CN113162364B - Double-stator cylindrical linear motor based on semiconductor cooling fins - Google Patents

Double-stator cylindrical linear motor based on semiconductor cooling fins Download PDF

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Publication number
CN113162364B
CN113162364B CN202110491478.9A CN202110491478A CN113162364B CN 113162364 B CN113162364 B CN 113162364B CN 202110491478 A CN202110491478 A CN 202110491478A CN 113162364 B CN113162364 B CN 113162364B
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heat dissipation
semiconductor refrigerating
motor
semiconductor
inner stator
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CN113162364A (en
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郭亮
刘军辉
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Zhejiang Sci Tech University ZSTU
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Zhejiang Sci Tech University ZSTU
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K16/00—Machines with more than one rotor or stator
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/18—Casings or enclosures characterised by the shape, form or construction thereof with ribs or fins for improving heat transfer
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Motor Or Generator Cooling System (AREA)

Abstract

The invention discloses a double-stator cylindrical linear motor based on semiconductor refrigerating plate heat dissipation, which comprises a motor shell, an inner stator and a semiconductor refrigerating plate, wherein the inner stator is fixedly arranged in the motor shell, the semiconductor refrigerating plate comprises a semiconductor refrigerating plate cold end and a semiconductor refrigerating plate hot end, the semiconductor refrigerating plate cold end is contacted with one end of the inner stator, and the semiconductor refrigerating plate hot end is exposed out of the motor shell. According to the invention, the semiconductor refrigerating sheet transfers heat in the motor to the outside of the motor shell, so that the motor heat dissipation is enhanced, and the semiconductor refrigerating sheet has the advantages of no noise, no vibration, no refrigerant, small volume and light weight, and solves the technical problems of complex structure, high cost, increased motor volume and noise in the heat dissipation system of the motor in the prior art, thereby realizing the advantages of good motor heat dissipation effect, unaffected motor volume, weight and noise, economy and environmental protection.

Description

Double-stator cylindrical linear motor based on semiconductor refrigerating plate heat dissipation
Technical Field
The invention belongs to the technical field of permanent magnet linear motors, and particularly relates to a double-stator cylindrical linear motor based on semiconductor refrigeration fin heat dissipation.
Background
The double-stator cylindrical linear motor is used as a novel motor with compact structure and improved space utilization rate and power density, and is commonly used in scenes of important renewable energy sources characterized by reciprocating motion such as tide and wave energy.
The heat generated by key heating components, particularly windings, in the motor cannot be quickly transferred to a cooling motor shell due to the limitation of low heat conductivity materials such as insulating paint and air in the motor, so that a large amount of heat is accumulated in the key components of the motor to form a local high-temperature region. The heat generated in the motor operation process is quickly transferred to the outside by adopting the efficient and reliable heat dissipation system, so that the heat is prevented from accumulating on key parts of the motor, the motor is ensured to work at a proper temperature all the time, and the efficient heat dissipation system has important significance on the service life, efficiency and operation safety of the motor.
The heat dissipation is enhanced by providing the motor with a heat dissipation system, such as an air-cooled heat dissipation system, a liquid-cooled heat dissipation system, an evaporative cooling system.
The air cooling and radiating system can be divided into natural air cooling and forced air cooling according to whether an additional device for enhancing air flow is adopted, the natural air cooling does not need an additional power device, and heat exchange is carried out only through natural convection between the motor shell and surrounding air, so that the radiating efficiency is low. Forced air cooling generally utilizes a fan system to enhance heat exchange between the motor and external air, and the additional fan system greatly improves the heat dissipation efficiency of the motor compared with natural air cooling, but also increases the power consumption and noise of the motor system to a certain extent, and also increases the volume of the motor.
The liquid cooling heat dissipation system requires an additional circulating liquid path and a sealing system, and increases the cost and complexity of the motor system. Common liquid cooling heat dissipation system divide into water cooling heat dissipation system and oil cooling heat dissipation system, and water cooling heat dissipation system produces incrustation scale and corrodes the motor casing easily in long-term circulation process, consequently still need add additives such as corrosion resistance and anti foam in practical application, and oil cooling system then need strict filtration system to filter the oil medium to avoid impurity in the oil to cause the destruction to the insulating layer inside the motor, and oil cooling heat dissipation system's cost is expensive.
The evaporative cooling heat dissipation system utilizes the phase change circulation of the low-boiling-point cooling medium to realize efficient cooling of the motor. When a low-boiling-point and high-insulation-coefficient cooling medium is in contact with a heating component in the motor, the cooling medium absorbs a large amount of heat and is vaporized, the gaseous cooling medium is converted into a liquid state when the condenser is cooled, and the high-efficiency heat dissipation of the motor is realized by utilizing the gas-liquid phase change circulation of the cooling medium, but the structure is complex, and the volume and noise of the motor can be increased.
Therefore, the prior art has at least the technical problems that the heat dissipation system of the motor in the prior art is complex in structure and high in cost, and the volume and noise of the motor can be increased.
Disclosure of Invention
The embodiment of the application solves the technical problems that a heat dissipation system of a motor in the prior art is complex in structure and high in cost, and the volume and noise of the motor can be increased by providing the double-stator cylindrical linear motor based on the heat dissipation of the semiconductor refrigerating sheet.
The embodiment of the application provides a double-stator cylindrical linear motor based on semiconductor refrigerating plate heat dissipation, which comprises:
a motor housing;
the inner stator is fixedly arranged in the motor shell;
The semiconductor refrigerating piece comprises a semiconductor refrigerating piece cold end and a semiconductor refrigerating piece hot end, and the semiconductor refrigerating piece cold end and the semiconductor refrigerating piece hot end are connected through a semiconductor refrigerating piece P, N junction, wherein the semiconductor refrigerating piece cold end is contacted with one end of the inner stator, and the semiconductor refrigerating piece hot end is exposed out of the motor shell.
Furthermore, the inner stator is hollow to form a cavity, and the cavity is filled with a heat dissipation core.
Further, the cold end of the semiconductor refrigerating sheet is contacted with one end of the radiating core.
Further, the length of the heat dissipation core is the same as the length of the inner stator, that is, the heat dissipation core extends from one end of the inner stator to the other end of the inner stator.
Further, the shape of the cavity is cylindrical and coaxially arranged on the inner stator, the heat dissipation core is cylindrical, and the outer surface of the heat dissipation core is in close contact with the inner surface of the cavity.
Further, the heat dissipation core is a metal rod.
Further, the heat dissipation core is an aluminum rod or a copper rod.
Further, the cold end of the semiconductor refrigerating piece is fixed on one end of the heat dissipation core, and the area of the cold end of the semiconductor refrigerating piece is the same as the area of the end face of the heat dissipation core, which contacts one end.
Further, the area of the hot end of the semiconductor refrigerating sheet is larger than that of the cold end of the semiconductor refrigerating sheet.
Further, the hot end of the semiconductor refrigerating sheet is fixed on the outer end face of the motor shell, and projections of the hot end of the semiconductor refrigerating sheet on the outer end face of the motor shell are all located in the outer end face of the motor shell.
One or more technical solutions provided in the embodiments of the present application at least have the following technical effects or advantages:
(1) According to the embodiment of the application, the semiconductor refrigerating sheet is arranged on the motor, the cold end of the semiconductor refrigerating sheet is contacted with one end of the inner stator, and the hot end of the semiconductor refrigerating sheet is exposed out of the motor shell, so that the heat in the motor is transferred out of the motor shell, the heat dissipation of the motor is enhanced, and the technical problems that the structure is complex, the cost is expensive, the motor volume and the noise are increased in the heat dissipation system of the motor in the prior art are solved, the motor heat dissipation effect is good, the motor volume, the weight and the noise are not influenced, and the motor heat dissipation system has the advantages of economy and environmental protection.
(2) According to the embodiment of the application, the heat dissipation core is hollowed out in the middle of the inner stator and filled, so that the heat conduction capacity of the inner stator can be enhanced, the heat of the outer layer of the inner stator is conducted to the semiconductor refrigerating sheet for heat dissipation, and the heat dissipation effect is enhanced.
(3) According to the embodiment of the application, one end of the heat dissipation core is directly contacted with the cold end of the semiconductor refrigeration piece, and as the heat dissipation core has a good heat conduction effect, more heat can be conducted to the cold end of the semiconductor refrigeration piece, so that the heat dissipation effect is further improved.
(4) According to the embodiment of the application, the length of the radiating core is set to be the same as that of the inner stator, so that the overall heat conduction of the inner stator along the length direction is enhanced, and the radiating core can conduct more heat away from one end of the cold end of the semiconductor refrigerating plate to the cold end of the semiconductor refrigerating plate, so that the radiating effect is further improved.
(5) According to the embodiment of the application, the outer surface of the heat dissipation core and the inner surface of the cavity are closely arranged, so that the heat conduction is enhanced, and the heat dissipation effect is improved.
(6) According to the embodiment of the application, the heat dissipation core is arranged as the metal rod, and the metal rod has good heat conduction capacity, so that the heat dissipation effect of the motor is enhanced.
(7) According to the embodiment of the application, the area of the cold end of the semiconductor refrigeration piece is set to be the same as the area of the end face at the end contacted with the heat dissipation core, so that the heat conduction area between the cold end of the semiconductor refrigeration piece and the heat dissipation core is enlarged, and the heat dissipation effect is improved.
(8) According to the embodiment of the application, the heat dissipation area is increased by enlarging the area of the hot end of the semiconductor refrigerating sheet, so that the heat dissipation effect is improved.
(9) According to the embodiment of the application, the hot end of the semiconductor refrigerating sheet is arranged in the outer end face of the motor shell, so that the effect of protecting the hot end of the semiconductor refrigerating sheet is achieved.
Drawings
Fig. 1 is a schematic structural diagram of a dual-stator cylindrical linear motor based on heat dissipation of semiconductor cooling fins according to an embodiment of the present application;
Fig. 2 is a schematic diagram of semiconductor refrigeration in the prior art.
Detailed Description
The embodiment of the application solves the technical problems that a heat dissipation system of a motor in the prior art is complex in structure and high in cost, and the volume and noise of the motor can be increased by providing the double-stator cylindrical linear motor based on the heat dissipation of the semiconductor refrigerating sheet.
The technical scheme in the embodiment of the application aims to solve the problems, and the overall thought is as follows:
The semiconductor refrigerating sheet is arranged on the motor, the cold end of the semiconductor refrigerating sheet is contacted with one end of the inner stator, and the hot end of the semiconductor refrigerating sheet is exposed out of the motor shell, so that the heat in the motor is transferred out of the motor shell, the heat dissipation of the motor is enhanced, and the technical problems that the structure is complex, the cost is expensive, the motor volume and the noise are increased in the heat dissipation system of the motor in the prior art are solved, the heat dissipation effect of the motor is good, the motor volume, the weight and the noise are not affected, and the economic and environment-friendly effects are achieved;
The heat conducting capacity in the inner stator can be enhanced by hollowing out the middle of the inner stator and filling the heat radiating core, and the heat of the outer layer of the inner stator is conducted to the semiconductor refrigerating sheet for heat radiation, so that the heat radiating effect is enhanced;
One end of the heat dissipation core is directly contacted with the cold end of the semiconductor refrigeration piece, and as the heat dissipation core has a good heat conduction effect, more heat can be conducted to the cold end of the semiconductor refrigeration piece, so that the heat dissipation effect is further improved;
Through with the length setting of heat dissipation core with the length of interior stator is the same, promptly the heat dissipation core is followed the one end of interior stator extends to the other end of interior stator has strengthened interior stator is along length direction's whole heat conduction, the heat dissipation core can be kept away from the heat conduction of semiconductor refrigeration piece cold junction one end more to on the semiconductor refrigeration piece cold junction, further improved the radiating effect.
In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.
Fig. 1 is a double stator cylindrical linear motor based on heat dissipation of semiconductor cooling fins according to an embodiment of the present application, and as shown in fig. 1, the motor includes a motor housing 42, an inner stator 12 and semiconductor cooling fins.
As shown in fig. 1, the motor housing 42 is provided with an inner stator 12, an outer stator 11, an inner winding 22 on the inner stator 12, an outer winding 21 on the outer stator 11, a rotatable rotor 50 between the inner stator 12 and the outer stator 11, and an inner permanent magnet 32 and an outer permanent magnet 31 between the inner stator 12 and the outer stator 11, wherein the inner stator 12 is fixedly disposed on a central shaft of the motor housing 42, and the motor housing 42 is further provided with a mechanical support structure 41.
The semiconductor refrigerating sheet comprises a semiconductor refrigerating sheet cold end 70 and a semiconductor refrigerating sheet hot end 90, and the semiconductor refrigerating sheet cold end 70 and the semiconductor refrigerating sheet hot end 90 are connected through a semiconductor refrigerating sheet P, N junction 80 and a semiconductor refrigerating sheet 90, wherein the semiconductor refrigerating sheet cold end 70 is tightly contacted with the end face of one end of the inner stator 12 so as to improve the heat conduction effect, and the semiconductor refrigerating sheet hot end 90 is exposed out of the motor shell 42.
Further, the cold end 70 of the semiconductor refrigeration sheet is directly affixed (e.g., bonded) to an end face of one end of the inner stator 12.
Semiconductor refrigeration, i.e., thermoelectric refrigeration, is also referred to as thermoelectric refrigeration, and thermoelectric refrigeration is referred to as semiconductor refrigeration because the materials used for thermoelectric refrigeration are all basically semiconductor materials. The semiconductor refrigerating sheet has the characteristics of no noise, no vibration, no refrigerant, small volume, light weight and the like, and is reliable in work, simple and convenient to operate and easy to adjust the cold quantity.
Semiconductor materials have the property of thermoelectric energy conversion, and when direct current is applied, heat reaches the other end from one end of the material to generate a refrigeration effect. Semiconductor refrigeration is a novel refrigeration technology based on five thermoelectric effects of Fourier effect, joule effect, seebeck effect, thomson effect and Peltier effect.
Fig. 2 is a schematic diagram of semiconductor refrigeration in the prior art, as shown in fig. 2, two different semiconductor materials are connected in series to form a couple to form P, N junction b, when direct current passes through, the two ends of the couple suck out and release heat due to the temperature difference effect, and electric energy is converted into heat energy. The cold end current direction is N-P, the heat absorption and refrigeration, the hot end current direction is P-N, the heat release and the temperature rise. When dc current passes through the junction b of semiconductor P, N, a thermoelectric effect will be created at the junction interface. Semiconductor refrigeration is mainly the application of the peltier effect, which generates heat Q p as follows:
Qp＝(αp-αn)TI
Wherein alpha p、αn is the thermoelectric power ratio of the P-type junction and the N-type junction, T is the absolute temperature of the joint, and I is the current intensity generated by direct current in the loop.
In addition to the peltier effect, there are two irreversible effects, namely the fourier effect and the joule effect, in which the heat generated by the fourier effect, Q F:
Wherein lambda is the heat conductivity coefficient of the conductor, s is the effective sectional area of the conductor, l is the effective length of the conductor, T h is the absolute temperature of the hot end a, T c is the absolute temperature of the cold end c, K is the total heat conductivity of the conductor, and DeltaT is the temperature difference between the cold end and the hot end.
Heat generated by joule effect Q J:
where R is the total resistance of the conductor and ρ is the resistivity of the conductor.
In the refrigeration P, N junction couple, one end of the P, N junction b is a cold end a, and the other end is a hot end c, so that a temperature difference exists at two ends of the P, N junction b, and due to the existence of the temperature difference, meanwhile, due to the fact that joule heat is generated when current passes through a couple arm, the local temperature rises, and the heat can be transmitted from the hot end c to the cold end a. If equilibrium is reached at P, N junction b, then the heat conducted by hot end c to cold junction Q Heat of the body can be represented by a one-dimensional Fourier equation:
The semiconductor refrigeration efficiency is affected by the heat dissipation effect of the hot end c. When the semiconductor refrigerating device is actually used, the cold end a is attached to an object to be cooled to absorb heat, and the heat is transmitted to the hot end c and must be timely emitted to maintain the normal work of the semiconductor refrigerating device. When the system works, the heat dissipation density of the cold end a and the hot end c can reach 10 4W/m2, so that the effective operation of the system is strongly dependent on the heat transfer performance of the cold end and the hot end.
According to the embodiment of the application, the semiconductor refrigerating sheet is arranged on the motor, the cold end 70 of the semiconductor refrigerating sheet is contacted with one end of the inner stator 12, and the hot end 90 of the semiconductor refrigerating sheet is exposed out of the motor shell 42, so that the heat in the motor is transferred out of the motor shell, the heat dissipation of the motor is enhanced, and the technical problems that the structure is complex, the cost is high, the motor volume and the noise can be increased in the heat dissipation system of the motor in the prior art are solved, the motor heat dissipation effect is good, the motor volume, the weight and the noise are not influenced, and the motor heat dissipation system has the advantages of economy and environmental protection.
In an embodiment of the present application, the inner stator 12 is hollow to form a cavity, and the cavity is filled with the heat dissipation core 60, so that the heat conduction capability of the heat dissipation core 60 is better, and the heat conduction capability of the inner stator 12 can be enhanced, and the heat of the outer layer of the inner stator 12 is conducted to the semiconductor cooling fin for heat dissipation.
In an embodiment of the present application, the first end of the heat dissipation core 60 contacts the cold end 70 of the semiconductor refrigeration sheet, and since the heat dissipation core 60 has a better heat conduction effect, more heat can be conducted to the cold end 70 of the semiconductor refrigeration sheet, thereby improving the heat dissipation effect.
In an embodiment of the present application, the length of the heat dissipation core 60 is the same as the length of the inner stator 12, that is, the heat dissipation core 60 extends from one end of the inner stator to the other end of the inner stator 12, so that the overall heat conduction of the inner stator 12 along the length direction is enhanced, and the heat dissipation core 60 can conduct more heat away from one end of the cold end 70 of the semiconductor refrigeration sheet to the cold end 70 of the semiconductor refrigeration sheet, thereby improving the heat dissipation effect.
In summary, the middle of the inner stator 12 is hollowed out and filled with the heat dissipation core 60, the length of the heat dissipation core 60 is the same as that of the inner stator 12, and one end of the heat dissipation core 60 contacts with the cold end 70 of the semiconductor refrigeration sheet, so that heat is conducted to the cold end 70 of the semiconductor refrigeration sheet through the heat dissipation core 60, and finally, heat is transferred to the outside of the motor housing 42 through the semiconductor heating end 90, thereby enhancing the heat dissipation effect inside the motor.
In an embodiment of the present application, the cavity is cylindrical and coaxially opened on the inner stator 12, the heat dissipation core 60 is cylindrical and coaxially disposed in the cavity, the axial length of the heat dissipation core 60 is the same as the axial length of the inner stator 12, and the outer surface of the heat dissipation core 60 is closely contacted with the inner surface of the cavity, so as to enhance the heat conduction effect.
In an embodiment of the present application, the heat dissipation core 60 is a metal rod, which has a good heat conduction capability, so as to enhance the heat dissipation effect of the motor, and in particular, the heat dissipation core 60 is an aluminum rod or a copper rod with a high heat conduction coefficient.
In an embodiment of the present application, the area of the cold end 70 of the semiconductor cooling fin is the same as the area of the end surface of the end of the heat dissipation core 60 that contacts with the cold end 70 of the semiconductor cooling fin, so as to increase the heat conduction area between the cold end 70 of the semiconductor cooling fin and the heat dissipation core 60 as much as possible, and improve the heat dissipation effect.
In an embodiment of the present application, the area of the hot end 90 of the semiconductor refrigeration sheet is larger than the area of the cold end 70 of the semiconductor refrigeration sheet, and since the hot end 90 of the semiconductor refrigeration sheet is located outside the motor housing 42 and is not limited by the internal structure of the motor, the heat dissipation area can be increased as much as possible, thereby improving the heat dissipation effect.
In an embodiment of the present application, the semiconductor refrigeration sheet hot end 90 is fixed on the outer end surface of the motor housing 42, and the projections of the semiconductor refrigeration sheet hot end 90 on the outer end surface of the motor housing 42 are all located inside the outer end surface of the motor housing 42, that is, the outer edge of the semiconductor refrigeration sheet hot end 90 does not exceed the outer edge of the outer end surface of the motor housing 42, so as to avoid the semiconductor refrigeration sheet hot end 90 from being damaged.
Experiment verification
The three-dimensional thermal analysis is performed on the motor, compared with the motor before the optimization (before the optimization for short) without the semiconductor refrigerating sheet arranged according to the embodiment, the motor (after the semiconductor refrigerating sheet is added for short) provided with the semiconductor refrigerating sheet, the highest temperature of each part in the motor is shown in the table 1, the highest temperature of the inner stator before the optimization is 179.033 ℃, the highest temperature of the inner stator of the motor after the semiconductor refrigerating sheet is added is 105.272 ℃, the temperature is reduced by 69.355 ℃ compared with the temperature before the optimization, the cooling effect is quite obvious, and the temperature of other parts of the motor is obviously reduced.
Table 1 maximum temperature of each component of the motor
Therefore, the motor provided by the embodiment of the application has better heat dissipation capacity due to the arrangement of the semiconductor refrigerating sheet.
One or more technical solutions provided in the embodiments of the present application at least have the following technical effects or advantages:
(1) According to the embodiment of the application, the semiconductor refrigerating sheet is arranged on the motor, the cold end 70 of the semiconductor refrigerating sheet is contacted with one end of the inner stator, and the hot end 90 of the semiconductor refrigerating sheet is exposed out of the motor shell 42, so that the heat in the motor is transferred out of the motor shell, the heat dissipation of the motor is enhanced, and the technical problems that the structure is complex, the cost is high, the motor volume and the noise can be increased in the heat dissipation system of the motor in the prior art are solved, the motor heat dissipation effect is good, the motor volume, the weight and the noise are not influenced, and the motor is economical and environment-friendly.
(2) According to the embodiment of the application, the middle of the inner stator 12 is hollowed and filled with the upper radiating core 60, and the radiating core 60 has good heat conduction capacity, so that the heat conduction capacity in the inner stator 12 can be enhanced, the heat of the outer layer of the inner stator 12 is conducted to the semiconductor refrigerating sheet for radiating, and the radiating effect is enhanced.
(3) According to the embodiment of the application, one end of the heat dissipation core 60 is directly contacted with the cold end 70 of the semiconductor refrigeration piece, and as the heat dissipation core 60 has a good heat conduction effect, more heat can be conducted to the cold end 70 of the semiconductor refrigeration piece, so that the heat dissipation effect is further improved.
(4) According to the embodiment of the application, the length of the heat dissipation core 60 is set to be the same as that of the inner stator 12, so that the overall heat conduction of the inner stator 12 along the length direction is enhanced, and the heat dissipation core 60 can conduct more heat away from one end of the cold end 70 of the semiconductor refrigeration piece to the cold end 70 of the semiconductor refrigeration piece, thereby further improving the heat dissipation effect.
(5) According to the embodiment of the application, the outer surface of the heat dissipation core 60 and the inner surface of the cavity are closely arranged, so that the heat conduction is enhanced, and the heat dissipation effect is improved.
(6) According to the embodiment of the application, the heat dissipation core 60 is arranged as the metal rod, and the metal rod has good heat conduction capability, so that the heat dissipation effect of the motor is enhanced.
(7) According to the embodiment of the application, the area of the cold end 70 of the semiconductor refrigeration piece is set to be the same as the area of the end surface of the end contacted with the heat dissipation core 60, so that the heat conduction area between the cold end 70 of the semiconductor refrigeration piece and the heat dissipation core 60 is enlarged, and the heat dissipation effect is improved.
(8) According to the embodiment of the application, the heat dissipation area is increased by enlarging the area of the hot end 90 of the semiconductor refrigeration piece, so that the heat dissipation effect is improved.
(9) The embodiment of the application plays a role in protecting the hot end 90 of the semiconductor refrigeration piece by arranging the hot end 90 of the semiconductor refrigeration piece inside the outer end surface of the motor shell 42.
It will be understood that, although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of example embodiments.
Terms of orientation such as up, down, left, right, front, rear, front, back, top, bottom, etc. mentioned or possible to be mentioned in the present specification are defined with respect to the configurations shown in the drawings, which are relative concepts, and thus may be changed according to different positions and different use states thereof. These and other directional terms should not be construed as limiting terms.
While the application has been described with respect to preferred embodiments thereof, it will be understood by those skilled in the art that various modifications and additions may be made without departing from the scope of the application. Those skilled in the art will appreciate that many modifications, adaptations and variations of the present application can be made using the techniques disclosed herein without departing from the spirit and scope of the application, and that many modifications, adaptations and variations of the present application are within the scope of the application as defined by the appended claims.

Claims (6)

1. Double-stator cylindrical linear motor based on semiconductor refrigeration piece heat dissipation, its characterized in that, the motor includes:
a motor housing;
the inner stator is fixedly arranged in the motor shell;
The semiconductor refrigerating piece comprises a semiconductor refrigerating piece cold end and a semiconductor refrigerating piece hot end, and the semiconductor refrigerating piece cold end and the semiconductor refrigerating piece hot end are connected through a semiconductor refrigerating piece P, N junction, wherein the semiconductor refrigerating piece cold end is contacted with one end of the inner stator, and the semiconductor refrigerating piece hot end is exposed out of the motor shell;
The inner stator is internally hollow to form a cavity, the cavity is coaxial with the inner stator, and a heat dissipation core is filled in the cavity;
the cold end of the semiconductor refrigerating sheet is fixed on one end of the radiating core, the area of the cold end of the semiconductor refrigerating sheet is the same as the area of the end face of the radiating core, which is in contact with one end, and the area of the hot end of the semiconductor refrigerating sheet is larger than the area of the cold end of the semiconductor refrigerating sheet.
2. The dual stator cylindrical linear motor based on heat dissipation of semiconductor refrigerating fin as set forth in claim 1, wherein the length of the heat dissipation core is the same as the length of the inner stator, i.e., the heat dissipation core extends from one end of the inner stator to the other end of the inner stator.
3. The dual stator cylindrical linear motor based on semiconductor cooling fin heat dissipation as set forth in claim 1, wherein the shape of the cavity is a cylinder coaxially opened on the inner stator, the heat dissipation core is in a cylinder shape, and the outer surface of the heat dissipation core is in close contact with the inner surface of the cavity.
4. The dual stator cylindrical linear motor based on heat dissipation of semiconductor refrigerating fin as set forth in claim 1, wherein the heat dissipation core is a metal rod.
5. The dual stator cylindrical linear motor based on semiconductor cooling fin heat dissipation according to claim 1, wherein the heat dissipation core is an aluminum rod or a copper rod.
6. The dual stator cylindrical linear motor based on semiconductor refrigeration fin heat dissipation as claimed in claim 1, wherein the semiconductor refrigeration fin hot end is fixed on the outer end face of the motor housing, and projections of the semiconductor refrigeration fin hot end on the outer end face of the motor housing are all located in the outer end face of the motor housing.
CN202110491478.9A 2021-05-06 2021-05-06 Double-stator cylindrical linear motor based on semiconductor cooling fins Active CN113162364B (en)

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CN202110491478.9A CN113162364B (en) 2021-05-06 2021-05-06 Double-stator cylindrical linear motor based on semiconductor cooling fins

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Application Number Priority Date Filing Date Title
CN202110491478.9A CN113162364B (en) 2021-05-06 2021-05-06 Double-stator cylindrical linear motor based on semiconductor cooling fins

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CN113162364A CN113162364A (en) 2021-07-23
CN113162364B true CN113162364B (en) 2025-05-16

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