characteristic of interaction between a laser beam and a substance. The laser processing has the characteristics of high efficiency, good quality, no pollution, high accuracy and the like. Therefore, laser processing is widely applied to industries such as automobiles, electronics, electrical appliances, aviation, metallurgy, mechanical manufacturing and the like.
Since the ceramic substrate is thin and fragile, the ceramic substrate is generally processed by a laser device. However, the laser processing equipment on the market has low automation degree, needs to use more manpower for matching, and reduces the efficiency of laser processing; in addition, laser machining equipment on the market is inaccurate in positioning, and the ceramic substrate is easy to deviate due to vibration in the machining process, so that the laser machining quality is affected.
Disclosure of Invention
Based on the above, the embodiment of the invention provides laser processing equipment for a ceramic substrate for a circuit board, aiming at solving the problems that the laser processing equipment on the market has low automation degree, needs to use more manpower for matching and reduces the laser processing efficiency; in addition, laser machining equipment on the market is inaccurate in positioning, and the ceramic substrate is easy to deviate due to vibration in the machining process, so that the quality of laser machining is affected.
In order to achieve the above object, in one aspect, the embodiments of the present invention provide the following technical solutions:
a laser processing device of a ceramic substrate for a circuit board is used for processing the ceramic substrate and comprises a machine body, a control panel, a positioning mechanism, a feeding and discharging mechanism, an X shaft assembly, a Y shaft assembly, a Z shaft assembly, a visual detector and a laser generator; the machine body comprises a machine base and a machine shell arranged on the machine base; the control panel is arranged on the outer side of the shell; the feeding and discharging mechanism, the X shaft assembly and the Z shaft assembly are all arranged at the top of the base; the Y shaft assembly is arranged on the X shaft assembly; the positioning mechanism is arranged on the Y shaft assembly; the vision detector and the laser generator are adjacently arranged on the Z shaft component;
the X shaft assembly, the Y shaft assembly, the positioning mechanism and the Z shaft assembly are arranged from bottom to top; the feeding and discharging mechanism is arranged on one side of the Y-axis component; the vision detector and the laser generator are both arranged opposite to the positioning mechanism; the positioning mechanism, go up unloading mechanism, X axle subassembly, Y axle subassembly, Z axle subassembly, the vision detector with laser generator all with control panel communication connection.
In the invention, the control panel controls the positioning mechanism, the feeding and discharging mechanism, the X-axis assembly, the Y-axis assembly, the Z-axis assembly, the vision detector and the laser generator to be matched with each other for operation, so as to finish the processing of the ceramic substrate. Firstly, the ceramic substrate to be processed is placed on the positioning mechanism by the feeding and discharging mechanism, and then the positioning mechanism fixes the ceramic substrate to be processed; the positioning mechanism is at an initial position; conveying the ceramic substrate to be processed to a processing station through mutual linkage among the X shaft assembly, the Y shaft assembly and the Z shaft assembly, wherein the ceramic substrate is detected by the vision detector, and the laser generator starts to perform laser processing on the ceramic substrate to be processed; after the machining is finished, the positioning mechanism is conveyed back to the initial station through mutual linkage among the X shaft assembly, the Y shaft assembly and the Z shaft assembly; and finally, the processed ceramic substrate is discharged and temporarily stored by the feeding and discharging mechanism.
Furthermore, the positioning mechanism comprises a positioning base plate, a vacuum boss, a jig plate, a positioning air cylinder assembly, a first forward pushing assembly and a second forward pushing assembly; the positioning substrate is arranged on the Y shaft assembly; the vacuum boss, the positioning air cylinder assembly, the first forward pushing assembly and the second forward pushing assembly are all arranged on the positioning substrate; the jig plate is arranged at the top of the vacuum boss; the first forward pushing assembly and the second forward pushing assembly are respectively arranged at two adjacent sides of the vacuum boss; one end of the first forward pushing assembly is arranged opposite to the first side face of the jig plate, and the other end of the first forward pushing assembly is abutted to the output end of the positioning air cylinder assembly; one end of the second forward pushing assembly is opposite to the second side face of the jig plate, and the other end of the second forward pushing assembly is abutted to the output end of the positioning air cylinder assembly.
Furthermore, the positioning air cylinder assembly comprises an air cylinder fixing plate, a positioning air cylinder, an air cylinder connecting plate, a positioning push rod and an air cylinder protective cover; the cylinder fixing plate is arranged on the positioning substrate; the positioning cylinder is arranged on the cylinder fixing plate; one end of the cylinder connecting plate is connected with the output end of the positioning cylinder, and the other end of the cylinder connecting plate is connected with the positioning push rod; one end of the positioning push rod is vertically abutted against the first forward pushing assembly, and the other end of the positioning push rod is vertically abutted against the second forward pushing assembly; the cylinder protective cover covers the positioning cylinder and then is arranged on the cylinder fixing plate.
Furthermore, the positioning push rod comprises a first connecting part, a second connecting part and a third connecting part which are connected in sequence; an included angle formed between the first connecting part and the second connecting part is equal to an included angle formed between the third connecting part and the second connecting part; the first connecting part is vertically abutted against the first forward pushing assembly; the second connecting part is connected with the cylinder connecting plate; the third connecting part is vertically abutted against the second forward pushing assembly. In the invention, the second connecting part is arranged perpendicular to the movement direction of the positioning cylinder, so that the distance that the first connecting part pushes the first forward pushing assembly is equal to the distance that the third connecting part pushes the second forward pushing assembly under the pushing of the positioning cylinder, the first forward pushing assembly and the second forward pushing assembly can move synchronously, and the ceramic substrate is pushed to a preset position quickly and accurately.
Further, the first forward pushing assembly comprises a first support, a first cylinder, a first pushing block, a first bearing, a first spring, a first clamp spring, a first protection shell and a first sliding pin; (ii) a The first bracket is arranged on the positioning substrate; one end of the first cylinder is connected with the first push block through the first sliding pin, and the other end of the first cylinder sequentially penetrates through the first spring and the first clamp spring; the first bearing is arranged at one end, far away from the first push block, of the first cylinder; the first bearing is arranged tangentially to the side face of the first connecting part; one end of the first spring abuts against one side, close to the first bearing, of the first support, and the other end of the first spring abuts against the first clamp spring; the first protective shell is arranged on the first support after covering the first push block; and a second spring is also arranged between the first cylinder and the first push block.
Furthermore, one end of the first cylinder, which is close to the first pushing block, is provided with a first sliding through hole and a first mounting hole for mounting the first pushing block; one end of the first cylinder, which is far away from the first push block, is provided with a first shaft neck for mounting the first clamp spring, a first step for limiting and a second step for mounting the first bearing;
one end of the first push block, which is close to the first cylinder, is provided with a first connecting hole; the first sliding pin penetrates through the first connecting hole and then is arranged on the first sliding through hole in a sliding mode.
Further, the second forward pushing assembly comprises a second support, a second cylinder, a second pushing block, a second bearing, a third spring, a second clamp spring and a second protective shell; the second bracket is arranged on the positioning substrate; one end of the second cylinder is connected with the second push block, and the other end of the second cylinder sequentially penetrates through the third spring and the second snap spring; the second bearing is arranged at one end of the second cylinder, which is far away from the second push block; the second bearing is arranged tangentially to the side surface of the third connecting part; one end of the third spring abuts against one side, close to the second bearing, of the second support, and the other end of the third spring abuts against the second snap spring; the second protective shell covers the second push block and is arranged on the second support; and a fourth spring is also arranged between the second cylinder and the second push block.
Furthermore, a second sliding through hole and a second mounting hole for mounting the second pushing block are formed in one end, close to the second pushing block, of the second cylinder; a second shaft neck for mounting the second clamp spring, a third step for limiting and a fourth step for mounting the second bearing are arranged at one end, far away from the second push block, of the second cylinder;
one end of the second push block close to the second cylinder is provided with a second connecting hole; the second sliding pin penetrates through the second connecting hole and then is arranged on the second sliding through hole in a sliding mode.
Furthermore, a third through hole and a plurality of positioning columns are arranged at the geometric center of the jig plate; the positioning columns are arranged along two adjacent sides of the third through hole in a right angle mode; the jig plate is also provided with a first guide groove and a second guide groove which are mutually independent; the first guide groove is matched with the first push block; the second guide groove is matched with the second push block.
Further, the vacuum boss comprises a vacuum bracket and a sliding block which is detachably arranged at the bottom of the vacuum bracket; the sliding block is provided with an inner recess; the indent is used for receiving and timely removing waste materials generated in the processing process of the ceramic substrate.
Furthermore, a fourth through hole communicated with the third through hole is formed in the top of the vacuum support; and a fifth through hole connected with the vacuum generating device is formed in the side surface of the vacuum support. The vacuum boss is under vacuum generating device's effect, and the inner chamber forms the vacuum, because outside atmospheric pressure is greater than the inside atmospheric pressure of vacuum boss, under the effect as for of outside atmospheric pressure, ceramic substrate can laminate steadily on the tool board, be favorable to ceramic substrate's further processing.
Further, the feeding and discharging mechanism comprises a convex base plate, a feeding and discharging assembly, a first material rack assembly and a second material rack assembly, wherein the first material rack assembly and the second material rack assembly are arranged at two ends of the convex base plate; the convex base plate is arranged on the top of the base; the feeding and discharging assembly is arranged in the middle of the convex base plate; a material blocking assembly is further arranged on the side face of the first material frame assembly;
the first material frame component comprises a first KK module, a first supporting component, a first frame and a first optical fiber component arranged at the top of the first frame; the first KK module is arranged at one end, far away from the second material rack assembly, of the convex substrate; the output end of the first KK module is connected with the first supporting component; the first frame is arranged at the top of the first KK module;
the second material frame component comprises a second KK module, a second supporting component, a second frame and a second optical fiber component arranged at the top of the second frame; the second KK module is arranged at one end, far away from the first material rack assembly, of the convex substrate; the output end of the second KK module is connected with the second supporting component; the second frame is arranged at the top of the second KK module;
the first optical fiber assembly and the second optical fiber assembly are arranged at the same height.
Furthermore, the feeding and discharging assembly comprises a rotary cylinder, a lifting cylinder, a right-angle plate, a height sensor, a first sucker assembly and a second sucker assembly; the rotary cylinder is arranged in the middle of the convex base plate; the output end of the rotating cylinder is connected with the lifting cylinder; the output end of the lifting cylinder is connected with the right-angle plate; one end of the rectangular plate is connected with the first sucker component, and the other end of the rectangular plate is connected with the second sucker component; the height sensor is arranged at one end of the rectangular plate close to the first sucking disc component.
Further, the first suction nozzle assembly comprises a first suction nozzle bracket and a plurality of first suction nozzles arranged on the first suction nozzle bracket; the first sucker bracket is arranged at one end of the right-angle plate far away from the second sucker component;
the second sucker assembly comprises a second sucker bracket and a plurality of second suction nozzles arranged on the second sucker bracket; the second sucker support is arranged at one end, far away from the first sucker component, of the rectangular plate.
In the invention, the single rotation angle of the rotary cylinder is preset to be 90 degrees so as to match the rotation of the right-angle plate to drive the first sucker component and the second sucker component to carry out feeding and discharging.
When the loading and unloading mechanism is started, the first sucker component is in an initial position (when the first sucker component is positioned right above the first bearing component), and the second sucker component is in the initial position; when the Y-axis assembly conveys the positioning mechanism to the position right below the second sucker assembly, the feeding and discharging assembly starts to work; at the moment, the first sucker component adsorbs an unprocessed ceramic substrate on the first bearing component, the second sucker component adsorbs a processed ceramic substrate on the positioning mechanism, and then the lifting cylinder moves to drive the rectangular plate to ascend; when the lifting cylinder moves to the maximum displacement, the rotating cylinder rotates 90 degrees anticlockwise, and then the lifting cylinder resets; at the moment, the first sucker component places an unprocessed ceramic substrate on a processing station, and the second sucker component places a processed ceramic substrate on the second bearing component; then the height sensor can detect the thickness of the ceramic substrate placed at the processing station, so that the phenomenon of overlapping or oblique placement of the ceramic substrate is prevented, and the normal processing is ensured; when the height sensor detects, the lifting cylinder drives the right-angle plate to rise again, then the rotating cylinder resets, the lifting cylinder resets, and all the parts return to the initial positions.
Further, the first frame comprises a first flat plate, a first upright post, a second upright post and a third upright post; the first flat plate is arranged at the top of the first KK module; the first upright column is arranged on a first corner of the first flat plate; the second upright column is arranged on a second corner of the first flat plate; the third upright column is arranged on a third corner of the first flat plate;
the second frame comprises a second flat plate, a fourth upright post and a fifth upright post; the second flat plate is arranged at the top of the second KK module; the fourth upright post is arranged on the first corner of the second flat plate; the fifth upright post is arranged on a second corner of the second flat plate;
the first upright column, the second upright column, the third upright column, the fourth upright column and the fifth upright column are arranged in equal length.
In the invention, the first upright column, the second upright column and the third upright column are matched to play a limiting role, so that a ceramic substrate can be placed manually, and the first sucking disc component can grab the unprocessed ceramic substrate conveniently; the fourth upright post and the fifth upright post are matched to play a limiting role, so that the second sucker component can conveniently place the processed ceramic substrate; the first stand the second stand the third stand the fourth stand with the fifth stand can adopt the aluminum product stand that has the right angle, further promotes the limiting displacement to ceramic substrate, in order to improve go up the accuracy that unloading subassembly snatched and placed ceramic substrate.
Further, the first optical fiber assembly comprises a first grating and a second grating arranged opposite to the first grating; the first grating is arranged at the top of the first upright post; the second grating is arranged at the top of the second upright post.
In the invention, a first light path is formed between the first grating and the second grating; when the first sucking disc component takes the unprocessed ceramic substrate placed on the first bearing component away, the first light path is communicated, at the moment, the first KK module drives the first bearing component to ascend until the ceramic substrate shields the first light path again, the automatic ascending of the ceramic substrate is realized, and the material taking of the feeding and discharging component is facilitated.
Further, the second optical fiber assembly comprises a third grating and a fourth grating arranged opposite to the third grating; the third grating is arranged at the top of the fourth upright post; the fourth grating is arranged at the top of the fifth upright post.
In the invention, a second light path is formed between the third grating and the fourth grating; when the ceramic substrate that the second sucking disc subassembly will be processed is placed back on the second bearing subassembly, the second light path disconnection, at this moment, second KK module drives second bearing subassembly descends until the second light path is the route once more, makes the second sucking disc subassembly can pile up the ceramic substrate successive layer that the processing is good and temporarily exist on the second bearing subassembly.
Furthermore, the material blocking assembly comprises a material blocking fixing plate, a material blocking bearing and a barrier strip which is detachably arranged on the material blocking fixing plate; the material blocking fixing plate is arranged on the side surface of the third upright post; the material blocking bearing is arranged at one end, far away from the material blocking fixing plate, of the barrier strip. The one end of blend stop is passed through the screw fixation and is in on the material blocking fixed plate, accessible manual regulation the orientation of blend stop to in order to better play spacing effect, prevent the phenomenon that appears off the position when first sucking disc subassembly snatchs ceramic substrate, simultaneously, it also can prevent to keep off material bearing damage or damage appear in the in-process that first sucking disc subassembly snatchs ceramic substrate.
Further, the first bolster assembly includes a first connecting plate and a first bolster plate; one end of the first connecting plate is connected with the output end of the first KK module, and the other end of the first connecting plate penetrates through the first flat plate and then is connected with the first bearing plate.
Further, the second holding assembly comprises a second connecting plate and a second holding plate; one end of the second connecting plate is connected with the output end of the second KK module, and the other end of the second connecting plate penetrates through the second flat plate and then is connected with the second supporting plate.
Further, the Y-axis assembly includes a Y-axis base and a Y-axis moving member; the Y-axis substrate is arranged on the X-axis component; one end of the Y-axis moving part is arranged on the Y-axis base body, and the other end of the Y-axis moving part is connected with the positioning mechanism.
Further, the X-axis assembly comprises an X-axis base body and an X-axis moving part; the X-axis base is arranged at the top of the stand; one end of the X-axis moving component is arranged on the X-axis base body, and the other end of the X-axis moving component is connected with the Y-axis base body.
Further, the Z-axis assembly comprises a Z-axis base body, a Z-axis electric cylinder and a Z-axis connecting plate; the Z-axis base body is arranged at the top of the stand; the Z-axis electric cylinder is arranged on the Z-axis base body; one side of the Z-axis connecting plate is connected with the output end of the Z-axis electric cylinder, and the other end of the Z-axis connecting plate is connected with the laser generator.
In the invention, in order to ensure the accurate positioning and processing of the ceramic substrate, the Y-axis moving part and the X-axis moving part are controlled by linear motors.
According to the laser processing equipment for the ceramic substrate for the circuit board, provided by the invention, the two ends of the positioning push rod are respectively abutted against the first forward pushing assembly and the second forward pushing assembly, so that the positioning push rod can be pushed to a preset position of the jig plate stably in one step under the pushing of the positioning cylinder, and redundant steps are omitted. Through setting up the vacuum boss for ceramic substrate can hug closely on the tool board under the effect of atmospheric pressure difference, has avoided because vibrations lead to ceramic substrate to appear offset. Through setting up the equal altitude alignment of first optical fiber assembly and second optical fiber assembly, can ensure that the material loading height and the unloading height of going up unloading subassembly keep unanimous, and then guarantee the stability of going up unloading process. Through setting up height sensor, can accurately detect whether the ceramic substrate of placing at the processing station has the phenomenon of overlapping or slope to in time send out the police dispatch newspaper, remind the staff to clear up the barrier, ensure to process normally going on. The invention has high automation degree and strong practicability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic perspective view of a laser processing apparatus for a ceramic substrate for a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of FIG. 1 with the housing removed;
FIG. 3 is a schematic perspective view of the positioning mechanism of FIG. 2;
FIG. 4 is a perspective view of the positioning cylinder assembly of FIG. 3;
FIG. 5 is a perspective view of the positioning rod of FIG. 4;
FIG. 6 is an exploded view of the first push assembly of FIG. 3;
FIG. 7 is a perspective view of the first cylinder of FIG. 6;
FIG. 8 is a partial exploded view of FIG. 3;
fig. 9 is a schematic perspective view of the feeding and discharging mechanism in fig. 2;
fig. 10 is a perspective view of the first material holder assembly in fig. 9;
fig. 11 is a perspective view of the second magazine assembly of fig. 9;
FIG. 12 is a perspective view of the loading and unloading assembly shown in FIG. 9;
fig. 13 is a schematic perspective view of fig. 2 with the loading and unloading assembly removed.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, back, top and bottom … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
At present, laser processing equipment on the market has low automation degree, needs to utilize more manpower for matching, and reduces the efficiency of laser processing; in addition, laser machining equipment on the market is inaccurate in positioning, and the ceramic substrate is easy to deviate due to vibration in the machining process, so that the laser machining quality is affected. In order to solve the technical problem, the invention provides a laser processing device of a ceramic substrate for a circuit board.
As shown in fig. 1 to 2, a laser processing apparatus for a ceramic substrate a for a circuit board according to an embodiment of the present invention is used for processing the ceramic substrate a, and includes a machine body 1, a control panel 2, a positioning mechanism 3, a loading and unloading mechanism 4, an X-axis assembly 5, a Y-axis assembly 6, a Z-axis assembly 7, a visual detector 8, and a laser generator 9; the machine body comprises a machine base 11 and a machine shell 12 arranged on the machine base 11; the control panel 2 is arranged at the outer side of the shell 12; the feeding and discharging mechanism 4, the X shaft assembly 5 and the Z shaft assembly 7 are all arranged at the top of the base 11; the Y shaft assembly 6 is arranged on the X shaft assembly 5; the positioning mechanism 3 is arranged on the Y-axis assembly 6; the vision detector 8 and the laser generator 9 are adjacently arranged on the Z-axis component 7;
the X shaft assembly 5, the Y shaft assembly 6, the positioning mechanism 3 and the Z shaft assembly 7 are arranged from bottom to top; the feeding and discharging mechanism 4 is arranged on one side of the Y-axis assembly 6; the vision detector 8 and the laser generator 9 are both arranged opposite to the positioning mechanism 3; the positioning mechanism 3, the feeding and discharging mechanism 4, the X shaft assembly 5, the Y shaft assembly 6, the Z shaft assembly 7, the vision detector 8 and the laser generator 9 are all in communication connection with the control panel 2.
In the embodiment of the application, the control panel 2 controls the positioning mechanism 3, the feeding and discharging mechanism 4, the X shaft assembly 5, the Y shaft assembly 6, the Z shaft assembly 7, the vision detector 8 and the laser generator 9 to be matched with each other for operation, and the processing of the ceramic substrate A is completed. Firstly, the ceramic substrate A to be processed is placed on the positioning mechanism 3 by the feeding and discharging mechanism 4, and then the positioning mechanism 3 fixes the ceramic substrate A to be processed; the positioning mechanism 3 is at the initial position; the X-axis assembly 5, the Y-axis assembly 6 and the Z-axis assembly 7 are mutually linked, a ceramic substrate A to be processed is conveyed to a processing station, the vision detector 8 detects the ceramic substrate A at the moment, and the laser generator 9 starts to perform laser processing on the ceramic substrate A to be processed; after the machining is finished, the positioning mechanism 3 is conveyed back to the initial station through mutual linkage among the X shaft assembly 5, the Y shaft assembly 6 and the Z shaft assembly 7; and finally, the ceramic substrate A after being processed is fed and temporarily stored by the feeding and discharging mechanism 4.
Referring to fig. 3, in the embodiment of the present application, the positioning mechanism 3 includes a positioning base plate 31, a vacuum boss 32, a jig plate 33, a positioning cylinder assembly 34, a first pushing assembly 35, and a second pushing assembly 36; the positioning substrate 31 is arranged on the Y-axis assembly 6; the vacuum boss 32, the positioning cylinder assembly 34, the first forward pushing assembly 35 and the second forward pushing assembly 36 are all arranged on the positioning substrate 31; the jig plate 33 is arranged on the top of the vacuum boss 32; the first forward pushing assembly 35 and the second forward pushing assembly 36 are respectively arranged at two adjacent sides of the vacuum boss 32; one end of the first forward pushing assembly 35 is arranged opposite to the first side surface of the jig plate 33, and the other end of the first forward pushing assembly is arranged against the output end of the positioning air cylinder assembly 34; one end of the second pushing assembly 36 is opposite to the second side of the jig plate 33, and the other end of the second pushing assembly is opposite to the output end of the positioning cylinder assembly 34.
Referring to fig. 4, in the present embodiment, the positioning cylinder assembly 34 includes a cylinder fixing plate 341, a positioning cylinder 342, a cylinder connecting plate 343, a positioning push rod 344, and a cylinder shield 345; the cylinder fixing plate 341 is disposed on the positioning substrate 31; the positioning cylinder 342 is disposed on the cylinder fixing plate 341; one end of the cylinder connecting plate 343 is connected with the output end of the positioning cylinder 342, and the other end is connected with the positioning push rod 344; one end of the positioning push rod 344 vertically abuts against the first forward pushing assembly 35, and the other end vertically abuts against the second forward pushing assembly 36; the cylinder protective cover 345 covers the positioning cylinder 342 and is disposed on the cylinder fixing plate 341.
Referring to fig. 5, in the present embodiment, the positioning push rod 344 includes a first connection portion 3441, a second connection portion 3442, and a third connection portion 3443, which are connected in sequence; an included angle formed between the first connection portion 3441 and the second connection portion 3442 is equal to an included angle formed between the third connection portion 3443 and the second connection portion 3442; the first connecting portion 3441 is vertically abutted against the first forward pushing assembly 35; the second connecting portion 3442 is connected to the cylinder connecting plate 343; the third connecting portion 3443 is vertically abutted against the second pushing assembly 36. In the embodiment of the present application, the second connecting portion 3442 is perpendicular to the moving direction of the positioning cylinder 342, so as to ensure that under the pushing of the positioning cylinder 342, the distance that the first connecting portion 3441 pushes the first forward pushing assembly 35 is equal to the distance that the third connecting portion 3443 pushes the second forward pushing assembly 36, so that the first forward pushing assembly 35 and the second forward pushing assembly 36 can move synchronously, and the ceramic substrate a is pushed to a predetermined position quickly and accurately.
Referring to fig. 6, in the present embodiment, the first pushing assembly 35 includes a first bracket 351, a first cylinder 352, a first pushing block 353, a first bearing 354, a first spring 355, a first clamp spring 356, a first protection case 357, and a first sliding pin 358; the first support 351 is disposed on the positioning substrate 31; one end of the first cylinder 352 is connected to the first pushing block 353 through the first sliding pin 358, and the other end of the first cylinder passes through the first spring 355 and the first snap spring 356 in sequence; the first bearing 354 is arranged at one end of the first cylinder 352 far away from the first pushing block 353; the first bearing 354 is arranged tangentially to the side surface of the first connection portion 3441; one end of the first spring 355 abuts against one side of the first bracket 351 close to the first bearing 354, and the other end abuts against the first clamp spring 356; the first protection case 357 is disposed on the first support 351 after covering the first pushing block 353; a second spring 359 is disposed between the first cylinder 352 and the first pushing block 353.
Referring to fig. 7, in the embodiment of the present application, one end of the first cylinder 352 near the first pushing block 353 is provided with a first sliding through hole 3521 and a first mounting hole 3522 for mounting the first pushing block 353; one end of the first cylinder 352, which is far away from the first pushing block 353, is provided with a first journal 3523 for mounting the first clamp spring 353, a first step 3524 for limiting, and a second step 3525 for mounting the first bearing 354;
one end of the first pushing block 353 close to the first cylinder 352 is provided with a first connecting hole 3531; the first sliding pin 358 is slidably disposed on the first sliding through hole 3521 after passing through the first connection hole 3531.
In the embodiment of the present application, the first step 3524 serves as a limit, so as to prevent the positioning rod 344 from jumping in the vertical direction, and ensure the stability of the forward pushing of the first cylinder 352.
In this embodiment of the application, the second forward pushing assembly 36 and the first forward pushing assembly 35 have the same structure, and the second forward pushing assembly 36 includes a second bracket, a second cylinder, a second pushing block, a second bearing, a third spring, a second snap spring, a second protective shell, and a second sliding pin; the second bracket is arranged on the positioning substrate; one end of the second cylinder is connected with the second pushing block through the second sliding pin, and the other end of the second cylinder sequentially penetrates through the third spring and the second clamp spring; the second bearing is arranged at one end of the second cylinder, which is far away from the second push block; the second bearing is arranged tangentially to the side surface of the third connecting part; one end of the third spring abuts against one side, close to the second bearing, of the second support, and the other end of the third spring abuts against the second snap spring; the second protective shell covers the second push block and is arranged on the second support; and a fourth spring is also arranged between the second cylinder and the second push block.
Furthermore, a second sliding through hole and a second mounting hole for mounting the second pushing block are formed in one end, close to the second pushing block, of the second cylinder; a second shaft neck for mounting the second clamp spring, a third step for limiting and a fourth step for mounting the second bearing are arranged at one end, far away from the second push block, of the second cylinder;
one end of the second push block close to the second cylinder is provided with a second connecting hole; the second sliding pin penetrates through the second connecting hole and then is arranged on the second sliding through hole in a sliding mode.
In this application embodiment, the third step plays spacing effect, avoids the jump of location push rod on the vertical direction has guaranteed the stability that first cylinder pushed forward.
Referring to fig. 8, in the embodiment of the present application, a third through hole 331 and a plurality of positioning pillars 332 are disposed at the geometric center of the jig plate 33; the positioning columns 332 are arranged along two adjacent sides of the third through hole 331 at right angles; the jig plate 33 is further provided with a first guide groove 334 and a second guide groove 335 which are independent of each other; the first guide groove 334 is matched with the first pushing block 353; the second guide groove 335 is matched with the second push block.
The vacuum boss 32 comprises a vacuum support 321 and a sliding block 322 which is detachably arranged at the bottom of the vacuum support 321; the sliding block 322 is provided with an indent 3221; the recess 3221 is used for receiving and timely removing waste materials generated during the processing of the ceramic substrate a.
The top of the vacuum bracket 321 is provided with a fourth through hole 3211 communicated with the third through hole 331; the side surface of the vacuum bracket 321 is provided with a fifth through hole 3212 connected with a vacuum generating device. Vacuum boss 321 is under vacuum generating device's effect, and the inner chamber forms the vacuum, because outside atmospheric pressure is greater than the inside atmospheric pressure of vacuum boss, under the effect as for of outside atmospheric pressure, ceramic substrate A can laminate firmly on tool board 33 is favorable to ceramic substrate A's further processing.
Referring to fig. 9 to 11, in the present embodiment, the loading and unloading mechanism 4 includes a male substrate 41, a loading and unloading assembly 42, and a first rack assembly 43 and a second rack assembly 44 disposed at two ends of the male substrate 41; the male base plate 41 is disposed on top of the housing 11; the feeding and discharging assembly 42 is arranged in the middle of the convex substrate 41; a material blocking assembly 45 is further arranged on the side surface of the first material frame assembly 43;
the first rack assembly 43 comprises a first KK module 431, a first holding assembly 432, a first frame 433, and a first fiber assembly 434 disposed on top of the first frame 433; the first KK module 431 is disposed at an end of the male substrate 41 away from the second carriage assembly 44; the output end of the first KK module 431 is connected to the first supporting member 432; the first frame 433 is disposed on the top of the first KK module 431;
the second rack assembly 44 includes a second KK module 441, a second holder assembly 442, a second frame 443, and a second fiber assembly 444 disposed on top of the second frame 443; the second KK module 441 is disposed at an end of the male substrate 41 away from the first carriage assembly 43; the output end of the second KK module 431 is connected to the second holding member 442; the second frame 443 is disposed on the top of the second KK module 441;
the first fiber optic assembly 434 is disposed at the same height as the second fiber optic assembly 444.
Referring to fig. 12, in the embodiment of the present application, the loading and unloading assembly 42 includes a rotary cylinder 421, a lifting cylinder 422, a square plate 423, a height sensor 424, a first suction cup assembly 425, and a second suction cup assembly 426; the rotary cylinder 421 is arranged in the middle of the convex substrate 41; the output end of the rotating cylinder 421 is connected with the lifting cylinder 422; the output end of the lifting cylinder 422 is connected with the right-angle plate 423; one end of the square 423 is connected to the first chuck assembly 425, and the other end is connected to the second chuck assembly 426; the height sensor 424 is disposed at an end of the square plate 423 adjacent to the first sucker assembly 425.
The first suction cup assembly 425 comprises a first suction cup holder 4251, and a plurality of first suction nozzles 4252 provided on the first suction cup holder 4251; the first sucker bracket 4251 is arranged at one end of the right angle plate 423 far away from the second sucker component 426;
the second suction cup assembly 426 comprises a second suction cup support 4261, and a plurality of second suction nozzles 4262 provided on the second suction cup support 4261; the second suction cup support 4261 is disposed at an end of the square plate 423 remote from the first suction cup assembly 425.
In the embodiment of the present application, a single rotation angle of the rotary cylinder 421 is preset to be 90 degrees, so as to cooperate with the square plate 423 to rotate to drive the first suction cup assembly 425 and the second suction cup assembly 426 to perform loading and unloading.
When the first chuck assembly 425 is in the initial position (when the first chuck assembly 425 is directly above the first holding assembly 432) before the loading and unloading mechanism 4 is turned on, the second chuck assembly 426 is in the initial position; when the Y-axis assembly 6 conveys the positioning mechanism 3 to the position right below the second sucker assembly 426, the loading and unloading assembly 42 starts to work; at this time, the first chuck assembly 425 sucks the unprocessed ceramic substrate a on the first supporting assembly 432, the second chuck assembly 426 sucks the processed ceramic substrate a on the positioning mechanism 3, and then the lifting cylinder 422 moves to drive the rectangular plate 423 to ascend; when the lifting cylinder 422 moves to the maximum displacement, the rotating cylinder 421 rotates 90 degrees counterclockwise, and then the lifting cylinder 422 resets; at this time, the first chuck assembly 425 places the unprocessed ceramic substrate a on the processing station, and the second chuck assembly 426 places the processed ceramic substrate a on the second holding assembly 442; then, the height sensor 424 detects the thickness of the ceramic substrate a placed at the processing station, so as to prevent the ceramic substrate a from overlapping or inclining, thereby ensuring the normal processing; after the height sensor 424 detects, the lifting cylinder 422 drives the right-angle plate 423 to ascend again, then the rotating cylinder 421 resets, the lifting cylinder 422 resets, and all the components return to the initial position.
Referring again to fig. 10 to 11, in the present embodiment, the first frame 433 includes a first plate 4331, a first upright 4332, a second upright 4333 and a third upright 4334; the first flat plate 4331 is disposed on the top of the first KK module 431; the first upright column 4332 is disposed on a first corner of the first flat plate 4331; the second upright 4333 is disposed on a second corner of the first plate 4331; the third upright column 4334 is disposed on a third corner of the first plate 4331;
the second frame 443 includes a second plate 4431, a fourth column 4432, and a fifth column 4433; the second plate 4431 is disposed on the top of the second KK module 441; the fourth pillar 4432 is disposed on a first corner of the second plate 4431; the fifth pillar 4433 is disposed on a second corner of the second plate 4431;
the first upright column 4331, the second upright column 4332, the third upright column 4333, the fourth upright column 4432 and the fifth upright column 4433 are arranged with equal length.
In the embodiment of the present application, the first upright column 4331, the second upright column 4332 and the third upright column 4333 cooperate to limit the position of the ceramic substrate a, so that the ceramic substrate a can be easily placed by a human and the first chuck assembly 425 can grasp the unprocessed ceramic substrate a; the fourth upright 4432 and the fifth upright 4433 are matched to limit the position of the ceramic substrate A, so that the second suction cup assembly 426 can conveniently place the processed ceramic substrate A; the first upright column 4331, the second upright column 4332, the third upright column 4333, the fourth upright column 4432 and the fifth upright column 4433 can adopt aluminum upright columns with right angles, so that the limiting effect on the ceramic substrate A is further improved, and the accuracy of grabbing and placing the ceramic substrate A by the feeding and discharging assembly 42 is improved.
The first optical fiber assembly 434 includes a first grating 4341, and a second grating 4342 disposed opposite the first grating 4341; the first grating 4341 is disposed on top of the first upright 4331; the second grating 4342 is disposed on top of the second upright 4332.
In the embodiment of the present application, a first optical path is formed between the first grating 4341 and the second grating 4342; when the first chuck assembly 425 takes away the unprocessed ceramic substrate a placed on the first supporting assembly 432, the first light path is accessed, and at this time, the first KK module 431 drives the first supporting assembly 432 to ascend until the ceramic substrate a shields the first light path again, so that the ceramic substrate a automatically ascends, and the feeding and discharging assembly 42 is convenient to take the unprocessed ceramic substrate a.
The second fiber assembly 444 includes a third grating 4441, and a fourth grating 4442 disposed opposite the third grating 4441; the third grating 4441 is arranged on the top of the fourth pillar 4432; the fourth grating 4442 is disposed on top of the fifth pillar 4433.
In the embodiment of the present application, a second optical path is formed between the third grating 4441 and the fourth grating 4442; after the second chuck assembly 426 places the processed ceramic substrate a on the second holding assembly 442, the second light path is broken, and at this time, the second KK module 441 drives the second holding assembly 442 to descend until the second light path is re-opened, so that the second chuck assembly 426 can stack the processed ceramic substrate a layer by layer and temporarily store the ceramic substrate a on the second holding assembly 442.
Referring to fig. 10 again, in the embodiment of the present application, the striker assembly 45 includes a striker fixing plate 451, a striker bearing 452, and a bar 453 detachably disposed on the striker fixing plate 451; the material blocking fixing plate 451 is arranged on the side surface of the third upright column 4333; the material blocking shaft 452 is arranged at one end of the blocking strip 453 far away from the material blocking fixing plate 451. One end of the barrier strip 453 is fixed on the material blocking fixing plate 451 through a screw, and the orientation of the barrier strip 453 can be manually adjusted, so that the effect of limiting is better achieved, the phenomenon of running when the first chuck assembly 425 grabs the ceramic substrate a is prevented, and meanwhile, the material blocking bearing 452 can also prevent the first chuck assembly 425 from being damaged or damaged in the process of grabbing the ceramic substrate a.
Referring again to fig. 10-11, in the present embodiment, the first supporting member 432 includes a first connecting plate 4321 and a first supporting plate 4322; one end of the first connecting plate 4321 is connected to the output end of the first KK module 431, and the other end of the first connecting plate 4321 passes through the first plate 4331 and then is connected to the first support plate 4322.
The second holding member 442 includes a second connecting plate 4421 and a second holding plate 4422; one end of the second connecting plate 4421 is connected to the output end of the second KK module 441, and the other end of the second connecting plate passes through the second plate 4431 and is connected to the second supporting plate 4322.
Referring to fig. 13, in the present embodiment, the Y-axis assembly 6 includes a Y-axis base 61 and a Y-axis moving member 62; the Y-axis base body 61 is arranged on the X-axis assembly 5; one end of the Y-axis moving member 62 is provided on the Y-axis base 61, and the other end is connected to the positioning mechanism 3.
The X-axis assembly 5 comprises an X-axis base body 51 and an X-axis moving part 52; the X-axis base 51 is arranged at the top of the stand 11; one end of the X-axis moving member 52 is disposed on the X-axis base 51, and the other end is connected to the Y-axis base 61.
The Z-axis assembly 7 comprises a Z-axis base body 71, a Z-axis electric cylinder 72 and a Z-axis connecting plate 73; the Z-axis base 71 is arranged at the top of the stand 11; the Z-axis electric cylinder 72 is provided on the Z-axis base 71; one side of the Z-axis connecting plate 73 is connected with the output end of the Z-axis electric cylinder 72, and the other end of the Z-axis connecting plate is connected with the laser generator 9.
In the embodiment of the present application, in order to ensure accurate positioning and processing of the ceramic substrate a, the Y-axis moving unit 62 and the X-axis moving unit 52 are controlled by linear motors.
In the embodiment of the application, X axle subassembly 5Y axle subassembly 6 with all be provided with on the Z axle subassembly 7 and be used for dirt-proof gum cover, can avoid the dust or the piece shadow that produce in the course of working to get into the inside of each subassembly effectively to guarantee the normal clear of processing.
In the embodiment of the present application, the vision detector 8 may be matched with the laser generator 9 to implement fixed-point processing on the ceramic substrate a; meanwhile, when the machine is stopped due to a fault, the vision detector 8 can be used for repositioning the machining position before the fault after the laser machining equipment is started again, so that repeated machining or machining missing is avoided.
In the embodiment of the present application, a power supply, an air source, a vacuum generating device, and the like are installed inside the base 11.
According to the laser processing equipment for the ceramic substrate A for the circuit board, provided by the invention, the two ends of the positioning push rod 44 are respectively abutted against the first forward pushing assembly 35 and the second forward pushing assembly 36, so that the positioning push rod 44 can be pushed to a preset position of the jig plate 33 stably in one step by the pushing of the positioning cylinder 342, and redundant steps are omitted. Through setting up vacuum boss 32 for ceramic substrate A can hug closely on tool board 33 under the effect of atmospheric pressure difference, has avoided because vibrations lead to ceramic substrate A to appear offset. By arranging the first optical fiber assembly 434 and the second optical fiber assembly 444 to be aligned in equal height, the material loading height and the material unloading height of the material loading and unloading assembly 42 can be kept consistent, and the stability of the material loading and unloading process can be further ensured. Through setting up height sensor 424, can accurately detect and place whether there is the phenomenon of overlapping or slope at the ceramic substrate A of processing station to in time send out the police dispatch newspaper, remind the staff to clear up the barrier, ensure to process normally to go on. The invention has high automation degree and strong practicability.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
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| CN202110627664.0A CN113210841B (en) | 2021-06-05 | 2021-06-05 | Laser processing equipment for ceramic substrates for circuit boards |
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| CN202110627664.0A CN113210841B (en) | 2021-06-05 | 2021-06-05 | Laser processing equipment for ceramic substrates for circuit boards |
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| CN113210841B CN113210841B (en) | 2025-03-21 |
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Cited By (1)
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| CN115156820A (en) * | 2022-07-30 | 2022-10-11 | 武汉莱常富商贸有限公司 | Aluminum alloy door frame positioning and mounting system |
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| CN113210841B (en) | 2025-03-21 |
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