CN113204182A - Visual auxiliary alignment device and method for LDI automatic connection - Google Patents
Visual auxiliary alignment device and method for LDI automatic connection Download PDFInfo
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- CN113204182A CN113204182A CN202110543957.0A CN202110543957A CN113204182A CN 113204182 A CN113204182 A CN 113204182A CN 202110543957 A CN202110543957 A CN 202110543957A CN 113204182 A CN113204182 A CN 113204182A
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- 230000033001 locomotion Effects 0.000 abstract description 9
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- 230000008054 signal transmission Effects 0.000 abstract description 3
- 230000003116 impacting effect Effects 0.000 abstract description 2
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 16
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- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 3
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- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
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Abstract
The invention provides a visual auxiliary alignment device and a visual auxiliary alignment method for LDI automatic connection, which comprise a conveying platform, an exposure platform, a mechanical arm and a positioning system for positioning a PCB on the conveying platform, wherein the positioning system is connected to a control module and used for sending a positioning result to the control module, and the control module is connected to the exposure platform so as to enable the exposure platform to move to a corresponding position suitable for the position of the PCB. The scheme breaks through the traditional clapper positioning thinking, replaces mechanical motion with wireless electric pulse signal transmission and data processing, breaks through the speed limit of the mechanical motion, can greatly shorten the time required by clapper alignment, omits the process of impacting clappers, can improve the equipment stability, and ensures the yield of PCB boards to the maximum extent.
Description
Technical Field
The invention belongs to the technical field of exposure connection, and particularly relates to a visual auxiliary alignment device and method for LDI automatic connection.
Background
Automation is a trend in production plants, for example, automatic inline loading and unloading is currently adopted for LDI exposure. The automation has the advantages that on one hand, the labor is saved, and on the other hand, the productivity is greatly improved.
However, automation is not a perpetual task and needs to be improved over and over again to continuously improve the performance, work efficiency, productivity and the like of the automation equipment. For the LDI automatic wiring equipment, the stability and the productivity of the equipment directly determine the benefit of a board factory, the higher the stability is, the higher the productivity is, the higher the board yield of the equipment of the automatic equipment is, and the better the yield is.
At present, the automatic LDI connecting equipment comprises a conveying platform, an exposure platform and a mechanical arm, wherein the mechanical arm grabs a board conveyed by the conveying platform to the exposure platform, the exposure platform moves to a fixed position in advance to wait for the board, and the exposure platform receives the board and then drives the board to move to an exposure chamber for exposure. As shown in fig. 1 and 2, the conveying platform is provided with a Y-direction limiting plate 7 and an X-direction clapping plate structure 8, the plate is conveyed to one end close to the exposure platform through a roller on the conveying platform and is limited by the Y-direction limiting plate 7, then the X-direction clapping plate structure 8 carries out clapping plate alignment in the X-axis direction on the plate to adapt to the position of the exposure platform, and after the alignment is finished, the plate is grabbed onto the exposure platform by a manipulator. In the automatic working process in the prior art, two steps of processes are required, namely, the PCB is firstly conveyed to the position of the Y-direction limiting plate 7, the Y-direction limiting plate 7 is used for limiting, then the X-direction clapping structure 8 is used for clapping, one clapping plate stop lever 81 of the X-direction clapping structure needs to be moved in the clapping process of the X-direction clapping structure 8, the PCB 4 is pushed by the clapping plate stop lever 81 to be moved to be clapped by the other fixed clapping plate stop lever 81, and the alignment is completed. In this process, since it takes a certain time for the flap lever 81 to move, it takes a long time for alignment, and one side of the board may contact the Y-direction stopper plate 7, causing a certain friction to the board in the process of moving the board, which lowers the board yield. In addition, because the two clapper blocking rods 81 of the X-direction clapper structure 8 directly impact the edge of the clapper during the clapper process, the PCB is damaged, and the problem of chip falling is easily caused, which causes defects.
At present, when many manufacturers start to solve the problems of efficiency and speed caused by the clappers, starting from the structural movement stroke, the shorter the time from the beginning of movement of a moving clapper baffle rod to the completion of alignment, the shorter the time consumed by the clappers, and the main mode of improving the efficiency to a certain extent and shortening the duration by compressing the duration is to accelerate the movement speed; but the boost is quite limited. On the one hand, this mechanical stroke is still present, no matter how fast the speed is, and it is impossible to shorten this duration to a great extent if the mechanical stroke is present; secondly, the shorter the duration, the greater the speed of the clapper lever, the greater the stability and the risk of collision, and the greater the damage to the board. That is, in the prior art, when solving the speed and efficiency problems caused by the flap, the stability of the device needs to be sacrificed, and because the stability problem of the device needs to be considered, the speed of the flap lever cannot be greatly increased, so the efficiency improvement is very limited.
Disclosure of Invention
The invention aims to solve the problems and provides a visual auxiliary alignment device and a method for LDI automatic connection.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a visual auxiliary aligning device of LDI automatic connection, includes conveying platform, exposure platform and manipulator to and be used for carrying out the positioning system who fixes a position to the PCB board on the conveying platform, positioning system connect and be used for sending the control module with the location result in control module, control module connect in exposure platform so that exposure platform moves to the corresponding position who is adapted to PCB board position.
In the visual auxiliary alignment device for the LDI automatic connection, the control module is connected to the manipulator so that the manipulator can be adjusted to a target position suitable for the position of the PCB before grabbing the PCB, that is, adjusted to a position capable of grabbing the PCB, and is suitable for a manipulator which cannot grab the PCB at any position, for example, a manipulator with only one set or a small number of suckers; or, the control module connect in the manipulator be in order to control the corresponding sucking disc of manipulator in the in-process control of snatching the PCB board effective, be applicable to the scene that the manipulator is equipped with the multiunit sucking disc, can realize snatching the PCB board of any position through adjusting different sucking discs.
In the visual auxiliary alignment device for LDI automatic connection, the positioning system is a visual positioning system, the visual positioning system comprises a visual information acquisition module and a visual information processing module connected with the visual information acquisition module, and the visual information processing module is connected with the control module.
In the visual auxiliary alignment device for LDI automatic connection, the visual information acquisition module comprises an alignment camera arranged above/below/side/rear/front/oblique rear/oblique upper/oblique lower/oblique front of the conveying platform, and the alignment camera is used for acquiring CCD image data and sending the CCD image data to the visual information processing module.
In the visual auxiliary alignment device for LDI automatic wiring, the control module is embedded into an automatic controller of corresponding LDI automatic wiring equipment;
or, the visual information processing module and the control module are simultaneously embedded into the automatic controller of the corresponding LDI automatic wiring device.
In the visual auxiliary alignment device for LDI automatic connection, the conveying platform is provided with a Y-direction limiting plate.
A vision-aided alignment method of LDI automatic connection of a vision-aided alignment device based on the LDI automatic connection comprises the following steps:
s1, acquiring position information of a PCB on a conveying platform;
s2, generating an exposure platform control command according to the position information while the manipulator is controlled to capture the PCB, and sending the exposure platform control command to an exposure platform to enable the exposure platform to move to a corresponding position;
and S3, controlling the manipulator to convey the grabbed PCB to the exposure platform at the corresponding position.
In the above-mentioned visual auxiliary alignment method for LDI automatic wiring, in step S1, the position information of the PCB board is obtained by:
s11, collecting CCD image data and sending the CCD image data to a visual information processing module;
s12, the visual information processing module analyzes and processes the CCD image data to obtain the position information of the PCB and sends the position information to the control module;
and in step S2, the control module generates the exposure stage control command according to the position information.
In the above-mentioned visual auxiliary alignment method for LDI automatic wiring, in step S2, the control module is embedded into the automatic controller of the LDI automatic wiring device, and the robot and the exposure stage are controlled by the automatic controller.
In the above visual auxiliary alignment method for LDI automatic connection, in step S2, the manipulator is adjusted according to the position information and then the PCB is grabbed;
or controlling the manipulator to grab the PCB and controlling the corresponding sucker of the manipulator to be effective according to the position information.
The invention has the advantages that: the scheme breaks through the traditional thought of clapper alignment, replaces mechanical motion with wireless pulse signal transmission and data processing, breaks through the speed limit of the mechanical motion, can greatly shorten the time required by clapper alignment, omits the process of impacting clappers, can improve the stability of equipment, and ensures the yield of PCB boards to the maximum extent.
Drawings
FIG. 1 is a schematic diagram of an LDI automatic connection alignment device according to the prior art;
FIG. 2 is a schematic diagram of an LDI automatic connection device on a PCB conveying platform in the prior art;
FIG. 3 is a schematic top view of an LDI automatic wiring device according to an embodiment of the present invention;
FIG. 4 is a block diagram of a control structure of a visual auxiliary alignment apparatus for LDI automatic connection according to an embodiment of the present invention;
fig. 5 is a block diagram of a control module and a visual information processing module embedded in an automatic controller in a visual auxiliary alignment apparatus for LDI automatic connection according to an embodiment of the present invention;
FIG. 6 is a diagram illustrating a working process of a positioning system in an LDI automatic connection vision-aided alignment apparatus according to an embodiment of the present invention;
FIG. 7 is a flowchart illustrating a visual alignment apparatus for LDI automatic connection according to an embodiment of the present invention;
FIG. 8 is a flowchart illustrating the operation of the LDI automatic connection vision-aided alignment apparatus according to the second embodiment of the present invention;
FIG. 9 is a block diagram of a control structure of a visual auxiliary alignment apparatus for LDI automatic connection according to a second embodiment of the present invention;
fig. 10 is a flowchart of the operation of the visual auxiliary alignment apparatus for LDI automatic connection according to the third embodiment of the present invention.
Description of the drawings: a conveying platform 1; a roller 11; an exposure stage 2; a manipulator 3; a PCB board 4; a positioning system 5; a visual information acquisition module 51; a visual information processing module 52; a control module 6; an alignment camera 53; a Y-direction limiting plate 7; an X-direction clapper structure 8; a paddle catch lever 81; and an automatic controller 9.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Currently, the capacity limit in LDI automatic wiring equipment is 10.1 sec/plane, and the capacity per minute is 5.9 sheets/minute. This scheme is through providing a neotype aligning device, will originally be improved by the mode that the PCB board removed the adaptation exposure platform for removing the position that adapts to the PCB board by the exposure platform, breaks traditional clapping board counterpoint thinking, can improve equipment stability, shortens the time consumption of clapping the board process when improving the PCB board yield, improves the productivity of automation equipment greatly, makes automation equipment have qualitative leap on the productivity. The present solution is described in detail below with reference to the accompanying drawings.
Example one
As shown in fig. 3 and 4, the present embodiment provides a visual auxiliary alignment device for LDI automatic connection, the device includes a conveying platform 1, an exposure platform 2 and a manipulator 3, and a positioning system 5 for positioning a PCB 4 on the conveying platform 1, the conveying platform 1 is provided with a Y-direction limiting plate 7, the positioning system 5 is connected to a control module 6 for sending a positioning result to the control module 6, the control module 6 is connected to the exposure platform 2 so that the exposure platform 2 moves to a corresponding position according to the positioning result to adapt to a current position of the PCB 4, and an X-direction shooting of the PCB 4 is not required. The positioning system 5 is a visual positioning system, and the visual positioning system includes a visual information obtaining module 51 and a visual information processing module 52 connected to the visual information obtaining module 51, and the visual information processing module 52 is connected to the control module 6. The visual information acquisition module 51 includes an alignment camera 53 installed above/below/side/rear/front/oblique rear/oblique above/oblique below/oblique front of the conveying platform 1, and the alignment camera 53 is configured to collect CCD image data and send the CCD image data to the visual information processing module 52. The installation position of the alignment camera 53 is not absolutely limited, and the DDC image data acquired by the alignment camera only needs to be satisfied, so that the vision positioning system can analyze and determine the position of the PCB.
As shown in fig. 5, the control module 6 according to this embodiment may be embedded in the automatic controller 9 of the LDI automatic device itself, and the visual information processing module 52 may also be embedded in the automatic controller 9 of the LDI automatic connection device itself, so that when the conventional LDI automatic connection device is improved to this embodiment, only the alignment camera 53 needs to be installed at a suitable position, then the alignment camera 53 is connected to the automatic controller 9, and the program of the LDI automatic connection device is updated to embed the visual information processing module 52 and the control module 6 into the automatic controller 9, which is very easy and convenient to upgrade. At this time, as shown in fig. 6, when the exposure apparatus is put into use, the CCD image data is acquired by the alignment camera 53 and sent to the automatic controller 9, and the control module 6 controls the exposure stage 2 based on the position information output from the visual information processing module 52 in the automatic controller 9 after a series of analysis processes are performed on the CCD image data.
Of course, if necessary, a person skilled in the art may also install the visual information processing module 52 or the control module 6 outside the automatic controller 9 of the LDI automatic wiring apparatus, and then connect the visual information processing module 52 or the control module 6 to the automatic controller 9 to join the control system of the LDI automatic wiring apparatus.
As shown in fig. 7, taking the example that the control module 6 is embedded in the automatic controller 9 of the LDI automatic device itself, the visual auxiliary alignment method for LDI automatic connection of the visual auxiliary alignment apparatus for LDI automatic connection includes the following steps:
s1, an automatic controller 9 controls a conveying platform 1 to convey a PCB 4 to one end close to an exposure platform 2, and the PCB is limited by a Y-direction limiting plate 7; the time taken and the implementation of this part are the same as in conventional devices. After the step, the traditional equipment carries out plate-clapping alignment on the PCB 4 through the X-direction plate-clapping structure 8, and the scheme carries out alignment through the subsequent steps;
s2, CCD image data containing the PCB 4 are collected by the alignment camera 53 and sent to the visual information processing module 52;
s3, the visual information processing module 52 analyzes and processes the CCD image data to obtain the position information of the PCB 4 and sends the position information to the control module 6, namely the automatic controller 9;
s4, the automatic controller 9 controls the mechanical arm 4 to grab the PCB 4, and meanwhile, an exposure platform control command is generated according to the position information and sent to the exposure platform 2 to enable the exposure platform to move to a corresponding position;
and S5, the automatic controller 9 controls the mechanical arm 3 to convey the grabbed PCB 4 to the exposure platform 2 which is located at the corresponding position.
Traditional LDI automatic wiring equipment moves exposure platform 2 to fixed position, then realize counterpoint both through the position of clapping the board mode adjustment PCB board 4, and this scheme realizes counterpoint both through the mode that makes exposure platform 2 adapt to PCB board 4 position, need not clap the board to PCB board 4, need not consume the movement time of traditional clapping board shelves pole 81 promptly, use signal transmission and signal processing to replace mechanical motion, make speed be the order of magnitude promotion, shorten this part consumed time greatly.
Example two
The manipulator 3 in the first embodiment can accommodate any position of the PCB board, and the manipulator 3 is controlled to perform the grabbing action after the PCB board 4 is transported to the end near the exposure platform 2. The present embodiment is similar to the present embodiment, except that the robot 3 of the present embodiment cannot grasp the PCB 4 at any position, for example, the robot 3 having a set or a small number of suction cups may need to adjust the position of the robot 3. As shown in fig. 8 and 9, the control module 6 receiving the position information is connected to the robot arm 3 so that the robot arm 3 is adjusted to a target position adapted to the position of the PCB 4 before gripping the PCB 4, i.e., the controller 9 grips the PCB 4 after adjusting the robot arm 3 according to the position information of the PCB 4.
EXAMPLE III
As shown in fig. 3, this embodiment is similar to the first embodiment or the second embodiment, except that the manipulator of this embodiment employs a sufficient number of suckers, and the PCB board at any different position can be effectively grasped by controlling different suckers, in this embodiment, the control module 6 is connected to the manipulator 3, and the control module 6 controls the corresponding sucker of the manipulator 3 to be effective according to the positioning result, so as to grasp the PCB board at the current position. Namely, the automatic controller 9 controls the manipulator 3 to grab the PCB 4 and controls the corresponding sucker of the manipulator 3 to be effective according to the position information.
The inventor carries out a plurality of experiments on the LDI automatic equipment using the scheme of the embodiment, and the result shows that the device of the scheme can realize the productivity of 7.5 chips/minute, breaks through the productivity limit of 5.9 chips/minute of the current LDI automatic wiring equipment, and the yield performance of the PCB automatically exposed by using the device is quite good, the following five groups of continuous test data are provided, and the test time of each time is 1 hour:
| |
1 hour capacity | Yield of |
| 1 | 450 | 100% |
| 2 | 451 | 100% |
| 3 | 450 | 100% |
| 4 | 450 | 100% |
| 5 | 450 | 100% |
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Although the transport platform 1 is used more herein; a roller 11; an exposure stage 2; a manipulator 3; a PCB board 4; a positioning system 5; a visual information acquisition module 51; a visual information processing module 52; a control module 6; an alignment camera 53; a Y-direction limiting plate 7; an X-direction clapper structure 8; a paddle catch lever 81; automation controller 9, etc., but does not exclude the possibility of using other terms. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Claims (10)
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| CN202110543957.0A CN113204182B (en) | 2021-05-19 | 2021-05-19 | Visual auxiliary alignment device and method for LDI automatic wiring |
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| CN202110543957.0A CN113204182B (en) | 2021-05-19 | 2021-05-19 | Visual auxiliary alignment device and method for LDI automatic wiring |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115220310A (en) * | 2022-06-23 | 2022-10-21 | 苏州源卓光电科技有限公司 | Full-automatic direct-writing type exposure system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120092865A (en) * | 2011-02-14 | 2012-08-22 | 오에프티 주식회사 | Digital exposure for flexible substrate and exposure method thereof |
| CN105278263A (en) * | 2015-11-25 | 2016-01-27 | 四川聚能核技术工程有限公司 | 8CCD double-side simultaneous aligning method for exposure machine |
| CN208044297U (en) * | 2018-04-25 | 2018-11-02 | 东莞市威力固电路板设备有限公司 | A kind of double-table LDI automatic connection |
| CN215181409U (en) * | 2021-05-19 | 2021-12-14 | 杭州新诺微电子有限公司 | Alignment device for LDI automatic connection |
-
2021
- 2021-05-19 CN CN202110543957.0A patent/CN113204182B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120092865A (en) * | 2011-02-14 | 2012-08-22 | 오에프티 주식회사 | Digital exposure for flexible substrate and exposure method thereof |
| CN105278263A (en) * | 2015-11-25 | 2016-01-27 | 四川聚能核技术工程有限公司 | 8CCD double-side simultaneous aligning method for exposure machine |
| CN208044297U (en) * | 2018-04-25 | 2018-11-02 | 东莞市威力固电路板设备有限公司 | A kind of double-table LDI automatic connection |
| CN215181409U (en) * | 2021-05-19 | 2021-12-14 | 杭州新诺微电子有限公司 | Alignment device for LDI automatic connection |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115220310A (en) * | 2022-06-23 | 2022-10-21 | 苏州源卓光电科技有限公司 | Full-automatic direct-writing type exposure system |
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