CN112845184B - A packaged chip testing device and application method thereof - Google Patents
A packaged chip testing device and application method thereof Download PDFInfo
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- CN112845184B CN112845184B CN202110252522.0A CN202110252522A CN112845184B CN 112845184 B CN112845184 B CN 112845184B CN 202110252522 A CN202110252522 A CN 202110252522A CN 112845184 B CN112845184 B CN 112845184B
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- 238000012360 testing method Methods 0.000 title claims abstract description 160
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000001514 detection method Methods 0.000 claims abstract description 120
- 239000000463 material Substances 0.000 claims abstract description 112
- 230000002950 deficient Effects 0.000 claims abstract description 39
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000000284 extract Substances 0.000 claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims description 15
- 241000218202 Coptis Species 0.000 claims description 12
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 12
- 238000011056 performance test Methods 0.000 claims description 11
- 238000012797 qualification Methods 0.000 claims description 9
- 239000013072 incoming material Substances 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 5
- 230000007547 defect Effects 0.000 claims description 4
- 206010034972 Photosensitivity reaction Diseases 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 108091008695 photoreceptors Proteins 0.000 claims description 3
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
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- 238000010586 diagram Methods 0.000 description 3
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- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
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Abstract
The invention provides a packaging chip testing device and an application method thereof, wherein a first material moving module firstly detects gold wire spacing of a first chip detection CCD module after extracting chips to be tested from a feeding unit, after ensuring that the materials are normal, then the chips to be tested are placed on a testing jig for performance testing, after the performance testing is finished, a second material moving module firstly extracts the chips to be tested, firstly detects the gold wire spacing of the second chip detection CCD module, and then judges whether the gold wires of the chips are damaged in the testing process, after ensuring that the chips are normal, the qualified chips are placed on a good product tray, and the chips which are unqualified in testing and unqualified in gold wire spacing detection are placed on a defective product tray, so that automatic testing judgment of each link is realized, the testing efficiency is improved, the management and control of defective products are more accurate, and the degree of automation is high. The detection and positioning of the CCD module to the to-be-detected tray are performed through the tray detection CCD module, so that the grabbing accuracy of the first material moving module is ensured, and the detection and positioning of the to-be-detected chip are performed through the CCD module to ensure that the position of the to-be-detected chip is normal.
Description
Technical Field
The invention belongs to the technical field of chip testing equipment, and particularly relates to packaged chip testing equipment and an application method thereof.
Background
The packaged chip is in a rapid development period at present, the requirements of various industries are very strong, and the automatic test equipment of the packaged chip has great significance for the research and the production of the packaged chip. The automatic test equipment mainly works to test the working state and related performance of the packaged chip. Along with the continuous increase of chip yield, more and more testing requirements become to test each chip, and this requirement causes that the testing cost accounts for the proportion of chip manufacturing cost bigger, and the testing cost is very high, and present test equipment is inaccurate to the location of bad reason, can't accurately confirm at which link appear unusual, and is not accurate enough to the management and control of defective products, degree of automation is not high.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a packaged chip testing device and an application method thereof, which solve the problems of low testing efficiency, inaccurate control of defective products and low degree of automation of the packaged chip in the prior art.
In a first aspect, the invention provides a packaged chip testing device, comprising a base, a first material moving module, a second material moving module, a feeding unit, a discharging unit, a testing jig, a first chip detecting CCD module, a defective feeding tray and a second chip detecting CCD module, wherein the first material moving module, the second material moving module, the feeding unit, the discharging unit, the testing jig, the first chip detecting CCD module and the second chip detecting CCD module are all arranged above the base, the feeding unit is used for providing a tray to be tested, a chip to be tested is placed on the tray to be tested, the first material moving module is used for grabbing the chip to be tested on the tray to be tested and placing the chip to be tested on the testing jig, the first chip detecting CCD module is used for carrying out gold wire spacing detection on the chip to be tested before the chip to be tested moves to the testing jig, the defective receiving tray is used for receiving the unqualified chips to be tested after being detected by the first chip detection CCD module, the testing jig is used for performing performance test on the unqualified chips to be tested after being detected by the first chip detection CCD module, the second material moving module is used for grabbing the chips to be tested on the testing jig and placing the chips on the blanking unit, the second chip detection CCD module is used for performing gold wire interval detection on the chips to be tested before the chips to be tested move to the blanking unit, the blanking unit comprises a defective tray and a good tray, the defective tray is used for receiving the unqualified chips to be tested after being detected by the second chip detection CCD module, the good tray is used for receiving the qualified chips to be tested after being detected by the second chip detection CCD module, the number of the test jigs is at least one.
Further, still include charging tray detection CCD module, the charging tray detection CCD module is located the charging tray top that awaits measuring, the charging tray detection CCD module is used for right the charging tray that awaits measuring detects the location, first material moving module is according to the locating information that the charging tray detection CCD module feeds back, right await measuring the chip that awaits measuring on the charging tray is snatched.
Further, the device also comprises a testing jig detection CCD module, wherein the testing jig detection CCD module is arranged above the testing jig, and the testing jig detection CCD module is used for detecting and positioning a chip to be tested on the testing jig.
Further, still include empty tray detection CCD module, empty tray detection CCD module locates the yields tray top, empty tray detection CCD module is used for right the yields tray detects the location, the second moves the material module according to empty tray detection CCD module feedback's positioning information, place the chip that awaits measuring on yields tray.
Further, the testing fixture comprises a bottom plate and a cover plate, the cover plate is movably covered on the bottom plate, a plurality of chip grooves are formed in the bottom plate and used for placing chips to be tested, each chip groove is connected with a corresponding image acquisition card, and each image acquisition card is connected with a corresponding processor.
Further, the test fixture further comprises a heating unit, wherein the heating unit is arranged below the bottom plate and is used for heating the chip groove of the bottom plate.
In a second aspect, the invention provides an application method applied to the above-mentioned packaged chip test equipment, the first material moving module grabs the chip to be tested from the tray to be tested of the feeding unit, the chip to be tested passes through the first chip detection CCD module, the first chip detection CCD module detects the gold wire interval on the bottom of the chip to be tested, and carries on the qualification judgment to the gold wire interval, the first material moving module puts the unqualified chip to be tested on the defective tray of incoming material, put the qualified chip to be tested on the test fixture;
The test fixture performs performance test on the chip to be tested, and determines the qualification state of each chip to be tested in the same test fixture by combining performance test judgment of at least one technical index of single photoreceptor defect detection time which is not longer than 200s, image distortion, modulation conversion detection, black-and-white point detection, stain detection, fixed point noise detection, noise ratio, dynamic range detection, color and photosensitive reaction detection time and dark current detection;
According to the qualified state of each chip to be tested in the test fixture, the second material moving module extracts the unqualified chip to be tested and places the unqualified chip to be tested in the defective product tray, the second material moving module extracts the qualified chip to be tested and passes through the second chip detection CCD module, the second chip detection CCD module detects gold thread interval of the chip to be tested and judges the gold thread interval to be qualified, and the second material moving module places the unqualified chip to be tested in the defective product tray and places the qualified chip to be tested in the defective product tray.
Further, before the first material moving module grabs chips to be detected from a tray to be detected of a feeding unit, a tray detection CCD module detects and positions the trays to be detected, judges whether chips to be detected are mounted on each tray to be detected or not, sends positioning information to the first material moving module, and the first material moving module grabs the chips to be detected on the trays to be detected according to the positioning information fed back by the tray detection CCD module;
before the second moves the material module and puts qualified chip that awaits measuring in the good product tray, empty dish detects the CCD module and detects the location to the good product tray, judges whether every chip position on the good product tray is empty, empty dish detects the CCD module and takes place locating information to the second and moves the material module, the second moves the material module according to empty dish detects the locating information that CCD module feeds back, places the chip that awaits measuring on the vacancy of good product tray.
Further, after the first material moving module is used for placing the chip to be tested on the test jig, the test jig detection CCD module is used for detecting and positioning the chip to be tested on the test jig, detecting and judging whether the chip to be tested is arranged on a chip groove of the test jig or not, judging whether the chip to be tested is biased or not, and controlling the buzzer to send out warning sound if the chip to be tested on the chip groove is biased.
Further, when the test fixture tests the chip to be tested, the chip groove of the bottom plate of the test fixture is heated by the heating unit, so that the test temperature is within the range of 38-48 ℃.
The invention has the beneficial effects that:
The invention provides a packaging chip testing device and an application method thereof, wherein a first material moving module firstly detects gold thread spacing of a first chip detection CCD module after extracting chips to be tested from a feeding unit, after ensuring that the materials are normal, then the chips to be tested are placed on a testing jig for performance testing, after the performance testing is finished, a second material moving module firstly extracts the gold thread spacing of the chips to be tested, and then judges whether the gold threads of the chips to be tested are damaged in the testing process, after ensuring that the chips are normal, the qualified chips are placed on a good product tray, and the chips which are unqualified in testing and unqualified in gold thread spacing detection are placed on a defective product tray, so that automatic testing judgment of each link is realized, the testing efficiency is improved, the management and control of defective products are more accurate, and the degree of automation is high.
Drawings
The invention will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the invention, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
Fig. 1 is a schematic diagram of the overall structure of a packaged chip testing apparatus according to embodiment 1 under a single viewing angle.
Fig. 2 is a schematic diagram of the overall structure of a packaged chip testing apparatus according to embodiment 1 under another view angle.
Fig. 3 is a schematic diagram of the overall structure of a test fixture in a test apparatus for a packaged chip according to embodiment 1.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Example 1:
Referring to fig. 1 to 3, embodiment 1 provides a packaged chip testing device, which comprises a base 10, a first material moving module 11, a second material moving module 12, a feeding unit 2, a blanking unit 3, a testing jig 4, a first chip detecting CCD module 51, a bad material placing tray 6 and a second chip detecting CCD module 52, wherein the first material moving module 11, the second material moving module 12, the feeding unit 2, the blanking unit 3, the testing jig 4, the first chip detecting CCD module 51 and the second chip detecting CCD module 52 are all arranged above the base 10, the first material moving module 11 and the second material moving module 12 are fixedly connected to the first fixing frame 13 together and move along a cross rod portion of the first fixing frame 13 under the action of a linear motor, so that the first material moving module 11 can reciprocate between the feeding unit 2, the first chip detecting CCD module 51 and the testing jig 4, the second material moving module 12 can reciprocate between the testing jig 4, the second chip detecting CCD module 52 and the blanking unit 3, and the left and right chip detecting CCD modules 3 are arranged at intervals from the base 10 to the left and right, and the first chip detecting module 51 and the second chip detecting CCD module 3 are also arranged in sequence.
The feeding unit 2 is configured to provide a tray to be tested, a chip to be tested is placed on the tray to be tested, the first material moving module 11 is configured to grab the chip to be tested on the tray to be tested and place the chip to be tested on the test fixture 4, the first chip detecting CCD module 51 is configured to detect a gold thread pitch of the chip to be tested before the chip to be tested moves to the test fixture 4, and since the first material moving module 11 grabs the chip to be tested from top to bottom, the first chip detecting CCD module 51 beats the chip to be tested from bottom to top, the step does not need to overturn the chip to be tested, and the gold thread pitch detection can be completed in a material moving process, and the incoming material defective placing tray 6 is configured to place the chip to be tested that is failed after the first chip detecting CCD module 51 detects, so as to improve the control accuracy of defective products, and to determine whether the chip to be tested is an abnormal condition occurring in an incoming material link or a test through the gold thread pitch detection of the first chip detecting CCD module 51.
The test fixture 4 is used for carrying out the performance test to passing through the qualified chip that awaits measuring after the first chip detects CCD module 51 detects, the second moves material module 12 and is used for with the chip that awaits measuring on the test fixture 4 snatchs and places on unloading unit 3, the second chip detects CCD module 52 and is used for before the chip that awaits measuring moves to unloading unit 3, right the chip that awaits measuring carries out gold thread interval detection, because the second moves material module 12 snatchs the chip that awaits measuring from last, consequently the chip that awaits measuring is beaten by second chip detects CCD module 52 from the bottom upwards, this step is not needed to overturn the chip that awaits measuring, can accomplish gold thread interval detection at the material process of moving, unloading unit 3 includes defective products tray 31 and good products tray 32, defective products tray 31 is used for placing passing through the qualified chip that awaits measuring after the second chip detects CCD module 52 detects, in order to improve defective products and manage and control accurately, to the chip that awaits measuring after the test fixture 4 tests from top to bottom, this step also can be distinguished at this time and the defective products can be distinguished at this time by the defective products tray 31 and the defective products are also be distinguished at this time and the defective products are separated from the defective products that the defective products are placed in this step and the defective products are separated by the defective products and the defective products are placed in this step and the CCD module 31.
The number of the test tools 4 is two, the first test tools 4 are positioned on the left, the second test tools 4 are positioned on the right, the first material moving module 11 firstly places chips to be tested on the first test tools 4, in the test process of the first test tools 4, the first material moving module 11 places the chips to be tested on the second test tools 4, when the first test tools 4 finish the test, the second material moving module 12 takes away the chips to be tested on the first test tools 4, then the first test tools 4 supplement the chips to be tested on the first test tools 4, and so on, automatic material taking and discharging are performed, and material moving efficiency is improved.
The first material moving module 11 includes a first vertical moving unit, a first fixing plate and six extracting units, where the six extracting units are arranged side by side with the first fixing plate, and the first fixing plate is connected to the first fixing frame 13 through the first vertical moving unit. The second material moving module 12 includes a second vertical moving unit, a second fixing plate, and six extracting units arranged side by side with the second fixing plate, and the second fixing plate is connected to the first fixing frame 13 through the second vertical moving unit. The first vertical moving unit and the second vertical moving unit are used for respectively realizing that the extracting units on the first material moving module 11 and the second material moving module 12 move on the vertical Z axis, so that the chip to be tested is grabbed and put down.
It should be noted that, for the feeding unit 2, when the photoelectric sensor on the to-be-tested material rack senses that the to-be-tested material rack has a to-be-tested material tray, the to-be-tested material tray moves to the set positioning 'to-be-tested material tray lower disc', the to-be-tested material rack lower disc support is firstly lifted to the 'high position', the supporting cylinder is loosened to enable the to-be-tested material tray to be separated from the supporting cylinder clamp, the lower disc support is lowered to the 'middle position', the supporting cylinder is closed to enable the stacked to-be-tested material trays to be separated, the lower disc support is continuously lowered to the 'low position', the to-be-tested material tray is left on the to-be-tested material tray, the clamping cylinder on the to-be-tested material tray acts to clamp the to-be-tested material tray, and the feeding action of the to-be-tested material rack is completed. The working principle for the blanking unit 3 is similar to that of the loading unit 2, except that the order is reversed.
Referring to fig. 1 and 2, in this embodiment, the packaged chip testing apparatus further includes a tray detection CCD module 53, the tray detection CCD module 53 is disposed above the tray to be tested, the tray detection CCD module 53 is configured to detect and locate the tray to be tested, the first material moving module 11 captures the chip to be tested on the tray to be tested according to the positioning information fed back by the tray detection CCD module 53, and by using the tray detection CCD module 53, it is possible to accurately determine which position of the tray to be tested has the chip to be tested and which position is empty, and according to this positioning information, the first material moving module 11 can accurately capture the chip to be tested on the tray to be tested.
In this embodiment, the packaged chip testing apparatus further includes a testing jig detecting CCD module 54, where the testing jig detecting CCD module 54 is disposed above the testing jig 4, and the testing jig detecting CCD module 54 is configured to detect and locate a chip to be tested on the testing jig 4, detect and determine whether the chip to be tested is located on a chip slot of the testing jig 4, and determine whether the chip to be tested is biased, and if the chip to be tested on the chip slot has a bias phenomenon, control the buzzer to send a warning sound.
In this embodiment, the packaged chip test device further includes an empty tray detection CCD module 55, the empty tray detection CCD module 55 is disposed above the good tray 32, the empty tray detection CCD module 55 is used for detecting and positioning the good tray 32, the second material moving module 12 is used for placing the chip to be tested on the good tray 32 according to the positioning information fed back by the empty tray detection CCD module 55, and whether each chip position on the good tray 32 is empty can be accurately judged through the empty tray detection CCD module 55, which positions can be distinguished to place the chip to be tested, so that the second material moving module 12 can accurately place the chip to be tested.
It should be noted that, the tray detecting CCD module 53, the testing jig detecting CCD module 54 and the empty tray detecting CCD module 55 are all fixedly connected to the second fixing frame 14, and the tray detecting CCD module 53, the testing jig detecting CCD module 54 and the empty tray detecting CCD module 55 are respectively driven by the linear motor to move linearly along the cross rod of the second fixing frame 14. The linear motor realizes the horizontal X-axis movement of the charging tray detection CCD module 53, the test jig detection CCD module 54 and the empty tray detection CCD module 55, namely, the charging tray detection CCD module 53 horizontally moves to the upper side of the charging tray to be detected and performs detection positioning, the test jig detection CCD module 54 horizontally moves to the upper side of the test jig 4 and performs detection positioning, and the empty tray detection CCD module 55 horizontally moves to the upper side of the good product tray 32 and performs detection positioning.
Referring to fig. 3, as an implementation manner, the packaged chip testing device further includes a plurality of image acquisition cards and a plurality of processors, the testing fixture 4 includes a bottom plate 41 and a cover plate 42, the cover plate 42 is movably covered on the bottom plate 41, a plurality of chip slots are provided in the bottom plate 41, the chip slots are used for placing the chip to be tested, when the chip to be tested is placed in the chip slots, the control cover plate 42 covers down, so that the space where the chip to be tested is located is relatively closed, each chip slot is connected with a corresponding image acquisition card, each image acquisition card is connected with a corresponding processor, the image acquisition card and the chip slots form a hardware combination for testing the performance of the chip to be tested, and after the testing is completed, the control cover plate 42 is opened, so that the second material moving module 12 takes out the chip to be tested.
As an implementation manner, the test fixture 4 further includes a heating unit 43, the heating unit 43 is disposed below the bottom plate 41, the heating unit 43 is used for heating the chip slot of the bottom plate 41, and the test performance of the chip to be tested at different temperatures is simulated by heating the heating unit 43, so as to provide a more real test environment.
Example 2:
The embodiment provides an application method applied to the packaged chip test equipment in embodiment 1, wherein the first material moving module 11 grabs a chip to be tested from a tray to be tested of the feeding unit 2, the chip to be tested passes through the first chip detection CCD module 51, the first chip detection CCD module 51 detects the gold wire spacing at the bottom of the chip to be tested and performs qualification judgment on the gold wire spacing, the first material moving module 11 places the unqualified chip to be tested on the defective incoming material placing tray 6, and places the qualified chip to be tested on the test fixture 4;
The test fixture 4 performs performance test on the chips to be tested, and determines the qualification state of each chip to be tested in the same test fixture 4 by combining performance test judgment of at least one technical index of single photoreceptor defect detection time which is not longer than 200s, image distortion, modulation conversion detection, black-and-white point detection, stain detection, fixed point noise detection, noise ratio, dynamic range detection, color and photosensitive reaction detection time and dark current detection, wherein the detection items can also comprise all the above contents, and other test items can be added;
According to the qualification state of each chip to be tested in the test fixture 4, the second material moving module 12 extracts the unqualified chip to be tested and places the unqualified chip to be tested on the defective product tray 31, the second material moving module 12 extracts the qualified chip to be tested and passes through the second chip detection CCD module 52, the second chip detection CCD module 52 detects the gold wire spacing of the chip to be tested and performs qualification judgment on the gold wire spacing, and the second material moving module 12 places the unqualified chip to be tested on the defective product tray 31 and then places the qualified chip to be tested on the defective product tray 32.
Before testing, the engineering control software ProH and the vision software VisionMaster are opened, an operator scans the batch number of the chip product into the industrial control software by using a scanning gun, the correctness of the current batch number is judged by a PLC subprogram 'waferID' in the industrial control software, the follow-up program is executed if the batch number is correct, and otherwise, the execution is stopped and an alarm is given. After the lot number is correct, an operator places a tray to be tested, which is provided with a certain number of chips to be tested, on the rack to be tested, and simultaneously places a certain number of good trays 32 on the rack of the blanking unit 3. The preparation is completed, and the start button can be pressed to enable the test equipment to normally operate.
When the gold wire spacing detection is carried out on the chip back image, the chip back image is sent to VsionMaster to be used as gold wire spacing detection judgment. Different CCD modules are set differently at VsionMaster.
In this embodiment, before the first material moving module 11 grabs the chips to be tested from the trays to be tested of the feeding unit 2, the tray detection CCD module 53 performs detection positioning on the trays to be tested, determines whether the chips to be tested are mounted on each tray to be tested, and the tray detection CCD module 53 sends positioning information to the first material moving module 11, where the first material moving module 11 grabs the chips to be tested on the trays to be tested according to the positioning information fed back by the tray detection CCD module 53;
Before the second material moving module 12 places qualified chips to be tested on the good product tray 32, the empty tray detecting CCD module 55 detects and positions the good product tray 32, whether each chip position on the good product tray 32 is empty is judged, the empty tray detecting CCD module 55 sends positioning information to the second material moving module 12, and the second material moving module 12 places the chips to be tested on the empty position of the good product tray 32 according to the positioning information fed back by the empty tray detecting CCD module 55.
In this embodiment, after the first material transferring module 11 places the chip to be tested on the test fixture 4, the test fixture detection CCD module 54 detects and locates the chip to be tested on the test fixture 4, detects and determines whether the chip to be tested is located on the chip slot of the test fixture 4, and determines whether the chip to be tested is biased, if the chip to be tested on the chip slot has a bias phenomenon, the buzzer is controlled to send out a warning sound, and the buzzer sends out a sound of "drip" to prompt the operator, and the device can resume normal operation only after the operator removes the chip from errors.
In this embodiment, when the test fixture 4 tests the chip to be tested, the test fixture 4 can set the brightness of the light source, the number of times of the light source, etc. through the control interface, and can also heat the chip slot of the bottom plate 41 of the test fixture 4 through controlling the heating unit 43, so that the test temperature is within the range of 38-48 ℃, and the test performance of the chip to be tested at different temperatures is simulated, thereby providing a more real test environment.
Compared with the prior art, the invention provides the packaged chip testing equipment and the application method thereof, the first material moving module 11 firstly detects the gold wire spacing of the first chip detection CCD module 51 after extracting the chip to be tested from the feeding unit 2, after ensuring that the material is normal, then the chip to be tested is put on the testing jig 4 for performance test, after the performance test is finished, the second material moving module 12 extracts the chip to be tested, firstly detects the gold wire spacing of the second chip detection CCD module 52, judges whether the gold wire of the chip is damaged in the testing process again, ensures that the qualified chip is put on the good product tray 32 after being normal, and puts the chips which are unqualified in testing and unqualified in the gold wire spacing detection on the bad product tray 31, thereby realizing automatic testing judgment of each link, improving the testing efficiency, ensuring more accurate management and control of the bad products and high automation degree.
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but is merely preferred embodiments of the invention, and any modifications, equivalents, improvements, etc. within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (2)
1. The packaged chip testing equipment is characterized by comprising a base, a first material moving module, a second material moving module, a feeding unit, a discharging unit, a testing jig, a first chip detecting CCD module, an incoming material bad placing tray and a second chip detecting CCD module, wherein the first material moving module, the second material moving module, the feeding unit, the discharging unit, the testing jig, the first chip detecting CCD module and the second chip detecting CCD module are all arranged above the base, the feeding unit is used for providing a tray to be tested, a chip to be tested is placed on the tray to be tested, the first material moving module is used for grabbing the chip to be tested on the tray to be tested and placing the chip to be tested on the testing jig, the first chip detecting CCD module is used for carrying out gold thread spacing detection on the chip to be tested before the chip to be tested moves to the testing jig, the defective receiving tray is used for receiving the unqualified chips to be tested after being detected by the first chip detection CCD module, the testing jig is used for performing performance test on the unqualified chips to be tested after being detected by the first chip detection CCD module, the second material moving module is used for grabbing the chips to be tested on the testing jig and placing the chips on the blanking unit, the second chip detection CCD module is used for performing gold wire interval detection on the chips to be tested before the chips to be tested move to the blanking unit, the blanking unit comprises a defective tray and a good tray, the defective tray is used for receiving the unqualified chips to be tested after being detected by the second chip detection CCD module, the good tray is used for receiving the qualified chips to be tested after being detected by the second chip detection CCD module, the number of the test jigs is at least one;
The device comprises a charging tray detection CCD module, a first material moving module and a second material moving module, wherein the charging tray detection CCD module is arranged above a charging tray to be detected, the charging tray detection CCD module is used for detecting and positioning the charging tray to be detected, and the first material moving module is used for grabbing a chip to be detected on the charging tray to be detected according to positioning information fed back by the charging tray detection CCD module;
the testing jig detection CCD module is arranged above the testing jig and is used for detecting and positioning a chip to be tested on the testing jig;
the empty tray detection CCD module is arranged above the good product tray, the empty tray detection CCD module is used for detecting and positioning the good product tray, and the second material moving module is used for placing the chip to be detected on the good product tray according to the positioning information fed back by the empty tray detection CCD module;
The testing jig comprises a bottom plate and a cover plate, wherein the cover plate is movably covered on the bottom plate, a plurality of chip grooves are formed in the bottom plate and used for placing chips to be tested, each chip groove is connected with a corresponding image acquisition card, and each image acquisition card is connected with a corresponding processor;
the test fixture further comprises a heating unit, wherein the heating unit is arranged below the bottom plate and is used for heating the chip groove of the bottom plate.
2. The application method applied to the packaging chip testing equipment as claimed in claim 1, wherein the first material moving module grabs a chip to be tested from a tray to be tested of the feeding unit, the chip to be tested passes through a first chip detection CCD module, the first chip detection CCD module detects the gold wire spacing at the bottom of the chip to be tested and judges the gold wire spacing to be qualified, the first material moving module places the unqualified chip to be tested on a defective incoming material placing tray, and places the qualified chip to be tested on a testing jig;
The test fixture performs performance test on the chip to be tested, and determines the qualification state of each chip to be tested in the same test fixture by combining performance test judgment of at least one technical index of single photoreceptor defect detection time which is not longer than 200s, image distortion, modulation conversion detection, black-and-white point detection, stain detection, fixed point noise detection, noise ratio, dynamic range detection, color and photosensitive reaction detection time and dark current detection;
According to the qualification state of each chip to be tested in the test fixture, the second material moving module extracts the chips to be tested which are unqualified in test and places the chips to be tested in the defective product tray, the second material moving module extracts the chips to be tested which are qualified in test and passes through the second chip detection CCD module, the second chip detection CCD module detects the gold wire spacing of the chips to be tested and performs qualification judgment on the gold wire spacing, and the second material moving module places the unqualified chips to be tested in the defective product tray and places the qualified chips to be tested in the defective product tray;
Before the first material moving module grabs chips to be detected from a material tray to be detected of a feeding unit, a material tray detection CCD module detects and positions the material tray to be detected, judges whether the chips to be detected are arranged on each material tray to be detected or not, and sends positioning information to the first material moving module, and the first material moving module grabs the chips to be detected on the material tray to be detected according to the positioning information fed back by the material tray detection CCD module;
Before a second material moving module places qualified chips to be detected on a good tray, an empty tray detection CCD module detects and positions the good tray and judges whether each chip position on the good tray is empty or not, the empty tray detection CCD module generates positioning information to the second material moving module, and the second material moving module places the chips to be detected on the empty position of the good tray according to the positioning information fed back by the empty tray detection CCD module;
After the first material moving module is used for placing the chip to be tested on the test jig, the test jig detection CCD module is used for detecting and positioning the chip to be tested on the test jig, detecting and judging whether the chip to be tested is arranged on a chip slot of the test jig or not, judging whether the chip to be tested is biased or not, and controlling the buzzer to give out warning sound if the chip to be tested on the chip slot is biased;
When the test fixture tests the chip to be tested, the chip groove of the bottom plate of the test fixture is heated by the heating unit, so that the test temperature is within the range of 38-48 ℃.
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| CN114130695B (en) * | 2021-11-29 | 2023-12-22 | 苏州乾鸣半导体设备有限公司 | Detection equipment for detecting surface of chip |
| CN114295959B (en) * | 2021-12-17 | 2022-08-26 | 珠海市科迪电子科技有限公司 | Double-line driving chip testing method and device |
| CN114275260A (en) * | 2021-12-29 | 2022-04-05 | 浙江暨阳电子科技有限公司 | Automatic detection and packaging process and equipment for magnetic ring inductance |
| CN116448780A (en) * | 2023-03-06 | 2023-07-18 | 武汉光谷卓越科技股份有限公司 | Chip defect detection device, method and equipment |
| CN120736048B (en) * | 2025-09-05 | 2025-11-25 | 无锡昌鼎电子有限公司 | Product testing and packaging machine with magnet |
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