CN113079656A

CN113079656A - Noise reduction structure and electronic device with same

Info

Publication number: CN113079656A
Application number: CN202010007423.1A
Authority: CN
Inventors: 徐仲恺; 洪忠仁; 陈钦洲
Original assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2020-01-04
Filing date: 2020-01-04
Publication date: 2021-07-06
Anticipated expiration: 2040-01-04
Also published as: CN113079656B

Abstract

A noise reduction structure is embedded in a front shell. The noise reduction structure is a hollow structure and comprises a first surface and a second surface. The first surface is disposed coplanar with the front housing. The second surface is disposed between the first surface and the rear case, and is spaced apart from the first surface by a predetermined distance. The second surface comprises a plurality of shielding parts and a plurality of retaining walls. Each retaining wall is overlapped with the shielding part and is positioned between the shielding part and the rear shell. The retaining wall is of a hollow structure. Each retaining wall and the corresponding shielding part form a noise reduction flow channel, and noise is absorbed after being impacted back and forth in the noise reduction flow channel so as to realize the noise reduction function. The invention also provides an electronic device with the noise reduction structure.

Description

Noise reduction structure and electronic device with same

Technical Field

The invention relates to a noise reduction structure and an electronic device with the same.

Background

Heat dissipation and noise problems in high power electronic devices are major factors affecting the normal operation of the electronic devices. If the heat dissipation is not good, the operation stability of the electronic components in the electronic device will be caused, and the operation of the electronic device will be affected. In the prior art, a fan is generally adopted for heat dissipation. At higher temperatures, the fan speed increases, which in turn generates noise. The health of the user can be affected under the noise environment for a long time.

Disclosure of Invention

In view of the above, the present invention provides a noise reduction structure capable of reducing noise.

It is also desirable to provide an electronic device having a noise reduction structure.

A noise reduction structure is embedded in a front shell of an electronic device; the structure of making an uproar falls for the cavity casing, it includes:

a first surface disposed coplanar with the front housing;

the second surface is arranged between the first surface and a rear shell of the electronic device and is spaced from the first surface by a preset distance; the second surface comprises a plurality of shielding parts and a plurality of retaining walls;

each retaining wall is overlapped with the shielding part and is positioned between the shielding part and the rear shell; the retaining wall is of a hollow structure; every the barricade with correspond the shielding part constitutes the runner of making an uproar falls, the noise is in fall make an uproar the runner in make an uproar and make a round trip the back absorption.

An electronic device with a noise reduction structure, the electronic device comprising a front housing, a noise reduction structure, and a rear housing; the front shell and the rear shell are matched to form an accommodating space so as to accommodate the noise reduction structure; the front housing has an opening; the noise reduction structure is embedded in the front shell and exposed out through the opening; the structure of making an uproar falls for the cavity casing, it includes:

a first surface disposed coplanar with the front housing;

Above-mentioned structure of making an uproar and having the electronic device who makes an uproar structure of making an uproar falls through the runner of making an uproar that falls that sets up the cooperation formation of hollow barricade and occlusion part electronic device falls, and then improves electronic device's use impression.

Drawings

Fig. 1 is a perspective view of an electronic device according to a preferred embodiment.

Fig. 2 is a partially exploded view of the electronic device of fig. 1.

FIG. 3 is a schematic view of another angle of the noise reduction structure of FIG. 2.

Fig. 4 is a schematic cross-sectional view along IV-IV of the noise reducing structure of fig. 3.

FIG. 5 is a graphical illustration of a test static pressure change curve of the noise reduction structure of FIG. 2 under a first condition.

FIG. 6 is a graphical illustration of a test noise plot of the noise reduction structure of FIG. 2 under a second condition.

Description of the main elements

Electronic device 1

Front case 11

Rear housing 13

Main circuit board 20

Noise reduction structure 30

Opening 110

First surface 32

Hollow-out part 321

Second surface 34

Edge portion 341

Connecting portion 342

Shielding part 345

Cavity 346

Retaining wall 347

Noise reduction runner 349

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the term "connected" is to be interpreted broadly, e.g. as a fixed connection, a detachable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; they may be connected directly or indirectly through intervening elements, or may be connected through inter-element communication or may be in the interaction of two elements. To those of ordinary skill in the art, the above terms may be immediately defined in the present invention according to their specific meanings.

The terms "first," "second," and "third," etc. in the description and claims of the present invention and the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "comprises" and any variations thereof, are intended to cover non-exclusive inclusions.

The following describes an embodiment of the electronic device according to the present invention with reference to the drawings.

Please refer to fig. 1, which is a perspective view of an electronic device 1 according to a preferred embodiment of the invention. The electronic apparatus 1 may be applied to apparatuses having high-power electronic devices, such as, but not limited to, computer hosts, servers, and home appliances.

Please refer to fig. 2, which is a partially exploded view of the electronic device 1 according to the preferred embodiment. The electronic device 1 includes a front case 11, a main circuit board 20, a noise reduction structure 30, and a rear case 13. The front housing 11 and the rear housing 13 cooperate to form a sealed accommodating space for accommodating the main circuit board 20 and the noise reduction structure 30 therein. The front housing 11 is opened with an opening 110 to partially expose the noise reducing structure 30. In at least one embodiment of the present invention, the main circuit board 20 may be provided with various high-power electronic components, such as a Central Processing Unit (CPU), a memory, and a hard disk, and the high-power electronic components may emit a large amount of heat and noise during operation.

The noise reduction structure 30 is embedded in the front case 11. In at least one embodiment of the present invention, the noise reduction structure 30 has a thickness of 10 centimeters. The noise reducing structure 30 is a hollow shell that includes a first surface 32 and a second surface 34. The first surface 32 is generally rectangular parallelepiped in configuration. The first surface 32 is disposed coplanar with a surface of the front case 11. The first surface 32 is provided with a plurality of hollow parts 321. The hollow portions 321 are arranged in a matrix. The number of the hollow-out portions 321 in the odd-numbered rows is greater than that of the hollow-out portions 321 in the even-numbered rows. In at least one embodiment of the present invention, the hollowed-out portion 321 is a circular structure. The diameter of the hollow-out portion 321 is 9.6 mm. In other embodiments, the hollow portion 321 may have other shapes, such as other polygons, e.g., a triangle, a square, a honeycomb, and an oval.

Referring to fig. 3 and 4, the second surface 34 is disposed between the first surface 32 and the rear housing 13. The first surface 32 is disposed at a predetermined distance from the first surface 32. The predetermined distance is less than a thickness of the noise reduction structure. The second surface 34 is substantially rectangular parallelepiped and is disposed opposite to and as large as the first surface 32. The second surface 34 includes four edge portions 341, a plurality of connecting portions 342, a plurality of blocking portions 345, and a plurality of retaining walls 347.

The four edge portions 341 are connected end to form a frame structure, and are connected to the edge of the first surface 32. In at least one embodiment of the present invention, the edge portion 341 has a rectangular parallelepiped structure.

The connecting portion 342 is connected between the shielding portions 345 or between the shielding portion 345 and the edge portion 341, and is used to fix the shielding portion 345 to the edge portion and further increase the strength of the shielding portion 345. In at least one embodiment of the present invention, the connection portion 342 connected to the shielding portion 345 and the edge portion 341 has a V-shape, and the connection portion 342 connected between the shielding portions 345 has a Y-shape. In other embodiments, the connecting portion 345 may have other shapes, such as, but not limited to, a star shape, a snowflake shape, and a meter shape.

The shielding portions 345 are arranged in a matrix. The shielding portions 345 adjacent to the edge portions 341 are connected to the edge portions 341 by the connecting portions 342, and the shielding portions 345 distant from the edge portions 341 are connected to each other by at least one of the connecting portions 342. In at least one embodiment of the present invention, each of the shielding portions 345 is connected to three of the edge portions 341. The shielding portion 345 is opposite to the hollow portion 321. That is, the projection of the shielding portion 345 on the first surface 32 completely overlaps the hollow portion 321. A plurality of cavities 346 are formed between the hollow-out portion 321 and the shielding portion 345. The cavity 346 is communicated with the hollow portion 321 to form a heat dissipation channel. The cavity 346 is completely shielded by the first surface 32 when viewed from a direction perpendicular to the first surface 32, and the shielding portion 345 is completely exposed through the hollow portion 321 to prevent the internal structure of the electronic device 1 from being seen. The thickness of the shielding portion 345 is the same as that of the edge portion 341.

The retaining wall 347 is overlapped with the shielding portion 345 and is located between the shielding portion 345 and the rear housing 13. The retaining wall 347 is a hollow structure defining a noise reduction flow passage 349. The noise reduction flow passage 349 extends in a direction perpendicular to the second surface 34. The noise passing through the noise reduction flow channel 349 collides back and forth in the noise reduction flow channel 349 to form a sound absorption effect, so that the noise reduction effect is improved. In at least one embodiment of the present invention, the retaining wall 347 is a hollow ring structure. In other embodiments, the shape of the retaining wall 347 may be changed as needed, for example, the retaining wall 347 may have a hollow structure such as a hemisphere, a sphere, a polyhedron, and the like. In at least one embodiment of the present invention, the connecting portion 342, the shielding portion 345 and the retaining wall 347 are integrally formed and made of a plastic material. The height of the retaining wall 347 ranges from 4 mm to 7 mm. Namely, the depth range of the noise reduction flow channel is 4 mm-7 mm. Turbulent flow is further generated in the noise reduction flow channel 349 to reduce the flow resistance of the noise reduction structure 30, thereby improving the heat dissipation effect. In at least one embodiment of the present invention, the height of the retaining wall 347 is 7 mm. In other embodiments, the retaining wall 347 may be made of a metal material and then contacts with a metal portion of the front housing 11 to form an electrostatic discharge path, so as to protect the electronic device 1 from static electricity, and the retaining wall 347 may further be connected to ground, so as to reduce electromagnetic interference. In at least one embodiment of the present invention, the ground may be the ground when actually placed, or may be an equivalent ground on the main circuit board 20.

In at least one embodiment of the present invention, a fan (not shown) is disposed between the noise reduction structure 30 and the rear housing 13, and noise generated when the fan rotates is transmitted from the rear housing 13 to the noise reduction structure 30, and is absorbed after hitting back and forth in the noise reduction flow channel 349 formed by the blocking portion 345 and the retaining wall 347, and generates turbulent flow in the noise reduction flow channel 349, so as to reduce the flow resistance of the noise reduction structure 30 and improve the heat dissipation effect of the noise reduction structure 30.

Referring to FIG. 5, a graph of the test flow resistance of various noise reduction structures 30 under a first condition is shown. Under a first condition, the noise reduction structure 30 is disposed in a closed space having an air inlet and an air outlet, and the noise reduction structure 30 is tested by adjusting the flow rate of the air inlet and the height of the retaining wall 347. Wherein the first flow velocity is 2 meters per second (m/s), the second flow velocity is 4m/s, the third flow velocity is 6m/s, the fourth flow velocity is 8m/s, and the fifth flow velocity is 10 m/s. A first curve T0 is the magnitude of the static pressure change sensed at the air outlet without the noise reduction structure 30 between the first flow rate and the fifth flow rate. A second curve T1 is the magnitude of the static pressure change sensed at the air outlet between the first flow rate and the fifth flow rate for the noise reduction structure 30 without the retaining wall 347. The third curve T2 is the magnitude of the static pressure change sensed at the air outlet between the first flow rate and the fifth flow rate when the height of the retaining wall 347 is 1 mm. The fourth curve T3 is the magnitude of the static pressure change sensed at the air outlet between the first flow rate and the fifth flow rate when the height of the retaining wall 347 is 2 mm. The fifth curve T4 is the magnitude of the static pressure change sensed at the air outlet between the first flow rate and the fifth flow rate when the height of the retaining wall 347 is 3 mm. The sixth curve T5 is the magnitude of the static pressure change sensed at the air outlet between the first flow rate and the fifth flow rate when the height of the retaining wall 347 is 4 mm. The seventh curve T6 is the corresponding magnitude of the static pressure change between the first flow rate and the fifth flow rate when the height of the retaining wall 347 is 5 mm. The eighth curve T7 is a magnitude of a static pressure change sensed at the air outlet between the first flow rate and the fifth flow rate when the height of the retaining wall 347 is 6 mm. The ninth curve T8 is a magnitude of a static pressure change sensed at the air outlet between the first flow rate and the fifth flow rate when the height of the retaining wall 347 is 7 mm. As can be seen from fig. 5, the static pressure variation is small when the height of the retaining wall 347 is between 3 mm and 7 mm, and particularly, the static pressure variation is minimum when the height of the retaining wall 347 is 7 mm, and the heat dissipation effect is best.

Please refer to fig. 6, which is a graph illustrating a test noise of different noise reduction structures 30 under a second condition. In the second condition, the noise reduction structure 30 is sandwiched between the fan and the sensor. The noise reduction structure 30 is tested by adjusting the rotation speed of the fan and the height of the retaining wall 347. Wherein the first speed is 2200 RPM, the second speed is 2700RPM, the third speed is 3200RPM, the fourth speed is 3700RPM, and the fifth speed is 4200 RPM. A first curve L0 is the corresponding noise loudness without the noise reduction structure 30 between the first rotational speed and the fifth rotational speed. A second curve L1 is the corresponding noise loudness of the noise reduction structure 30 without the retaining wall 347 between the first rotational speed and the fifth rotational speed. The height of the third curve L2 is 1 mm for the corresponding noise loudness between the first rotational speed and the fifth rotational speed. The fourth curve L3 is the corresponding noise loudness of the height of the retaining wall 347 at 2 mm between the first rotational speed and the fifth rotational speed. The fifth curve L4 is the corresponding noise loudness of the height of the retaining wall 347 at 3 mm between the first rotational speed and the fifth rotational speed. The sixth curve L5 is the corresponding noise loudness of the height of the retaining wall 347 at 4 mm between the first rotational speed and the fifth rotational speed. The seventh curve L6 is the corresponding noise loudness of the height of the retaining wall 347 at 5 mm between the first rotational speed and the fifth rotational speed. The eighth curve L7 is the corresponding noise loudness of the height of the retaining wall 347 at between the first rotational speed and the fifth rotational speed of 6 mm. The ninth curve L8 is the corresponding noise loudness of the height of the retaining wall 347 at 7 mm between the first rotational speed and the fifth rotational speed. As can be seen from fig. 6, the noise reduction effect is good when the height of the retaining wall 347 is between 3 mm and 7 mm at the medium rotation speed and the high rotation speed, and particularly, the noise reduction effect is best when the height of the retaining wall 347 is 7 mm.

In the noise reduction structure 30 and the electronic device 1 having the noise reduction structure 30, the hollow portions 321 and the shielding portions 345 which are arranged in a staggered manner are arranged to improve the heat dissipation effect, and the noise reduction flow channel 349 formed by matching the hollow retaining wall 347 and the shielding portions 345 is arranged to reduce the noise of the electronic device 1, so that the use feeling of the electronic device 1 is improved.

It will be appreciated by those skilled in the art that the above embodiments are illustrative only and not intended to be limiting, and that suitable modifications and variations may be made to the above embodiments without departing from the true spirit and scope of the invention.

Claims

1. A noise reduction structure is embedded in a front shell of an electronic device; the structure of making an uproar falls for the cavity casing, it includes:

a first surface disposed coplanar with the front housing;

2. The noise reduction structure of claim 1, wherein: the second surface further comprises four edge portions and a plurality of connecting portions; the four edge parts are connected end to form a hollow frame body; the shielding parts at the edges are connected with the edge parts through at least one connecting part, and the other shielding parts are connected with each other through the at least one connecting part; the thickness of the shielding part is the same as that of the edge part; a cavity is formed between the connecting part and the shielding part.

3. The noise reduction structure of claim 2, wherein: a plurality of hollow parts are arranged on the first surface; the plurality of hollow parts are uniformly arranged; each hollow-out part corresponds to one shielding part; the shielding part is completely exposed relative to the hollow part; the hollow-out part and the cavity form a heat dissipation flow channel.

4. The noise reduction structure of claim 3, wherein: the hollow parts are arranged in a matrix; the number of the hollow parts in the odd-numbered rows is larger than that of the hollow parts in the even-numbered rows.

5. The noise reduction structure of claim 1, wherein: the barricade is hollow annular structure, just the thickness scope of barricade is 3 millimeters to 7 millimeters.

6. An electronic device with a noise reduction structure, the electronic device comprising a front housing, a noise reduction structure, and a rear housing; the front shell and the rear shell are matched to form an accommodating space so as to accommodate the noise reduction structure; the front housing has an opening; the noise reduction structure is embedded in the front shell and exposed out through the opening; the structure of making an uproar falls for the cavity casing, it includes:

a first surface disposed coplanar with the front housing;

7. The electronic device of claim 6, wherein: the second surface further comprises four edge portions and a plurality of connecting portions; the four edge parts are connected end to form a hollow frame body; the shielding parts at the edges are connected with the edge parts through at least one connecting part, and the other shielding parts are connected with each other through the at least one connecting part; the thickness of the shielding part is the same as that of the edge part; a cavity between the connecting portion and the shielding portion.

8. The electronic device of claim 7, wherein: a plurality of hollow parts are arranged on the first surface; the plurality of hollow parts are uniformly arranged; each hollow-out part corresponds to one shielding part; the shielding part is completely exposed relative to the hollow part; the hollow-out part and the cavity form a heat dissipation flow channel.

9. The electronic device of claim 8, wherein: the hollow parts are arranged in a matrix; the number of the hollow parts in the odd-numbered rows is larger than that of the hollow parts in the even-numbered rows.

10. The electronic device of claim 6, wherein: the barricade is hollow annular structure, just the thickness scope of barricade is 3 millimeters to 7 millimeters.