CN113066786A - Led集成封装激光焊接方法 - Google Patents

Led集成封装激光焊接方法 Download PDF

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CN113066786A
CN113066786A CN202110273461.6A CN202110273461A CN113066786A CN 113066786 A CN113066786 A CN 113066786A CN 202110273461 A CN202110273461 A CN 202110273461A CN 113066786 A CN113066786 A CN 113066786A
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Abstract

本发明提出了一种LED集成封装激光锡焊方法，基板(2)阵列开有晶片嵌口(22)，LED晶片(1)镶嵌于晶片嵌口(22)中，采用激光加热熔化锡球/锡丝/锡膏，实现LED晶片(1)上的晶片焊盘(11)与基板(2)上的基板焊盘(21)之间焊连，采用了视觉定位激光焊点，降低了基板(2)的精度以及锡膏(33)的设置精度要求，有效提高焊连良品率，降低产品造价。

Description

LED集成封装激光焊接方法
技术领域
本发明属于LED晶片封装技术领域，特别涉及数多LED晶片的集成封装。
背景技术
LED进入Mini时代(Mini LED背光，Mini LED显示)，COB倒装被行业认为最有前途的技术方案，但是采用COB倒装技术方案生产LED集成模组时，其良品率低，生产造价高。良品率低的原因是尺寸小，LED晶片上两电极焊连的工艺精度要求高，基板的精度以及锡膏的设置精度要求高，现有的设备工艺精度满足不了COB倒装技术方案。
发明内容
本发明的目的就是针对以上所述的问题，提出了一种技术方案，可以避开COB倒装技术方案所要求的高精度设备工艺，降低了基板的精度以及锡膏的设置精度要求，有效提高良品率，降低产品造价。
本发明的技术方案：LED集成封装片包括有不少于10粒(一般要有100粒以上)LED晶片和基板，基板采用了绝缘料材制成，基板阵列开有数多(不少于10，一般要有100以上)晶片嵌口，基板上设置有基板焊盘，晶片嵌口中设置有LED晶片，基板上的基板焊盘与LED晶片上的晶片焊盘采用了金属焊锡直接焊接电连接，所述金属焊锡直接焊接电连接工艺过程中采用了用激光来加热熔化锡焊料。
锡焊料指的是未熔焊之前的含锡的焊接材料，比如锡丝、锡球、锡膏，其中可能包含有助焊剂等非金属材料；金属焊锡指的是锡焊料被加热融化之后的含锡的金属，一般含锡的成分最多。
附图说明
下面将结合本发明实施例中的附图，对本发明实施进行清楚、完整地描述，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。
图1是一种本发明中的LED集成封装片的特征平面示意图，连接基板焊盘与晶片焊盘的金属焊锡没有示出。
图2是图1中的单个LED焊接部分的特征平面示意图，金属焊锡没有示出。
图3是图2中C-C处的特征剖面示意图。
图4是图2中D-D处的特征剖面示意图。
图5是一种本发明中的锡球激光焊接特征示意图。
图6是一种本发明中的锡丝激光焊接特征示意图。
图7和8分别是两种本发明中的锡膏设置特征平面示意图。
图9是一种图8所示的锡膏设置方案，激光照射熔焊方式特征示意图。
图10是图9所示的激光照射熔焊后的特征剖面示意图。
图11是一种本发明中的锡膏设置特征平面示意图。
图12是图11中的晶片嵌口以及基板焊盘的特征立体示意图。
图13是一种图11所示的激光照射熔焊后的特征剖面示意图。
图14是一种本发明中的锡膏设置特征平面示意图。
图中：1、LED晶片，11、晶片焊盘，12、外边界，13、内边界，2、基板，21、基板焊盘，22、晶片嵌口，23、外边界，24，内边界，3、金属焊锡，31、锡丝，32、锡球，33、锡膏，4、激光，5、连接边界，6、喷嘴。
具体实施方式
图1所示的本发明LED集成封装片，基板2阵列开有数多晶片嵌口22，数多LED晶片1设置在晶片嵌口22中，基板2上设置有基板焊盘21，金属焊锡3直接将两晶片焊盘11与其对应的两基板焊盘21焊接电连接(如图3所示)；基板焊盘21呈C字形，其对应的晶片焊盘11在C字形内(不一定要求像图中所示的全部在C字形内)，图4示出该C字形基板焊盘21与其对应的晶片焊盘11焊连的特征，这样的焊连更有保障。
图5示出了一种本发明的锡球激光焊接方案，锡球供给装置将锡球输送于喷嘴6口内，激光4发出照射熔化锡球32，锡球32在气压(氮气)的作用下喷出，熔化的锡球喷射到焊盘上，在锡球热量以及激光的作用下，锡球与焊盘完成融合。
以基板嵌口22位置为基准，或者以晶片焊盘11实际固晶(设置)的位置为基准，或仅仅是参考晶片焊盘11实际固晶(设置)的位置来修正，采用视觉定位(CCD扫描定位)喷嘴6。设置图像识别检测系统(AOI)，检测缺陷焊点，并进行修复。
图6示出了一种本发明的锡丝激光焊接方案，采用视觉定位(CCD扫描定位)，送丝机将锡丝31准确传送于焊盘上，在激光加热作用下，锡丝融化，与焊盘融合。
图7所示的本发明，采用了锡膏33，两晶片焊盘11以及其对应的基板焊盘21设置有，两分开的，各自的锡膏33。
锡膏33的设置(涂敷)采用了印刷方式或喷滴方式，所述的喷滴方式包含有：喷墨式(比如采用压电陶瓷的作用力，产生喷射)，点滴式(比如类似滴胶一样)。
采用激光照射，加热锡膏33以及焊盘，锡膏33融化，与焊盘融合，实现晶片焊盘11与基板焊盘21之间的焊连。，
锡膏33的设置可以有越过基板焊盘21与其对应的晶片焊盘11所占锡焊区域的边界，图7示出，锡膏33越过了基板焊盘21的外边界。加热熔焊锡膏的激光的光斑也应该有越过基板焊盘21与其对应的晶片焊盘11所占锡焊区域的边界。
基板焊盘21与其对应的晶片焊盘11所占锡焊区域的边界是指，基板焊盘21外边界23与其对应的晶片焊盘11的外边界12直线连接(连接边界5，如图2中所示)构成的区域边界，也就是锡焊有效区域边界，图2示出锡焊有效区域边界长为A，宽为B。
LED晶片1上的两晶片焊盘11与其相对应的基板焊盘21的金属焊锡直接焊接电连接工艺过程可以分成两个激光熔焊工序，两个激光熔焊工序之间设置有焊接检测工序，比如图像识别(AOI)检测系统。检测出有缺陷的产品，进入缺陷修复工序。
图8所示的本发明，两晶片焊盘11与其对应的基板焊盘21上对应的锡膏33连成一片，两晶片焊盘11与其对应的基板焊盘21上对应的锡膏(33)的激光加热熔化不是同一时间进行，如图9和10所示。
图9示出，加热熔焊锡膏的激光4的光斑有越过基板焊盘21与其对应的晶片焊盘11所占锡焊区域的边界。加热熔焊锡膏的激光4的光斑应设计成大于基板焊盘21与其对应的晶片焊盘11所占锡焊区域(锡焊有效区域)，激光4的光斑的形状应该采用与锡焊有效区域形状相当的形状，比如椭圆形。锡膏3的厚度d应设计成小于金属焊锡3的高度D。锡膏3的厚度d也应小于金属焊锡3的宽度B)。
加热熔焊锡膏的激光4的光斑会有小于锡膏33的面积的情况，如图8所示，当所有的电极焊盘激光焊连完成后，还会有残留的锡膏，因而，两晶片焊盘11上对应的锡膏33的激光加热熔焊工序完成后，应该设置有残留锡膏清洗工序。
图11所示的本发明，一个晶片嵌口22中设置有三个LED晶片1，适用于RGB彩色显示应用，基板焊盘21采用有设置在晶片嵌口22的侧壁上(如图12和13所示)，设置有四个独立分开的锡膏33。
图14所示的本发明，锡膏33的设置与图8类似，所有焊盘对应的锡膏33连成一片，这种锡膏设置适合采用印刷方式。
本发明的锡膏激光焊接技术方案中，加热熔焊锡膏的激光4应采用视觉定位(CCD扫描定位)，以基板嵌口22位置为基准，或者以晶片焊盘11实际固晶(设置)的位置为基准，或仅仅是参考晶片焊盘11实际固晶(设置)的位置来修正。图8和14所示的本发明，基板焊盘21以及晶片焊盘11都被锡膏33覆盖，应该在基板上设置不被锡膏覆盖的定位坐标(标记)，便于CCD扫描定位。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。

Claims (10)

1.一种LED集成封装激光锡焊方法，所述LED集成封装片包括有不少于10粒的LED晶片(1)和基板(2)，基板(2)采用了绝缘料材制成，基板(2)阵列开有晶片嵌口(22)，基板(2)上设置有基板焊盘(21)，晶片嵌口(22)中设置有LED晶片(1)，基板(2)上的基板焊盘(21)与LED晶片(1)上的晶片焊盘(11)采用了金属焊锡(3)直接焊接电连接，其特征在于：所述金属焊锡(3)直接焊接电连接工艺过程中采用了用激光来加热熔化锡焊料。
2.根据权利要求1所述的激光锡焊方法，其特征在于：锡焊料采用了球形结构或丝线形结构。
3.根据权利要求1所述的激光锡焊方法，其特征在于：锡焊料采用了锡膏(33)，锡膏(33)的设置采用了印刷方式或喷滴方式。
4.根据权利要求3所述的激光锡焊方法，其特征在于：锡膏(33)有越过基板焊盘(21)与其对应的晶片焊盘(11)所占锡焊区域的边界。
5.根据权利要求3所述的激光锡焊方法，其特征在于：加热熔焊锡膏的激光的光斑有越过基板焊盘(21)与其对应的晶片焊盘(11)所占锡焊区域的边界。
6.根据权利要求3所述的激光锡焊方法，其特征在于：两晶片焊盘(11)与其对应的基板焊盘(21)上对应的锡膏(33)连成一片，两晶片焊盘(11)上对应的锡膏(33)的激光加热熔化不是同一时间进行。
7.根据权利要求3所述的激光锡焊方法，其特征在于：两晶片焊盘(11)上对应的锡膏(33)的激光加热熔焊工序完成后，设置有设置有残留锡膏清洗工序。
8.根据权利要求3所述的激光锡焊方法，其特征在于：两晶片焊盘(11)上对应的锡膏(33)的设置分为两个工序，当一个晶片焊盘(11)上的对应的锡膏(33)被加热熔化，完成了其对应的晶片焊盘(11)与基板焊盘(21)焊接后，再设置另一个晶片焊盘(11)上的对应的锡膏(33)。
9.根据权利要求8所述的激光锡焊方法，其特征在于：完成第一次晶片焊盘(11)与基板焊盘(21)焊接之后，另一个锡膏(33)设置工序之前，设置有残留锡膏清洗工序。
10.根据权利要求1至9中任何一项所述的激光锡焊方法，其特征在于：采用了视觉定位激光光斑。
CN202110273461.6A 2021-03-05 2021-03-05 Led集成封装激光焊接方法 Pending CN113066786A (zh)

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WO2024065101A1 (zh) * 2022-09-26 2024-04-04 京东方科技集团股份有限公司 驱动背板、发光基板、背光模组及显示装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024065101A1 (zh) * 2022-09-26 2024-04-04 京东方科技集团股份有限公司 驱动背板、发光基板、背光模组及显示装置

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