CN112847625A - Optical diaphragm cutting equipment, cutting method thereof and machining method of cutting die - Google Patents
Optical diaphragm cutting equipment, cutting method thereof and machining method of cutting die Download PDFInfo
- Publication number
- CN112847625A CN112847625A CN202110010837.4A CN202110010837A CN112847625A CN 112847625 A CN112847625 A CN 112847625A CN 202110010837 A CN202110010837 A CN 202110010837A CN 112847625 A CN112847625 A CN 112847625A
- Authority
- CN
- China
- Prior art keywords
- cutting
- waste
- cutting die
- blade
- transmission platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 200
- 230000003287 optical Effects 0.000 title claims abstract description 89
- 238000003754 machining Methods 0.000 title description 3
- 239000002699 waste material Substances 0.000 claims abstract description 110
- 230000005540 biological transmission Effects 0.000 claims abstract description 72
- 238000004080 punching Methods 0.000 claims abstract description 71
- 238000003672 processing method Methods 0.000 claims abstract description 7
- 238000004140 cleaning Methods 0.000 claims description 26
- 238000010791 quenching Methods 0.000 claims description 13
- 230000000171 quenching Effects 0.000 claims description 13
- 238000005496 tempering Methods 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims 2
- 230000037250 Clearance Effects 0.000 description 7
- 230000035512 clearance Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 230000003014 reinforcing Effects 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
- B26F1/14—Punching tools; Punching dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D9/00—Cutting apparatus combined with punching or perforating apparatus or with dissimilar cutting apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/18—Hardening; Quenching with or without subsequent tempering
Abstract
The invention relates to the technical field of optical diaphragm cutting, in particular to cutting equipment of an optical diaphragm, a cutting method of the cutting equipment and a processing method of a cutting die. The cutting equipment for the optical diaphragm comprises a punching device, wherein the punching device comprises a transmission platform, a cutting die and a waste discharge assembly, the transmission platform bears and conveys the optical diaphragm, and the transmission platform is provided with a plurality of chip discharge holes; the hardness of the blade of the cutting die is greater than HRC45, the blade is a single-blade knife, and the blade angle of the single-blade knife is 5-30 degrees; or the blade is a double-blade knife, and the angle of the blade of the double-blade knife is 10-60 degrees; the cutting die is positioned on one side of the transmission platform and can move relative to the transmission platform so as to punch and cut the optical film to form a light hole; the waste discharge assembly is arranged on one side face, far away from the cutting die, of the transmission platform, and absorbs waste scraps generated when the cutting die punches the optical diaphragm through the waste discharge hole. The invention has the advantages that: the cutting difficulty is low, the operation is convenient and fast, and the cost is low.
Description
Technical Field
The invention relates to the technical field of optical diaphragm cutting, in particular to cutting equipment of an optical diaphragm, a cutting method of the cutting equipment and a processing method of a cutting die.
Background
The backlight module is an important component of the liquid crystal display device, and in order to reduce the increase of the thickness of the existing liquid crystal display device, a Mini light emitting diode (Mini-LED) is applied to the backlight module, wherein the Mini-LED is a small LED with the size of about 100 microns, the Mini-LED has a smaller chip size, and the distance between two adjacent chips (light sources) is smaller.
However, similar to the conventional backlight module, the Mini-LED backlight module also needs to use an optical film to achieve the characteristics of brightness enhancement, light uniformity, and the like, and the Mini-LED backlight module includes a reflective film, a diffusion film, a brightness enhancement film, a composite film, a quantum dot film, and the like; the diffusion film, the brightness enhancement film, the composite film, the quantum dot film and the like are similar to those in the optical diaphragm framework of the traditional backlight module, but the difference of the reflection film is larger, because the number of LEDs of the Mini-LED backlight module is increased from dozens to one hundred to thousands of LEDs compared with that of the traditional backlight module, the number of openings of the reflection film is also increased from dozens to one hundred to thousands of openings, and the difficulty of the cutting process of the reflection film is linearly increased; meanwhile, the reflective film used in the Mini-LED backlight module must be fixed to the circuit board by attaching a double-sided adhesive tape to the bottom layer, otherwise, the reflective film may be shifted or covered on the LED, but the cutting difficulty of the reflective film covered with the double-sided adhesive tape may be further increased.
Disclosure of Invention
In view of the above, it is desirable to provide a cutting apparatus for an optical film, a cutting method thereof, and a processing method of a cutting mold, which have low cutting difficulty, convenient operation, and low cost.
In order to solve the technical problem, the application provides the following technical scheme:
the cutting equipment for the optical diaphragm comprises a punching device, wherein the punching device comprises a transmission platform, a cutting die and a waste discharge assembly, the transmission platform bears and conveys the optical diaphragm, and the transmission platform is provided with a plurality of chip discharge holes; the hardness of the blade of the cutting die is greater than HRC45, the blade is a single-blade knife, and the angle of the blade of the single-blade knife is 5-30 degrees; or the blade is a double-blade knife, and the angle of the blade of the double-blade knife is 10-60 degrees; the cutting die is positioned on one side of the transmission platform and can move relative to the transmission platform so as to punch and cut the optical film to form a light hole; the waste discharge assembly is arranged on one side face, far away from the cutting die, of the transmission platform and absorbs waste scraps generated when the cutting die punches the optical diaphragm through the waste discharge hole.
In the application, the type and the angle of the blade of the cutting die are selected within a certain range, and the blade is processed, so that the hardness of the blade is greater than HRC45, the blade is processed to be sharper, the difficulty of the cutting process of the optical film is reduced, and the cutting die can cut and punch the optical film conveniently; and, the waste discharge assembly can adsorb the sweeps in time fast when cutting die carries out die-cut, reduces the degree of difficulty of sweeps clearance to further form the light trap after die-cut on optical film, reinforcing backlight unit's light permeability, easy operation and cut the degree of difficulty of punching a hole and hang down.
In one embodiment, the cutting equipment further comprises a waste cleaning device, the waste cleaning device is located on one side of the punching device, which is used for cleaning waste on the optical film punched by the cutting die, along the feeding direction of the transmission platform.
So set up, clear useless device can carry out the secondary clearance with the not absorbent sweeps of waste discharge assembly to make the sweeps after punching device die-cut to optical diaphragm can all discharge, in order to form the light trap, reinforcing backlight unit's light transmissivity can.
In one embodiment, clear useless device includes clear useless subassembly and collection subassembly, clear useless subassembly with the collection subassembly sets up relatively in the both sides of transmission platform, just clear useless subassembly with cutting die is located same one side of transmission platform, the collection subassembly with the subassembly of wasting discharge is located same one side of transmission platform, clear useless subassembly can stretch into in the light transmission hole to clear away the sweeps in the light transmission hole, the collection subassembly is collected the sweeps through clear useless subassembly is clear away.
So set up, clear useless subassembly can carry out the secondary clearance with the sweeps that the subassembly of wasting discharge was not in time cleared up, arrives in the collection device side by side.
In one embodiment, the waste removing assembly comprises a waste removing platform, waste removing jigs and a CCD positioning unit, the CCD positioning unit and the waste removing jigs are sequentially arranged at intervals on one side of the waste removing platform close to the transmission platform along the transmission direction of the transmission platform, the waste removing jigs are convex towards the direction of the transmission platform, and the CCD positioning unit can position the position of the optical film and enable the waste removing jigs to correspond to the light holes one to one.
So set up, CCD positioning unit can fix a position the optics diaphragm after punching device cuts to make bellied useless tool of clearing up on the useless subassembly of clearing up can with the light trap one-to-one, be convenient for carry out the secondary to the sweeps that is not cleared up in the light trap.
The application also provides a processing method of the blade of the cutting die, which comprises the following steps:
providing a raw material of a cutting die;
processing the raw material of the cutting die into the cutting die with a sharp blade;
quenching the cutting die with the sharp blade; the quenching condition is 1050 ℃ at 1000-; and
tempering the quenched cutting die with the sharp blade; the tempering condition is 500-550 ℃, the temperature is kept for 30-90min, and then the air cooling or the oil cooling is carried out to the room temperature, so that the hardness of the blade of the cutting die is larger than HRC 45.
In the application, the cutting die formed by processing is subjected to heat treatment, and the physical properties of the cutting die are changed by heating and cooling so as to improve the microstructure of the cutting die and enable the microstructure to meet the required physical requirements, thereby improving the toughness, hardness and wear resistance of the cutting die; the cutting die is firstly quenched and then cooled under a certain temperature condition, so that the blade obtains certain hardness, the blade becomes brittle after quenching, the blade can be broken by tapping due to stress caused by quenching, and then the blade is tempered and then cooled under a certain temperature condition so as to reduce the brittleness, meanwhile, the toughness of the blade can be increased, the internal stress of the blade can be fully released by repeating the quenching, the hardness of the blade of the cutting die is maximized, and the cutting difficulty of the optical diaphragm is reduced.
In one embodiment, in the step of providing a log of a cutting die, the log is any one of SKD11, ST11, D2, DC53 or Cr 12.
So set up, the machine-shaping of cutting die of being convenient for.
In one embodiment, the number of times of tempering the cutting die is greater than or equal to 3 times.
So set up, can fully release its internal stress, with cutting die's blade hardness maximize to reduce the degree of difficulty of punching a hole of cutting to optical film.
The application also provides a cutting method of the optical diaphragm, which is realized based on cutting equipment, wherein the cutting equipment comprises a transmission platform and a punching device, and the punching device comprises a cutting die and a waste discharge assembly; the cutting method comprises the following steps:
placing an optical film to be cut on the transmission platform;
starting the punching device, enabling the cutting die to be close to the transmission platform, and cutting and punching the optical film to be cut to form a light hole; and
and the waste discharge assembly sucks away waste scraps formed after the punching of the cutting die.
In this application, the waste discharge assembly can in time adsorb the sweeps fast when punching device's cutting die carries out die-cut, reduces the degree of difficulty of sweeps clearance to further form the light trap after die-cut on the optics diaphragm, light transmittance, easy operation of reinforcing backlight unit and cut the degree of difficulty of punching a hole and hang down.
In one embodiment, the cutting equipment further comprises a waste cleaning assembly and a collecting assembly, wherein the waste cleaning assembly comprises a waste cleaning jig and a CCD positioning unit; the cutting method further comprises the following steps:
the transmission platform transmits the cut optical film to the lower part of the waste removing assembly;
the CCD positioning unit positions the position of the optical diaphragm so that the waste cleaning jig corresponds to the light holes one by one; and
the waste cleaning jig is pressed downwards, and the waste scraps which are not adsorbed by the waste discharge assembly are discharged into the collection assembly.
So set up, CCD positioning unit can fix a position the optics diaphragm after punching device cuts to make bellied useless tool of clearing up on the useless subassembly of clearing up can with the light trap one-to-one, be convenient for carry out the secondary to the sweeps that is not cleared up in the light trap and clear up, is collecting the sweeps through collecting the subassembly.
In one embodiment, the cutting die cuts the size of the optical film sheet into the size of 10mm multiplied by 10mm to 2000mm multiplied by 2000 mm; the number of the punched light holes is 1-100000, the light holes are round holes or square holes, the diameter range of the round holes is 0.5mm-20mm, and the area range of the square holes is 0.25mm2-400mm2。
By the arrangement, a certain number of small holes with a certain size can be cut by using the cutting method of the cutting equipment, so that the light transmittance of the backlight module is enhanced.
Compared with the prior art, according to the cutting equipment for the optical diaphragm, the type and the angle of the blade of the cutting die are selected within a certain range, the blade is processed, so that the hardness of the blade is greater than HRC45, the blade is processed to be sharper, the difficulty of the cutting process of the optical diaphragm is reduced, and the cutting die can cut and punch the optical diaphragm conveniently; and, the waste discharge assembly can adsorb the sweeps in time fast when cutting die carries out die-cut, reduces the degree of difficulty of sweeps clearance to further form the light trap after die-cut on optical film, reinforcing backlight unit's light permeability, easy operation and cut the degree of difficulty of punching a hole and hang down.
Drawings
Fig. 1 is a schematic diagram of a cutting apparatus for optical film provided by the present invention.
Fig. 2 is a flowchart of steps of a processing method of a cutting die according to the present invention.
FIG. 3 is a flowchart illustrating steps of a method for cutting an optical film according to the present invention.
In the figure, 100, the cutting apparatus; 10. a punching device; 11. a transmission platform; 12. a punching platform; 13. cutting a die; 14. a waste discharge assembly; 20. a waste cleaning device; 21. clearing the waste component; 211. a waste cleaning platform; 212. clearing waste jigs; 213. a CCD positioning unit; 22. and (4) collecting the components.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
It will be understood that when an element is referred to as being "mounted on" another element, it can be directly mounted on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, fig. 1 is a schematic view of a cutting apparatus 100 for an optical film according to an embodiment of the present invention, where the cutting apparatus 100 is applied to the technical field of film cutting, and can cut and punch an optical film in a backlight module to enhance the light transmittance of the backlight module.
At present, in order to reduce the thickness of the liquid crystal display device, a Mini-LED backlight module is usually used, but in the Mini-LED backlight module in the market, the number of openings of a reflective film is increased from dozens to one hundred of the conventional number to thousands to ten thousands, so that the difficulty of the cutting process of the reflective film is increased linearly; meanwhile, the reflective film used in the Mini-LED backlight module must be fixed to the circuit board by attaching a double-sided adhesive tape to the bottom layer, otherwise, the reflective film may be shifted or covered on the LED, but the cutting difficulty of the reflective film covered with the double-sided adhesive tape may be further increased.
Referring to fig. 1, the cutting apparatus 100 includes a punching device 10, wherein the punching device 10 is used for cutting and punching the optical film; the punching device 10 comprises a transmission platform 11, a cutting die 13 and a waste discharge assembly 14, wherein the transmission platform 11 can bear and convey the optical film, and the transmission platform 11 is provided with a plurality of waste discharge holes (not shown); the hardness of the blade of the cutting die 13 is greater than HRC45, the blade is a single-blade knife, and the blade angle of the single-blade knife is 5-30 degrees; or the blade is a double-blade knife, and the angle of the blade of the double-blade knife is 10-60 degrees; the cutting die 13 is positioned on one side of the transmission platform 11 and can move relative to the transmission platform 11 so as to punch and cut the optical film to form a light hole; the type and the angle of the blade of the cutting die 13 are selected within a certain range, and the blade is processed, so that the hardness of the blade is greater than HRC45, and the blade is processed to be sharper, thereby reducing the difficulty of the cutting process of the optical film and facilitating the cutting and punching of the optical film by the cutting die 13; the waste discharge assembly 14 is mounted on one side surface of the transmission platform 11, which is far away from the cutting die 13, and absorbs waste scraps generated when the cutting die 13 punches the optical film through a scrap discharge hole; waste discharge assembly 14 can in time adsorb the sweeps fast when cutting die 13 carries out die-cut, reduces the degree of difficulty of sweeps clearance to further form the light trap after die-cut on optical film, reinforcing backlight unit's light permeability, easy operation and cut the degree of difficulty of punching a hole and hang down.
In the application, under the condition of certain hardness of the blade of the cutting die 13, the angle range of the blade of the single-blade knife is set to be 5-30 degrees, so that the blade is sharper and has long service life; when the angle of the blade of the single-blade knife is less than 5 degrees, although the sharpness of the blade is improved, the service life of the single-blade knife is greatly reduced, and the single-blade knife is easier to become dull in the using process; when the blade angle of the single-blade knife is greater than 30 °, the sharpness of the blade is reduced, which results in an increase in difficulty in cutting and punching the optical film. It should be noted that the reason for selecting the range of the blade angle of the double blade is similar to that of the single blade, and is not described herein again.
Further, the punching device 10 further comprises a punching platform 12, the cutting die 13 is installed on one side of the punching platform 12 close to the transmission platform 11, the punching platform 12 is driven by hydraulic pressure or voltage to drive the cutting die 13 to be close to or far away from the transmission platform 11 along the transmission direction perpendicular to the transmission platform 11, the distance that the punching platform 12 can move is 500mm, and the pressure range is 1-500 tons.
Specifically, the waste discharge assembly 14 is a component having a vacuum adsorption function, and can adsorb waste scraps formed on the optical film after the cutting and punching of the cutting die 13, and the adsorption force is 0.1MPa-10MPa, and the adsorption force can be adjusted according to the difference of the adsorption difficulty, so that the waste scraps can be adsorbed into the waste discharge assembly 14 quickly and timely to form a light hole, and the light transmission performance of the backlight module is enhanced.
Preferably, in the present application, the adsorption force of the waste discharge assembly 14 is 0.7 MPa; of course, in other embodiments, the adsorption force may be adjusted according to different situations to achieve the same adsorption effect, and for example, the adsorption force may be adjusted to 0.5MPa, 1MPa, 3MPa, or the like.
Specifically, the transmission platform 11 can move the cut and punched optical film by 1-2000mm along the transmission direction, and the transmission tolerance is +/-0.1 mm; the moving distance can be adjusted according to the size of the optical diaphragm, so that after the punching device 10 cuts and punches a hole on one optical diaphragm, the transmission platform 11 drives the optical diaphragm which is cut and punched to move by a preset distance, the punching device 10 is convenient to cut and punch a hole on the next optical diaphragm, the operation efficiency is improved, and meanwhile, the punching device 10 is prevented from carrying out secondary punching on the optical diaphragm which is cut and punched.
With reference to fig. 1, the cutting apparatus 100 further includes a waste removing device 20 for removing the waste on the optical film punched by the cutting die 13; along the pay-off direction of transmission platform 11, clear useless device 20 is located one side of the ejection of compact of punching device 10, and the conveying of optical film through transmission platform 11 is earlier cut through punching device 10 and is punched a hole, clears up the sweeps through clear useless device 20 secondary again to make punching device 10 can all discharge to the sweeps after the punching of optical film, show out with all light traps of punching device 10 punching, thereby improve the punching efficiency of cutting equipment 100, strengthen backlight unit's light transmittance.
Further, clear useless device 20 is including clear useless subassembly 21 and collection subassembly 22, clear useless subassembly 21 sets up in the both sides of transmission platform 11 with collection subassembly 22 relatively, and clear useless subassembly 21 lies in the same one side of transmission platform 11 with cutting die 13, collection subassembly 22 lies in the same one side of transmission platform 11 with waste discharge subassembly 14, clear useless subassembly 21 can stretch into in the printing opacity hole, and clear away the sweeps in the printing opacity hole, collection subassembly 22 collects the sweeps of clearing away through clear useless subassembly 21, clear useless subassembly 21 can carry out the secondary with the sweeps that waste discharge subassembly 14 did not in time clear up and clear up, reach in the collection device side by side.
In the present application, in order to save cost, the collection assembly 22 does not have the adsorption function of the waste discharge assembly 14, and the collection assembly 22 can only collect and contain the waste scraps secondarily cleaned by the waste cleaning assembly 21; of course, in other embodiments, the collection assembly 22 may be a component having the same suction function as the waste discharge assembly 14 to perform a secondary suction cleaning of the waste.
Specifically, clear useless subassembly 21 is including clear useless platform 211, clear useless tool 212 and CCD positioning unit 213, along transmission platform 11's direction of transfer, CCD positioning unit 213, clear useless tool 212 is laid in clear useless platform 211 near one side of transmission platform 11 at interval in proper order, and clear useless tool 212 is protruding towards transmission platform 11's direction, CCD positioning unit 213's camera can fix a position the position of optical diaphragm, so that clear useless subassembly 21 goes up bellied clear useless tool 212 can correspond with the light trap one-to-one, again through clear useless platform 211's drive, make clear useless tool 212 remove towards the optical diaphragm, in order to carry out the secondary to the sweeps that is not cleared up in the light trap.
As shown in fig. 2, the present application also provides a method for processing the cutting die 13, which includes the following steps:
step S1, providing a log of the cutting die 13;
step S2, processing the raw material of the cutting die 13 into a cutting die with a sharp blade;
step S3, quenching the cutting die 13 with sharp blade; the quenching condition is 1050 ℃ at 1000-; and
step S4, tempering the quenched cutting die 13 with sharp blade; the tempering condition is 500-550 ℃, the temperature is kept for 30-90min, and then the air cooling or the oil cooling is carried out to the room temperature, so that the hardness of the blade of the cutting die 13 is larger than HRC 45.
Specifically, in step S1, the model of the adopted raw material is any one of SKD11, ST11, D2, DC53 or Cr 12; the raw material is steel, and a steel plate with the thickness of at least 20mm is adopted, so that the blade of the cutting die 13 can be milled conveniently. In step S2, the process of processing into the cutting die 13 mills out a blade from the upper part of the raw material of a predetermined thickness of several millimeters in step S1 by CNC engraving. In steps S3 and S4, the cutting mold 13 is quenched and then cooled at a predetermined temperature to obtain a certain hardness of the blade, which becomes brittle after quenching, and the blade is broken by tapping due to stress caused by quenching and quenching, and then tempered and cooled at a predetermined temperature to reduce brittleness, increase toughness of the blade, and repeat the quenching process to sufficiently release internal stress, thereby maximizing the hardness of the blade of the cutting mold 13; the cutting die 13 formed by processing is subjected to heat treatment, and the physical properties of the cutting die 13 are changed by heating and cooling, so that the microstructure of the cutting die 13 is improved to meet the required physical requirements, the toughness, the hardness and the wear resistance of the cutting die 13 are improved, and the difficulty in cutting and punching the optical film can be reduced.
In this application, the number of times that cutting die 13 tempers is more than or equal to 3 times, can fully release its internal stress, with cutting die 13's blade rigidity maximize to reduce the cutting punching hole degree of difficulty to optical film.
Preferably, in the present application, the log used is model number DC 53; of course, in other embodiments, other types of raw materials may be used for processing, such as ST11, Cr12, or D2.
Preferably, in the present application, the tempering time of the cutting mold 13 is 3 times, and the hardness of the blade of the cutting mold 13 after heat treatment is HRC60, so as to facilitate the punching of the optical film; of course, in other embodiments, the tempering times of the cutting mold 13 may also be performed according to the condition of the cutting mold 13 itself, and if the blade hardness of the cutting mold 13 after the primary tempering of the cutting mold 13 is sufficient, the secondary tempering is not performed; if the cutting die 13 is brittle and is easily broken, the cutting die 13 may be tempered three times or more, for example, four times, five times or six times.
As shown in fig. 3, the present application further provides a cutting method of an optical film, the cutting method is implemented based on a cutting apparatus 100, the cutting apparatus 100 includes a transmission platform 11 and a punching device 10, the punching device 10 includes a cutting die 13 and a waste discharge assembly 14; the cutting method comprises the following steps:
step Y1, placing the optical film to be cut on the transmission platform 11;
step Y2, starting the punching device 10, enabling the cutting die 13 to be close to the transmission platform 11, and cutting and punching the optical film to be cut; and
in step Y3, the waste discharge assembly 14 sucks away the waste scraps formed by punching the cutting die 13.
It should be noted that, when the cutting die 13 performs cutting and punching in step Y2, the waste discharge assembly 14 is always turned on in step Y3, and the waste scraps formed after punching are simultaneously absorbed into the waste discharge assembly 14; waste discharge assembly 14 can in time adsorb the sweeps fast when punching device 10's cutting die 13 carries out die-cut promptly, reduces the degree of difficulty of sweeps clearance to further form the light trap after die-cut on the optical film piece, reinforcing backlight unit's light transmissivity, easy operation and cut the degree of difficulty of punching a hole and hang down.
Further, the cutting device 100 further comprises a waste cleaning assembly 21 and a collecting assembly 22, wherein the waste cleaning assembly 21 comprises a waste cleaning jig 212 and a CCD positioning unit 213; the cutting method further comprises the following steps:
step Y4, the transmission platform 11 transmits the cut optical film to the lower part of the waste cleaning component 21;
step Y5, positioning the optical film by the CCD positioning unit 213, so that the waste removing jig 212 corresponds to the light holes one by one; and
in step Y6, the waste disposal jig 212 is pressed down to discharge the waste not adsorbed by the waste discharge unit 14 into the collection unit 22.
Specifically, in step Y5, the optical film cut by the punching device 10 is positioned by the camera on the CCD positioning unit 213, so that the raised waste cleaning jig 212 on the waste cleaning assembly 21 can correspond to the light holes one by one, and the waste scraps not cleaned in the light holes are cleaned secondarily.
Further, by applying the cutting method of the cutting apparatus 100, the cutting die 13 can cut the size of the optical film sheet to between 10mm × 10mm and 2000mm × 2000 mm; the number of the punched light holes is between 1 and 100000, the light holes are round holes or square holes, the diameter range of the round holes is between 0.5 and 20mm, and the area range of the square holes is between 0.25mm2-400mm2Therefore, the number of openings of the reflecting film in the Mini-LED backlight module is thousands to tens of thousands, and the light transmission performance of the backlight module is enhanced.
It should be noted that, the cutting and punching of the optical film are completed by using the same cutting die 13, that is, the cutting die 13 performs the punching operation while cutting the optical film with the required size, that is, the edge is cut and the hole is punched; all tool lines (namely tool points) needed by punching and cutting are milled from the same steel plate according to punching requirements in the machining process of the cutting die 13, and then the cutting die 13 is subjected to heat treatment, so that the requirement of cutting and punching the cutting die 13 to form the needed optical diaphragm is met. The number, shape, size, and the like of the light-transmitting holes formed after punching are punched by different cutting dies 13, and the number, size, and shape of the light-transmitting holes punched by different cutting dies 13 are different.
The features of the above embodiments may be arbitrarily combined, and for the sake of brevity, all possible combinations of the features in the above embodiments are not described, but should be construed as being within the scope of the present specification as long as there is no contradiction between the combinations of the features.
It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that suitable changes and modifications of the above embodiments are within the scope of the claimed invention as long as they are within the spirit and scope of the present invention.
Claims (10)
1. The cutting equipment for the optical diaphragm comprises a punching device, and is characterized in that the punching device comprises a transmission platform, a cutting die and a waste discharge assembly, wherein the transmission platform bears and conveys the optical diaphragm, and is provided with a plurality of waste discharge holes;
the hardness of the blade of the cutting die is greater than HRC45, the blade is a single-blade knife, and the angle of the blade of the single-blade knife is 5-30 degrees; or the blade is a double-blade knife, and the angle of the blade of the double-blade knife is 10-60 degrees;
the cutting die is positioned on one side of the transmission platform and can move relative to the transmission platform so as to punch and cut the optical film to form a light hole; the waste discharge assembly is arranged on one side face, far away from the cutting die, of the transmission platform and absorbs waste scraps generated when the cutting die punches the optical diaphragm through the waste discharge hole.
2. The optical film cutting apparatus of claim 1, further comprising a waste removing device, wherein the waste removing device is located on a discharging side of the punching device along a feeding direction of the transmission platform, and is used for removing waste on the optical film punched by the cutting die.
3. The optical film cutting apparatus of claim 2, wherein the waste removing device includes a waste removing component and a collecting component, the waste removing component and the collecting component are disposed on two sides of the transmission platform opposite to each other, the waste removing component and the cutting mold are disposed on the same side of the transmission platform, the collecting component and the waste discharging component are disposed on the same side of the transmission platform, the waste removing component can extend into the light hole and remove the waste in the light hole, and the collecting component collects the waste removed by the waste removing component.
4. The optical film cutting apparatus according to claim 3, wherein the waste removing assembly includes a waste removing platform, a waste removing jig and a CCD positioning unit, the CCD positioning unit and the waste removing jig are sequentially arranged on one side of the waste removing platform close to the transmission platform at intervals along the transmission direction of the transmission platform, the waste removing jig protrudes towards the transmission platform, and the CCD positioning unit can position the optical film and enable the waste removing jig to correspond to the light holes one by one.
5. A processing method of a cutting die is characterized by comprising the following steps:
providing a raw material of a cutting die;
processing the raw material of the cutting die into the cutting die with a sharp blade;
quenching the cutting die with the sharp blade; the quenching condition is 1050 ℃ at 1000-; and
tempering the quenched cutting die with the sharp blade; the tempering condition is 500-550 ℃, the temperature is kept for 30-90min, and then the air cooling or the oil cooling is carried out to the room temperature, so that the hardness of the blade of the cutting die is larger than HRC 45.
6. The cutting die processing method according to claim 5, wherein in the step of providing a stock of the cutting die, the stock is any one of SKD11, ST11, D2, DC53 or Cr 12.
7. The method of claim 5, wherein the number of times the cutting die having the sharp blade is tempered is 3 or more.
8. The cutting method of the optical diaphragm is realized based on cutting equipment and is characterized in that the cutting equipment comprises a transmission platform and a punching device, and the punching device comprises a cutting die and a waste discharge assembly; the cutting method comprises the following steps:
placing an optical film to be cut on the transmission platform;
starting the punching device, enabling the cutting die to be close to the transmission platform, and cutting and punching the optical film to be cut to form a light hole; and
and the waste discharge assembly sucks away waste scraps formed after the punching of the cutting die.
9. The method for cutting the optical film according to claim 8, wherein the cutting device further comprises a waste cleaning assembly and a collecting assembly, wherein the waste cleaning assembly comprises a waste cleaning jig and a CCD positioning unit; the cutting method further comprises the following steps:
the transmission platform transmits the cut optical film to the lower part of the waste removing assembly;
the CCD positioning unit positions the position of the optical diaphragm so that the waste cleaning jig corresponds to the light holes one by one; and
the waste cleaning jig is pressed downwards, and the waste scraps which are not adsorbed by the waste discharge assembly are discharged into the collection assembly.
10. The method of claim 8, wherein the cutting die cuts the optical film to a size of between 10mm x 10mm and 2000mm x 2000 mm;
the number of the punched light holes is 1-100000, the light holes are round holes or square holes, the diameter range of the round holes is 0.5mm-20mm, and the area range of the square holes is 0.25mm2-400mm2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110010837.4A CN112847625A (en) | 2021-01-06 | 2021-01-06 | Optical diaphragm cutting equipment, cutting method thereof and machining method of cutting die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110010837.4A CN112847625A (en) | 2021-01-06 | 2021-01-06 | Optical diaphragm cutting equipment, cutting method thereof and machining method of cutting die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112847625A true CN112847625A (en) | 2021-05-28 |
Family
ID=76004070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110010837.4A Pending CN112847625A (en) | 2021-01-06 | 2021-01-06 | Optical diaphragm cutting equipment, cutting method thereof and machining method of cutting die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112847625A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102418043A (en) * | 2011-12-16 | 2012-04-18 | 北京科技大学 | High-obdurability shear blade die steel and heat treatment method |
| CN205255076U (en) * | 2015-12-29 | 2016-05-25 | 苏州市迪飞特电子有限公司 | Automatic board device that divides of PCB board |
| CN205521676U (en) * | 2016-04-07 | 2016-08-31 | 阜宁县华强纸品有限公司 | Printing die cuts automatic clear useless device of all -in -one |
| CN106350985A (en) * | 2016-10-14 | 2017-01-25 | 马鞍山市威马机械设备有限责任公司 | Method for cutting glasses cloth by utilizing tooth-shaped cloth cutter |
| CN109049103A (en) * | 2018-08-10 | 2018-12-21 | 南京锦富电子有限公司 | A kind of useless remove device of diaphragm hole |
| CN208880874U (en) * | 2018-09-14 | 2019-05-21 | 江门市厚润纸制品有限公司 | A kind of die-cutting machine facilitating stripping |
| CN112171216A (en) * | 2020-09-29 | 2021-01-05 | 重庆派斯克刀具制造股份有限公司 | Machining process of high-speed steel surface-replaceable blade |
-
2021
- 2021-01-06 CN CN202110010837.4A patent/CN112847625A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102418043A (en) * | 2011-12-16 | 2012-04-18 | 北京科技大学 | High-obdurability shear blade die steel and heat treatment method |
| CN205255076U (en) * | 2015-12-29 | 2016-05-25 | 苏州市迪飞特电子有限公司 | Automatic board device that divides of PCB board |
| CN205521676U (en) * | 2016-04-07 | 2016-08-31 | 阜宁县华强纸品有限公司 | Printing die cuts automatic clear useless device of all -in -one |
| CN106350985A (en) * | 2016-10-14 | 2017-01-25 | 马鞍山市威马机械设备有限责任公司 | Method for cutting glasses cloth by utilizing tooth-shaped cloth cutter |
| CN109049103A (en) * | 2018-08-10 | 2018-12-21 | 南京锦富电子有限公司 | A kind of useless remove device of diaphragm hole |
| CN208880874U (en) * | 2018-09-14 | 2019-05-21 | 江门市厚润纸制品有限公司 | A kind of die-cutting machine facilitating stripping |
| CN112171216A (en) * | 2020-09-29 | 2021-01-05 | 重庆派斯克刀具制造股份有限公司 | Machining process of high-speed steel surface-replaceable blade |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101529575A (en) | Chip pickup method and chip pickup apparatus | |
| CN111451646A (en) | Processing technology for laser invisible cutting of wafer | |
| EP1892275A3 (en) | Adhesive sheet for laser processing | |
| CN101447411B (en) | Method for disconnecting adhesive bonding film with backmounted wafer and adhesive bonding film | |
| EP1767502A1 (en) | Process to separate pieces from a substrate | |
| JP5946112B2 (en) | Substrate processing method | |
| CN112847625A (en) | Optical diaphragm cutting equipment, cutting method thereof and machining method of cutting die | |
| JP2012169361A (en) | Substrate processing method and substrate | |
| CN101643629A (en) | Manufacturing method and device of small size double sticky tape product with pull handles | |
| CN109177434B (en) | Laser preparation method of panel with back adhesive | |
| TWI510375B (en) | Mold structure, transfer formation device and transfer formation method | |
| JP2009233759A (en) | Punching apparatus | |
| CN103547905B (en) | The manufacture method of substrate film | |
| KR101422391B1 (en) | Mold structure, transcription molding device, transcription molding method, optical member, surface light source device, lcd device and mobile device | |
| TW201345685A (en) | Cutting method and apparatus for fragile sheet-like work piece | |
| CN110828615A (en) | Method for manufacturing laminated battery string | |
| CN101706594B (en) | Method and device for processing filter | |
| CN111070323A (en) | Ultra-soft heat-conducting silicon wafer die cutting processing technology | |
| CN110739371A (en) | Processing method of LED wafer | |
| KR102199052B1 (en) | Film cutting device and method of cutting film | |
| JP2010094681A (en) | Method of working film base material using laser beam | |
| JP4091313B2 (en) | Punching device and punching method | |
| JP2008112117A (en) | Lens sheet cutting method | |
| JP6948540B1 (en) | Label cutter unit, blade, blade manufacturing method, blade manufacturing equipment | |
| CN209273508U (en) | Sheet material automatic-shearing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |