CN113194244B - Upper cover of the optical element drive mechanism - Google Patents
Upper cover of the optical element drive mechanismInfo
- Publication number
- CN113194244B CN113194244B CN202110245706.4A CN202110245706A CN113194244B CN 113194244 B CN113194244 B CN 113194244B CN 202110245706 A CN202110245706 A CN 202110245706A CN 113194244 B CN113194244 B CN 113194244B
- Authority
- CN
- China
- Prior art keywords
- base
- upper cover
- magnet
- carrier
- metal sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
- G03B13/34—Power focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
- G03B13/34—Power focusing
- G03B13/36—Autofocus systems
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Optics & Photonics (AREA)
- Adjustment Of Camera Lenses (AREA)
Abstract
本发明公开了一种光学元件驱动机构的上盖，该光学元件驱动机构包括该上盖、上簧片、磁石组、载体、下簧片、底座、滚珠、底部电路板以及基座。上簧片将载体与上盖可活动连接，下簧片将载体与底座可活动连接，底部电路板安装于基座上并与基座固定连接，基座用于安装芯片并与底座之间通过滚珠可活动连接。载体设有第一组线圈，底部电路板设有第二组线圈，磁石组固定安装于上盖并与第一组线圈配合以驱动载体运动以及与第二组线圈配合以驱动基座运动。上盖设有磁石金属片，磁石金属片与上盖固定连接，磁石组安装于磁石金属片的侧面。本发明将光学变焦和光学防抖通过不同的部件运动实现，解决拍摄过程中因手抖动而造成照片模糊的问题。
The present invention discloses an upper cover of an optical element driving mechanism, which includes the upper cover, an upper spring, a magnet group, a carrier, a lower spring, a base, a ball bearing, a bottom circuit board, and a base. The upper spring movably connects the carrier to the upper cover, the lower spring movably connects the carrier to the base, the bottom circuit board is mounted on the base and fixedly connected to the base, the base is used to mount a chip and is movably connected to the base via a ball bearing. The carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, the magnet group is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the carrier to move and cooperates with the second set of coils to drive the base to move. The upper cover is provided with a magnetic metal sheet, the magnetic metal sheet is fixedly connected to the upper cover, and the magnet group is mounted on the side of the magnetic metal sheet. The present invention realizes optical zoom and optical image stabilization through the movement of different components, thereby solving the problem of blurred photos caused by hand shaking during shooting.
Description
Technical Field
The invention relates to the field of optical driving, in particular to an upper cover of an optical element driving mechanism.
Background
With the development of technology, many electronic devices (such as smart phones or digital cameras) have photographing or video recording functions. The use of these electronic devices is becoming more and more popular and is evolving towards a convenient and light-weight design that provides more options for the user. However, in the current mobile phone shooting process, sometimes the shot picture is deficient, that is, the shot picture is not clear enough, and even ghost or blurring occurs. These reasons are due in large part to the small jitter that occurs when the shot is exposed to the scene, except for occasional defocus (i.e., the camera fails to focus properly).
In general, such a slight shake phenomenon often occurs under a hand-held condition, thereby causing a lens shift of the image pickup apparatus, so that the quality of an image captured by the image sensor is deteriorated. Therefore, the requirements for developing the anti-shake technology function are relatively large in recent years.
However, in the prior art, the optical zoom and the optical anti-shake function are mostly realized through the movement of the same component (carrier), the movement range of the carrier is limited by weight, volume and the like, and the trouble of taking a blurred picture due to hand shake in the shooting process cannot be effectively solved.
Disclosure of Invention
The invention aims to provide an upper cover of an optical element driving mechanism, so that optical zooming and optical anti-shake are realized through different component movements, and the problem that a blurred picture is shot due to hand shake in the shooting process is solved.
In order to solve the above-mentioned problems, according to one aspect of the present invention, there is provided an optical element driving mechanism comprising an upper cover, an upper reed movably connecting the carrier with the upper cover, a lower reed movably connecting the carrier with the base, a ball, a bottom circuit board mounted on the base and fixedly connected with the base, and a base for mounting a chip and movably connected with the base through the ball, wherein the carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, and the magnet set is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the carrier to move and cooperates with the second set of coils to drive the base to move.
In one embodiment, the upper cover is further provided with an upper cover embedded metal sheet, an upper cover central opening is formed in the middle of the upper cover to be matched with the optical element, a magnet installation part is arranged around the upper cover central opening, the magnet group is installed on the magnet installation part, the upper cover embedded metal sheet comprises a magnet matching part, and the magnet matching part is arranged on the magnet installation part and is arranged above the magnet group.
In one embodiment, the upper cover embedded metal sheet further includes a sensor connection portion, a circuit introduction portion, and an external circuit connection portion, the external circuit connection portion and the circuit introduction portion being electrically connected with the sensor connection portion.
In one embodiment, the upper cover is provided with a magnet metal sheet, the magnet metal sheet is fixedly connected with the upper cover, and the magnet group is mounted on the side surface of the magnet metal sheet.
In one embodiment, the upper cover is provided with four magnet metal sheets, the four magnet metal sheets are respectively and fixedly mounted on the inner walls of the four side parts of the upper cover, and the magnet group comprises four magnets and is respectively and fixedly mounted on the side surfaces of the four magnet metal sheets.
In one embodiment, the magnet metal sheet includes a main body plate-shaped portion and a fastening portion formed to extend from a top of the main body plate-shaped portion to one side and an embedding portion formed to extend from the top of the main body plate-shaped portion to the other side, the embedding portion is embedded into the upper cover to fixedly connect the magnet metal sheet with the upper cover, and the fastening portion is used for fastening the magnet group.
In one embodiment, the base is provided with a base embedded metal sheet and a ball mounting groove, the balls are mounted in the ball mounting groove, the base embedded metal sheet is arranged in the base and is provided with a ball combining part, and the ball combining part is arranged in the ball mounting groove of the base and is in contact with the balls.
In one embodiment, the carrier is provided with a damping glue groove, the inner side of the ball combining part of the base embedded with the metal sheet is provided with an avoidance hole, a protruding sheet extending upwards is arranged close to the avoidance hole, and the protruding sheet is matched with the damping glue groove at the bottom of the carrier and extends into the damping glue groove so as to buffer the movement of the carrier.
In one embodiment, the metal sheet embedded in the base is provided with four protruding sheets, the carrier is provided with four damping rubber grooves, and one protruding sheet is arranged in each damping rubber groove.
In one embodiment, the base is integrally formed into a rectangular structure and comprises a base plate and side parts integrally extending upwards from the periphery of the base plate, a base center hole is formed in the middle of the base plate to be matched with a lens, protruding parts are formed at four corners of the base plate and are matched with the upper cover, magnet avoiding holes are formed in the inner sides of the side parts, and the magnet avoiding holes are correspondingly matched with a second group of coils in the bottom circuit board and the lower surface of the magnet group, so that the lower surface of the magnet group directly faces the second group of coils in the circuit board.
According to another aspect of the present invention, there is also provided an upper cover of an optical element driving mechanism including the upper cover, an upper reed, a magnet group, a carrier, a lower reed, a base, balls, a bottom circuit board, and a base,
The upper reed is used for movably connecting the carrier with the upper cover, the lower reed is used for movably connecting the carrier with the base, the bottom circuit board is mounted on the base and fixedly connected with the base, the base is used for mounting a chip and movably connected with the base through the balls, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, and the magnet group is fixedly mounted on the upper cover and matched with the first group of coils to drive the carrier to move and matched with the second group of coils to drive the base to move, wherein the upper cover is also provided with an upper cover embedded metal sheet.
In one embodiment, the middle part of the upper cover is provided with an upper cover central opening to be matched with the optical element, a magnet installation part is arranged around the upper cover central opening, the magnet group is installed on the magnet installation part, the upper cover embedded metal sheet comprises a magnet matching part, and the magnet matching part is arranged on the magnet installation part and is arranged above the magnet group.
In one embodiment, the upper cover embedded metal sheet further includes a sensor connection portion, a circuit introduction portion, and an external circuit connection portion, the external circuit connection portion and the circuit introduction portion being electrically connected with the sensor connection portion.
In one embodiment, the magnet fitting portion is independent of the sensor connection portion, the circuit introduction portion, and the external circuit connection portion.
In one embodiment, one end of the circuit lead-in part is electrically connected to the sensor connecting part, and the other end of the circuit lead-in part is electrically connected to the upper reed.
In one embodiment, the circuit lead-in portion connects one end of the upper reed and one end of the sensor connecting portion lower than the middle body portion of the circuit lead-in portion in the height direction.
In one embodiment, the upper cover embedded metal sheet comprises four magnet matching parts, and the magnet group comprises four magnets, and the four magnet matching parts are respectively positioned above the four magnets.
In one embodiment, the upper cover embedded metal sheet includes two circuit lead-in parts disposed at diagonal positions and electrically connected to the two circuit lead-in parts of the upper reed, respectively.
In one embodiment, the external circuit connection part is bent 180 degrees to be connected with the sensor connection part, and one of the magnet matching parts is arranged in an area surrounded by the bending of the external circuit connection part.
In one embodiment, the inner surface of the upper cover is provided with an upper reed fixing part, and the circuit lead-in part of the embedded metal sheet of the base is positioned in the upper reed fixing part.
According to another aspect of the present invention, there is also provided an upper cover of an optical element driving mechanism including the upper cover, an upper reed, a magnet group, a carrier, a lower reed, a base, balls, a bottom circuit board, and a base,
The upper reed is used for movably connecting the carrier with the upper cover, the lower reed is used for movably connecting the carrier with the base, the bottom circuit board is mounted on the base and fixedly connected with the base, the base is used for mounting a chip and movably connected with the base through the balls, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, and the magnet group is fixedly mounted on the upper cover and matched with the first group of coils to drive the carrier to move and matched with the second group of coils to drive the base to move, wherein
The upper cover is provided with a magnet metal sheet, the magnet metal sheet is fixedly connected with the upper cover, and the magnet group is arranged on the side face of the magnet metal sheet.
In one embodiment, the upper cover is provided with four magnet metal sheets, the four magnet metal sheets are respectively and fixedly mounted on the inner walls of the four side parts of the upper cover, and the magnet group comprises four magnets and is respectively and fixedly mounted on the side surfaces of the four magnet metal sheets.
In one embodiment, the magnet metal sheet includes a main body plate-shaped portion and a fastening portion formed to extend from a top of the main body plate-shaped portion to one side and an embedding portion formed to extend from the top of the main body plate-shaped portion to the other side, the embedding portion is embedded into the upper cover to fixedly connect the magnet metal sheet with the upper cover, and the fastening portion is used for fastening the magnet group.
In one embodiment, the top of the body plate portion is integrally formed with two catching portions, and the embedded portion is formed to protrude from a position between the two catching portions to the other side.
In one embodiment, the fastening portion and the insert portion extend upward from the top of the body plate portion by a certain distance and then extend to both sides, respectively, wherein the fastening portion protrudes upward to a height lower than that of the insert portion.
In one embodiment, the embedded portion extends vertically upward for a first distance d1 and then extends in a first direction, and the fastening portion extends vertically upward for a second distance d2 and then extends in a second direction, wherein the first distance d1 is greater than the second distance d2, and the first direction is opposite to the second direction.
In one embodiment, the height of the main body plate-like portion of the magnet metal sheet is smaller than the height of the magnet, and when the magnet is mounted on the magnet metal sheet, a part of the bottom of the magnet protrudes out of the magnet metal sheet.
In one embodiment, the middle part of the upper cover is provided with an upper cover central opening to be matched with the optical element, a magnet mounting part is arranged around the upper cover central opening, and the magnet group is mounted on the magnet mounting part.
In one embodiment, the upper cover is further provided with an upper cover embedded metal sheet, the upper cover embedded metal sheet comprises a magnet matching portion, and the magnet matching portion is arranged on the magnet mounting portion and above the magnet group.
In one embodiment, the inner surface of the upper cover is provided with an upper reed fixing part, and the upper cover embedded metal sheet comprises a circuit lead-in part, and the circuit lead-in part is arranged in the upper reed fixing part.
According to another aspect of the present invention, there is also provided a base of an optical element driving mechanism including an upper cover, an upper reed, a magnet group, a carrier, a lower reed, the base, balls, a bottom circuit board, and a base,
The upper reed is used for movably connecting the carrier with the upper cover, the lower reed is used for movably connecting the carrier with the base, the bottom circuit board is mounted on the base and fixedly connected with the base, the base is used for mounting a chip and movably connected with the base through the balls, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, and the magnet group is fixedly mounted on the upper cover and matched with the first group of coils to drive the carrier to move and matched with the second group of coils to drive the base to move, wherein
The base is provided with a base embedded metal sheet and a ball mounting groove, the balls are mounted in the ball mounting groove, the base embedded metal sheet is arranged in the base and is provided with a ball combining portion, and the ball combining portion is arranged in the ball mounting groove of the base and is in contact with the balls.
In one embodiment, each corner of the lower surface of the base is provided with a ball mounting groove, and the embedded metal sheet of the base is provided with one ball joint at a position corresponding to each ball mounting groove.
In one embodiment, the inner side of the ball combining part of the base embedded with the metal sheet is provided with an avoidance hole, a protruding sheet extending upwards is arranged close to the avoidance hole, and the protruding sheet is matched with the damping rubber groove at the bottom of the carrier and extends into the damping rubber groove so as to buffer the movement of the carrier.
In one embodiment, the metal sheet embedded in the base is provided with four protruding sheets, the carrier is provided with four damping rubber grooves, and one protruding sheet is arranged in each damping rubber groove.
In one embodiment, the ball joint is provided as a rectangular sheet having a length and width equal to or greater than the diameter of the ball.
In one embodiment, the ball joints are provided as circular lamellae having a diameter equal to or larger than the diameter of the balls.
In one embodiment, the base is integrally formed with a rectangular structure and includes a bottom plate and side portions integrally protruding upward from the periphery of the bottom plate, the middle portion of the bottom plate is formed with a base center hole to be engaged with the lens, and four corners of the bottom plate are formed with protruding portions to be engaged with the upper cover.
In one embodiment, a lower reed fixing column integrally extending upwards from the bottom plate is arranged on the inner side of the protruding part, and the lower reed fixing column is fixedly connected with the lower reed.
In one embodiment, a magnet avoiding hole is formed in the inner side of the side portion, and the magnet avoiding hole is correspondingly matched with the second group of coils in the bottom circuit board and the lower surface of the magnet group, so that the lower surface of the magnet group directly faces the second group of coils in the circuit board.
In one embodiment, the magnet group comprises four magnets, and the base is provided with four magnet avoiding holes around the central hole of the base.
According to another aspect of the present invention, there is also provided a carrier for an optical element driving mechanism including an upper cover, an upper reed, a magnet group, the carrier, a lower reed, a base, balls, a bottom circuit board, and a base,
The upper reed is used for movably connecting the carrier with the upper cover, the lower reed is used for movably connecting the carrier with the base, the bottom circuit board is mounted on the base and fixedly connected with the base, the base is used for mounting a chip and movably connected with the base through the balls, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, and the magnet group is fixedly mounted on the upper cover and matched with the first group of coils to drive the carrier to move and matched with the second group of coils to drive the base to move, wherein
The base is provided with a base embedded metal sheet, the carrier is provided with a damping glue groove, the base embedded metal sheet is provided with a protruding sheet, and the protruding sheet is installed in the damping glue groove.
In one embodiment, a plurality of carrier damping gel grooves are arranged at the bottom of the carrier, and the plurality of carrier damping gel grooves are uniformly distributed around the central opening of the carrier.
In one embodiment, the carrier is provided with a lens mounting hole for mounting a lens, four carrier side parts and four carrier corner parts are formed around the lens mounting hole, the upper surface of the carrier is movably connected with the upper cover through an upper reed, and the lower surface of the carrier is movably connected with the base through a lower reed.
In one embodiment, an upper reed connecting column is arranged on the upper surface of the carrier, and an upper reed carrier fixing part of the upper reed is fixedly connected with the upper reed connecting column.
In one embodiment, a coil mounting groove is formed around the carrier, a first group of coils is arranged in the coil mounting groove, and the first group of coils are correspondingly matched with the magnet group so as to drive the carrier to move along the optical axis direction when the first group of coils are electrified.
In one embodiment, the upper surface of the carrier is further provided with a carrier upper limit part integrally extending upwards so as to prevent the upper surface of the carrier from directly colliding with the upper cover in the moving process.
In one embodiment, the side of the carrier is further provided with a side sensor magnet mounting groove for mounting a side sensor magnet and cooperating with a side sensor to detect displacement of the carrier in the optical axis direction.
In one embodiment, the side of the carrier is further provided with a winding post, and the ends of the first set of coils are arranged on the winding post.
In one embodiment, the carrier damping gel groove is arranged at the bottom of the carrier and extends upwards for a certain distance, and the width of the carrier damping gel groove is larger than the width of the protruding piece of the embedded metal sheet of the base.
In one embodiment, the lower surface of the carrier is further provided with a carrier lower limit part integrally extending downwards so as to prevent the lower surface of the carrier from directly colliding with the base during movement.
The optical element driving mechanism drives the chip to move through the base to realize optical anti-shake, creatively utilizes the balls in a dynamic chip scheme, can strengthen the strength of the whole component by connecting the base and the base through the balls, and ensures that the balls are not directly contacted with the base and the base but contacted with the metal sheets and the gaskets through the metal sheets and the gaskets arranged in the ball mounting groove and the ball mounting part for mounting the balls, thereby reducing the abrasion of the base and prolonging the service life of the mechanism.
Drawings
Fig. 1 is a perspective view of an optical element driving mechanism according to an embodiment of the present invention.
Fig. 2 is a perspective view of the base of fig. 1.
Fig. 3 is a bottom view of the base of fig. 1.
Fig. 4 is a perspective view of the base-embedded sheet metal of fig. 1.
Fig. 5 is a bottom view of the circuit board of fig. 1.
Fig. 6 is a perspective view of the base of fig. 1.
Fig. 7 is a top view of an assembly of the circuit board of fig. 1 mounted on a base.
Fig. 8 is a perspective view of the carrier of fig. 1.
Figure 9 is a top view of the assembly formed by the attachment of the upper reed to the carrier.
Fig. 10A is a bottom view of the upper cover with the embedded metal sheet mounted thereon.
Fig. 10B is a perspective view of the upper cover embedded metal sheet.
Fig. 11 is a bottom view of a lens driving mechanism according to an embodiment of the present invention, in which a base, and a circuit board are not mounted.
Fig. 12 is a top view of a lens driving mechanism according to an embodiment of the present invention.
Fig. 13 is a cross-sectional view of the lens driving mechanism of fig. 12 taken along line A-A.
Fig. 14 is a cross-sectional view of the lens driving mechanism of fig. 12 taken along line C-C.
Fig. 15 is a top view of the carrier and base of fig. 1 mated.
Fig. 16 is a cross-sectional view of the assembly of fig. 15 taken along line B-B.
Fig. 17-18 are perspective views of a magnet sheet metal with magnets mounted thereon according to one embodiment of the present invention from different perspectives.
Fig. 19 is a perspective view of a magnet metal sheet to which no magnet is attached according to an embodiment of the present invention. .
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the attached drawings, so that the objects, features and advantages of the present invention will be more clearly understood. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the invention, but rather are merely illustrative of the true spirit of the invention.
In the following description, for the purposes of explanation of various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. One skilled in the relevant art will recognize, however, that an embodiment may be practiced without one or more of the specific details. In other instances, well-known devices, structures, and techniques associated with the present application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.
Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In the following description, for the purposes of clarity of presentation of the structure and manner of operation of the present invention, the description will be made with the aid of directional terms, but such terms as "forward," "rearward," "left," "right," "outward," "inner," "outward," "inward," "upper," "lower," etc. are to be construed as convenience, and are not to be limiting.
The present application relates generally to an optical element driving mechanism, which can be used in terminal products such as mobile phones and tablet computers to realize functions of photographing, video recording, etc. by matching with lenses. The optical element driving mechanism can comprise an upper cover, an upper reed, a magnet set, a carrier, a lower reed, a base, a ball, a bottom circuit board and a base, wherein the upper reed is movably connected with the carrier and the upper cover, the lower reed is movably connected with the carrier and the base, the bottom circuit board is arranged on the base and fixedly connected with the base, the base is used for installing a chip and movably connected with the base through the ball, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, the magnet set is fixedly arranged on the upper cover and matched with the first group of coils to drive the carrier to move, for example, along the direction of an optical axis to realize an optical zooming function, and matched with the second group of coils to drive the base to move, for example, on a plane vertical to the direction of the optical axis or rotate around two mutually vertical axes vertical to the optical axis to realize an optical anti-shake function. Some embodiments of the present application will be described in detail below with reference to the accompanying drawings, it being understood that these embodiments are exemplary and are intended to understand the present application therethrough.
Fig. 1 is a perspective view of an optical element driving mechanism 100 according to an embodiment of the present invention. As shown in fig. 1, the optical element driving mechanism 100 includes an upper cover 10, an upper cover embedded metal sheet 11, an upper reed 20, a magnet group 30, an electronic element 31, a carrier 40, a lower reed 50, a base 60, a base embedded metal sheet 61, balls 70, a spacer 71, a circuit board 80, and a base 90. The upper cover embedded metal sheet 11 is arranged in the upper cover 10, the base embedded metal sheet 61 is arranged in the base 60, the electronic element 31 is arranged on the inner surface of the upper cover 10 and is in circuit connection with the upper cover embedded metal sheet 11, the carrier 40 is used for bearing optical elements such as cameras and is movably arranged on the base 60, the circuit board is fixedly arranged on the base 90, the carrier 40 is provided with a first group of coils, the circuit board 80 is internally provided with a second group of coils, the base 90 is used for installing imaging chips and is movably connected with the base 60 through the balls 70, the base 90 is movably connected with the carrier 40 through the lower reed 50, the upper cover 10 is movably connected with the carrier 40 through the upper reed 20, the magnet group 30 is arranged on the base 60 and is matched with the first group of coils to drive the carrier 40 to move along the optical axis direction so as to realize functions such as automatic focusing, and is matched with the second group of coils to drive the base 90 to move on a plane perpendicular to the optical axis or rotate around two mutually perpendicular axes perpendicular to the optical axis so as to realize optical anti-shake functions.
The optical element driving device of the application has a movement mode different from that of a conventional optical element driving device, the conventional optical element driving device realizes optical zooming by moving the driving carrier along the direction of the optical axis and realizes optical anti-shake by moving the driving carrier on a plane vertical to the optical axis, but the application realizes optical zooming by moving the driving carrier along the direction of the optical axis and realizes optical anti-shake by driving the chip on the base to move on the plane vertical to the optical axis by driving the base. The chip mainly refers to an imaging chip, and because the variable-focus moving part is different from the optical anti-shake moving part, the chip can realize a larger range of movement and realize more excellent variable-focus and anti-shake effects, thereby obtaining better imaging quality.
In addition, the base and the base are connected through the balls, in other words, the base is supported on the base through the balls, so that the base can realize a larger range of motion relative to the base and a carrier connected with the base, and a better anti-shake function is realized. In addition, through the ball connection base and the carrier of being connected with the base, can avoid taking place to return the stagnancy phenomenon, have the advantage that the formation of image is stable, imaging time is fast. The balls can be made of ceramic or rigid material, for example.
Fig. 2 is a perspective view of the base 60 of fig. 1, and fig. 3 is a bottom view of the base 60 of fig. 1. As shown in fig. 2 to 3, the base 60 is integrally formed in a rectangular structure and includes a base plate 62 and side portions 63 integrally protruding upward from the periphery of the base plate 62, a central base hole 621 is formed in the middle of the base plate 62 to be engaged with a lens, four corners of the base plate 62 form base projections 622, and lower reed fixing posts 623 integrally protruding upward from the base plate 62 are provided on the inner sides of the base projections 622, the lower reed fixing posts 623 being for fixed connection with lower reeds. The inner side of the side 63 is provided with a magnet avoiding hole 631, and the magnet avoiding hole 631 is correspondingly matched with the second group of coils in the circuit board 80 and the lower surface of the magnet group 50, so that the lower surface of the magnet group 50 directly faces the second group of coils in the circuit board to provide a larger anti-shake driving force.
Referring to fig. 3, a ball mounting groove 632 is provided at each corner of the lower surface of the base 60, and the balls 70 are mounted in the ball mounting groove 632. As shown in fig. 1-3, in the present embodiment, the magnet group 50 includes four magnets in total, and correspondingly, the base 60 is provided with four magnet avoiding holes 631 around the base center hole 621, however, those skilled in the art will understand that in other embodiments, the magnet group 50 may include two magnets, three magnets, and the like, and correspondingly, three or four magnet avoiding holes may be provided on the base 60. That is, the number of magnets and the number of magnet avoiding holes included in the magnet group 50 are not limited, and a suitable number of magnets and magnet avoiding holes may be selected according to the specific circumstances.
Fig. 4 is a perspective view of a base-embedded metal sheet 61 according to an embodiment of the present application. As shown in fig. 4, the base-embedded metal sheet 61 is provided in the base 60 and is provided with ball coupling portions 611 at four corners, and the ball coupling portions 611 are disposed in the ball mounting grooves 632 of the base 60 and contact the balls 70. Alternatively, the ball bonding portion 611 is provided in a rectangular shape having a length and width substantially equal to or slightly larger than the diameter of the ball, or the ball bonding portion 611 is provided in a circular shape having a diameter substantially equal to or larger than the diameter of the ball. The inner side of the ball combining part 611 is provided with a material reducing hole 612, a protruding piece 613 extending upwards is arranged next to the material reducing hole 612, and the protruding piece 613 is matched with the damping glue groove at the bottom of the carrier 40 and extends into the damping glue groove to play a role in buffering the motion of the carrier 40.
Fig. 5 is a bottom view of the circuit board 80, the circuit board 80 is mounted on the base 90 and integrally forms a rectangular structure, four corners of the rectangular structure form notches 83 to avoid ball mounting portions of the base 60, a circuit board center hole 81 is provided in the middle of the circuit board 80, and the circuit board center hole 81 cooperates with a base center hole 621 of the base 60 and is provided with a plurality of circuit conducting portions 82 along a peripheral portion. One surface of the circuit board 80 may further be provided with one or more electronic components 31 (see fig. 1), and the electronic components 31 may be electrically connected with the circuit conducting portion 82, for example, and the circuit board 80 may further be provided with a base positioning hole 85, and the base positioning hole 85 is matched with a circuit board positioning post on the base 90, so that the circuit board 80 is fixed to the upper surface of the base 90.
Fig. 6 is a perspective view of a base 90 according to one embodiment of the present application. As shown in fig. 6, the base 90 is integrally formed in a rectangular structure and provided with a chip mounting hole 91 in the middle to mount a chip, which mainly refers to an imaging chip, on which light entering through an optical element generates an image, four corners of the base 90 are provided with ball mounting portions 92, the ball mounting portions 92 are fitted with ball mounting grooves 632 on the base 60 to mount balls 70, and the balls 70 are arranged in the ball mounting grooves 632 and the ball mounting portions 92. It should be noted that the ball mounting portion 92 is only a term used herein for convenience of description, and may be specifically in the form of a groove, a sink, a round hole, or the like. A spacer 71 is provided in each ball mounting portion 92, and the spacer 71 may be made of the same material as the base-embedded metal sheet 61, for example.
Fig. 7 is a top view of an assembly formed by the circuit board 80 mounted on the base 90. As shown in fig. 7, the four notches 83 of the circuit board 80 avoid the ball mounting portion 92 of the base 90, and the positioning holes 85 of the circuit board 80 are matched with the positioning posts 93 on the base 90, so that the circuit board 80 is fixedly mounted on the base 90.
Fig. 8 is a perspective view of the carrier 40. As shown in fig. 8, the carrier 40 is provided with a lens mounting hole 41 to mount a lens, four carrier side portions and four carrier corner portions being formed around the lens mounting hole 41. The surface of the carrier 40 facing the housing is defined as an upper surface, and the surface facing the base is defined as a lower surface, so that the upper surface of the carrier 40 is movably connected with the upper cover 10 through the upper reed 20, the lower surface of the carrier 40 is movably connected with the base 60 through the lower reed 50, specifically, the upper surface of the carrier 40 is provided with the upper reed connecting post 42, and the upper reed carrier fixing portion 22 of the upper reed 20 is fixedly connected with the upper reed connecting post 42.
A coil mounting groove 47 (see fig. 16) is provided around the carrier 40, and a first group of coils 46 (see fig. 13) is provided in the coil mounting groove 47, the first group of coils 46 being correspondingly engaged with the magnet group 50 to drive the carrier 40 to move in the optical axis direction when the first group of coils 46 is energized. The upper surface of the carrier 40 is further provided with a carrier upper limit part 43 integrally extended upward, and the carrier 40 is prevented from directly colliding with the upper cover 10 during the movement by the carrier upper limit part 43. The side of the carrier 40 is further provided with a side sensor magnet mounting groove 44, and the sensor magnet mounting groove 44 is used for mounting the side sensor magnet and cooperating with the side sensor to detect displacement of the carrier 40 in the optical axis direction. The lower surface of the carrier 40 is also provided with a damping gel groove 45 which is opened towards the base and extends upwards along the optical axis direction, and the damping gel groove 45 is internally provided with damping gel and accommodates a protruding piece 613 on the metal sheet 61 embedded in the base. The application creatively cooperates with the damping glue groove 45 through the protruding piece 613 of the embedded metal piece 61 of the base, and can play a good role in buffering the motion of the carrier.
Figure 9 is a top view of the assembly formed by the attachment of upper reed 20 to carrier 40. As shown in fig. 9, the upper reed 20 is provided with an upper cover fixing portion 21 and an upper reed carrier fixing portion 22, the upper cover fixing portion 21 and the upper reed carrier fixing portion 22 are movably connected by an upper reed elastic portion 23, the upper cover fixing portion 21 is fixedly connected with the upper cover 10, and the upper reed carrier fixing portion 22 is fixedly connected with an upper reed connecting post 42 of the carrier 40. The upper reed 20 is further provided with a coil connecting portion 24, the coil connecting portion 24 is electrically connected with the first set of coils on the carrier 40, and the upper cover connecting portion 21 is electrically connected with the upper cover embedded metal sheet 20, so that the upper cover embedded metal sheet current is introduced to the first set of coils on the carrier through the upper reed 20 to drive the carrier 40 to move in the optical axis direction.
Fig. 10A is a bottom view of the upper cover 10 with the upper cover-embedded metal sheet 11 mounted thereon. As shown in fig. 10A, the upper cover embedded metal sheet 11 is provided in the upper cover 10, and upper reed fixing portions 13 are provided at four corners of the upper cover 10, and upper cover fixing portions 21 of the upper reed 20 are fixed to the upper reed fixing portions 13. The upper cap insert metal sheet 11 is provided with a circuit introduction portion 111, and the circuit introduction portion 111 is disposed in the upper reed fixing portion 13 of the upper cap 10 and electrically connected to the upper reed 20, thereby introducing the current of the upper cap insert metal sheet 11 to the upper reed 20. The upper cap insert metal sheet 11 is further provided with an external circuit connection part 112, and the external circuit connection part 112 extends out of the outer circumference of the upper cap 11 and is used for connecting an external circuit, and the external circuit connection part 112 is electrically connected with the circuit introduction part 111, so that an external current is introduced into the upper reed 20 through the upper cap insert metal sheet 11.
Fig. 10B is a perspective view of the upper cover embedded metal sheet 11. As shown in fig. 10B, the upper cover embedded metal sheet 11 is embedded in the upper cover 10 to increase the strength of the upper cover 10 as a whole, the upper cover embedded metal sheet 11 as a whole includes a magnet fitting portion 113, a sensor connecting portion 114, a circuit introducing portion 111, and an external circuit connecting portion 112, the four magnet fitting portions 113 are arranged above the magnet group 30 and are independent of the sensor connecting portion 114, the circuit introducing portion 111, and the external circuit connecting portion 112, the sensor connecting portion 114 is electrically connected with the sensor, and the external circuit connecting portion 112 and the circuit introducing portion 111 are electrically connected with the sensor connecting portion 114. Wherein one end of the circuit introducing part 111 is connected to the sensor connecting part 114 and the other end is electrically connected to the upper reed 20, it is preferable that one end of the circuit introducing part 111 connected to the upper reed 20 and one end connected to the sensor connecting part 114 are lower than a central body part of the circuit introducing part 111 in a height direction, that is, both ends of the circuit introducing part 111 are sunk with respect to the whole upper cover embedded metal sheet 11 to be electrically connected to the upper reed 20 and the sensor connecting part 114.
Fig. 11 is a bottom view of a lens driving mechanism according to an embodiment of the present invention, in which a base, and a circuit board are not mounted. As shown in fig. 11, the lower reed 50 is provided with a base fixing portion 51 and a lower reed carrier fixing portion 52, and the base fixing portion 51 and the lower reed carrier fixing portion 52 are movably connected by a lower reed elastic portion 53. Wherein, the base fixing portion 51 is fixedly connected with the base 60, and the lower reed carrier fixing portion 52 is fixedly connected with the lower surface of the carrier 40, so that the carrier 40 and the base 60 can be movably connected through the lower reed 50. As is clear from fig. 11, the lower surface of the carrier 40 is provided with a damping gel groove 45 extending in the optical axis direction, the damping gel groove 45 is used for mounting damping gel and is matched with the protruding piece 613 of the base embedded metal piece 61, i.e. the protruding piece 613 of the base embedded metal piece 61 protrudes into the damping gel groove 45, wherein the protruding piece 613 is preferably provided with a smaller size than the damping gel groove 45, so that the protruding piece 613 can move in the damping gel groove 45.
Fig. 12 is a top view of a lens driving mechanism 100 according to an embodiment of the present invention. Fig. 13 is a sectional view of the lens driving mechanism of fig. 12 taken along line A-A, fig. 14 is a sectional view of the lens driving mechanism of fig. 12 taken along line C-C, fig. 15 is a top view of the carrier mated with the base, and fig. 16 is a sectional view of the assembly of fig. 15 taken along line B-B. As shown in fig. 12-16, a first set of coils 46 is disposed on the carrier 40, the magnet set 30 is fixedly mounted in the upper cover 10 and is disposed opposite to the first set of coils 46, the upper surface of the carrier 40 is movably connected with the upper cover 10 by the upper reed 20, the lower surface of the carrier 40 is movably connected with the base 60 by the lower reed 50, the circuit board 80 is fixedly mounted on the base 90 and is internally provided with a second set of coils 86, and the second set of coils 86 is disposed below the magnet set 30 and cooperates with the magnet set 30 to drive the base 90 to further drive the chip to move when energized, for example, to move on a plane perpendicular to the optical axis or rotate about mutually perpendicular axes on a plane perpendicular to the optical axis, thereby realizing an optical anti-shake function. The base 90 is further provided with a bottom sensor 92, and the bottom sensor 92 is located below the second set of coils and the magnet set 50, so as to detect displacement of the assembly of the carrier, the upper cover, and the base in a direction perpendicular to the optical axis.
Referring to fig. 14, the base 60 and the base 90 are connected by a ball 70. Specifically, the balls 70 are mounted in the ball mounting portion 92 of the base 90 and the ball mounting groove 632 of the base 60, and the ball mounting groove 632 and the ball mounting portion 92 cooperate to form a space having a size larger than that of the balls 70, so that the balls 70 can freely roll in the ball mounting groove 632 and the ball mounting portion 92. The balls 70 are respectively contacted with the ball combining part 611 of the base embedded metal sheet 61 and the gasket 71 of the ball mounting part 92 in the ball mounting groove 632, when the second group coil 86 in the circuit board 80 is electrified, electromagnetic induction is formed with the magnet group 50, and the base 90 is driven to drive the chip (not shown) to move, and the base 90 and the base 60 are connected through the balls 70, so that the base 60, the carrier 40 connected with the base 60 and the base 90 are relatively moved through the movement of the balls 70, and the optical anti-shake function is realized.
Referring to fig. 13 in combination with fig. 16, when the first set of coils 46 is energized, it cooperates with the magnet set 50 and drives the carrier 40 to move in the optical axis direction relative to the base 60 by the action of ampere force, thereby realizing an optical zoom function. Since the protruding piece 63 of the metal sheet embedded in the base extends into the damping gel groove 45 and is surrounded by the damping gel (not shown), a better buffering effect on the movement of the carrier can be achieved.
The optical element driving mechanism drives the chip to move through the base to realize optical anti-shake, creatively utilizes the balls in a dynamic chip scheme, can strengthen the strength of the whole component by connecting the base and the base through the balls, and ensures that the balls are not directly contacted with the base and the base but contacted with the metal sheets and the gaskets through the metal sheets and the gaskets arranged in the ball mounting groove and the ball mounting part for mounting the balls, thereby reducing the abrasion of the base and prolonging the service life of the mechanism.
The magnet metal sheet 32 of the upper cover 10 according to an embodiment of the present application will be described with reference to fig. 17 to 19. Fig. 17 to 18 are perspective views showing different views of the magnet metal sheet 32 with the magnets mounted thereon, and fig. 19 is a perspective view of the magnet metal sheet 32 without the magnets mounted thereon. As shown in fig. 17 to 19, the magnet metal sheet 32 is provided outside the magnet 30, the magnet metal sheet 32 is fixedly mounted on the inner walls of the four side portions of the upper cover 10, and the magnet 30 is fixedly mounted on the inner surface of the magnet metal sheet 32. Specifically, the magnet metal piece 32 includes a body plate-like portion 321, a locking portion 322 extending from the top of the body plate-like portion 321 to one side, and an insertion portion 323 extending from the top to the other side, and the insertion portion 323 is inserted into the upper cover 10, and the locking portion 322 locks the magnet 30. Wherein, the top of the body plate portion 321 is integrally formed with two catching portions 322, and the insertion portion 323 is formed to protrude from a position between the two catching portions 322 to the other side. The height of the protruding portion 322 is lower than the height of the protruding portion 323, that is, the protruding portion 323 extends vertically upward a first distance d1 and then protrudes in a first direction, and the protruding portion 322 extends vertically upward a second distance d2 and then protrudes in a second direction, wherein the first distance d1 is greater than the second distance d2, and the first direction is opposite to the second direction. By using the magnet metal sheet 32, on the one hand, the function of regulating the magnetic field is achieved, and on the other hand, since the present application creatively fixedly mounts the magnet to the upper cover instead of mounting the magnet to the base in a conventional manner, the magnet 30 can be better fixed to the upper cover 10 by providing the magnet metal sheet 32.
While the preferred embodiments of the present application have been described in detail, it will be appreciated that those skilled in the art, upon reading the above teachings, may make various changes and modifications to the application. Such equivalents are also intended to fall within the scope of the application as defined by the following claims.
Claims (7)
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| CN113194244B true CN113194244B (en) | 2025-09-02 |
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| CN114217491B (en) * | 2021-11-29 | 2022-08-09 | 辽宁中蓝光电科技有限公司 | Anti-shake camera driving device |
| CN114114601B (en) * | 2021-12-28 | 2025-09-02 | 河南皓泽电子股份有限公司昆山分公司 | Lens drive mechanism and its frame |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160105351A (en) * | 2015-02-27 | 2016-09-06 | 성우전자 주식회사 | Camera module having autofocusing and optical image stabilization functions |
| CN111123466A (en) * | 2020-02-24 | 2020-05-08 | 河南皓泽电子股份有限公司 | lens drive mechanism |
| CN217283127U (en) * | 2021-03-05 | 2022-08-23 | 河南皓泽电子股份有限公司 | Upper cover of optical element driving mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104991400A (en) * | 2015-08-07 | 2015-10-21 | 浙江水晶光电科技股份有限公司 | Hand-shaking resistance device and infrared filtering anti-shaking module group structure |
| CN205301682U (en) * | 2015-12-29 | 2016-06-08 | 上海比路电子有限公司 | Optical zoom motor |
| CN209514182U (en) * | 2019-01-25 | 2019-10-18 | 河南省皓泽电子有限公司 | Lens driving mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160105351A (en) * | 2015-02-27 | 2016-09-06 | 성우전자 주식회사 | Camera module having autofocusing and optical image stabilization functions |
| CN111123466A (en) * | 2020-02-24 | 2020-05-08 | 河南皓泽电子股份有限公司 | lens drive mechanism |
| CN217283127U (en) * | 2021-03-05 | 2022-08-23 | 河南皓泽电子股份有限公司 | Upper cover of optical element driving mechanism |
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