CN112904663A - Ultrathin mask and processing method thereof - Google Patents
Ultrathin mask and processing method thereof Download PDFInfo
- Publication number
- CN112904663A CN112904663A CN202110159598.9A CN202110159598A CN112904663A CN 112904663 A CN112904663 A CN 112904663A CN 202110159598 A CN202110159598 A CN 202110159598A CN 112904663 A CN112904663 A CN 112904663A
- Authority
- CN
- China
- Prior art keywords
- plate
- shaped protection
- protection plate
- mask
- reticle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title abstract description 9
- 239000000428 dust Substances 0.000 claims description 36
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 21
- 229910052804 chromium Inorganic materials 0.000 claims description 21
- 239000011651 chromium Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 229920002120 photoresistant polymer Polymers 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 8
- 238000010894 electron beam technology Methods 0.000 claims description 8
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical class O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 claims description 6
- 238000000609 electron-beam lithography Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 239000005350 fused silica glass Substances 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000001259 photo etching Methods 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 3
- 238000000276 deep-ultraviolet lithography Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 238000001459 lithography Methods 0.000 claims description 3
- 230000003595 spectral effect Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Respiratory Apparatuses And Protective Means (AREA)
Abstract
The invention relates to the technical field of ultrathin masks and discloses an ultrathin mask, which comprises a first L-shaped protection plate, wherein a placing groove is formed in the inner side of the first L-shaped protection plate, and an inner cavity of the placing groove is movably connected with an ultrathin mask body. According to the ultrathin mask and the processing method thereof, the first L-shaped protection plate and the second L-shaped protection plate are respectively arranged on the outer side of the ultrathin mask body, due to the shape characteristics of the first L-shaped protection plate and the shape characteristics of the second L-shaped protection plate, four sides of the ultrathin mask body can be conveniently protected, the first telescopic rod is utilized between the first L-shaped protection plate and the second L-shaped protection plate, the baffle is connected with the first spring, one side of the second L-shaped protection plate can be conveniently clamped on the rear side of the first L-shaped protection plate, the second L-shaped protection plate can be connected with the first L-shaped protection plate under the condition that the second L-shaped protection plate is not subjected to external force, and the stability of protection on the four sides of the ultrathin mask body is improved.
Description
Technical Field
The invention relates to the technical field of ultrathin masks, in particular to an ultrathin mask and a processing method thereof.
Background
The ultrathin mask is also called as a photomask, a mask in the industry, and is made of the following materials: quartz glass, metal chromium and photosensitive resist, the product is by the quartz glass as the substrate, plate a layer of metal chromium and photosensitive resist on it, become a kind of photosensitive material, expose the circuit figure that has already been designed on the photosensitive resist through the electronic laser equipment, the area exposed will be developed out, form the circuit figure on the metal chromium, become the photo-mask plate similar to negative after exposing, then apply to carry on the projection positioning to the integrated circuit, carry on the photo-etching to the projected circuit through the integrated circuit photoetching machine, its production and processing process is: exposing, developing, removing photoresist, and finally applying to photoetching.
The existing ultra-thin mask plate has only four fixed pins on the table top, the fixed pins can not be directly fixed when the ultra-thin mask plate is placed, and the accurate position can be reached only by moving, so that when the ultra-thin mask plate moves, the four sides of the ultra-thin mask plate can generate a lot of scratches, which causes poor product exposure and quality problems, which leads to the waste of time and cost of re-operation, therefore, two fixed pins are very necessary to be added on the table top of the ultra-thin mask plate, the moving is prevented when the mask plate is placed, and the mask plate can be placed at the accurate position only by vertically placing,
meanwhile, the surface of the existing ultrathin mask is easily contaminated by dust, most of the existing processing methods are troublesome because workers hold towels to clean the ultrathin mask, and the situation of unclean and incomplete cleaning is easy to occur.
Disclosure of Invention
Technical problem to be solved
The invention provides an ultrathin mask and a processing method thereof, which have the advantages of being convenient for protecting four sides of the ultrathin mask, avoiding the ultrathin mask from being damaged when moving, and being convenient for cleaning dust on the ultrathin mask, and solve the problems mentioned in the background technology.
(II) technical scheme
The invention provides the following technical scheme: the utility model provides an ultra-thin mask version, includes first L type guard plate, the standing groove has been seted up to the inboard of first L type guard plate, the inner chamber swing joint of standing groove has ultra-thin mask version body, second L type guard plate has been cup jointed through the axle activity in one side of first L type guard plate rear side, the front side fixed mounting of second L type guard plate one side has the handle, the groove has been seted up to one side of standing groove inner chamber and has been accomodate, the front side fixed mounting who accomodates the inslot chamber has first telescopic link, the rear end fixed mounting of first telescopic link has the baffle that is located second L type guard plate one side, first spring has been cup jointed in the outside activity of first telescopic link, the both ends of first spring are fixed mounting respectively on the front side of accomodating the inslot chamber and the front side of baffle.
Preferably, the upper side and the lower side of one side of the first L-shaped protection plate are both provided with a moving groove, the inner cavity of the moving groove is movably sleeved with a moving plate, the top of the moving plate is fixedly provided with a connecting plate, the bottom of the connecting plate is fixedly provided with a second telescopic rod, the bottom of the second telescopic rod is fixedly provided with a dust wiping plate, the outer side of the second telescopic rod is movably sleeved with a second spring, two ends of the second spring are respectively and fixedly arranged at the bottom of the connecting plate and the top of the dust wiping plate, the length of the dust wiping plate is equal to the width of the ultrathin mask body, the upper side and the lower side of the first L-shaped protection plate 1 are respectively provided with a connecting plate 12, a second spring 15, a second telescopic rod 13 and a dust wiping plate 14, the moving plate 11 is pulled to move in the inner cavity of the moving groove 10, so as to drive the dust wiping plate 14 to move, be convenient for clear up the dust on the ultra-thin mask version body 3 top, because the last downside of ultra-thin mask version body 3 all is equipped with dust and wipes board 14, can wipe the equal clear-up dust of the upper and lower side of ultra-thin mask version body 3, wipe the length size of board 14 and the width size of ultra-thin mask version body 3 through the dust and equal for dust wipes board 14 can be completely with the dust clean up of the upper and lower side of ultra-thin mask version body 3.
Preferably, the whole movable plate is T-shaped, the section of the inner cavity of the movable groove is T-shaped, the whole movable plate 11 is T-shaped, and the section of the inner cavity of the movable groove 10 is T-shaped, so that the movable plate 11 can move in the inner cavity of the movable groove 10 and cannot fall off from the inner cavity of the movable groove 10, and a user can use the movable plate 11 conveniently.
Preferably, the front side fixed mounting of movable plate has preceding even board, the jack has been opened to the front side of preceding even board, the bolt has been cup jointed in the inner chamber activity of jack, links board 16 and jack 17 before all being equipped with through the front side of two movable plates 11, is convenient for link together two movable plates 11, can drive two movable plates 11 simultaneously through pulling bolt 18 and remove, and convenient to use person can clear up the dust to the upper and lower side of ultra-thin mask version body 3 simultaneously.
Preferably, the even three first telescopic link and the three first spring that are equipped with of front side of baffle, one side of first spring baffle under free state and one side contact of second L type guard plate, the even three first telescopic link 7 and three first spring 9 that are equipped with of front side through baffle 8, and one side of first spring 9 baffle 8 under free state and one side contact of second L type guard plate 4, be convenient for when there is not external force to pull second L type guard plate 4, second L type guard plate 4 can be steadily connected with first L type guard plate 1, improved the stability to the protection of ultra-thin mask version body 3.
Preferably, the rear side of second L type guard plate opposite side wholly is L word shape, the rear side of second L type guard plate opposite side cup joints in the inner chamber of standing groove through the axle activity, wholly is L word shape through the rear side of 4 opposite sides of second L type guard plate, and the rear side of 4 opposite sides of second L type guard plate cup joints in the inner chamber of standing groove 2 through the axle activity for second L type guard plate 4 can remove in the inner chamber of standing groove 2, and first L type guard plate 1 can not restrict the rotation of second L type guard plate 4.
The method for processing the ultra-thin mask as claimed in any one of the preceding claims, comprising the following processing steps:
s1, preparing a projection mask material;
s2, depositing a layer of chromium on the quartz glass sheet, arranging a film formed by chromium nitride or oxide below the chromium film, and arranging a chromium sesquioxide anti-reflection layer above the chromium film;
s3, forming a pattern on the projection mask by using electron beam lithography;
s4, photoetching, transferring the processed graphic data file to a laser drawing machine, and carrying out non-contact exposure on the uniform-photoresist chromium plate;
s5, developing, removing the photoresist layer at the exposure position and exposing the chromium layer;
s6, etching, and corroding and removing the exposed chromium layer;
s7, demolding, and removing the photoresist;
s8, cutting, namely cutting a large piece of makeup finished product into independent single finished products according to the production process requirement;
and S9, final inspection, and surface inspection for etching irregularity and other problems.
Preferably, the substrate material of the reticle for submicron lithography, which is the most important reticle substrate material for obtaining reticles in said S1, is fused silica, which is always used in deep uv lithography because it has a high optical transmission in the deep uv spectral part (248 nm and 193nm), fused silica used as reticle is the most expensive material and has a very low temperature expansion, which means that the reticle is relatively dimensionally stable when the temperature changes, and the reticle material should have the other properties of high optical transmission and no defects on the surface or inside of the material.
Preferably, in S3, the e-beam lithography uses direct writing to transfer the high resolution pattern to the surface of the reticle, in which the electron source generates a plurality of electrons which are accelerated and focused to form a pattern on the reticle, the electron beam can be focused magnetically or electrically and scanned on the reticle coated with the e-beam resist to form the desired pattern, and the electron beam can be scanned across the entire reticle, scanned in a raster, or scanned only across the area to be patterned (vector scanning) to form the pattern on the reticle.
Preferably, the chromium oxide antireflection layer in S2 is 20nm thick.
(III) advantageous effects
The invention has the following beneficial effects:
1. according to the ultrathin mask and the processing method thereof, the first L-shaped protection plate and the second L-shaped protection plate are respectively arranged on the outer side of the ultrathin mask body, due to the shape characteristics of the first L-shaped protection plate and the shape characteristics of the second L-shaped protection plate, four sides of the ultrathin mask body can be conveniently protected, the first telescopic rod is utilized between the first L-shaped protection plate and the second L-shaped protection plate, the baffle is connected with the first spring, one side of the second L-shaped protection plate can be conveniently clamped on the rear side of the first L-shaped protection plate, the second L-shaped protection plate can be connected with the first L-shaped protection plate under the condition that the second L-shaped protection plate is not subjected to external force, and the stability of protection on the four sides of the ultrathin mask body is improved.
2. According to the ultrathin mask and the processing method thereof, the connecting plates, the second springs, the second telescopic rods and the dust wiping plates are arranged on the upper side and the lower side of the first L-shaped protection plate, the first L-shaped protection plate is pulled to move in the inner cavity of the moving groove, so that the dust wiping plates are driven to move at the top of the ultrathin mask body, dust on the top of the ultrathin mask body is convenient to clean, and the dust wiping plates are arranged on the upper side and the lower side of the ultrathin mask body, so that dust can be cleaned on the upper side and the lower side of the ultrathin mask body.
3. According to the ultrathin mask and the processing method thereof, the front connecting plate and the jack are arranged on the front sides of the two movable plates, the two movable plates are convenient to connect together, the two movable plates can be driven to move simultaneously by pulling the bolt, a user can clean dust on the upper side and the lower side of the ultrathin mask body simultaneously, the efficiency of cleaning the ultrathin mask body is improved, and the ultrathin mask is convenient for workers to use.
Drawings
FIG. 1 is a schematic structural view of the present invention as a whole;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic perspective view of the placement groove of the present invention;
FIG. 4 is a schematic perspective view of a connecting plate according to the present invention;
FIG. 5 is an enlarged perspective view of the present invention at A;
FIG. 6 is a schematic view of an exploded perspective structure between the first telescoping rod and the baffle of the present invention;
fig. 7 is a schematic view of an exploded perspective structure between the connecting plate and the second telescopic rod of the present invention.
In the figure: 1. a first L-shaped guard plate; 2. a placement groove; 3. an ultrathin mask body; 4. a second L-shaped guard plate; 5. a handle; 6. a receiving groove; 7. a first telescopic rod; 8. a baffle plate; 9. a first spring; 10. a moving groove; 11. moving the plate; 12. a connecting plate; 13. a second telescopic rod; 14. wiping the board with dust; 15. a second spring; 16. a front connecting plate; 17. a jack; 18. and (4) a bolt.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, an ultra-thin mask includes a first L-shaped protection plate 1, a moving slot 10 is formed on both upper and lower sides of one side of the first L-shaped protection plate 1, a moving plate 11 is movably sleeved in an inner cavity of the moving slot 10, a connecting plate 12 is fixedly installed on a top of the moving plate 11, a second telescopic rod 13 is fixedly installed on a bottom of the connecting plate 12, a dust wiping plate 14 is fixedly installed on a bottom of the second telescopic rod 13, a second spring 15 is movably sleeved on an outer side of the second telescopic rod 13, both ends of the second spring 15 are respectively fixedly installed on a bottom of the connecting plate 12 and a top of the dust wiping plate 14, a length of the dust wiping plate 14 is equal to a width of the ultra-thin mask body 3, the connecting plate 12, the second spring 15, the second telescopic rod 13 and the dust wiping plate 14 are respectively arranged on both upper and lower sides of the first L-shaped protection plate 1, the moving plate 11 is pulled to move, thereby driving the dust wiping board 14 to move at the top of the ultra-thin mask body 3, which is convenient for cleaning the dust on the top of the ultra-thin mask body 3, because the upper and lower sides of the ultra-thin mask body 3 are all provided with the dust wiping boards 14, which can clean the dust on the upper and lower sides of the ultra-thin mask body 3, the dust wiping board 14 can completely clean the dust on the upper and lower sides of the ultra-thin mask body 3 through the length of the dust wiping board 14 being equal to the width of the ultra-thin mask body 3, the whole moving board 11 is T-shaped, the section of the inner cavity of the moving groove 10 is T-shaped, so that the moving board 11 can move in the inner cavity of the moving groove 10, and can not drop from the inner cavity of the moving groove 10, which is convenient for users to use the moving board 11, the front side of the movable plate 11 is fixedly provided with a front connecting plate 16, the front side of the front connecting plate 16 is provided with an insertion hole 17, the inner cavity of the insertion hole 17 is movably sleeved with a bolt 18, the front sides of the two movable plates 11 are respectively provided with the front connecting plate 16 and the insertion hole 17, so that the two movable plates 11 can be conveniently connected together, the two movable plates 11 can be simultaneously driven to move by pulling the bolt 18, a user can conveniently clean dust on the upper side and the lower side of the ultrathin mask plate body 3 simultaneously, the cleaning efficiency on the ultrathin mask plate body 3 is improved, the use by a worker is convenient, the inner side of the first L-shaped protection plate 1 is provided with a placing groove 2, the inner cavity of the placing groove 2 is movably connected with the ultrathin mask plate body 3, one side of the rear side of the first L-shaped protection plate 1 is movably sleeved with a second L-shaped protection plate 4 through a shaft, the rear side of the other side of the second L-shaped protection plate 4 is integrally L-shaped, the rear side, the rear side of the other side of the second L-shaped protection plate 4 is integrally L-shaped, the rear side of the other side of the second L-shaped protection plate 4 is movably sleeved in the inner cavity of the placing groove 2 through a shaft, so that the second L-shaped protection plate 4 can move in the inner cavity of the placing groove 2, the first L-shaped protection plate 1 cannot limit the rotation of the second L-shaped protection plate 4, the front side of one side of the second L-shaped protection plate 4 is fixedly provided with a handle 5, the front side of one side of the second L-shaped protection plate 4 is provided with the handle 5, a user can conveniently detach and connect the second L-shaped protection plate 4 and the first L-shaped protection plate 1 through the handle 5, the worker can conveniently control the rotation of the second L-shaped protection plate 4 through the handle 5, one side of the inner cavity of the placing groove 2 is provided with an accommodating groove 6, the accommodating groove 6 is connected with a baffle plate 8, a first telescopic rod 7 is connected, when the second L-shaped protection plate 4 and the first L-shaped protection plate 1 need to be disassembled, the baffle plate 8, the first telescopic rod 7 and the first spring 9 are extruded, the baffle plate 8, the first telescopic rod 7 and the first spring 9 are retracted into the accommodating groove 6, the second L-shaped protection plate 4 and the first L-shaped protection plate 1 are convenient to disassemble, the second L-shaped protection plate 4 and the first L-shaped protection plate 1 can be disassembled under the condition of external force while the position of the second L-shaped protection plate 4 is limited, the first telescopic rod 7 is fixedly installed on the front side of the inner cavity of the accommodating groove 6, the baffle plate 8 positioned on one side of the second L-shaped protection plate 4 is fixedly installed on the rear side of the first telescopic rod 7, three first telescopic rods 7 and three first springs 9 are uniformly arranged on the front side of the baffle plate 8, one side of the first springs 9 is in contact with one side of the second L-shaped protection plate 4 in a free state, the three first telescopic rods 7 and the three first springs 9 are uniformly arranged on the front side of the baffle plate 8, one side of the baffle plate 8 is in contact with one side of the second L-shaped protection plate 4 by the first springs 9 in a free state, so that when the second L-shaped protection plate 4 is pulled by no external force, the second L-shaped protection plate 4 can be stably connected with the first L-shaped protection plate 1, the protection stability of the ultrathin mask plate body 3 is improved, the first springs 9 are movably sleeved on the outer side of the first telescopic rods 7, two ends of the first springs 9 are fixedly arranged on the front side of an inner cavity of the accommodating groove 6 and the front side of the baffle plate 8 respectively, the first L-shaped protection plate and the second L-shaped protection plate are arranged on the outer side of the ultrathin mask plate body respectively, due to the shape characteristics of the first L-shaped protection plate and the shape characteristics of the second L-shaped protection plate, four sides of the ultrathin mask plate body are convenient to be protected by the first telescopic rods between the first L-shaped protection plate and the second L-shaped, Baffle and first spring coupling are convenient for block one side of second L type guard plate on the rear side of first L type guard plate for second L type guard plate can be connected with first L type guard plate under the condition that does not receive external force, has improved the stability to the protection of four sides of ultra-thin mask version body.
The method for processing the ultra-thin mask as claimed in any one of the preceding claims, comprising the following processing steps:
s1, preparing a projection mask material;
s2, depositing a layer of chromium on the quartz glass sheet, arranging a film formed by chromium nitride or oxide below the chromium film, and arranging a chromium sesquioxide anti-reflection layer above the chromium film;
s3, forming a pattern on the projection mask by using electron beam lithography;
s4, photoetching, transferring the processed graphic data file to a laser drawing machine, and carrying out non-contact exposure on the uniform-photoresist chromium plate;
s5, developing, removing the photoresist layer at the exposure position and exposing the chromium layer;
s6, etching, and corroding and removing the exposed chromium layer;
s7, demolding, and removing the photoresist;
s8, cutting, namely cutting a large piece of makeup finished product into independent single finished products according to the production process requirement;
and S9, final inspection, and surface inspection for etching irregularity and other problems.
The substrate material of the reticle, which is most mainly used for submicron lithography in said S1, is fused silica, which is always used in deep ultraviolet lithography because it has a high optical transmission in the deep ultraviolet spectral portion (248 nm and 193nm), fused silica used as a reticle is the most expensive material and has a very low temperature expansion, which means that the reticle is relatively stable in size when the temperature changes, and the reticle material should have other properties of a high optical transmission and no defects on the surface or inside of the material.
In S3, the electron beam lithography uses direct writing to transfer a high resolution pattern onto the surface of the reticle, in which the electron source generates a plurality of electrons that are accelerated and focused to form a pattern on the reticle, the electron beam can be focused magnetically or electrically and scanned on the reticle coated with the electron beam resist to form a desired pattern, the electron beam can be scanned across the entire reticle, scanned in a raster fashion, or scanned only over the area to be patterned (vector scanning) to form a pattern on the reticle.
The chromium oxide antireflection layer in the S2 is 20nm thick.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides an ultra-thin mask version, includes first L type guard plate (1), its characterized in that: a placing groove (2) is arranged on the inner side of the first L-shaped protection plate (1), the inner cavity of the placing groove (2) is movably connected with an ultrathin mask plate body (3), one side of the rear side of the first L-shaped protection plate (1) is movably sleeved with a second L-shaped protection plate (4) through a shaft, a handle (5) is fixedly arranged at the front side of one side of the second L-shaped protection plate (4), one side of the inner cavity of the placing groove (2) is provided with a containing groove (6), the front side of the inner cavity of the containing groove (6) is fixedly provided with a first telescopic rod (7), a baffle (8) positioned at one side of the second L-shaped protection plate (4) is fixedly arranged at the rear end of the first telescopic rod (7), a first spring (9) is movably sleeved on the outer side of the first telescopic rod (7), and two ends of the first spring (9) are respectively and fixedly arranged on the front side of the inner cavity of the accommodating groove (6) and the front side of the baffle (8).
2. The ultra-thin mask of claim 1, wherein: the utility model discloses a mask plate, including first L type guard plate (1), movable groove (10) have all been seted up to the last downside of first L type guard plate (1) one side, movable plate (11) have been cup jointed in the inner chamber activity of movable groove (10), the top fixed mounting of movable plate (11) has connecting plate (12), the bottom fixed mounting of connecting plate (12) has second telescopic link (13), the bottom fixed mounting of second telescopic link (13) has dust to wipe board (14), second spring (15) have been cup jointed in the outside activity of second telescopic link (13), the both ends difference fixed mounting of second spring (15) is on the bottom of connecting plate (12) and the top of dust wiping board (14), the length size of dust wiping board (14) equals with the width size of ultra-thin mask plate body (3).
3. The ultra-thin mask as claimed in claim 2, wherein: the moving plate (11) is T-shaped as a whole, and the section of the inner cavity of the moving groove (10) is T-shaped as a whole.
4. The ultra-thin mask as claimed in claim 2, wherein: the front side of the moving plate (11) is fixedly provided with a front connecting plate (16), the front side of the front connecting plate (16) is provided with an insertion hole (17), and an inner cavity of the insertion hole (17) is movably sleeved with a bolt (18).
5. The ultra-thin mask of claim 1, wherein: the front side of baffle (8) is even is equipped with three first telescopic link (7) and three first spring (9), one side of first spring (9) baffle (8) is in the contact of one side of second L type guard plate (4) under free state.
6. The ultra-thin mask of claim 1, wherein: the rear side of the other side of the second L-shaped protection plate (4) is integrally L-shaped, and the rear side of the other side of the second L-shaped protection plate (4) is movably sleeved in the inner cavity of the placing groove (2) through a shaft.
7. The method for processing the ultra-thin mask according to any one of claims 1 to 6, wherein: the method comprises the following processing steps:
s1, preparing a projection mask material;
s2, depositing a layer of chromium on the quartz glass sheet, arranging a film formed by chromium nitride or oxide below the chromium film, and arranging a chromium sesquioxide anti-reflection layer above the chromium film;
s3, forming a pattern on the projection mask by using electron beam lithography;
s4, photoetching, transferring the processed graphic data file to a laser drawing machine, and carrying out non-contact exposure on the uniform-photoresist chromium plate;
s5, developing, removing the photoresist layer at the exposure position and exposing the chromium layer;
s6, etching, and corroding and removing the exposed chromium layer;
s7, demolding, and removing the photoresist;
s8, cutting, namely cutting a large piece of makeup finished product into independent single finished products according to the production process requirement;
and S9, final inspection, and surface inspection for etching irregularity and other problems.
8. The method for processing the ultrathin mask as claimed in claim 7, characterized in that: the substrate material of the reticle, which is most mainly used for submicron lithography in said S1, is fused silica, which is always used in deep ultraviolet lithography because it has a high optical transmission in the deep ultraviolet spectral portion (248 nm and 193nm), fused silica used as a reticle is the most expensive material and has a very low temperature expansion, which means that the reticle is relatively stable in size when the temperature changes, and the reticle material should have other properties of a high optical transmission and no defects on the surface or inside of the material.
9. The method for processing the ultrathin mask as claimed in claim 7, characterized in that: in S3, the electron beam lithography uses direct writing to transfer a high resolution pattern onto the surface of the reticle, in which the electron source generates a plurality of electrons that are accelerated and focused to form a pattern on the reticle, the electron beam can be focused magnetically or electrically and scanned on the reticle coated with the electron beam resist to form a desired pattern, the electron beam can be scanned across the entire reticle, scanned in a raster fashion, or scanned only over the area to be patterned (vector scanning) to form a pattern on the reticle.
10. The method for processing the ultrathin mask as claimed in claim 7, characterized in that: the chromium oxide antireflection layer in the S2 is 20nm thick.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110159598.9A CN112904663B (en) | 2021-02-05 | 2021-02-05 | Bearing device of mask plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110159598.9A CN112904663B (en) | 2021-02-05 | 2021-02-05 | Bearing device of mask plate |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112904663A true CN112904663A (en) | 2021-06-04 |
CN112904663B CN112904663B (en) | 2024-10-01 |
Family
ID=76122639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110159598.9A Active CN112904663B (en) | 2021-02-05 | 2021-02-05 | Bearing device of mask plate |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112904663B (en) |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06175356A (en) * | 1992-12-11 | 1994-06-24 | Nikon Corp | Device for peeling pellicle |
CN1687846A (en) * | 2005-05-09 | 2005-10-26 | 中国科学院光电技术研究所 | Method for making miniature Chinese characters by using microphotography technology |
CN101344652A (en) * | 2008-08-11 | 2009-01-14 | 友达光电(苏州)有限公司 | Glue frame structure used for fixing display panel and display equipment |
CN103328215A (en) * | 2011-12-07 | 2013-09-25 | 松下电器产业株式会社 | Mask holder |
US20150123693A1 (en) * | 2013-11-07 | 2015-05-07 | Nidec-Read Corporation | Inspection jig |
CN105543802A (en) * | 2015-12-29 | 2016-05-04 | 厦门大学 | Plasma texturing cutter and preparing method thereof |
CN106169416A (en) * | 2016-08-29 | 2016-11-30 | 复旦大学 | A kind of manufacture method of extreme ultraviolet mask |
CN107399613A (en) * | 2017-08-03 | 2017-11-28 | 武汉华星光电技术有限公司 | A kind of mask plate handling device |
CN206916257U (en) * | 2017-05-18 | 2018-01-23 | 苏州阿特斯阳光电力科技有限公司 | A kind of quartz boat |
CN108008604A (en) * | 2018-01-03 | 2018-05-08 | 苏州赛森电子科技有限公司 | Equipment for preventing edge of mask from being scraped |
CN108323080A (en) * | 2017-12-28 | 2018-07-24 | 重庆市中光电显示技术有限公司 | Circuit board fixing tooling |
CN108919569A (en) * | 2018-07-26 | 2018-11-30 | 京东方科技集团股份有限公司 | A kind of mask plate, display base plate and preparation method thereof and display device |
CN209869866U (en) * | 2019-04-25 | 2019-12-31 | 新疆工程学院 | Novel dust absorption blackboard |
CN210320587U (en) * | 2019-06-16 | 2020-04-14 | 山西二建集团有限公司 | Filter screen frame convenient to dismantle filter screen |
CN210615440U (en) * | 2019-09-02 | 2020-05-26 | 南京泽文电子科技有限公司 | Electronic component welding device |
CN210745674U (en) * | 2019-10-23 | 2020-06-12 | 万安裕维电子有限公司 | PCB (printed circuit board) clamp |
CN111381436A (en) * | 2018-12-27 | 2020-07-07 | 中芯国际集成电路制造(上海)有限公司 | Method for manufacturing photomask with pattern |
CN111438096A (en) * | 2020-04-13 | 2020-07-24 | 祝振英 | Cleaning treatment method for polyester plastic membrane sheet |
CN111735231A (en) * | 2019-03-24 | 2020-10-02 | 宁波德业科技股份有限公司 | High-performance corrosion-resistant air conditioner evaporator |
CN111965952A (en) * | 2020-09-01 | 2020-11-20 | 江苏九迪激光装备科技有限公司 | Vacuum detection device for photoetching machine |
CN112130427A (en) * | 2020-10-31 | 2020-12-25 | 无锡中微掩模电子有限公司 | Mask frame |
-
2021
- 2021-02-05 CN CN202110159598.9A patent/CN112904663B/en active Active
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06175356A (en) * | 1992-12-11 | 1994-06-24 | Nikon Corp | Device for peeling pellicle |
CN1687846A (en) * | 2005-05-09 | 2005-10-26 | 中国科学院光电技术研究所 | Method for making miniature Chinese characters by using microphotography technology |
CN101344652A (en) * | 2008-08-11 | 2009-01-14 | 友达光电(苏州)有限公司 | Glue frame structure used for fixing display panel and display equipment |
CN103328215A (en) * | 2011-12-07 | 2013-09-25 | 松下电器产业株式会社 | Mask holder |
US20150123693A1 (en) * | 2013-11-07 | 2015-05-07 | Nidec-Read Corporation | Inspection jig |
CN105543802A (en) * | 2015-12-29 | 2016-05-04 | 厦门大学 | Plasma texturing cutter and preparing method thereof |
CN106169416A (en) * | 2016-08-29 | 2016-11-30 | 复旦大学 | A kind of manufacture method of extreme ultraviolet mask |
CN206916257U (en) * | 2017-05-18 | 2018-01-23 | 苏州阿特斯阳光电力科技有限公司 | A kind of quartz boat |
CN107399613A (en) * | 2017-08-03 | 2017-11-28 | 武汉华星光电技术有限公司 | A kind of mask plate handling device |
CN108323080A (en) * | 2017-12-28 | 2018-07-24 | 重庆市中光电显示技术有限公司 | Circuit board fixing tooling |
CN108008604A (en) * | 2018-01-03 | 2018-05-08 | 苏州赛森电子科技有限公司 | Equipment for preventing edge of mask from being scraped |
CN108919569A (en) * | 2018-07-26 | 2018-11-30 | 京东方科技集团股份有限公司 | A kind of mask plate, display base plate and preparation method thereof and display device |
CN111381436A (en) * | 2018-12-27 | 2020-07-07 | 中芯国际集成电路制造(上海)有限公司 | Method for manufacturing photomask with pattern |
CN111735231A (en) * | 2019-03-24 | 2020-10-02 | 宁波德业科技股份有限公司 | High-performance corrosion-resistant air conditioner evaporator |
CN209869866U (en) * | 2019-04-25 | 2019-12-31 | 新疆工程学院 | Novel dust absorption blackboard |
CN210320587U (en) * | 2019-06-16 | 2020-04-14 | 山西二建集团有限公司 | Filter screen frame convenient to dismantle filter screen |
CN210615440U (en) * | 2019-09-02 | 2020-05-26 | 南京泽文电子科技有限公司 | Electronic component welding device |
CN210745674U (en) * | 2019-10-23 | 2020-06-12 | 万安裕维电子有限公司 | PCB (printed circuit board) clamp |
CN111438096A (en) * | 2020-04-13 | 2020-07-24 | 祝振英 | Cleaning treatment method for polyester plastic membrane sheet |
CN111965952A (en) * | 2020-09-01 | 2020-11-20 | 江苏九迪激光装备科技有限公司 | Vacuum detection device for photoetching machine |
CN112130427A (en) * | 2020-10-31 | 2020-12-25 | 无锡中微掩模电子有限公司 | Mask frame |
Also Published As
Publication number | Publication date |
---|---|
CN112904663B (en) | 2024-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW400566B (en) | Method for repairing photomask by removing residual defect in said photomask | |
TW569303B (en) | Lithographic template and method of formation and use | |
KR101303795B1 (en) | EUV pellicle and manufacturing method of the same | |
US6961186B2 (en) | Contact printing using a magnified mask image | |
JP6806274B2 (en) | How to make photomasks, photomask blanks, and photomasks | |
US7136145B2 (en) | Pattern-forming apparatus using a photomask | |
TW542940B (en) | Photomask having a fused silica pellicle | |
TW511149B (en) | Photomask and method for manufacturing the same | |
JP6370255B2 (en) | Pellicle frame and pellicle using the same | |
TW460928B (en) | Method of removing particles from stage and cleaning plate | |
US20110215602A1 (en) | Pellicle handling tool | |
KR20130088565A (en) | Euv pellicle uging graphene and manufacturing method of the same | |
US5953107A (en) | Mask pellicle remove tool | |
TW505828B (en) | Pellicle, method for producing the same, and photomask | |
WO2005079470A2 (en) | Photomask and method for conveying information associated with a photomask substrate | |
JP4478568B2 (en) | Method of using an amorphous carbon layer for the production of an improved reticle | |
KR100849714B1 (en) | Structure and method for manufacturing pellicle of photo-mask | |
CN112904663A (en) | Ultrathin mask and processing method thereof | |
TWI787966B (en) | Extreme ultraviolet mask and method of forming the same | |
CN109298594B (en) | Glass recycling method, recycled glass substrate, and photomask blank and photomask using same | |
JPWO2004088421A1 (en) | Mask blank, mask blank manufacturing method, transfer mask manufacturing method, and semiconductor device manufacturing method | |
JP2004101868A (en) | Method for manufacturing photomask | |
TW508642B (en) | Clean method of phase shifting mask | |
US8960928B2 (en) | Pellicle frame | |
TW542944B (en) | Mask for electron beam exposure and electron beam exposure method using the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |