CN112912427B - 导电性树脂组合物和半导体装置 - Google Patents

导电性树脂组合物和半导体装置 Download PDF

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Publication number
CN112912427B
CN112912427B CN201980070190.5A CN201980070190A CN112912427B CN 112912427 B CN112912427 B CN 112912427B CN 201980070190 A CN201980070190 A CN 201980070190A CN 112912427 B CN112912427 B CN 112912427B
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China
Prior art keywords
resin composition
conductive resin
mass
particles
monomer
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CN201980070190.5A
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Chinese (zh)
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CN112912427A (zh
Inventor
玉野孝一
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)
CN201980070190.5A 2018-10-24 2019-10-23 导电性树脂组合物和半导体装置 Active CN112912427B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018200424 2018-10-24
JP2018-200424 2018-10-24
PCT/JP2019/041504 WO2020085372A1 (ja) 2018-10-24 2019-10-23 導電性樹脂組成物および半導体装置

Publications (2)

Publication Number Publication Date
CN112912427A CN112912427A (zh) 2021-06-04
CN112912427B true CN112912427B (zh) 2023-08-22

Family

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JP (2) JPWO2020085372A1 (https=)
CN (1) CN112912427B (https=)
TW (1) TWI824045B (https=)
WO (1) WO2020085372A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604230A (en) * 1984-10-15 1986-08-05 Stauffer Chemical Company Thermally stable adhesive
US5043102A (en) * 1989-11-29 1991-08-27 Advanced Products, Inc. Conductive adhesive useful for bonding a semiconductor die to a conductive support base
JP2000186261A (ja) * 1998-12-21 2000-07-04 Hitachi Chem Co Ltd 銅フレーム用接着剤、半導体パッケージ及び半導体パッケージの製造法
JP2001181482A (ja) * 1999-12-27 2001-07-03 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
CN102939645A (zh) * 2010-06-15 2013-02-20 索尼化学&信息部件株式会社 连接结构体的制造方法
JP2017171844A (ja) * 2016-03-25 2017-09-28 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07101696B2 (ja) * 1988-07-08 1995-11-01 株式会社住友金属セラミックス 半導体素子塔載用セラミック基板
JPH06350000A (ja) * 1993-06-04 1994-12-22 Hitachi Ltd リードフレームの表面処理剤およびそれを用いた半導体集積回路装置の製造方法
JP3343210B2 (ja) * 1997-12-26 2002-11-11 株式会社ジャパンエナジー エポキシブリ−ドアウト防止剤及び防止方法
JP5352970B2 (ja) * 2007-07-04 2013-11-27 住友ベークライト株式会社 樹脂組成物および半導体装置
JP5513734B2 (ja) * 2008-11-27 2014-06-04 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
CN109643662B (zh) * 2016-08-19 2021-07-13 住友电木株式会社 芯片粘结膏和半导体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604230A (en) * 1984-10-15 1986-08-05 Stauffer Chemical Company Thermally stable adhesive
US5043102A (en) * 1989-11-29 1991-08-27 Advanced Products, Inc. Conductive adhesive useful for bonding a semiconductor die to a conductive support base
JP2000186261A (ja) * 1998-12-21 2000-07-04 Hitachi Chem Co Ltd 銅フレーム用接着剤、半導体パッケージ及び半導体パッケージの製造法
JP2001181482A (ja) * 1999-12-27 2001-07-03 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
CN102939645A (zh) * 2010-06-15 2013-02-20 索尼化学&信息部件株式会社 连接结构体的制造方法
JP2017171844A (ja) * 2016-03-25 2017-09-28 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法

Also Published As

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JP2022115943A (ja) 2022-08-09
TWI824045B (zh) 2023-12-01
JPWO2020085372A1 (ja) 2021-09-02
WO2020085372A1 (ja) 2020-04-30
TW202033567A (zh) 2020-09-16
JP7359252B2 (ja) 2023-10-11
CN112912427A (zh) 2021-06-04

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