CN113036382A - Novel common-mode rejection balun structure for magnetic resonance radio frequency coil - Google Patents
Novel common-mode rejection balun structure for magnetic resonance radio frequency coil Download PDFInfo
- Publication number
- CN113036382A CN113036382A CN202110463055.6A CN202110463055A CN113036382A CN 113036382 A CN113036382 A CN 113036382A CN 202110463055 A CN202110463055 A CN 202110463055A CN 113036382 A CN113036382 A CN 113036382A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- magnetic resonance
- radio frequency
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 45
- 239000003990 capacitor Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000004804 winding Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 230000002401 inhibitory effect Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 239000003985 ceramic capacitor Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002595 magnetic resonance imaging Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses a novel common mode rejection balun structure for a magnetic resonance radio frequency coil, which comprises an upper layer, a middle layer and a lower layer, wherein the upper layer is a solenoid coil formed by winding coaxial lines, the middle layer is a hard printed circuit board, and the lower layer is a double-layer flexible printed circuit board; the double-layer flexible printed circuit board comprises a substrate, an upper layer on the upper surface of the substrateGuide tube BodyAnd an underlayer on the lower surface of the flexible substrateGuide tube Body(ii) a Upper and lower layersGuide tube BodyPartially overlapping, overlapping upper and lower layersGuide tube BodyThe substrate between the two forms a planar flexible capacitor; the shielding layers at the two ends of the solenoid are respectively welded on the hard printed circuit board and are connected with the planar flexible capacitor in parallel through a copper-clad conductor on the hard printed circuit board, a connecting wire conductor and a conductor on the flexible printed circuit board in sequence. The novel common mode rejection balun structure for the magnetic resonance radio frequency coil is remarkably smaller than the existing common mode rejection balun in size and weight, is very convenient for frequency adjustment,the cost is lower.
Description
Technical Field
The invention relates to a novel common-mode rejection balun structure for a magnetic resonance radio frequency coil.
Background
Magnetic resonance imaging is an advanced technique for non-destructive imaging of the human body and is widely applied to diagnosis of diseases of various parts of the human body. The performance of the magnetic resonance radio frequency coil, which is an important component of the magnetic resonance imaging system, directly determines the quality of the magnetic resonance imaging.
The frequency of the signals of magnetic resonance is usually between several tens MHz to several hundreds MHz, and coaxial cables are usually used to transmit the signals. Meanwhile, because the electromagnetic environment in which the magnetic resonance radio frequency coil works is very complex, a balun is required to be used for suppressing the common mode current on the coaxial line, otherwise, the signal-to-noise ratio of the magnetic resonance radio frequency coil is obviously reduced, and even a huge radio frequency current is induced on a cable line during the radio frequency transmission of a magnetic resonance system to cause the burn of a patient.
Referring to fig. 1, a conventional common mode current suppressing balun is formed by winding a coaxial line 1 'into one or more circles of solenoids 2', stripping off outer insulating skins 11 'at two ends to expose a shielding layer 21', soldering the shielding layers 21 'at two ends to a hard printed circuit board 3', and soldering a ceramic capacitor 4 'in parallel through a copper-clad conductor on the hard printed circuit board 3', so that the shielding layer and the capacitor of the coaxial line can form a parallel resonant circuit, which presents a high impedance, thereby suppressing the common mode current on the shielding layer.
With the development and advancement of magnetic resonance technology, especially in recent years, flexible radio frequency coils have become increasingly popular with doctors and patients and become more popular because of their advantages of portability, ease of use, patient comfort, etc. However, the conventional common mode rejection balun has a structure of a coaxial solenoid parallel ceramic capacitor, and is large in size due to the fact that the solenoid needs to be wound and a high-voltage-resistant ceramic capacitor needs to be welded, and is usually large and thick due to the fact that an independent plastic shell is needed for protection. Moreover, since the number of channels of the current rf coil is increasing, and there are more and more flexible rf coils with 16 channels, 32 channels and even 64 channels, and each channel requires at least one balun, such a traditional balun structure formed by coaxially winding into a solenoid is increasingly unable to meet the development requirement of a high-density flexible rf coil, and becomes a bottleneck factor limiting further soft flexibility of the flexible coil.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a novel common mode rejection balun structure for a magnetic resonance radio frequency coil, and the balun structure is simple in design and manufacture, low in cost, high in safety, small in size and light in weight, can obviously reduce the size and the weight of the magnetic resonance radio frequency coil when used in the magnetic resonance radio frequency coil, improves the softness and the comfort degree of the magnetic resonance radio frequency coil, is ingenious in design, simple in structure, convenient to produce and debug and suitable for large-scale popularization and application.
The technical scheme for realizing the purpose is as follows: a novel common mode rejection balun structure for a magnetic resonance radio frequency coil comprises an upper layer, a middle layer and a lower layer, wherein the upper layer is a solenoid formed by coaxial wire winding, the middle layer is a hard printed circuit board, and the lower layer is a double-layer flexible printed circuit board; wherein:
the double-layer flexible printed circuit board comprises a substrate, an upper conductor positioned on the upper surface of the substrate and a lower conductor positioned on the lower surface of the flexible substrate; the upper and lower conductors are partially overlapped, and the overlapped upper and lower conductors and the base material between the overlapped upper and lower conductors form a planar flexible capacitor;
the outer insulating skin at the two ends of the solenoid is stripped to expose the shielding layers, the shielding layers at the two ends of the solenoid are respectively welded on the hard printed circuit board and are connected with the planar flexible capacitor in parallel sequentially through a copper-clad conductor, a connecting wire conductor and a conductor on the flexible printed circuit board on the hard printed circuit board, and the solenoid, the planar flexible capacitor and all the conductors between the solenoid and the planar flexible capacitor form a parallel resonant circuit to play a role in inhibiting common mode current.
The novel common-mode rejection balun structure for the magnetic resonance radio frequency coil is characterized in that the connecting line conductor is a thin copper wire and/or a through hole.
The novel common-mode rejection balun structure for the magnetic resonance radio frequency coil is characterized in that the hard printed circuit board and the flexible printed circuit board are bonded together through glue, holes are respectively drilled in the hard printed circuit board and the flexible printed circuit board, fine copper wires are inserted into the drilled holes in an inserting mode, two ends of each fine copper wire are welded on bonding pads of the hard printed circuit board and the flexible printed circuit board in a one-to-one correspondence mode, and the fine copper wires are used for electrical connection.
The novel common-mode rejection balun structure for the magnetic resonance radio frequency coil is characterized in that the hard printed circuit board and the flexible printed circuit board are of an integrally formed structure to form a rigid-flexible printed circuit board, and the rigid-flexible printed circuit board is electrically connected through a through hole from the top layer to the bottom layer.
The novel common mode rejection balun structure for the magnetic resonance radio frequency coil is characterized in that the axis of the solenoid is parallel to the plane of the hard printed circuit board.
The novel common mode rejection balun structure for the magnetic resonance radio frequency coil is characterized in that a plastic rod core perpendicular to the plane of the rigid printed circuit board is bonded on the rigid printed circuit board, the coaxial wire is wound on the plastic rod core to form a solenoid, and the axis of the solenoid is perpendicular to the plane of the rigid printed circuit board.
The novel common mode rejection balun structure for the magnetic resonance radio frequency coil is characterized in that the solenoid is covered by a shielding case, the bottom end of the shielding case is welded on the pad of the hard printed circuit board, and the pad of the hard printed circuit board is communicated with one end of the solenoid.
When the magnetic resonance radio-frequency coil adopts a magnetic resonance flexible radio-frequency coil, the flexible printed circuit board used by the novel common-mode rejection balun and the flexible printed circuit board used by the flexible coil radio-frequency loop of the magnetic resonance flexible radio-frequency coil are designed and produced on the same whole flexible printed circuit board.
The novel common-mode rejection balun structure for the magnetic resonance radio frequency coil is remarkably smaller than the existing common-mode rejection balun in size and weight, very convenient in frequency adjustment and lower in cost, and can be used for reducing welding spots and improving reliability by manufacturing a hard printed circuit board and a flexible printed circuit board into an integral soft-hard combined printed circuit board or integrating the flexible printed circuit board and the flexible printed circuit board used by the flexible magnetic resonance radio frequency coil, so that the cost is further reduced and the reliability is improved; particularly, the polyimide substrate used for a conventional flexible printed wiring board has dielectric strength of several thousands volts per mil, and therefore, is excellent in safety.
Drawings
Fig. 1 is a schematic structural diagram of a conventional common mode rejection balun structure;
fig. 2 is a structural diagram of a novel common mode rejection balun structure for a 3T magnetic resonance radio frequency coil according to the first embodiment;
fig. 3 is a diagram illustrating the common-mode attenuation effect of the novel common-mode rejection balun according to the first embodiment;
FIG. 4 is a structural diagram of a novel common mode rejection balun structure for a 1.5T magnetic resonance RF coil according to the second embodiment;
fig. 5 is a graph illustrating the common-mode attenuation effect of the novel common-mode rejection balun according to the second embodiment.
Detailed Description
In order that those skilled in the art will better understand the technical solution of the present invention, the following detailed description is given with reference to the accompanying drawings:
the first embodiment is as follows:
referring to fig. 2, a novel common mode rejection balun structure for a 3T magnetic resonance radio frequency coil is composed of an upper layer, a middle layer and a lower layer, wherein the upper layer is a solenoid 1 formed by coaxial winding, the middle layer is a hard printed circuit board 2, and the lower layer is a double-layer flexible printed circuit board 3.
The double-layer flexible printed wiring board 3 includes a base material 31, an upper conductor 32 on the upper surface of the base material, and a lower conductor 33 on the lower surface of the flexible base material; the upper and lower conductors 32, 33 partially overlap, and the overlapping upper and lower conductors 32, 33 form a planar flexible capacitor with the substrate 31 therebetween.
The axis of the solenoid 1 is parallel to the plane of the hard printed circuit board 2, the outer insulating skins at the two ends of the solenoid 1 are stripped to expose the shielding layers, the shielding layers at the two ends of the solenoid 1 are respectively welded on the hard printed circuit board 2 and are connected with the planar flexible capacitor in parallel sequentially through a copper-clad conductor on the hard printed circuit board 2, a connecting wire conductor and a conductor on the flexible printed circuit board 3, and the solenoid 1, the planar flexible capacitor and all the conductors between the solenoid 1 and the planar flexible capacitor form a parallel resonant circuit to play a role in inhibiting common mode current.
The hard printed wiring board 2 and the flexible printed wiring board 3 are separately manufactured and then bonded together with a double-sided adhesive tape (not shown). Drilling holes in the hard printed circuit board 2 and the flexible printed circuit board 3 respectively, inserting thin copper wires into the holes, welding two ends of each thin copper wire on the welding pads of the hard printed circuit board and the flexible printed circuit board in a one-to-one correspondence mode, and electrically connecting the thin copper wires
The hard and flexible printed circuit board 2 has via holes at certain positions, which can connect the upper copper-clad conductor and the lower copper-clad conductor of the hard printed circuit board 2. Some positions of the flexible printed wiring board 3 are also provided with via holes, which can connect the upper layer conductor and the lower layer conductor on the flexible printed wiring board 3. Some corresponding positions of the hard printed circuit board 2 and the flexible printed circuit board 3 are respectively drilled with holes, fine copper wires 4 are inserted into the drilled holes, two ends of each fine copper wire 4 are welded at some positions of an upper copper layer conductor of the hard printed circuit board and a lower conductor of the flexible printed circuit board in a one-to-one correspondence manner, the copper-clad layer conductor of the hard printed circuit board and the upper conductor of the flexible printed circuit board can be communicated, and the fine copper wires 4 are used for electrical connection.
The use of conductors, vias and fine copper wires on the hard printed circuit board 2 and the flexible printed circuit board 3 allows the pads at both ends of the solenoid 1 to communicate with both ends of the planar flexible capacitor, thereby forming a parallel resonance.
The capacitance value of the planar flexible capacitor is determined by the following formula:
C＝ε0*εr*A/d (1)
in the formula (1), C is a capacitance value, ε0Is a vacuum dielectric constant of ∈rIs the relative dielectric constant of the substrate, A is the overlap area, and d is the thickness of the substrate.
Therefore, the overlapping area of the upper conductor and the lower conductor on the flexible printed circuit board is adjusted, the capacitance value of the formed planar flexible capacitor can be adjusted, and therefore the resonant frequency of the solenoid and the planar flexible capacitor is adjusted to be resonant to the frequency of the magnetic resonance system, a common mode rejection balun is formed, common mode current on the transmission line can be effectively rejected, and no influence is caused on differential mode signals.
If a coaxial wire of 1mm outer diameter is used, it is wound around a core of 5mm diameter, is wound for 7 turns, has an inductance of about 100nH, and is soldered to a hard printed wiring board 2 of 1mm thickness. A double-layer flexible printed circuit board using polyimide as a base material; the thickness of the upper and lower layer conductors is 18um, the thickness of the polyimide is 50 micron, the relative dielectric constant is 3.3, and the planar flexible capacitor with the overlapping area of 5.1mmx5.1mm 26mm2 can be formed by the upper and lower layer conductors with the overlapping area of about 15 pF. In actual use, the outermost layers of the flexible printed wiring board are usually provided with a very thin polyimide protective film, so that the total thickness of the flexible printed wiring board 3 is about 0.13mm, and the flexible printed wiring board is bonded to the hard printed wiring board 2 by using a double-sided adhesive tape having a thickness of about 0.2 mm.
An inductance of 100nH and a capacitance of around 15pF can resonate at a frequency around the 3T magnetic resonance. By fine tuning the overlap area, the frequency can be tuned perfectly to the system frequency of 3T magnetic resonance, i.e. 127.7 MHz.
Referring to fig. 3, the common mode attenuation curve of the common mode rejection balun for 3T magnetic resonance is enough to use more than 35dB attenuation at the deepest position. Furthermore, 50 μm polyimide can withstand voltages of up to 10 kv, even much higher than that of the conventional ceramic capacitors, so that its safety is not at all problematic.
While such a common mode rejection balun has dimensions of only about 7mm long and 7mm wide, and the total thickness does not exceed 8.5mm, if a conventional ceramic capacitor is used, a 10C series capacitor is required if a compressive strength of 2500V is to be achieved, and a 10C series capacitor itself has dimensions of about 6mm wide, 6mm long and 4mm high, so that the dimensions of such a conventional balun are much larger than those of the novel balun of the present embodiment in any case.
Example two:
referring to fig. 4, a novel common mode rejection balun structure for a 1.5T magnetic resonance radio frequency coil is composed of an upper layer, a middle layer and a lower layer, wherein the upper layer is a solenoid 1 made by coaxial winding, the middle layer is a hard printed circuit board 2, and the lower layer is a double-layer flexible printed circuit board 3.
One difference from the first embodiment is that the rigid-flex printed circuit board is used, that is, the rigid printed circuit board 2 and the flexible printed circuit board 3 are directly integrated, so that the cost is high, but the through holes 7 penetrating through the rigid printed circuit board and the flexible printed circuit board can be directly used for electrical connection, and fine copper wires are not needed to be used for connecting the two printed circuit boards, so that the process is simple, and the reliability is high. The thickness of the hard printed wiring board 2 was 1mm, and the substrate of the flexible printed wiring board 3 was 25 μm thick polyimide. It is thick earlier 4mm, the perpendicular upwards bonding of plastics excellent core 5 that 4mm is high is on hard printed circuit board 2, then twine the thick coaxial line of 1mm on this plastics excellent core 5 from up down, after twining 3 circles, again from last 3 circles of down twining, the shielding layer welding that finally exposes the both ends of coaxial line is on hard printed circuit board 2's pad, and use an 8mm long, 8mm is wide, 4mm high shield cover 6 is detained outside coaxial line wound solenoid 1, the welding is on hard printed circuit board 2's pad all around of shield cover 6, hard printed circuit board 2's pad and solenoid 1's one end intercommunication. Thus, the inductance of the solenoid 1 is about 110nH, and if the solenoid resonates to a frequency of 1.5T, i.e., 63.86MHz, the required capacitance is about 56.5pF, and it can be calculated according to the formula (1) in the first embodiment that the overlap area of less than 7mmx7 mm-49 mm2 is required to generate such a large capacitance.
Referring to fig. 5, the common mode rejection effect of the common mode rejection balun for 1.5T magnetic resonance in the present embodiment can be seen to be more than 20dB even at 1.5T. The voltage resistance of the polyimide with the thickness of 25 microns can reach 5.5 kilovolts, which is much higher than that of a 10C series capacitor.
The size of the common mode rejection balun is only 8mm long, 8mm wide and less than 5.5mm high, the size is very small, the common mode rejection balun is only slightly larger than the capacitance of a 10C series, and the common mode rejection balun is very suitable for being used by a multi-channel high-density flexible radio frequency coil. Moreover, the common mode rejection balun is provided with a shielding cover, and can be placed at any position of the coil without worrying about coupling with the coil. More importantly, when the flexible coil is designed, the flexible printed circuit board is also used, and the flexible printed circuit board used by the resonant circuit of the flexible coil and the flexible printed circuit board used by the common-mode rejection balun can be completely designed on one flexible printed circuit board as a whole, so that the cost of the whole design and production can be reduced, welding points are greatly reduced, and the reliability of the flexible coil is obviously improved.
In conclusion, the novel common mode rejection balun structure for the magnetic resonance radio frequency coil is simple in design and manufacture, low in cost, high in safety, small in size and light in weight, and when the novel common mode rejection balun structure is used in the magnetic resonance radio frequency coil, the size and the weight of the magnetic resonance radio frequency coil can be obviously reduced, the softness and the comfort degree of the magnetic resonance radio frequency coil are improved, the design is ingenious, the structure is simple, the production and the debugging are convenient, and the novel common mode rejection balun structure is suitable for large-scale popularization and application.
It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that changes and modifications to the above described embodiments are within the scope of the claims of the present invention as long as they are within the spirit and scope of the present invention.
Claims (8)
1. A novel common mode rejection balun structure for a magnetic resonance radio frequency coil is characterized by consisting of an upper layer, a middle layer and a lower layer, wherein the upper layer is a solenoid coil formed by coaxial wire winding, the middle layer is a hard printed circuit board, and the lower layer is a double-layer flexible printed circuit board; wherein:
the double-layer flexible printed circuit board comprises a substrate, an upper conductor positioned on the upper surface of the substrate and a lower conductor positioned on the lower surface of the flexible substrate; the upper and lower conductors are partially overlapped, and the overlapped upper and lower conductors and the base material between the overlapped upper and lower conductors form a planar flexible capacitor;
the outer insulating skin at the two ends of the solenoid is stripped to expose the shielding layers, the shielding layers at the two ends of the solenoid are respectively welded on the hard printed circuit board and are connected with the planar flexible capacitor in parallel sequentially through a copper-clad conductor, a connecting wire conductor and a conductor on the flexible printed circuit board on the hard printed circuit board, and the solenoid, the planar flexible capacitor and all the conductors between the solenoid and the planar flexible capacitor form a parallel resonant circuit to play a role in inhibiting common mode current.
2. The novel common-mode rejection balun structure for a magnetic resonance radio frequency coil according to claim 1, wherein the connecting line conductor is a thin copper wire and/or a via hole.
3. The novel common-mode rejection balun structure for a magnetic resonance radio frequency coil according to claim 1, wherein the hard printed circuit board and the flexible printed circuit board are bonded together by glue, holes are respectively drilled on the hard printed circuit board and the flexible printed circuit board, fine copper wires are inserted into the drilled holes, two ends of each fine copper wire are welded on the bonding pads of the hard printed circuit board and the flexible printed circuit board in a one-to-one correspondence manner, and the fine copper wires are used for electrical connection.
4. The novel common-mode rejection balun structure for a magnetic resonance radio frequency coil as claimed in claim 1, wherein the rigid printed circuit board and the flexible printed circuit board are integrally formed to form a rigid-flexible printed circuit board, and the rigid-flexible printed circuit board is electrically connected through a via hole from the top layer to the bottom layer.
5. A novel common-mode rejection balun structure for a magnetic resonance radio frequency coil as claimed in claim 1 wherein the axis of the solenoid is parallel to the plane of the hard printed wiring board.
6. A novel common-mode rejection balun structure for a magnetic resonance radio frequency coil as claimed in claim 1 wherein a plastic rod core is bonded to said rigid printed circuit board perpendicular to the plane thereof, said coaxial line is wound around said plastic rod core to form a solenoid, the axis of said solenoid being perpendicular to the plane of the rigid printed circuit board.
7. The novel common mode rejection balun structure for a magnetic resonance radio frequency coil as claimed in claim 1, wherein said solenoid is covered with a shielding case, a bottom end of said shielding case is soldered to a pad of said hard printed circuit board, said pad of said hard printed circuit board is in communication with one end of said solenoid.
8. The novel common-mode rejection balun structure for a magnetic resonance radio frequency coil according to claim 1, wherein when the magnetic resonance radio frequency coil adopts a magnetic resonance flexible radio frequency coil, a flexible printed circuit board used by the novel common-mode rejection balun and a flexible printed circuit board used by a flexible coil radio frequency loop of the magnetic resonance flexible radio frequency coil are designed and produced on the same flexible printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110463055.6A CN113036382A (en) | 2021-04-27 | 2021-04-27 | Novel common-mode rejection balun structure for magnetic resonance radio frequency coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110463055.6A CN113036382A (en) | 2021-04-27 | 2021-04-27 | Novel common-mode rejection balun structure for magnetic resonance radio frequency coil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113036382A true CN113036382A (en) | 2021-06-25 |
Family
ID=76454882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110463055.6A Pending CN113036382A (en) | 2021-04-27 | 2021-04-27 | Novel common-mode rejection balun structure for magnetic resonance radio frequency coil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113036382A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114122659A (en) * | 2021-12-06 | 2022-03-01 | 北京晟德微集成电路科技有限公司 | Microstrip line balun and frequency adjusting method thereof |
-
2021
- 2021-04-27 CN CN202110463055.6A patent/CN113036382A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114122659A (en) * | 2021-12-06 | 2022-03-01 | 北京晟德微集成电路科技有限公司 | Microstrip line balun and frequency adjusting method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5960383B2 (en) | Contact holder | |
| US6828894B1 (en) | Isolation transformer arrangement | |
| CN101061556B (en) | Coil component | |
| US7750637B2 (en) | Transmission line for use in RF fields | |
| US8071890B2 (en) | Electrically conductive structure of circuit board and circuit board using the same | |
| EP1945010B1 (en) | Multi-layer substrate and electronic device having the same | |
| US8773232B2 (en) | High-frequency transformer, high-frequency component, and communication terminal device | |
| JP5603788B2 (en) | Coil and manufacturing method thereof | |
| US9312059B2 (en) | Integrated connector modules for extending transformer bandwidth with mixed-mode coupling using a substrate inductive device | |
| CN215184482U (en) | Novel common-mode rejection balun structure for magnetic resonance radio frequency coil | |
| CN113036382A (en) | Novel common-mode rejection balun structure for magnetic resonance radio frequency coil | |
| US7291916B2 (en) | Signal transmission structure and circuit substrate thereof | |
| CN105957691A (en) | Three-dimensional winding inductor, transformer, equalizer and LC filter | |
| CN215187595U (en) | Flexible planar transmission line and common-mode rejection balun structure | |
| WO2001091291A1 (en) | Emi filters based on amorphous metals | |
| CN113079633A (en) | Flexible planar transmission line and common-mode rejection balun structure | |
| CN215180820U (en) | Planar flexible detuning circuit structure for magnetic resonance radio frequency coil | |
| CN215180816U (en) | Flexible magnetic resonance radio frequency coil structure | |
| CN113093075A (en) | Planar flexible detuning circuit structure for magnetic resonance radio frequency coil | |
| JP5178351B2 (en) | Electronic component mounting structure | |
| CN113093073A (en) | Flexible magnetic resonance radio frequency coil structure | |
| CN215180818U (en) | Zero-welding-point flexible radio frequency coil structure for magnetic resonance imaging | |
| CN215449562U (en) | Magnetic resonance radio frequency transmitting coil structure of distributed capacitor | |
| CN109768370A (en) | A kind of capsule gastroscope | |
| CN113433497A (en) | Magnetic resonance radio frequency transmitting coil structure of distributed capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |