CN112970099A - 前管道设备前端模块、侧存储舱及其操作方法 - Google Patents

前管道设备前端模块、侧存储舱及其操作方法 Download PDF

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Publication number
CN112970099A
CN112970099A CN201980070805.4A CN201980070805A CN112970099A CN 112970099 A CN112970099 A CN 112970099A CN 201980070805 A CN201980070805 A CN 201980070805A CN 112970099 A CN112970099 A CN 112970099A
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CN
China
Prior art keywords
end module
side storage
chamber
equipment front
return
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980070805.4A
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English (en)
Chinese (zh)
Inventor
保罗·B·路透
罗宾·C·阿姆斯特朗
约翰·C·门克
尼尔·玛利
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Applied Materials Inc
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Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN112970099A publication Critical patent/CN112970099A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ventilation (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
CN201980070805.4A 2018-10-26 2019-10-23 前管道设备前端模块、侧存储舱及其操作方法 Pending CN112970099A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862751514P 2018-10-26 2018-10-26
US62/751,514 2018-10-26
US16/660,057 US11373891B2 (en) 2018-10-26 2019-10-22 Front-ducted equipment front end modules, side storage pods, and methods of operating the same
US16/660,057 2019-10-22
PCT/US2019/057650 WO2020086709A1 (en) 2018-10-26 2019-10-23 Front-ducted equipment front end modules, side storage pods, and methods of operating the same

Publications (1)

Publication Number Publication Date
CN112970099A true CN112970099A (zh) 2021-06-15

Family

ID=70325553

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980070805.4A Pending CN112970099A (zh) 2018-10-26 2019-10-23 前管道设备前端模块、侧存储舱及其操作方法

Country Status (6)

Country Link
US (2) US11373891B2 (https=)
JP (1) JP7365408B2 (https=)
KR (1) KR102577683B1 (https=)
CN (1) CN112970099A (https=)
TW (2) TW202314930A (https=)
WO (1) WO2020086709A1 (https=)

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US11610794B2 (en) * 2018-10-26 2023-03-21 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating the same
US11244844B2 (en) * 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
US11189511B2 (en) * 2018-10-26 2021-11-30 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating EFEMs
US11373891B2 (en) 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
KR102202463B1 (ko) * 2019-03-13 2021-01-14 세메스 주식회사 기판 처리 장치 및 방법
US12076854B2 (en) * 2021-03-18 2024-09-03 Applied Materials, Inc. Increased number of load ports on factory interface with robot that moves on track
US12370573B2 (en) * 2021-10-06 2025-07-29 Applied Materials, Inc. Equipment front end modules with induced gas mixing, and methods of use thereof
KR102780011B1 (ko) * 2022-02-09 2025-03-12 주식회사 저스템 Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치
KR102780012B1 (ko) * 2022-02-09 2025-03-12 주식회사 저스템 Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치
KR102729958B1 (ko) * 2022-06-15 2024-11-13 세메스 주식회사 장비 전단부 모듈 및 이의 동작 방법, 이를 포함하는 기판 처리 장치
US20260096386A1 (en) * 2024-09-30 2026-04-02 Applied Materials, Inc. Load lock chamber improvement

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CN112397426B (zh) * 2019-08-14 2024-08-30 罗泽系统株式会社 基板搬送装置
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Also Published As

Publication number Publication date
JP2022505473A (ja) 2022-01-14
US11373891B2 (en) 2022-06-28
JP7365408B2 (ja) 2023-10-19
WO2020086709A1 (en) 2020-04-30
WO2020086709A8 (en) 2021-06-03
TW202107600A (zh) 2021-02-16
US20220293444A1 (en) 2022-09-15
US20200135523A1 (en) 2020-04-30
KR102577683B1 (ko) 2023-09-11
TWI785279B (zh) 2022-12-01
TW202314930A (zh) 2023-04-01
KR20210068576A (ko) 2021-06-09

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