CN113182947A - Scribing cutter repairing process - Google Patents
Scribing cutter repairing process Download PDFInfo
- Publication number
- CN113182947A CN113182947A CN202110485160.XA CN202110485160A CN113182947A CN 113182947 A CN113182947 A CN 113182947A CN 202110485160 A CN202110485160 A CN 202110485160A CN 113182947 A CN113182947 A CN 113182947A
- Authority
- CN
- China
- Prior art keywords
- cutting
- saw
- dicing
- scribing
- knife
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 57
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 57
- 239000010703 silicon Substances 0.000 claims abstract description 57
- 238000009966 trimming Methods 0.000 claims description 38
- 239000000498 cooling water Substances 0.000 claims description 15
- 230000008439 repair process Effects 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 2
- 238000005259 measurement Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 7
- 239000003082 abrasive agent Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 235000013619 trace mineral Nutrition 0.000 description 3
- 239000011573 trace mineral Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The embodiment of the invention discloses a scribing cutter repairing process, which comprises the following steps: selecting a knife grinding plate, fixing the knife grinding plate on a working disc of a dicing saw, and installing a dicing saw on a main shaft of the dicing saw; starting a dicing saw, controlling a dicing knife to cut along a certain length on the surface of a knife grinding plate by the dicing saw to form a first cutting groove, stopping cutting after cutting the set length, and pausing the dicing saw; taking down the knife grinding plate, selecting a silicon wafer, and mounting the silicon wafer in a cutting area of a dicing saw; and starting the dicing saw again, controlling the dicing knife to cut along a certain length on the surface of the silicon wafer by the dicing saw to form a second cutting groove, stopping cutting after cutting for a set length, and suspending the dicing saw. According to the scribing knife repairing process, the scribing knife is repaired successively through the knife grinding plate and the silicon wafer, the eccentricity of the scribing knife can be greatly reduced, and the scribing quality of the scribing knife is guaranteed.
Description
Technical Field
The invention relates to the technical field of wafer cutting, in particular to a scribing cutter repairing process.
Background
At present, a great amount of demands appear on the market of the scribing cutter, and the scribing cutter needs to be repaired according to the requirements of customers before being provided for the customers regardless of adopting imported scribing cutters or domestic scribing cutters. The common cutter repairing method is a traditional cutter repairing process of a scribing cutter or a cutter repairing process of the scribing cutter provided by manufacturers, the scribing cutter repaired by the cutter repairing processes has eccentricity when being installed with a main shaft of the scribing cutter, and a phenomenon that a product is seriously cracked and a core of the scribing cutter is cracked frequently occurs when a client uses the scribing cutter with the eccentricity, so that the product of the client is seriously scrapped.
Disclosure of Invention
In view of the above, it is necessary to provide a saw blade trimming process for reducing the eccentricity.
The invention provides a scribing knife repairing process, which comprises the following steps:
selecting a knife grinding plate, fixing the knife grinding plate on a working disc of a dicing saw, and installing a dicing saw on a main shaft of the dicing saw;
starting the dicing saw, controlling the dicing cutter to cut on the surface of the knife grinding plate along a certain length by the dicing saw to form a first cutting groove, stopping cutting after cutting the set length, and pausing the dicing saw;
taking down the knife grinding plate, selecting a silicon wafer, and mounting the silicon wafer in a cutting area of the dicing saw;
and starting the dicing saw again, controlling the dicing cutter to cut the surface of the silicon wafer along a certain length by the dicing saw to form a second cutting groove, stopping cutting after cutting for a set length, and suspending the dicing saw.
In some embodiments of the saw blade trimming process, the starting the saw blade, the controlling the saw blade to cut along a certain length on the surface of the blade grinding plate by the saw blade to form a first cutting groove, and stopping cutting after cutting a set length, wherein the suspending the saw blade includes: the scribing machine is used for controlling the scribing knife to cut from one end of the knife grinding plate to the other end of the knife grinding plate to form a first cutting groove, and the length direction of the first cutting groove is perpendicular to the end faces, at the head end and the tail end, of the first cutting groove on the knife grinding plate.
In some embodiments of the saw blade trimming process, the saw blade controlling the saw blade to cut from one end of the blade sharpening plate towards the other end thereof, the forming the first cutting groove comprising: the scribing knife is controlled by the scribing machine to scribe ten first cutting grooves which are arranged in parallel on the surface of the knife sharpening plate, and the interval between every two adjacent first cutting grooves is 0.2 mm.
In some embodiments of the saw blade trimming process, the dicing machine controls the saw blade to cut from one end of the blade sharpening plate towards the other end thereof, and forming the first cutting groove further comprises: the dicing saw controls the dicing blade to cut at a speed of 15 mm/s.
In some embodiments of the saw blade trimming process, the dicing saw controls the dicing blade to cut along a certain length on the surface of the blade grinding plate to form a first cutting groove, the cutting is stopped after the cutting for the set length, and the dicing saw further includes:
according to the specification of the scribing knife, a qualified width standard of a first cutting groove is specified, and a qualified forward-collapse standard of the first cutting groove is specified to be less than 3 mu m;
and measuring whether the width of the first cutting groove and the positive breakout meet the standard or not by using a microscope, and if so, carrying out subsequent operation, and if not, carrying out repeated cutting.
In some embodiments of the saw blade trimming process, the restarting of the dicing saw, the dicing saw controlling the dicing blade to cut along a certain length on the surface of the silicon wafer to form a second cutting groove, and stopping cutting after cutting for a set length, wherein suspending the dicing saw includes: and the scribing cutter controls the scribing cutter to cut from one end of the silicon wafer to the other end of the silicon wafer to form a second cutting groove, and the length direction of the second cutting groove is perpendicular to the end surfaces of the sharpening plates at which the head end and the tail end of the second cutting groove are located.
In some embodiments of the saw blade trimming process, the saw controlling the saw blade to cut from one end of the silicon wafer towards the other end thereof, and forming the second scribe line comprises: and the scribing cutter controls the scribing cutter to scribe fifty parallel second cutting grooves on the surface of the cutter grinding plate, and the interval between every two adjacent second cutting grooves is 0.2. mm.
In some embodiments of the saw blade trimming process, the controlling the saw blade to scribe fifty parallel second scribe grooves on the surface of the blade sharpening plate by the saw blade includes: the scribing machine controls the scribing knife to cut the first ten second cutting grooves on the silicon wafer at the speed of 10mm/s, and the scribing machine controls the speed of the scribing knife to cut the second cutting grooves on the silicon wafer to be increased by 10mm/s after every ten second cutting grooves are cut.
In some embodiments of the saw blade trimming process, the restarting the dicing saw, the dicing saw controlling the dicing blade to cut along a certain length on the surface of the silicon wafer to form a second cutting groove, stopping cutting after cutting for a set length, and suspending the dicing saw further includes:
according to the specification of the scribing knife, the qualified width standard of a second cutting groove is specified, the qualified front opening breakage standard of the second cutting groove is specified to be less than 5 mu m, and the qualified back opening breakage standard is specified to be less than 12 mu m;
and measuring whether the width of the second cutting groove, the positive breakout and the negative breakout meet the standard or not by using a microscope, and if so, carrying out subsequent operation, and if not, carrying out repeated cutting.
In some embodiments of the saw blade trimming process, the controlling, by the saw blade, the saw blade to cut along a certain length on the surface of the blade grinding plate to form a first cutting groove and controlling, by the saw blade, the saw blade to cut along a certain length on the surface of the silicon wafer to form a second cutting groove further includes: and spraying cooling water to the cutting part of the scribing knife.
The embodiment of the invention has the following beneficial effects:
after the scribing cutter of the type that has selected the customer requirement, utilize the break bar to repair the sword to the scribing cutter according to the break bar step of setting for, the break bar can be repaiied the convex part on the scribing cutter outer fringe, and then reduces the eccentricity between scribing cutter and the main shaft greatly, for using the great scribing cutter of eccentricity, the customer can guarantee the scribing quality when using the less scribing cutter scribing of eccentricity, and the scribing cutter is difficult for cracking the core yet. The grinding materials on the scribing knife can be exposed by utilizing the knife grinding plate to trim the scribing knife, a knife edge is established, then the scribing knife is trimmed by utilizing the silicon wafer, the grinding materials which are in transition and protruding on the scribing knife are ground, the appearance of the scribing knife is enabled to be more consistent with the appearance required by a customer, and meanwhile, the knife point of the scribing knife can be trimmed more sharply by utilizing the silicon wafer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
fig. 1 is a flowchart of a saw blade trimming process according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a dicing blade cutting and blade grinding plate in the dicing blade trimming process according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a blade grinding plate having a first cutting groove in a saw blade trimming process according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating a calibration measurement dashed line in a saw blade trimming process according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a saw blade trimming process according to an embodiment of the present invention when a parameter of a first scribe line starts to be measured;
fig. 6 is a schematic diagram of the process of measuring the parameters of the first scribe line at the end of the saw blade trimming process according to the embodiment of the present invention;
FIG. 7 is a schematic diagram of a dicing blade cutting a silicon wafer in a dicing blade trimming process according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a silicon wafer having a second cutting groove in a saw trimming process according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The embodiment of the invention provides a scribing cutter repairing process, which can greatly reduce the eccentricity of a scribing cutter and enable the scribing cutter to better meet the requirements of customers.
In an embodiment of the present invention, the saw blade trimming process may include the following steps:
s10, selecting a knife grinding plate, fixing the knife grinding plate in the cutting area of the dicing saw, and installing the dicing saw on a main shaft of the dicing saw;
s20, starting a dicing saw, controlling the dicing saw to rotate and cutting the surface of the knife grinding plate along a certain length to form a first cutting groove, stopping cutting after cutting the set length, and pausing the dicing saw;
s30, taking down the knife sharpening plate, selecting a silicon wafer, and mounting the silicon wafer in the cutting area of the dicing saw;
and S40, starting the dicing saw again, controlling the dicing saw to cut the surface of the silicon wafer along a certain length by the dicing saw to form a second cutting groove, stopping cutting after cutting the set length, and suspending the dicing saw.
When the scribing knife is installed on the main shaft of the scribing machine, the eccentricity possibly exists between the scribing knife and the main shaft, namely, the outer edge of the cutting edge is arranged eccentrically to the main shaft, if the existing repairing process is utilized for repairing the scribing knife, the eccentricity can not be reduced, when a customer uses the scribing knife, the eccentricity of the scribing knife can cause the scribing knife to break edges seriously when cutting products, the cutting quality is reduced, even the time is long, the scribing knife can crack chips, and the service life of the scribing knife is shortened. The method for repairing the cutter comprises the steps of utilizing a cutter grinding plate to repair the scribing cutter according to set steps, and repairing the outer edge of the scribing cutter to be round, so that the eccentricity of the scribing cutter is greatly reduced, abrasive materials on the scribing cutter can be exposed to establish a cutter edge, then utilizing a silicon wafer to repair the scribing cutter according to the set steps, and repairing the excessively exposed abrasive materials, so that the cutter point is sharpened, the cutter edge has an ideal shape, and the requirements of customers are met.
In one embodiment, referring to fig. 2, in step S10, a resin-made blade grinding plate 4 is selected, the selected blade grinding plate 4 has a length of 75mm, a width of 75mm and a thickness of 1mm, the selected blade grinding plate 4 is fixed on a working disc 1 of a dicing saw after the selection is completed, and then a type of a dicing blade 100 required by a customer is selected and installed on a spindle of the dicing saw.
In one embodiment, referring to fig. 3, step S20 includes the dicing saw controlling the dicing blade 100 to cut from one end of the sharpening board 4 toward the other end thereof to form the first cutting groove 40, wherein the length direction of the first cutting groove 40 is perpendicular to the end surface of the sharpening board 4 where the head and the tail ends are located.
Specifically, after the selected sharpening plate 4 is fixed to the working disc 1, the dicing saw is activated to control the dicing blade 100 to cut on the sharpening plate 4, typically from one end of the sharpening plate 4 towards the opposite end thereof, with the first groove created in the sharpening plate 4 having a depth of 0.2 mm. It should be noted that the program for controlling the dicing saw to operate is designed in advance according to the cutting requirements of the customer, and is directly input and stored into the dicing saw, and when the trimming is to be performed, the corresponding cutting program is called out.
In a specific embodiment, step S20 further includes the dicing saw controlling the dicing blade 100 to scribe ten first grooves 40 arranged in parallel on the surface of the sharpening plate 4, and the interval between two adjacent first grooves 40 is 0.2 mm.
When trimming is performed using the sharpening plate 4, the dicing blade 100 needs to be sufficiently sharpened on the sharpening plate 4, and thus the dicing blade 100 needs to be cut on the sharpening plate 4 by a sufficiently long distance. However, due to the size limitation of the sharpening plate 4, the dicing blade 100 is not enough to be sharpened from one end of the sharpening plate 4 to the opposite end thereof, so that it is necessary to cut on the sharpening plate 4 several times more in order to achieve the required cutting distance, thereby enabling the dicing blade 100 to achieve the desired trimming effect. In the embodiment of the present invention, the dicing blade 100 is cut ten times on the blade sharpening plate 4, and the distance between the first cutting grooves 40 formed by each cutting is 0.2 mm.
It should be noted that, in step S20, the dicing saw controls the dicing blade 100 to cut the first cutting groove 40 on the sharpening board 4 at a speed of 15mm/S, and the cutting distance on the sharpening board 4 is matched, which is beneficial to trimming the outer edge of the dicing blade 100 into a true circle, greatly reducing the eccentricity of the dicing blade 100, and simultaneously exposing the abrasive material of the dicing blade 100 to establish a cutting edge. It should be noted that when the dicing blade 100 cuts on the sharpening board 4, the spindle speed of the dicing saw is 32000 rpm.
In one embodiment, after step S20, the method further includes:
s21, according to the specification of the scribing knife, the qualified width standard of the first cutting groove is specified, and the qualified positive breakout standard of the first cutting groove is specified to be less than 3 mu m;
and S22, measuring whether the width of the first cutting groove and the positive breakout meet the standard by using a microscope, if so, carrying out subsequent operation, and if not, carrying out repeated cutting.
Whether the pre-cutting of the dicing blade 100 on the blade sharpening plate 4 is acceptable is judged by checking the width of the first cutting groove 40 cut by the dicing blade 100 and the size of the positive relief 60. It should be noted that, in a general case, referring to fig. 2 and fig. 3, the dicing saw 100 includes a substrate 2 and a blade 3, the blade 3 is fixed at one end of the substrate 2, wherein the blade 3 has two cutting surfaces at a blade edge, which are a front surface 30 and a back surface 31, the blade edge of the dicing saw 100 is located between the two cutting surfaces, when the dicing saw 100 cuts an article, a portion of the article attached to the front surface 30 of the dicing saw 100 may be additionally taken away by one or more small pieces of debris by the front surface 30 of the dicing saw 100, and a notch formed by the pieces on the surface of the article is the front-break notch 60. Accordingly, the back chipping opening 61 is a notch formed by chips on the article that the back surface 31 of the dicing blade 100 carries away when cutting. The size of the positive breakout 60, which is larger than the size of the other positive breakouts 60, is usually measured and compared with a specified standard size. If the measured result does not meet the standard, the same process is required to be used for finishing, the subsequent process can be carried out when the measured result is qualified after finishing, and the treatment is abandoned when the measured result is not qualified.
It should be noted that, when the dicing blade 100 with different thicknesses is trimmed, the standard for the qualified width of the first cutting groove 40 is changed according to the thickness of the dicing blade 100, for example, when the dicing blade 100 with an outer diameter of 55.56mm, a blade thickness of 18 μm and a blade length of 530 μm is trimmed, the standard for the width of the first cutting groove 40 needs to be 18 μm. The embodiment of the present invention will be described by taking a saw 100 having a trimming thickness of 18 μm as an example.
As an example, please refer to fig. 4, 5 and 6, the microscope in step S22 includes three measurement dotted lines 70 arranged at intervals. The three measuring dotted lines 70 are arranged in parallel, the intervals of the three measuring dotted lines 70 are equal, the three measuring dotted lines 70 can be controlled to move in the direction perpendicular to the measuring dotted lines 70 by using a control key on the microscope, the measuring dotted lines 70 can display corresponding numerical values on the microscope in the moving process, the numerical values are position coordinates of the measuring dotted lines 70 and can be cleared, if the moving distance of the measuring dotted lines 70 is required to be known, the positions of the measuring dotted lines 70 are cleared before the measuring dotted lines 70 move, then the measuring dotted lines 70 are moved, and the numerical values displayed on the microscope are the moving distance of the measuring dotted lines 70.
After the first cut groove 40 is cut, the first cut groove 40 is measured by using a measurement dotted line 70, and it should be noted that the length direction of the first cut groove 40 is parallel to the measurement dotted line 70. Specifically, it is first necessary to stop the middle measuring dotted line 70 inside the first cut groove 40 to be measured, preferably at the middle position of the first cut groove 40, which is beneficial to calibrate the position of the measuring dotted line 70; then selecting a measuring dotted line 70 for measuring the selected first cutting groove 40, wherein the measuring dotted line 70 in the middle is selected as an example in the embodiment of the present invention, and controlling the microscope to control the measuring dotted line 70 to move to coincide with an edge line of the opening of the first cutting groove 40, and then performing zero clearing processing on the numerical value displayed on the microscope; finally, the microscope is operated to control the middle measuring dotted line 70 to move toward and coincide with the other edge line of the opening of the first cut groove 40, and the value on the microscope is read, namely the width of the first cut groove 40.
The measurement principle of the size of the positive breakout 60 is the same as that of the first cut groove 40, and therefore, the description thereof is omitted.
In one embodiment, referring to fig. 7 and 8, in step S30, a circular silicon wafer 5 with a thickness of 0.3mm and an outer diameter of 152mm is selected, and then the selected silicon wafer 5 is fixed on the working disc 1 of the dicing saw for secondary cutting by the dicing blade 100.
In one embodiment, step S40 includes: the scribing machine controls the scribing knife 100 to cut from one end of the silicon wafer 5 to the other end thereof to form a second cutting groove 50, and the length direction of the second cutting groove 50 is perpendicular to the end surfaces of the sharpening plates 4 at which the head end and the tail end of the second cutting groove are located.
Like the above-mentioned scribing knife 100 cutting the knife sharpening plate 4 to form the first cutting groove 40, the scribing knife 100 cutting the silicon wafer 5 to form the second cutting groove 50, the abrasive material transitionally exposed on the scribing knife 100 is trimmed by the friction between the scribing knife 100 and the silicon wafer 5, so as to sharpen the knife tip of the scribing knife 100 and trim the appearance of the scribing knife 100 closer to the requirement of the customer.
In a specific embodiment, step S40 further includes the dicing saw controlling the dicing blade 100 to scribe fifty second scribe grooves 50 arranged in parallel and at intervals on the surface of the sharpening plate 4, and the interval between two adjacent second scribe grooves 50 is 0.2. mm. The saw 100 needs to be sufficiently trimmed by the silicon wafer 5 so that the trimmed saw 100 meets the requirements of customers, and therefore, when the saw 100 is trimmed by the silicon wafer 5, the saw 100 needs to be cut on the silicon wafer 5 for a sufficiently long distance. When the silicon wafer 5 provided by the embodiment of the present invention is cut, fifty second cutting grooves 50 need to be cut, so as to meet the cutting distance of the dicing blade 100 on the silicon wafer 5, and further, the trimming of the dicing blade 100 is completed.
When the dicing saw controls the dicing blade 100 to scribe fifty second scribe grooves 50 that are arranged in parallel and at intervals on the surface of the sharpening plate 4, the dicing saw controls the speed at which the dicing blade 100 cuts the second scribe grooves 50 to be set in a progressive manner. Specifically, the dicing saw controls the dicing blade 100 to cut the first ten second cuts 50 on the silicon wafer 5 at a speed of 10mm/s, and after every ten second cuts 50, the dicing saw controls the speed at which the dicing blade 100 cuts the second cuts 50 on the silicon wafer 5 to increase by 10mm/s, i.e., the speed at which the dicing blade 100 cuts the second cuts 50 increases from 10mm/s to 50 mm/s. It should be noted that, when the dicing blade 100 cuts on the silicon wafer 5, the rotation speed of the spindle of the dicing saw is 40000 rpm.
In one embodiment, after step S40, the method further includes:
s41, according to the specification of the scribing knife, the qualified width standard of the second cutting groove is specified, the qualified front opening breakage standard of the second cutting groove is specified to be less than 5 mu m, and the qualified back opening breakage standard is specified to be less than 12 mu m;
and S42, measuring whether the width of the second cutting groove, the positive breakout and the negative breakout meet the standard by using a microscope, and if so, performing subsequent operation, and if not, performing repeated cutting.
The same tools for measuring the parameters of the second groove 50 as the first groove 40 are used for measuring the parameters using a microscope on a dicing saw, and the measurement methods are the same and are all measured using the measurement dotted line 70. However, the width standard of the second groove 50 and the standard of the forward chipping notch 60 are different from those of the first groove 40, and the width standard of the second groove 50 is also determined by the thickness of the dicing blade 100 and needs to be smaller than the thickness of the dicing blade 100 by 1 μm. For the second slot 50, the parameters of the front opening 60 and the back opening 61 of the second slot 50 are qualified only when the parameters meet the standards, generally, the front opening 60 of the second slot 50 is qualified when the diameter is smaller than 5 μm, and the back opening 61 of the second slot 50 is qualified when the diameter is smaller than 12 μm.
It should be noted that, whether the parameters of the first cutting groove 40 or the second cutting groove 50 are measured, the parameters of one or two cutting grooves which are finally cut are used as the standard. For the convenience of operation of workers or observation, a microscope is usually connected to a display screen, and when the cut groove is measured, the measurement dotted line 70 and the first cut groove 40 or the second cut groove 50 can be displayed on the display screen in an enlarged manner.
In an embodiment, when the dicing blade is trimmed in steps S20 and S40, cooling water is further required to be sprayed to the cutting portion of the dicing blade, the cooling water can flush away the cutting debris, the influence of the cutting debris on the trimming of the dicing blade is avoided, and meanwhile, the cooling water can also reduce the temperature of the contact position between the dicing blade and the blade grinding plate, and between the dicing blade and the silicon wafer, and can also ensure a good cutting environment.
It should be noted that parameters of the cooling water are also required, and the parameters include the resistance value of the cooling water and the ph value of the cooling water. In general, cooling water needs to be filtered to filter most trace elements, the trace elements may damage the surface of the dicing blade when the dicing blade is washed away, so that the surface of the dicing blade is uneven, and the resistance value of the cooling water after the trace elements are filtered is larger than 10M omega. Since the dicing blade is discolored if the cooling water is acidic, and is corroded if the cooling water is alkaline, it is also necessary to limit the PH (alkalinity acidity) of the cooling water to 6 to 8.
In one embodiment, the blade edge exposure amount of the dicing blade is measured before step S20 and after step S40, the former is the amount of blade edge exposure that needs to be measured, the latter is the amount of blade edge exposure that is measured after the dicing blade is trimmed, and the difference between the two is the amount of blade edge wear. The customer has a requirement on the blade exposure amount, so that the trimmed blade exposure amount needs to be measured, and then the standard of the customer is compared, and the exposure amount data can be stored in the scribing machine so as to be read when the cutter is repaired again.
It should be noted that before the trimming, a plurality of inspections are also required to eliminate other adverse effects generated during cutting, specifically:
(1) selecting a correct scribing cutter type and setting reasonable cutting parameters according to the cutting requirements of the product;
(2) before cutting, an operator needs to check the periphery of a placing platform and a rotating shaft of the dicing saw, and if impurities or foreign matters exist, the impurities are removed as soon as possible by using an air gun or a clamp;
(3) the operator must wear anti-static headgear, finger cot, anti-static wrist band.
In order to facilitate a clearer understanding of the method of repairing a blade in the embodiments of the present invention, a specific embodiment is given for further description.
Referring to the drawings, the knife repairing method comprises the following steps:
s100, fixing the sharpening plate 4, and installing the scribing cutter 100: referring to fig. 2, selecting a proper knife sharpening plate 4 to be installed on the scribing remembering working disc 1 for fixing, then selecting a corresponding scribing knife 100 according to the requirements of a customer, installing the scribing knife 100 on a main shaft of the scribing machine, and measuring the blade exposure of the scribing knife 100 to start to prepare for first knife repairing;
s200, utilizing a knife grinding plate 4 to repair a knife: referring to fig. 3, the dicing saw controls the dicing blade 100 to rotate at 32000rpm, cuts on the sharpening plate 4 at a traveling speed of 15mm/s to form a first cutting groove 40, and stops cutting after cutting a predetermined distance, thereby trimming the edge of the dicing blade 100 to greatly reduce the eccentricity and expose the abrasive. During cutting, cooling water needs to be sprayed at the cutting position between the scribing cutter 100 and the knife grinding plate 4, so that on one hand, chips generated by cutting are washed away, and on the other hand, the cutting position is cooled;
s300, measuring parameters of the first cutting groove 40 by using a microscope: referring to fig. 4, 5 and 6, the width of the first slot 40 and the positive breakout 60 thereof are measured by using three measurement dashed lines 70, any one of the three measurement dashed lines 70 can be measured, the selected measurement dashed line 70 needs to be reset to zero before measurement, that is, the measurement dashed line 70 is controlled to move to coincide with one side line of the opening of the first slot 40, then the corresponding value on the microscope is cleared, and then the measurement dashed line 70 is moved to the other side line of the opening of the first slot 40, at this time, the value correspondingly read on the microscope is the width of the first slot 40. The principle of measuring the positive breakout 60 is the same. When the scribing cutter 100 is trimmed by the cutter grinding plate 4, the width of the first cutting groove 40 needs to be consistent with the thickness of the scribing cutter 100, the size of the front break 60 needs to be less than 3 mu m, and if the size meets the standard, the subsequent steps are carried out, and if the size does not meet the standard, the recutting is carried out;
s400, taking off the knife sharpening plate 4, and fixing the silicon wafer 5: referring to fig. 7, when the first trimming of the dicing saw 100 by the sharpening plate 4 is qualified, the sharpening plate 4 is replaced with a silicon wafer 5, and a proper silicon wafer 5 is selected to be fixed on the working disc 1 of the dicing saw, and then the second trimming is prepared;
s500, utilizing a silicon wafer 5 to trim: referring to fig. 8, the spindle speed of the dicing saw is 40000rpm, the dicing blade 100 rotates to cut the second cutting grooves 50 on the silicon wafer 5, when the silicon wafer 5 is used for trimming, 50 second cutting grooves 50 need to be cut on the surface of the silicon wafer 5 by the dicing blade 100, the traveling speed of the dicing blade 100 when the first ten second cutting grooves 50 are cut is 10mm/s, and after every ten second cutting grooves 50 are cut, the traveling speed of the dicing blade 100 is increased by 10mm/s, so that the abrasive excessively exposed on the cutting edge of the dicing blade 100 is trimmed, and the cutting edge of the dicing blade 100 is sharpened. During cutting, cooling water is also required to be sprayed at the cutting position between the scribing cutter 100 and the silicon wafer 5, so that on one hand, scraps generated by cutting are washed away, and on the other hand, the cutting position is cooled;
s600, measuring parameters of the second cutting groove 50 by using a microscope: the parameters of the second slot 50 are measured in the same manner as the parameters of the first slot 40, using the dashed measurement line 70. Different from the above, the dimension of the back breakout 61 of the second slot 50 needs to be measured in addition to the width and the dimension of the front breakout 60, and the width standard of the second slot 50 needs to be smaller than the original thickness by 1 μm, the dimension of the front breakout 60 of the second slot 50 needs to be smaller than 5 μm, and the dimension of the back breakout 61 of the second slot 50 needs to be smaller than 12 μm, so that the tool repair can be completed when the standard is met, and the re-cutting is required when the standard is not met.
Therefore, in general, the trimming process of the saw 100 can be divided into two stages, the first stage is to trim the outer circle of the saw 100 by using the blade grinding plate 4, and the second stage is to trim the edge of the saw 100 sharper by using the silicon wafer 5.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A scribing knife repair process, comprising:
selecting a knife grinding plate, fixing the knife grinding plate on a working disc of a dicing saw, and installing a dicing saw on a main shaft of the dicing saw;
starting the dicing saw, controlling the dicing cutter to cut on the surface of the knife grinding plate along a certain length by the dicing saw to form a first cutting groove, stopping cutting after cutting the set length, and pausing the dicing saw;
taking down the knife grinding plate, selecting a silicon wafer, and mounting the silicon wafer in a cutting area of the dicing saw;
and starting the dicing saw again, controlling the dicing cutter to cut the surface of the silicon wafer along a certain length by the dicing saw to form a second cutting groove, stopping cutting after cutting for a set length, and suspending the dicing saw.
2. The saw blade trimming process according to claim 1, wherein the starting of the saw blade, the saw blade being controlled by the saw blade to cut along a certain length on the surface of the blade grinding plate to form a first cutting groove, the cutting being stopped after the cutting for a set length, the halting of the saw blade comprising: the scribing machine is used for controlling the scribing knife to cut from one end of the knife grinding plate to the other end of the knife grinding plate to form a first cutting groove, and the length direction of the first cutting groove is perpendicular to the end faces, at the head end and the tail end, of the first cutting groove on the knife grinding plate.
3. The saw blade break process as claimed in claim 2, wherein said saw machine controls said saw blade to cut from one end of said blade sharpening plate towards the other end thereof, and forming said first cut groove comprises: the scribing knife is controlled by the scribing machine to scribe ten first cutting grooves which are arranged in parallel on the surface of the knife sharpening plate, and the interval between every two adjacent first cutting grooves is 0.2 mm.
4. The saw blade break process of claim 2, wherein the saw machine controls the saw blade to cut from one end of the blade sharpening plate towards the other end thereof, and wherein forming the first kerf further comprises: the dicing saw controls the dicing blade to cut at a speed of 15 mm/s.
5. The saw blade trimming process according to claim 1, wherein the saw blade is controlled by the saw blade machine to cut along a certain length on the surface of the blade grinding plate to form a first cutting groove, the cutting is stopped after the cutting for a set length, and the saw blade machine further comprises:
according to the specification of the scribing knife, a qualified width standard of a first cutting groove is specified, and a qualified forward-collapse standard of the first cutting groove is specified to be less than 3 mu m;
and measuring whether the width of the first cutting groove and the positive breakout meet the standard or not by using a microscope, and if so, carrying out subsequent operation, and if not, carrying out repeated cutting.
6. The saw blade trimming process according to claim 1, wherein the dicing saw is restarted, the dicing saw is controlled by the dicing saw to cut the surface of the silicon wafer along a certain length to form a second cutting groove, the cutting is stopped after the set length is cut, and the halting of the dicing saw comprises: and the scribing cutter controls the scribing cutter to cut from one end of the silicon wafer to the other end of the silicon wafer to form a second cutting groove, and the length direction of the second cutting groove is perpendicular to the end surfaces of the sharpening plates at which the head end and the tail end of the second cutting groove are located.
7. The saw blade break process as claimed in claim 6, wherein said saw controls said saw blade to cut from one end of said silicon wafer towards the other end thereof, and wherein forming said second kerf comprises: and the scribing cutter controls the scribing cutter to scribe fifty parallel second cutting grooves on the surface of the cutter grinding plate, and the interval between every two adjacent second cutting grooves is 0.2. mm.
8. The saw blade trimming process of claim 6, wherein the saw controlling the saw blade to scribe fifty parallel second scribe grooves on the surface of the blade sharpening plate comprises: the scribing machine controls the scribing knife to cut the first ten second cutting grooves on the silicon wafer at the speed of 10mm/s, and the scribing machine controls the speed of the scribing knife to cut the second cutting grooves on the silicon wafer to be increased by 10mm/s after every ten second cutting grooves are cut.
9. The saw blade trimming process according to claim 1, wherein the dicing saw is restarted, the dicing saw is controlled by the dicing saw to cut the surface of the silicon wafer along a certain length to form a second cutting groove, the cutting is stopped after the set length is cut, and the halting of the dicing saw further comprises:
according to the specification of the scribing knife, the qualified width standard of a second cutting groove is specified, the qualified front opening breakage standard of the second cutting groove is specified to be less than 5 mu m, and the qualified back opening breakage standard is specified to be less than 12 mu m;
and measuring whether the width of the second cutting groove, the positive breakout and the negative breakout meet the standard or not by using a microscope, and if so, carrying out subsequent operation, and if not, carrying out repeated cutting.
10. The saw blade trimming process according to claim 1, wherein the controlling the saw blade to cut along a certain length on the surface of the blade grinding plate by the dicing saw to form a first cutting groove and controlling the saw blade to cut along a certain length on the surface of the silicon wafer by the dicing saw to form a second cutting groove further comprises: and spraying cooling water to the cutting part of the scribing knife.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110485160.XA CN113182947A (en) | 2021-04-30 | 2021-04-30 | Scribing cutter repairing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110485160.XA CN113182947A (en) | 2021-04-30 | 2021-04-30 | Scribing cutter repairing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113182947A true CN113182947A (en) | 2021-07-30 |
Family
ID=76983749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110485160.XA Pending CN113182947A (en) | 2021-04-30 | 2021-04-30 | Scribing cutter repairing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113182947A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5261385A (en) * | 1992-03-27 | 1993-11-16 | Dicing Technology Inc. | Abrasive cutting blade assembly with multiple cutting edge exposures |
| JP2000049120A (en) * | 1998-07-27 | 2000-02-18 | Disco Abrasive Syst Ltd | Cutting device |
| JP2007203429A (en) * | 2006-02-03 | 2007-08-16 | Disco Abrasive Syst Ltd | Dressing/truing board and dressing truing method |
| JP2011079112A (en) * | 2009-10-09 | 2011-04-21 | Mitsubishi Materials Corp | Apparatus and method for dressing cutting blade |
| CN104752311A (en) * | 2013-12-27 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | Silicon-on insulator substrate and manufacturing method thereof |
| CN106041321A (en) * | 2016-07-19 | 2016-10-26 | 北京沃尔德金刚石工具股份有限公司 | Cutter wheel repair method |
| JP2017213613A (en) * | 2016-05-30 | 2017-12-07 | 株式会社ディスコ | Dresser board and dressing method |
| CN107471062A (en) * | 2017-10-10 | 2017-12-15 | 扬州乾照光电有限公司 | A kind of cutting method |
| CN109128731A (en) * | 2018-09-25 | 2019-01-04 | 山东普信模具有限公司 | A kind of Press Tools for Automobiles trimming edge processing method |
| CN110842799A (en) * | 2019-11-19 | 2020-02-28 | 郑州磨料磨具磨削研究所有限公司 | Ceramic-metal composite binding agent grinding wheel and preparation method thereof |
| CN111633479A (en) * | 2020-06-15 | 2020-09-08 | 郑州磨料磨具磨削研究所有限公司 | Method for repairing scribing cutter for gallium arsenide wafer |
| CN112659003A (en) * | 2020-12-16 | 2021-04-16 | 郑州磨料磨具磨削研究所有限公司 | Self-sharpening superhard material grinding wheel and preparation method thereof |
-
2021
- 2021-04-30 CN CN202110485160.XA patent/CN113182947A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5261385A (en) * | 1992-03-27 | 1993-11-16 | Dicing Technology Inc. | Abrasive cutting blade assembly with multiple cutting edge exposures |
| JP2000049120A (en) * | 1998-07-27 | 2000-02-18 | Disco Abrasive Syst Ltd | Cutting device |
| JP2007203429A (en) * | 2006-02-03 | 2007-08-16 | Disco Abrasive Syst Ltd | Dressing/truing board and dressing truing method |
| JP2011079112A (en) * | 2009-10-09 | 2011-04-21 | Mitsubishi Materials Corp | Apparatus and method for dressing cutting blade |
| CN104752311A (en) * | 2013-12-27 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | Silicon-on insulator substrate and manufacturing method thereof |
| JP2017213613A (en) * | 2016-05-30 | 2017-12-07 | 株式会社ディスコ | Dresser board and dressing method |
| CN106041321A (en) * | 2016-07-19 | 2016-10-26 | 北京沃尔德金刚石工具股份有限公司 | Cutter wheel repair method |
| CN107471062A (en) * | 2017-10-10 | 2017-12-15 | 扬州乾照光电有限公司 | A kind of cutting method |
| CN109128731A (en) * | 2018-09-25 | 2019-01-04 | 山东普信模具有限公司 | A kind of Press Tools for Automobiles trimming edge processing method |
| CN110842799A (en) * | 2019-11-19 | 2020-02-28 | 郑州磨料磨具磨削研究所有限公司 | Ceramic-metal composite binding agent grinding wheel and preparation method thereof |
| CN111633479A (en) * | 2020-06-15 | 2020-09-08 | 郑州磨料磨具磨削研究所有限公司 | Method for repairing scribing cutter for gallium arsenide wafer |
| CN112659003A (en) * | 2020-12-16 | 2021-04-16 | 郑州磨料磨具磨削研究所有限公司 | Self-sharpening superhard material grinding wheel and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5238317B2 (en) | Silicon block grinding and polishing machine and silicon wafer processing method | |
| JP2022525521A (en) | Method for automatic process monitoring during continuous creation grinding | |
| CN103447786B (en) | Formed turning tool processing technology | |
| US5643052A (en) | Method for renewing grinding wheel surfaces and disk and machine for carrying out said method | |
| CN102347275B (en) | Method for sharpening blade of scribing machine | |
| KR20130102521A (en) | Scribing wheel and method for manufacturing the same | |
| US10232491B2 (en) | Retruing of a grinding wheel using EDM machine | |
| CN113182947A (en) | Scribing cutter repairing process | |
| CN110757261B (en) | Online debugging method for cutter machining equipment | |
| CN107336090B (en) | The method of saw blade secondary use | |
| KR101949604B1 (en) | Test method for thermal deformation according to continuous operation of machine tool | |
| CN108195703B (en) | Method for evaluating machining performance of repaired cutter | |
| US6981909B2 (en) | Method for conditioning superabrasive tools | |
| KR20130101763A (en) | Window glass manufacturing methods for mobile devices | |
| CN101417514B (en) | Titanium-alloy high-pressure compressor arc rabbet working-blade processing technique | |
| JPH0740172A (en) | Tool on which cutting-edge is formed and useage thereof | |
| JP7087817B2 (en) | How to cut the cover glass | |
| JP6998128B2 (en) | How to check the shape of the sample wafer and wafer | |
| CN108256216B (en) | Calculation method for cutting parameter range of repaired cutter | |
| JP2022507483A (en) | Disc-shaped tools and methods for machining workpieces, cutting devices, and the use of cutting, grinding, and polishing discs to generate surface structures on workpieces. | |
| CN111546138B (en) | Cutter changing method | |
| JP2001162426A (en) | Curved surface cutting device and curved surface cutting method | |
| CN111360698A (en) | Repairing method of high-precision grinding rod | |
| CN111113238A (en) | V-CUT processing technology for forming and processing V-shaped groove of aluminum substrate | |
| JPH07237136A (en) | Grinding wheel and cutting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210730 |