CN113130730A

CN113130730A - Light emitting device packaging method and light emitting device

Info

Publication number: CN113130730A
Application number: CN202010048491.2A
Authority: CN
Inventors: 施华平; 孙平如; 柯有谱; 苏宏波; 李运华; 邢美正
Original assignee: Shenzhen Jufei Optoelectronics Co Ltd
Current assignee: Shenzhen Jufei Optoelectronics Co Ltd
Priority date: 2020-01-16
Filing date: 2020-01-16
Publication date: 2021-07-16

Abstract

The application provides a light-emitting device packaging method which comprises the steps of providing a supporting piece, wherein the supporting piece comprises a first breadth, a second breadth opposite to the first breadth and a plurality of through holes arranged at intervals, and the plurality of through holes penetrate through the first breadth and the second breadth; filling or injecting a conductive heat dissipation material into the through holes to form a conductive piece; the conductive parts comprise conductive bodies and conductive extension parts, the conductive bodies are arranged in the through holes, cover the first breadth with the conductive extension parts and are connected with the conductive bodies, and the conductive extension parts of two adjacent conductive parts in the three conductive parts are connected into a whole. Mounting an LED chip of at least one light-emitting device on the first breadth or one side of the conductive piece, which is adjacent to the first breadth, and packaging the support piece and the LED chip; and cutting the support member to obtain a plurality of light emitting devices. In the working process of the light-emitting device, heat generated by the LED chip can be dissipated through the through holes. The present application also provides a light emitting device.

Description

Light emitting device packaging method and light emitting device

Technical Field

The present application relates to the field of semiconductor packaging technology, and in particular, to a light emitting device packaging method and a light emitting device.

Background

Light emitting devices have become one of semiconductor materials that are widely used in the field of backlights such as illumination and liquid crystal displays. Before the light-emitting device is applied to a circuit, a chip of the light-emitting device needs to be packaged to protect the chip. At present, chip packaging of a light emitting device mainly adopts a mode that a chip is fixed on a conductive plane substrate in an injection molding mode.

During operation of the light emitting device, the chip generates heat. The traditional packaging mode makes the chip unable to radiate better, which affects the service life of the chip.

Disclosure of Invention

The application discloses a light-emitting device packaging method which can solve the technical problem that a chip cannot be well cooled in a traditional packaging mode, and prolongs the service life of the chip.

In a first aspect, the present application provides a light emitting device packaging method, including:

providing a supporting part, wherein the supporting part comprises a first breadth, a second breadth opposite to the first breadth and a plurality of through holes arranged at intervals, and the through holes penetrate through the first breadth and the second breadth;

filling or injecting a conductive heat dissipation material into the through holes to form a conductive piece, wherein the conductive heat dissipation material at least extends to cover the surface of the supporting piece close to the through holes to form a conductive extension part;

mounting at least one LED chip of the light-emitting device on the first breadth or one side of the conductive piece, which is adjacent to the first breadth, and packaging the support piece and the LED chip;

and cutting the support piece to obtain a plurality of light-emitting devices.

In the working process of the light-emitting device, the heat generated by the LED chip can be dissipated through the through holes. Meanwhile, the packaging method of the light-emitting device meets the production and preparation requirements of a production line, and saves materials and labor cost.

In a second aspect, the present application further provides a light emitting device, the light emitting device includes a supporting member and an LED chip, the supporting member includes a first breadth, a second breadth opposite to the first breadth, and a plurality of through holes arranged at intervals, the plurality of through holes penetrate through the first breadth and the second breadth, conductive members are respectively arranged in the plurality of through holes, the LED chip is bonded to the first breadth or one side of the conductive member adjacent to the first breadth through a solid crystal glue, the supporting member and the LED chip are packaged in a separation film, the separation film is filled with a fluorescent glue or a packaging glue, a single LED chip corresponds to three adjacent conductive members, each conductive member includes a conductive body and a conductive extension portion, the conductive body is arranged in the through hole, covers the first breadth with the conductive extension portion and is connected with the conductive body, the conductive extension parts of two adjacent conductive pieces in the three conductive pieces are connected into a whole, the conductive extension parts are electrically connected with the first electrode through a conductive line, and the conductive extension part of the rest conductive piece in the three conductive pieces is electrically connected with the second electrode.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for a person skilled in the art to obtain other drawings based on the drawings without any inventive exercise.

Fig. 1 is a flowchart provided in a first embodiment of the present application.

Fig. 2 is a schematic view of a support member according to a first embodiment of the present disclosure.

Fig. 3 is a schematic view of a conductive member according to a first embodiment of the present application.

Fig. 4 is a schematic view of a die attach adhesive according to a first embodiment of the present disclosure.

Fig. 5 is a schematic view of an LED chip provided in the first embodiment of the present application.

Fig. 6 is a schematic view of an LED chip provided in a second embodiment of the present application.

Fig. 7 is a schematic view of a conductive device according to an embodiment of the present application.

Fig. 8 is a schematic view of a conductive member according to a third embodiment of the present application.

Fig. 9 is a schematic view of an LED chip according to a fourth embodiment of the present application.

Fig. 10 is a schematic view of a package according to a first embodiment of the present application.

Fig. 11 is a schematic cutting view provided in the first embodiment of the present application.

Fig. 12 is a schematic view of a light emitting device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Referring to fig. 1 to 5 together, fig. 1 is a flowchart illustrating a method for packaging a light emitting device according to a first embodiment of the present disclosure; FIG. 2 is a schematic view of a support member according to a first embodiment of the present application; fig. 3 is a schematic view of a conductive member according to a first embodiment of the present application; fig. 4 is a schematic view of a die attach adhesive according to a first embodiment of the present disclosure; fig. 5 is a schematic view of an LED chip provided in the first embodiment of the present application. The light emitting device packaging method includes: steps S101, S102, S103, and S104, and steps S101, S102, S103, and S104 will be described in detail as follows.

S101, providing a support 11;

the supporting member 11 comprises a first breadth 11a, a second breadth 11b opposite to the first breadth 11a, and a plurality of through holes 111 arranged at intervals, wherein the plurality of through holes 111 penetrate through the first breadth 11a and the second breadth 11 b;

s102, filling or injecting a conductive heat dissipation material into the plurality of through holes 111 to form a conductive member 112;

it should be noted that the conductive heat dissipation material at least extends to the surface of the supporting member 11 close to the through hole 111 to form a conductive extension portion 112 b. In some embodiments, the conductive extension 112b may extend to the surface of the die attach position in the support 11, such as the surface of a metal pad, or may extend directly to the surface of the support 11, and the LED chip 12 is die attached directly to the surface of the conductive extension.

The conductive member 112 formed by the method of the present application includes a conductive body 112a and a conductive extension 112b, the conductive body 112a is disposed in the through hole 111, and the conductive extension 112b covers the surface of the first surface 11 a. A plurality of the conductive members 112 may be connected to each other by the adjacent conductive extension portions 112 b. As shown in fig. 8, the conductive members 112 are grouped into three groups for packaging one LED chip 12, and the conductive members 112 serve as conductive traces for connecting the LED chips 12. Specifically, two of the conductive members 112 are connected into a whole through the adjacent conductive extension portions 112b therebetween, and are used as a die bonding portion and a positive electrode or a negative electrode of an LED circuit to die bond one LED chip 12. The other conductive member 112 is used as a negative electrode or a positive electrode of the circuit of the light emitting device 1 and is connected to the LED chip 12 through a conducting wire 13. Thus, the conductive member 112 serves as a circuit layer of the light emitting device 1, and has good electrical conductivity and heat dissipation, and the conductive extension portion 112b can increase the heat dissipation area of the LED chip 12, thereby further improving the heat dissipation effect.

Of course, the distribution manner of the conductive members 12 in the embodiment of the present application is not limited to this, the conductive extension portions 112b may be distributed on the surface of one conductive body 112a, or may be connected on the surface of more than two conductive pillar bodies 112a through the conductive extension portions 112b, and may be set as required, as long as the conductive extension portions 112b do not connect the positive electrode and the negative electrode of the circuit of the light emitting device 1 to form a short circuit, which all belong to the extended embodiments of the present application.

S103, mounting at least one LED chip 12 of the light emitting device 1 on the first surface 11a or one side of the conductive member 112 adjacent to the first surface 11a, and encapsulating the supporting member 11 and the LED chip 12;

and S104, cutting the support member 11 to obtain a plurality of light-emitting devices 1.

Specifically, the material of the support 11 may be, but is not limited to, an insulating material or a non-insulating metal material, such as a resin, a composite resin, alumina, aluminum nitride, zirconia, zirconium nitride, titanium oxide, titanium nitride, or a mixture containing these materials. The supporting member 11 is used for bearing and supporting the conductive member 112 and the LED chip 12, and may further include a metal pad for die bonding.

Specifically, the conductive heat dissipation material filled or injected in the plurality of through holes 111 includes, but is not limited to, copper paste, copper pillars, or conductive paste, and forms the conductive member 112. The conductive member 112 has good electrical conductivity and heat dissipation. In one possible embodiment, the through hole 111 may be filled with copper paste, a copper pillar, or a conductive paste may be injected into the through hole 111 by a glue injection method to form the conductive device 112. The conductive member 112 is connected to the first surface 11a and the second surface 11b, and is configured to bear the LED chip 12, and perform the functions of electrical conduction and heat dissipation, so that the LED chip 12 is powered on to emit light, and heat generated by light emission is conducted and dissipated through the conductive pillar. Preferably, the different conductive extensions 112b are connected between two adjacent conductive members 112 near the cutting position.

Specifically, the die attach adhesive 113 may be, but is not limited to, an insulating adhesive, a silver adhesive, a solder paste, or a flux. The die bonding adhesive 113 is dropped to the first surface 11a or the side of the conductive member 112 adjacent to the first surface 11a by a dispensing needle, or is disposed on the first surface 11a or the side of the conductive member 112 adjacent to the first surface 11a by a steel screen printing method. The steel mesh is a patterned baffle, and an accommodating space is formed in the arrangement area of the die attach adhesive 113 to accommodate the die attach adhesive 113.

Specifically, the LED chip 12 is generally a chip of the light emitting device 1, and may be other chips, which is not limited herein. The heat generated by the LED chip 12 during operation is dissipated from the second surface 11b through the conductive member 112.

It is understood that, in the present embodiment, during the operation of the light emitting device 1, the heat generated by the LED chip 12 can be dissipated through the plurality of through holes 111. Meanwhile, the packaging method of the light-emitting device meets the production and preparation requirements of a production line, and saves materials and labor cost.

In a possible embodiment, the conditions for baking the die bond paste 113 include: keeping the temperature at 170 ℃ and baking for 2 hours.

Specifically, in this embodiment, the die bond paste 113 is an insulating paste or a silver paste. The die bond paste 113 is melted and solidified by baking and is fully bonded to the LED chip 12 and the support 11.

In a possible embodiment, the conditions for baking the die bond paste 113 include: in the nitrogen environment, the baking temperature is 300 ℃, and the baking time is 30-50 seconds.

Specifically, in the present embodiment, the die attach adhesive 113 includes solder paste and flux. And baking in a nitrogen environment to prevent the metal in the die bond paste 113 from being oxidized. The baking temperature is gradually increased from 0 ℃ to the baking temperature in the baking time and is divided into a first stage, a second stage, a third stage and a fourth stage. The first stage, the second stage, the third stage, and the fourth stage will be described in detail below.

In the first stage, the supporting member 11 is preheated, and the moisture of the supporting member 11 is evaporated and cleaned. A part of the solvent of the die bond 113 is evaporated to activate the die bond 113.

And in the second stage, the baking temperature reaches a temperature threshold and is kept, and the temperature threshold is smaller than the baking temperature, so that the support 11 and the LED chip 12 are prevented from being directly damaged by being directly heated to the baking temperature. Meanwhile, the temperature difference among the support member 11, the LED chip 12, and the die attach adhesive 113 is reduced. The solvent of the die bond adhesive 113 is evaporated to be clean.

And in the third stage, when the baking temperature reaches the baking temperature, the die bond paste 113 is liquefied and fully contacts the support 11 and the LED chip 12. The duration of the third stage is shorter than that of the first stage and the second stage, so that the support 11 and the LED chip 12 are prevented from being damaged by continuous high temperature.

And a fourth stage, stopping baking, and cooling and solidifying the die attach adhesive 113 to bond the LED chip 12 with the support member 11 through the die attach adhesive 113.

It can be understood that, in this embodiment, the baking temperature is controlled, so that the loss of the component due to the excessively high temperature is avoided. Meanwhile, the supporting piece 11 and the LED chip 12 are preheated, and the die attach adhesive 113 is activated, so that the LED chip 12 is better bonded with the supporting piece 11 through the die attach adhesive 113.

In the following drawings, the die bond adhesive 113 is omitted for illustration, but it is not meant that the die bond adhesive 113 does not fix the LED chip 12. When the die attach adhesive 113 has a conductive property, the LED chip 12 may be electrically connected to the conductive member 112 through the die attach adhesive 113.

In a possible implementation manner, please refer to fig. 6, and fig. 6 is a schematic diagram of an LED chip according to a second implementation manner of the present application. The LED chip 12 includes a first electrode 12a and a second electrode 12b, wherein the first electrode 12a is a positive electrode and the second electrode 12b is a negative electrode, or the first electrode 12a is a negative electrode and the second electrode 12b is a positive electrode. The bonding of the LED chips 12 to the die attach adhesive 113 includes: the first electrode 12a and the second electrode 12b are arranged away from the first web 11a of the support 11. Conductive lines 13 are provided, and the conductive lines 13 electrically connect the first electrode 12a and the second electrode 12b to different conductive members 112, respectively.

Specifically, in the present embodiment, the first electrode 12a and the second electrode 12b are located on one side of the light emitting direction of the LED chip 12, so that the current diffusion is stable, and the uniform light emission effect is achieved. The conducting wires 13 electrically connect the first electrode 12a and the second electrode 12b to different conducting members 112, respectively, so that the LED chip 12 operates normally when connected to a circuit.

In another possible implementation manner, please refer to fig. 7, and fig. 7 is a schematic view of a conductive member according to an embodiment of the present application. As shown in fig. 7, the first electrode 12a of the LED chip 12 is disposed adjacent to the conductive member 112, and the second electrode 12b is electrically connected to the conductive extension 112b of the conductive member 112 through the conductive line 13.

In a possible implementation manner, please refer to fig. 8, and fig. 8 is a schematic view of a conductive member according to a third implementation manner of the present application. The conductive heat dissipation material extends to cover the surface of the first surface 11a, and the LED chip 12 is attached to the surface of the conductive extension 112b close to the first surface 11 a.

Specifically, a single LED chip 12 corresponds to three adjacent conductive members 112, each conductive member 112 includes a conductive body 112a and a conductive extension 112b, the conductive body 112a is disposed in the through hole 111, and is connected to the conductive extension 112b covering the first surface 11a and the conductive body 112a, the conductive extensions 112b of two adjacent conductive members 112 of the three conductive members 112 are connected as a whole and electrically connected to the first electrode 12a through a conductive line 13, and the conductive extension 112b of the remaining conductive member 112 of the three conductive members 112 is electrically connected to the second electrode 12 b.

Specifically, as shown in fig. 8, in order to prevent the LED chip 12 from being worn by a short circuit, a space exists between the conductive extension portion 112b of two adjacent conductive members 112 and the conductive extension portion 112b of the remaining one of the three conductive members 112.

It can be understood that, in the present embodiment, the contact area between the LED chip 12 and the conductive member 112 is larger, so that the heat dissipation performance of the LED chip 12 dissipating heat through the conductive member 112 is better.

In a possible implementation manner, please refer to fig. 9, and fig. 9 is a schematic view of an LED chip according to a fourth implementation manner of the present application. The bonding of the LED chips 12 to the die attach adhesive 113 includes: the first electrode 12a and the second electrode 12b are disposed facing the first surface 11a of the supporting member 11, and the first electrode 12a and the second electrode 12b are respectively attached to different conductive members 112.

Specifically, in the present embodiment, the first electrode 12a and the second electrode 12b are located on the opposite side of the light emitting direction of the LED chip 12. The heat generated by the LED chip 12 is directly dissipated through the conductive member 112, and does not have to be dissipated through the LED chip 12 and then through the conductive member 112.

As can be appreciated, in the present embodiment, the conductive extension 112b of the conductive member 112 increases the contact area between the LED chip 12 and the conductive member 112, so as to have better conductive performance.

In one possible implementation, please refer to fig. 10, and fig. 10 is a schematic package diagram according to a first embodiment of the present application. The encapsulating of the plurality of LED chips 12 and the support 11 includes: the separation film 14 is fixed to the plurality of LED chips 12 and the support 11 by a molding tool. Fluorescent glue 15 is injected into the separation film 14 to encapsulate the plurality of LED chips 12 and the support 11.

Specifically, the separation film 14 is fixed to the LED chips 12 and the support 11 by suction in a vacuum environment. After the fluorescent glue 15 is injected, the fluorescent glue is cured by pressure or temperature change to encapsulate the plurality of LED chips 12 and the support 11. The fluorescent glue 15 can increase the transmittance and refractive index of the light emitted by the LED chip 12.

In one possible implementation, please refer to fig. 11, and fig. 11 is a schematic cutting diagram provided in the first implementation of the present application. The cutting the plurality of LED chips 12 and the support 11 to obtain a plurality of light emitting devices 1 includes: providing a cutting film 16, wherein the cutting film 16 comprises a plurality of bearing areas 16a and a plurality of identification areas 16b, and the bearing areas 16a and the identification areas 16b are arranged at intervals. Attaching the side of the support 11 away from the LED chip 12 to the cutting film 16, and disposing the LED chip 12 corresponding to the carrying region 16 a. The support 11 is cut according to the marking zone 16 b.

Specifically, in the present embodiment, the support 11 and the LED chip 12 are attached to the dicing film 16 by a film sticking machine. The portion of the support 11 corresponding to the identification region 16b is cut by a cutting machine to obtain the individual light emitting devices 1.

Fig. 12 is a schematic view of a light emitting device 1 according to an embodiment of the present application, and fig. 12 is a schematic view of the light emitting device 1. The light emitting device 1 comprises a supporting member 11 and a plurality of LED chips 12, wherein the supporting member 11 comprises a first breadth 11a, a second breadth 11b opposite to the first breadth 11a, and a plurality of through holes 111 arranged at intervals, the through holes 111 penetrate through the first breadth 11a and the second breadth 11b, conductive members 112 are respectively arranged in the through holes 111, and the LED chips 12 are bonded to the first breadth 11a or one side of the conductive member 112 adjacent to the first breadth 11a through a die bond 113. The support member 11 and the LED chip 12 are packaged in a separation film 14, and fluorescent glue 15 is filled in the separation film 14.

Specifically, please refer to the above description for a plurality of terms related in the present embodiment, which are not repeated herein. It is understood that, during the operation of the light emitting device 11, the heat generated by the LED chip 12 can be dissipated through the plurality of through holes 111.

In a possible implementation manner, as shown in fig. 12, a single LED chip 12 corresponds to three adjacent conductive members 112, each conductive member 112 includes a conductive body 112a and a conductive extension 112b, the conductive body 112a is disposed in the through hole 111, and is connected to the conductive extension 112b covering the first surface 11a and to the conductive body 112a, the conductive extensions 112b of two adjacent conductive members 112 of the three conductive members 112 are connected as a whole and are electrically connected to the first electrode 12a through a conductive line 13, and the conductive extension 112b of the remaining conductive member 112 of the three conductive members 112 is electrically connected to the second electrode 12 b.

It can be understood that, in the present embodiment, the conductive extension portion 112b increases the contact area between the LED chip 12 and the conductive member 112, so that the heat dissipation effect is better. In another possible embodiment, the conductive extension 112b can also enhance the conductive performance of the LED chip 12 and the conductive member 112.

The principle and the implementation of the present application are explained herein by applying specific examples, and the above description of the embodiments is only used to help understand the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A light emitting device packaging method, comprising:

and cutting the support piece to obtain a plurality of light-emitting devices.

2. The method for packaging a light emitting device according to claim 1, wherein the LED chip comprises a first electrode and a second electrode, wherein the first electrode is a positive electrode and the second electrode is a negative electrode, or the first electrode is a negative electrode and the second electrode is a positive electrode, and the mounting of the LED chip of at least one light emitting device on the first surface or the side of the conductive member adjacent to the first surface comprises:

disposing the first electrode and the second electrode away from the first face of the support;

and providing conducting wires which are respectively and electrically connected with the first electrode and the second electrode to different conducting pieces.

3. The light emitting device packaging method of claim 1, wherein the conductive heat spreading material extends to cover a surface of the first panel, and the LED chip is attached to a surface of the conductive extension portion adjacent to the first panel.

4. The light emitting device packaging method of claim 3, wherein the mounting at least one LED chip of the light emitting device on the first surface or the side of the conductive member adjacent to the first surface further comprises:

and arranging the first electrode and the second electrode to face the first breadth of the supporting part, and respectively attaching the first electrode and the second electrode to different conductive parts.

5. The method for packaging a light emitting device according to claim 1, wherein before the mounting at least one LED chip of the light emitting device on the first surface or the side of the conductive member adjacent to the first surface, the method further comprises:

arranging single or a plurality of crystal fixing glue at intervals on the first breadth or one side of the conductive piece adjacent to the first breadth;

and after the LED chip of at least one light-emitting device is mounted on the first breadth or one side of the conductive piece, which is adjacent to the first breadth, baking the die bonding adhesive.

6. The light emitting device packaging method of claim 5, wherein the conditions for baking the die attach adhesive comprise:

the temperature is kept at 140 ℃ and 180 ℃, and the baking time is 2-5 hours.

7. The method for encapsulating a light emitting device according to claim 5, wherein the baking the die attach adhesive further comprises:

and welding the die attach adhesive by reflow soldering, wherein the welding conditions of the solder paste comprise: in a nitrogen environment, the baking temperature is 200-350 ℃, and the baking time is 30-50 seconds.

8. The light emitting device packaging method of claim 1, wherein said packaging the support and the LED chip comprises:

fixing a separation film to the plurality of LED chips and the support member using a molding tool;

and injecting fluorescent glue into the separation film to encapsulate the plurality of LED chips and the support.

9. The light emitting device packaging method of claim 1, wherein the cutting the support member to obtain a plurality of the light emitting devices comprises:

providing a cutting film, wherein the cutting film comprises a plurality of bearing areas and a plurality of identification areas, and the bearing areas and the identification areas are arranged at intervals;

attaching one side of the support piece, which is far away from the LED chip, to the cutting film, and arranging the LED chip corresponding to the bearing area;

and cutting the supporting piece according to the identification area.

10. A light-emitting device is characterized by comprising a supporting piece and LED chips, wherein the supporting piece comprises a first breadth, a second breadth opposite to the first breadth and a plurality of through holes arranged at intervals, the through holes penetrate through the first breadth and the second breadth, conductive pieces are respectively arranged in the through holes, the LED chips are bonded to the first breadth or one side, adjacent to the first breadth, of the conductive pieces through crystal fixing glue, the supporting piece and the LED chips are packaged in a separation film, fluorescent glue or packaging glue is filled in the separation film, each LED chip corresponds to three adjacent conductive pieces, each conductive piece comprises a conductive body and a conductive extension part, the conductive body is arranged in the through holes, covers the first breadth with the conductive extension parts and is connected with the conductive body, the conductive extension parts of two adjacent conductive pieces in the three conductive pieces are connected into a whole, the conductive extension parts are electrically connected with the first electrode through a conductive line, and the conductive extension part of the rest conductive piece in the three conductive pieces is electrically connected with the second electrode.