CN112974158A - Automatic gluing device and gluing method for silicon rod cutting slices - Google Patents
Automatic gluing device and gluing method for silicon rod cutting slices Download PDFInfo
- Publication number
- CN112974158A CN112974158A CN202110181384.1A CN202110181384A CN112974158A CN 112974158 A CN112974158 A CN 112974158A CN 202110181384 A CN202110181384 A CN 202110181384A CN 112974158 A CN112974158 A CN 112974158A
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- resin plate
- glue
- gluing
- resin
- positioning
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- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 63
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 42
- 239000010703 silicon Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 148
- 229920005989 resin Polymers 0.000 claims abstract description 148
- 230000007246 mechanism Effects 0.000 claims abstract description 88
- 239000003292 glue Substances 0.000 claims abstract description 64
- 230000003068 static effect Effects 0.000 claims abstract description 22
- 230000033001 locomotion Effects 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000010073 coating (rubber) Methods 0.000 claims abstract description 5
- 230000000903 blocking effect Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000003921 oil Substances 0.000 description 5
- 230000005693 optoelectronics Effects 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 230000007480 spreading Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0075—Manipulators for painting or coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G35/00—Mechanical conveyors not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0266—Control or detection relating to the load carrier(s)
- B65G2203/0283—Position of the load carrier
Abstract
The invention discloses an automatic gluing device for silicon rod cutting slices, which comprises: a resin plate material box; the resin plate feeding mechanism is positioned above the resin plate box and can take out the resin plate from the resin plate box; the positioning assembly is arranged on a motion path of the resin plate feeding mechanism and can receive the grabbed resin plate from the resin plate feeding mechanism and perform centering operation on the resin plate; the gluing manipulator is arranged on a motion path of the positioning assembly and can glue the resin plate on the positioning assembly; wherein, the rubber coating manipulator includes 1:1MB static mixing tube and glue coating mouth; in addition, a speed-multiplying chain conveying line is arranged for conveying the silicon blocks subjected to gluing. The invention also provides a gluing method. The invention ensures that the thickness difference of the glue layer is small, and the glue layer can realize the glue thickness difference of 1:1 automatic glue mixing, and the effect that the glue is fine and smooth and does not generate bubbles is achieved, and in addition, the silicon blocks can be stably transmitted, so that the probability of damage to the silicon blocks is reduced.
Description
Technical Field
The invention relates to the field of solar equipment, in particular to an automatic gluing device and a gluing method for silicon rod cutting slices.
Background
Solar power generation is an emerging renewable energy source. Solar energy in a broad sense is a source of much energy on earth, such as wind energy, chemical energy, potential energy of water, and so on. At present, solar energy is mainly converted into electric energy through a solar cell panel for utilization. The solar cell panel is divided into a silicon solar cell panel, an organic solar cell panel and the like according to different used materials, wherein the silicon solar cell panel is the most mature solar cell panel.
In the prior art, silicon rods are generally processed into silicon wafers by adopting a diamond wire cutting technology, the process firstly requires that the silicon rods are adhered to a resin plate, and then the silicon rods and the resin plate are installed on a cutting machine together to achieve the purpose of fixing the silicon rods. At present, the procedure is often finished by manual gluing and bonding. However, the manual gluing method has the following disadvantages:
1. the glue is not uniformly coated, and the thickness difference of the glue layer is large, so that the parallelism of the silicon block is unbalanced;
2. glued A, B two glues do not yield 1:1 or other ratios;
3. air bubbles can be generated during gluing, and the edges of the silicon block can be broken due to the air bubbles.
In addition, in the prior art, the silicon blocks are generally conveyed by conveying lines with large friction force, such as belt lines and the like, which is not stable enough, and the probability of damage to the silicon blocks is increased.
Therefore, those skilled in the art have devoted themselves to develop an automatic glue spreading device for cutting silicon rods into slices, so that the difference of the thickness of the glue layer is small, and 1:1 automatic glue mixing, and the effect that the glue is fine and smooth and does not generate bubbles is achieved, and in addition, the silicon blocks can be stably transmitted, so that the probability of damage to the silicon blocks is reduced.
Disclosure of Invention
In order to achieve the above object, the present invention provides an automatic gluing device for silicon rod cut pieces, comprising:
a resin plate material box;
a resin plate feeding mechanism located above the resin plate box and configured to enable a resin plate to be taken out of the resin plate box;
a positioning assembly disposed on a movement path of the resin board feeding mechanism and configured to be capable of receiving the gripped resin board from the resin board feeding mechanism and performing a centering operation on the resin board;
the gluing manipulator is arranged on a motion path of the positioning assembly and is configured to glue the resin plate on the positioning assembly;
wherein, the rubber coating manipulator includes 1:1MB static mixing tube and a mixing tube arranged between the 1:1MB static mixing tube end glue nozzle, said 1: a 1MB static mixing tube configured to mix A, B glue, the glue nozzle configured to perform a glue application operation on the resin board;
the resin plate feeding mechanism, the positioning assembly and the gluing manipulator are integrated in a gluing machine main machine;
the automatic gluing device also comprises a speed-multiplying chain conveying line and a follow-up tool of the automatic gluing device; the speed-multiplying chain conveying line is connected to the glue spreader main machine, and the follow-up tool is arranged on the speed-multiplying chain conveying line; the follow-up tool is configured to circularly move on the double-speed line conveying line so as to receive the silicon block bonded with the resin plate and convey the silicon block to a curing area.
In some embodiments, optionally, the device further comprises a follow-up tool blocking device, wherein the follow-up tool blocking device is arranged at the end of the speed-multiplying chain conveying line to block the motion of the follow-up tool.
In some embodiments, optionally, the resin board feed mechanism comprises a rodless cylinder assembly, an electric cylinder assembly, a first rail slide, an electric cylinder mounting bracket, a resin board gripper, a first rail; the electric cylinder assembly is mounted on the electric cylinder mounting bracket; the electric cylinder mounting bracket is connected to the first guide rail through the first guide rail slider; the resin board gripper is arranged at the tail end of the electric cylinder assembly and is configured to be driven by the electric cylinder assembly to move along the direction perpendicular to the first guide rail; the rodless cylinder assembly is configured to drive the electric cylinder assembly along the first rail.
In some embodiments, optionally, the positioning assembly includes a positioning mechanism, an optoelectronic assembly, a second rail slider, a positioning mechanism limiting piece, a first rack, and a tooling rack; the positioning mechanism, the photoelectric component, the second guide rail sliding block, the positioning mechanism limiting piece and the first rack are all arranged on the tool rack; the second guide rail sliding blocks are arranged on the tool rack in parallel, and the positioning mechanism crosses over the second guide rail sliding blocks and is configured to move along the second guide rail sliding blocks; the photoelectric assembly is arranged on the tool rack and is configured to be capable of detecting whether the resin plate moves above the positioning mechanism; the first rack and the second guide rail sliding block are arranged in parallel and connected to the positioning mechanism; the positioning mechanism limiting part is arranged at the end point of the movement stroke of the positioning mechanism and is configured to block the movement of the positioning mechanism.
In some embodiments, optionally, the positioning mechanism includes a support tool, a support plate, a guide, a cam centering member, and an adjustable centering block; the supporting plates are arranged on the supporting tool in parallel; the guide piece, the cam centering piece and the adjustable centering block are respectively arranged at two ends of each supporting plate; the positioning mechanism is configured to be positioned on each of the support plates intermediate the guide, the cam centering member, and the adjustable centering block and perform centering under the action of the guide, the cam centering member, and the adjustable centering block when the resin plate is placed on the positioning mechanism.
In some embodiments, optionally, the positioning mechanism further includes a motor and a first gear, the motor is disposed below the support tool through a motor mounting bracket, the motor is connected to the first gear, and the first gear is engaged with the first rack, so as to drive the positioning mechanism to move along the second rail slider.
In some embodiments, optionally, the gluing manipulator comprises a Z-axis screw, a Y-axis screw, an X-axis screw; the Y-axis screw is arranged on the X-axis screw and is configured to move along the X-axis screw; the Z-axis screw is arranged on the Y-axis screw and is configured to move along the Y-axis screw; the following steps of 1: a 1MB static mixing tube is connected to the Z-axis screw and configured to be movable along the Z-axis screw.
In some embodiments, optionally, the glue applying nozzle is a flat glue applying nozzle, and a drawing die with a slope is arranged on the flat glue applying nozzle.
The invention also provides a gluing method using the automatic gluing device, which comprises the following steps:
placing a follow-up tool on a speed chain transmission line;
grabbing the resin plate by using a resin plate feeding mechanism and conveying the resin plate to a positioning assembly;
the positioning assembly performs centering operation after receiving the resin plate;
the positioning assembly moves the resin plate to be below the gluing manipulator;
the gluing manipulator performs gluing operation;
the resin plate feeding mechanism grabs the silicon block subjected to the gluing operation and conveys the silicon block to the follow-up tool;
wherein, the rubber coating manipulator includes 1:1MB static mixing tube and a mixing tube arranged between the 1:1MB static mixing tube end glue nozzle, said 1: a 1MB static mixing tube is configured to mix A, B glue, and the glue nozzle is configured to perform a glue application operation on the resin board.
In some embodiments, optionally, the resin board is detected by an optoelectronic component while the resin board is conveyed to the positioning component by the resin board feeding mechanism, and the resin board is placed on the positioning component by the resin board feeding mechanism while the resin board position is detected.
The automatic gluing device and the gluing method for the silicon rod cutting slices have the following technical effects:
1. the two kinds of glue are mixed and discharged automatically in a ratio of 1:1 through a 1:1MB static mixing pipe by adopting a customized glue mixing machine, and the two kinds of glue can be completely mixed.
2. The glue is coated by adopting the flat glue nozzle, so that the difference of the thickness of a glue layer is very small, and the inside of the glue nozzle is subjected to pattern drawing with a certain inclination, so that the discharged glue is fine and smooth, and no air bubble is generated.
3. And (4) conveying the silicon blocks which are well bonded with the resin plate by adopting a speed multiplying chain conveying line and a follow-up tool.
The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings to fully understand the objects, the features and the effects of the present invention.
Drawings
FIG. 1 is a general schematic diagram of a preferred embodiment of the present invention;
FIG. 2 is a schematic view of a follower tool;
FIG. 3 is a schematic structural view of a resin board feeding mechanism;
FIG. 4 is a schematic view of a moving mechanism of the resin board positioning assembly;
FIG. 5 is a schematic structural view of the positioning assembly;
fig. 6 is a schematic structural view of the gluing robot.
Wherein, 1-a glue spreader main machine, 2-a resin plate bin, 3-a double speed chain conveying line, 4-a follow-up tool blocking device, 5-a silicon block, 6-a follow-up tool, 7-a rodless cylinder component, 8-an electric cylinder component, 9-an oil buffer, 10-a limiting mounting plate, 11-a first guide rail slide block, 12-an electric cylinder mounting bracket 12, 13-a resin plate grab, 17-a positioning mechanism, 18-an optoelectronic component, 19-a second guide rail slide block, 20-a positioning mechanism limiting part, 21-a first rack, 22-a tool rack, 23-a guiding part, 24-a third guide rail slide block, 25-a resin plate, 26-a resin plate supporting part, 27-a cam centering part, 28-an adjustable centering block and 29-a supporting tool, 30-pneumatic finger, 31-second guide rail, 32-dust cover, 33-first gear, 35-motor, 36-motor mounting plate, 37-Z-axis screw rod, 38-Y-axis screw rod, 39-X-axis screw rod, 40-fourth guide rail sliding block, 41-1: the device comprises 1MB of static mixing pipes 41, 42-a flat gluing nozzle, 100-a resin plate feeding mechanism, 111-a first guide rail, 200-a positioning assembly and 300-a gluing manipulator.
Detailed Description
The technical contents of the preferred embodiments of the present invention will be more clearly and easily understood by referring to the drawings attached to the specification. The present invention may be embodied in many different forms of embodiments and the scope of the invention is not limited to the embodiments set forth herein.
In the drawings, structurally identical elements are represented by like reference numerals, and structurally or functionally similar elements are represented by like reference numerals throughout the several views. The size and thickness of each component shown in the drawings are arbitrarily illustrated, and the present invention is not limited to the size and thickness of each component. The thickness of the components may be exaggerated where appropriate in the figures to improve clarity.
As shown in fig. 1, an automatic gluing device for silicon rod cutting into slices comprises a gluing machine main machine 1, a resin plate material box 2, a speed doubling chain conveying line 3 and a follow-up tool blocking device 4. And a follow-up tool 6 can be arranged on the speed-multiplying chain conveying line 3. The resin plate bin 2 is arranged below the glue spreader main machine 1, the glue spreader main machine 1 takes out the resin plate 25 from the resin plate bin 2, the resin plate 25 is positioned, then the positioned resin plate 25 and the silicon rod are subjected to automatic glue spreading operation, after the glue spreading is finished, the silicon block group 5 (see figure 2) bonded with the resin plate is placed on a follow-up tool 6, and the bonded silicon block group 5 is conveyed to a curing area by the double-speed chain conveying line 3.
The glue spreader assembly 1 includes a resin plate feeding mechanism 100, a positioning assembly 200, and a glue spreading manipulator 300. The resin board feed mechanism 100 grasps the resin board 25 in the resin board hopper 2 and moves above the positioning assembly 200. The resin board feeding mechanism 100 cooperates with the positioning assembly 200 to ensure that the resin board is not damaged after being placed on the positioning assembly 200. After the resin plate 25 is placed on the positioning assembly 200, the positioning assembly 200 performs centering positioning on the resin plate 25, after the positioning is completed, the positioning assembly 200 is driven to the lower side of the gluing manipulator 300 by the transmission mechanism, and the resin plate 25 is precisely glued by the gluing manipulator 300. After the gluing is finished, the silicon rod is bonded with the resin plate by manually driving the power assisting arm.
The follow-up tool 6 can move back and forth on the speed-multiplying chain conveying line 3 and can be controlled by a PLC (programmable logic controller), and the follow-up tool 6 is blocked in front of the glue spreader main machine 1 under the cooperation of the follow-up tool blocking device 4.
The resin plate feeding mechanism 100 comprises a rodless cylinder assembly 7, an electric cylinder assembly 8, an oil buffer 9, a limiting mounting plate 10, a first guide rail sliding block 11, an electric cylinder mounting support 12, a resin plate gripper 13 and a first guide rail 111. The oil buffer 9 is arranged at one end of the electric cylinder assembly 8, and the limiting mounting plate 10 is connected to the oil buffer 9 and used for limiting the movement stroke of the electric cylinder assembly 8 and buffering the movement of the electric cylinder assembly 8. The electric cylinder assembly 8 is mounted on an electric cylinder mounting bracket 12, and the electric cylinder mounting bracket 12 is connected to the first rail 111 by a first rail slider 11 and is capable of sliding along the first rail 111 under the drive of the rodless cylinder assembly 7. The resin plate gripper 13 is disposed at the other end (the end opposite to the oil buffer 9) of the electric cylinder assembly 8, and the resin plate gripper 13 can move up and down (i.e., in a direction perpendicular to the first guide rail 111) under the driving of the electric cylinder assembly 8, so that the resin plate gripper 13 can move into the resin plate bin 2 to grip the resin plate 25 and place the gripped resin plate 25 on the positioning assembly 200.
The positioning assembly 200 is disposed on the movement path of the resin board feeding mechanism 100, i.e., the resin board feeding mechanism 100 can move to the positioning assembly 200, and the resin board 25 is placed on the positioning assembly 200. The positioning assembly 200 includes a positioning mechanism 17, an optoelectronic assembly 18, a second rail slider 19, a positioning mechanism limiting member 20, a first rack 21, and a tooling table 22.
The positioning mechanism 17, the photoelectric component 18, the second guide rail sliding block 19, the positioning mechanism limiting part 20 and the first rack 21 are all arranged on the tool rack 22. Specifically, the second rail blocks 19 are provided in parallel on the tool stage 22, and the positioning mechanism 17 straddles the two second rail blocks 19 and is movable along the second rail blocks 19. The opto-electronic assembly 18 is arranged on the second rail slide 19. The first rack 21 is arranged in parallel with the second rail block 19 and is connected to the bottom of the positioning mechanism 17. The first rack 21 is used for transmitting the power output by the power component to the positioning mechanism 17, so that the positioning mechanism 17 can move along the second rail block 19. The positioning mechanism limiting part 20 is arranged on the tooling rack 22 and is located at the end point of the movement stroke of the positioning mechanism 17, and is used for limiting the movement stroke of the positioning mechanism 17.
When the resin board gripper 13 grips the resin board 25 and moves above the positioning mechanism 17, the electric cylinder assembly 8 drives the resin board gripper 13 to descend at a certain speed, and when the photoelectric assembly 18 detects the resin board, the resin board gripper 13 opens to put down the resin board 25, thereby placing the resin board 25 on the positioning mechanism 17.
After receiving the resin board 25, the positioning mechanism 17 starts centering the resin board.
The positioning mechanism 17 comprises a guide piece 23, a third guide rail slide block 24, a resin plate support piece 26, a cam centering piece 27, an adjustable centering block 28, a support tool 29, a pneumatic finger 30, a second guide rail 31, a dust cover 32, a first gear 33, a motor 35 and a motor mounting plate 36. The support tool 29 is a support device of the whole positioning mechanism 17, and is used for supporting all components on the positioning mechanism 17. The second guide rail 31 is arranged below the support tool 29 and is used for matching with the second guide rail slide block 19. The supporting plates 291 are disposed above the supporting tool 29, the two supporting plates 291 are disposed in parallel, and the length direction of the two supporting plates 291 is perpendicular to the second rail block 19. Two sets of guide members 23, two sets of cam centering members 27 and two sets of adjustable centering blocks 28 are respectively arranged on each supporting plate 291, wherein the two sets of guide members 23, the two sets of cam centering members 27 and the two sets of adjustable centering blocks 28 are respectively arranged at two ends of the supporting plate 291 along the length direction. A third rail block 24 is provided below the support plate 291 such that the support plate 291 is movable in a direction parallel to the second rail block 19. The support plate 291 is driven to move by the pneumatic finger 30. The resin board support member 26 is provided on the support tool 29 for supporting the resin board 25 placed on the positioning mechanism 17. When the resin sheet 25 is placed on the positioning mechanism 17 from the resin sheet gripper 13, the resin sheets 15 are respectively positioned in the middle of the guide 23, the cam centering member 27 and the adjustable centering block 28 on the two support plates 291, and then the support plates 291 are driven while moving toward the middle, thereby completing the centering operation of the resin sheets.
The motor mounting plate 36 is disposed below the support tool 29, and the motor 35 is mounted on the motor mounting plate 36 for outputting power so that the positioning mechanism 17 moves along the second rail slider 19. Specifically, the motor 35 is connected to the first gear 33, and the first gear 33 is engaged to the first rack 22, thereby achieving the movement of the positioning mechanism 17. A dust cover 32 is provided outside the first gear 33 for preventing dust from entering the transmission.
The glue applying robot 300 is capable of performing a glue applying operation on the resin sheet 25 that is centered on the positioning mechanism 17, that is, the glue applying robot 300 is located on a movement path of the positioning mechanism 17.
The gluing manipulator 300 comprises a Z-axis screw 37, a Y-axis screw 38, an X-axis screw 39, a fourth guide rail slider 40, 1: a 1MB static mixing tube 41 and a flat applicator tip 42. One end of the X-axis lead screw 39 is disposed on the fourth rail block 40 and can move along the fourth rail block 40; the Y-axis screw 38 is arranged on the X-axis screw 39 and can move along the X-axis screw 39; the Z-axis screw is provided on the Y-axis screw 38 and can move along the Y-axis screw 38, and the Z-axis screw 37 is provided with 1:1MB static mixing tube 41, at 1: the end of the 1MB static mixing tube 41 is provided with a flat glue nozzle 42. With the above structure, 1: the 1MB static mixing tube 41 and the flat glue nozzle 42 can realize X, Y, Z three-degree-of-freedom movement, thereby realizing accurate alignment of the resin board to be sprayed with glue. Meanwhile, 1:1MB static mixing tube 41 can realize the uniform mixing of A, B glue and ensure the complete mixing of the glue. The flat rubber nozzle 42 is used, so that the difference of the thickness of the rubber layer is small when rubber is coated, and a drawing die with a certain inclination is arranged inside the rubber nozzle, so that the antenna is fine and smooth, and no air bubble is generated.
The automatic gluing device provided by the invention has the following working process:
placing a follow-up tool 6 on a speed doubling chain conveying line 3 in advance, enabling the follow-up tool 6 to flow on the speed doubling chain conveying line 3 in a circulating mode all the time, blocking the follow-up tool 6 in front of a resin plate glue spreader main machine 1 under the control of a plc, driving a resin plate gripper 13 to be above a resin plate material box 2 through a rodless cylinder assembly 7, driving the resin plate gripper 13 to grip a resin plate 25 through an electric cylinder assembly 8, moving the resin plate 25 gripped by the resin plate gripper 13 to be above a resin plate positioning mechanism 17 through the rodless cylinder assembly 7, driving the resin plate 25 gripped by the resin plate gripper 13 to descend at a certain speed through the electric cylinder assembly 8, opening the resin plate gripper 13 to place the resin plate 25 when the photoelectric assembly 18 detects the resin plate 25, and further centering and positioning the resin plate 25 through a resin plate positioning mechanism 17 (comprising a cam centering piece 27, an adjustable centering block 28, a pneumatic finger 30 and the like), and then the resin plate 25 is driven to the lower part of the gluing manipulator 300 by the first gear 33, the first rack 21 and the second guide rail slide block 19, finally the gluing manipulator 300 is used for accurately gluing the resin plate, further after the resin plate 25 is glued, the silicon rod and the resin plate 25 are bonded by a manual driving assistance arm, after the bonding is finished, the follow-up tool 6 moves to the position of the gluing machine main machine 1 and is positioned by the follow-up tool blocking device 4, the bonded silicon block 5 is grabbed and placed on the follow-up tool 6 on the speed-doubling chain conveying line 3 by the resin plate grabbing hand 13, and then the bonded silicon block 5 is conveyed to a curing area by the speed-doubling chain conveying line 3.
The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.
Claims (10)
1. An automatic gluing device for silicon rod cutting sheets is characterized by comprising:
a resin plate material box;
a resin plate feeding mechanism located above the resin plate box and configured to enable a resin plate to be taken out of the resin plate box;
a positioning assembly disposed on a movement path of the resin board feeding mechanism and configured to be capable of receiving the gripped resin board from the resin board feeding mechanism and performing a centering operation on the resin board;
the gluing manipulator is arranged on a motion path of the positioning assembly and is configured to glue the resin plate on the positioning assembly;
wherein, the rubber coating manipulator includes 1:1MB static mixing tube and a mixing tube arranged between the 1:1MB static mixing tube end glue nozzle, said 1: a 1MB static mixing tube configured to mix A, B glue, the glue nozzle configured to perform a glue application operation on the resin board;
the resin plate feeding mechanism, the positioning assembly and the gluing manipulator are integrated in a gluing machine main machine;
the automatic gluing device also comprises a speed-multiplying chain conveying line and a follow-up tool of the automatic gluing device; the speed-multiplying chain conveying line is connected to the glue spreader main machine, and the follow-up tool is arranged on the speed-multiplying chain conveying line; the follow-up tool is configured to circularly move on the double-speed line conveying line so as to receive the silicon block bonded with the resin plate and convey the silicon block to a curing area.
2. The automatic gluing device according to claim 1, further comprising a follow-up tooling blocking device arranged at an end of the speed doubling chain conveying line to block movement of the follow-up tooling.
3. The automatic gluing device according to claim 1, wherein the resin board feeding mechanism comprises a rodless cylinder assembly, an electric cylinder assembly, a first guide rail slider, an electric cylinder mounting bracket, a resin board gripper, a first guide rail; the electric cylinder assembly is mounted on the electric cylinder mounting bracket; the electric cylinder mounting bracket is connected to the first guide rail through the first guide rail slider; the resin board gripper is arranged at the tail end of the electric cylinder assembly and is configured to be driven by the electric cylinder assembly to move along the direction perpendicular to the first guide rail; the rodless cylinder assembly is configured to drive the electric cylinder assembly along the first rail.
4. The automatic gluing device according to claim 1, wherein the positioning assembly comprises a positioning mechanism, a photoelectric assembly, a second guide rail sliding block, a positioning mechanism limiting part, a first rack and a tooling rack; the positioning mechanism, the photoelectric component, the second guide rail sliding block, the positioning mechanism limiting piece and the first rack are all arranged on the tool rack; the second guide rail sliding blocks are arranged on the tool rack in parallel, and the positioning mechanism crosses over the second guide rail sliding blocks and is configured to move along the second guide rail sliding blocks; the photoelectric assembly is arranged on the tool rack and is configured to be capable of detecting whether the resin plate moves above the positioning mechanism; the first rack and the second guide rail sliding block are arranged in parallel and connected to the positioning mechanism; the positioning mechanism limiting part is arranged at the end point of the movement stroke of the positioning mechanism and is configured to block the movement of the positioning mechanism.
5. The automatic gluing device according to claim 4, wherein the positioning mechanism comprises a support tool, a support plate, a guide member, a cam centering member and an adjustable centering block; the supporting plates are arranged on the supporting tool in parallel; the guide piece, the cam centering piece and the adjustable centering block are respectively arranged at two ends of each supporting plate; the positioning mechanism is configured to be positioned on each of the support plates intermediate the guide, the cam centering member, and the adjustable centering block and perform centering under the action of the guide, the cam centering member, and the adjustable centering block when the resin plate is placed on the positioning mechanism.
6. The automatic gluing device according to claim 5, wherein the positioning mechanism further comprises a motor and a first gear, the motor is arranged below the support tool through a motor mounting frame, the motor is connected to the first gear, and the first gear is meshed with the first rack so as to drive the positioning mechanism to move along the second guide rail slider.
7. The automatic gluing device according to claim 1, wherein the gluing manipulator comprises a Z-axis screw, a Y-axis screw and an X-axis screw; the Y-axis screw is arranged on the X-axis screw and is configured to move along the X-axis screw; the Z-axis screw is arranged on the Y-axis screw and is configured to move along the Y-axis screw; the following steps of 1: a 1MB static mixing tube is connected to the Z-axis screw and configured to be movable along the Z-axis screw.
8. The automatic gluing device according to claim 1, wherein the gluing nozzle is a flat gluing nozzle provided with a drawing die having a slope.
9. A glue application method using the automatic glue application apparatus according to any one of claims 1 to 8, comprising:
placing a follow-up tool on a speed chain transmission line;
grabbing the resin plate by using a resin plate feeding mechanism and conveying the resin plate to a positioning assembly;
the positioning assembly performs centering operation after receiving the resin plate;
the positioning assembly moves the resin plate to be below the gluing manipulator;
the gluing manipulator performs gluing operation;
the resin plate feeding mechanism grabs the silicon block subjected to the gluing operation and conveys the silicon block to the follow-up tool;
wherein, the rubber coating manipulator includes 1:1MB static mixing tube and a mixing tube arranged between the 1:1MB static mixing tube end glue nozzle, said 1: a 1MB static mixing tube is configured to mix A, B glue, and the glue nozzle is configured to perform a glue application operation on the resin board.
10. A method of gluing according to claim 9, wherein the resin board is detected by an opto-electric module while the resin board is being conveyed to the positioning module by the resin board feeding mechanism, and the resin board is placed on the positioning module by the resin board feeding mechanism while the position of the resin board is detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110181384.1A CN112974158A (en) | 2021-02-09 | 2021-02-09 | Automatic gluing device and gluing method for silicon rod cutting slices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110181384.1A CN112974158A (en) | 2021-02-09 | 2021-02-09 | Automatic gluing device and gluing method for silicon rod cutting slices |
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| Publication Number | Publication Date |
|---|---|
| CN112974158A true CN112974158A (en) | 2021-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110181384.1A Pending CN112974158A (en) | 2021-02-09 | 2021-02-09 | Automatic gluing device and gluing method for silicon rod cutting slices |
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| Country | Link |
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| CN (1) | CN112974158A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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