CN112812236B - 一种5g通讯用smc天线外罩及其制备方法 - Google Patents
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Abstract
本发明属于天线罩技术领域,公开了一种5G通讯用新型SMC天线外罩及其制备方法。所述SMC天线外罩由包括以下重量份数的原料配制而成:不饱和聚酯树脂100份;交联剂20~30份;低收缩添加剂15~25份;引发剂0.5~1.5份;增稠剂0.4~2份;内脱模剂1~3份;填料10~100份;玻璃纤维20~30份。本发明以196型不饱和聚酯树脂为基料,空心玻璃微珠为填料,然后辅以交联剂、引发剂、内脱模剂、增稠剂等多种添加剂组合复配制备天线外罩,不仅成本低廉,而且各个组分之间相互协同作用,在大大降低天线外罩的介电常数和介电损耗,提高其透波率的同时,还还保证了天线外罩的力学和电气性能,更能够满足不同天线基站的应用需求。
Description
技术领域
本发明属于天线罩技术领域,具体涉及一种5G通讯用新型SMC天线外罩及其制备方法。
背景技术
随着现代移动通信技术的发展,当前移动通信技术正在步入5G时代,5G网络作为下一代蜂窝移动通信技术,其具有数据传输速率高、延迟少、系统容量高等诸多优点。而通信基站作为5G网络大规模应用的基础,其天线质量和性能的稳定性直接影响网络信号的可靠性和稳定性。
目前,通信领域中常采用玻璃钢天线罩来保护天线系统免受外部环境的影响,而衡量天线罩性能参数的主要指标是机械强度和介电常数。天线罩的机械强度越高,其抵御外界冲击的能力就越强;天线罩的介电常数越低,其透波率就越高。而由于5G基站多采用单频、多频或宽频毫米波天线,因此其对于天线罩的介电常数、介电损耗、密度以及外观等指标有了更高的要求。
然而纵观现有的玻璃钢天线罩生产时大多数以不饱和聚酯为主要原料,再加入填料和相关助剂混合后得到浸渍料,然后琉璃纤维等通过浸渍料制得表面含不饱和聚酯的复合材料,该复合材料再经过模具挤出定型和加热固化制得产品,由于其常使用碳酸钙作为填料,其制得的产品密度一般为2.6-2.75g/m3,介电常数为4.2-4.5,难以满足高频天线的校调驻波和隔离所需指标,从而大大降低天线罩产品的透波性能,使得无线电信号衰减较大。而虽然也有部分报道加入其它添加剂来降低天线罩的介电常数,提高透波率,但是制得的天线罩的力学、电气、密度等性能往往不够理想。因此如何选择天线罩的材料,在保证天线罩具备稳定力学、电气、密度等性能的前提下,具有较高的透波率和较低的介电常数,具有十分重要的现实意义。
发明内容
针对现有技术中存在的问题,本发明的目的是要提供一种成本低廉、介电常数低、透波率高、电气绝缘性佳且力学性能稳定的5G通讯用新型SMC天线外罩及其制备方法。
本发明提供了一种5G通讯用新型SMC天线外罩,由包括以下重量份数的原料配制而成:
具体的,所述的不饱和聚酯树脂为196型不饱和聚酯树脂。
具体的,所述的交联剂为苯乙烯,所述的低收缩添加剂为聚氯乙烯。
具体的,所述的引发剂为过氧化二异丙苯,所述的增稠剂为氧化镁,所述的内脱模剂为硬脂酸锌。
具体的,所述的填料重量份数为20~30份,优选为25份。
具体的,所述的填料为空心玻璃微珠,优选为经过除去金属的空心玻璃微珠,粒径为20-40微米。
具体的,所述的玻璃纤维优选为低介电短切玻璃纤维。
本发明还提供了一种如上文所述的5G通讯用新型SMC天线外罩制备方法,包括以下步骤:
(4)树脂糊制备
按重量份数称取上述各原料,将不饱和聚酯树脂进行烘干处理,然后加入交联剂、引发剂、增稠剂、脱模剂、填料和低收缩添加剂,混合搅拌均匀得到树脂糊;
(5)上糊及玻璃纤维沉降
将上述制得的树脂糊均匀涂布到聚乙烯薄膜上分别制得上承载薄膜和下承载薄膜,接着将短切玻璃纤维均匀沉降在涂布有树脂糊的下承载薄膜上,然后将沉降好的下承载薄膜与上承载薄膜相叠合制得SMC片状模塑料;
(6)浸渍和成型
将步骤(2)制得的SMC片状模塑料放入错落排列的辊阵中进行挤压,使得SMC片状模塑料中的玻璃纤维浸渍树脂并赶走其中的气泡,然后静止、成型得天线外罩。
具体的,所述步骤(1)中填料添加时分多次加入且与液体原料苯乙烯同步加入,搅拌速度≤1000r/min。
具体的,所述步骤(3)中静止时间为20-28h,成型时采用模压机模压成型,先热压后冷压,模压压力20-40MPa,模压时间2-4min。
与现有技术相比,本发明的优点是:
1.本发明以196型不饱和聚酯树脂为基料,空心玻璃微珠为填料,然后辅以交联剂、引发剂、内脱模剂、增稠剂等多种添加剂组合复配制备天线外罩,不仅成本低廉,而且各个组分之间相互协同作用,能够大大降低天线外罩的介电常数和介电损耗,提高其透波率,同时还保证了天线罩的力学和电气性能,适用范围更广。
2.本发明基料采用196型不饱和聚酯树脂,其对玻璃纤维具有良好的浸润效果,使得生产时玻璃纤维能够更均匀的分散在其中,从而有利于提高天线外罩的透波均匀性,此外,196型不饱和聚酯树脂还具有良好的耐紫外线和机械强度,更有利于提高天线外罩的力学和电学稳定性。
3.本发明采用空心玻璃微珠为填料,一方面空心玻璃微珠重量轻、环向强度好,能够有效降低了玻璃钢天线外罩的密度和自重,另一方面相对于传统的碳酸钙填料,空心玻璃珠的加入能够大大降低天线外罩的介电常数和损耗,提高其透波率,而且制得的天线外罩电气绝缘性佳,无电感应涡流,能够满足不同天线基站的应用需求,具有较好的市场前景。
具体实施方式
下面将结合本发明实施例,对本发明实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
应当说明的是,本发明中所使用的原料和装置,如无特殊规定,均为常规市售产品,所述的空心玻璃微珠为经过除去金属的空心玻璃微珠,粒径为20-40微米。
实施例1
一种5G通讯用新型SMC天线外罩,由包括以下重量份数的原料配制而成:
一种5G通讯用新型SMC天线外罩制备方法,包括以下步骤:
(1)树脂糊制备
按重量份数称取上述各原料,将196不饱和聚酯树脂进行烘干处理,然后加入聚氯乙烯、过氧化二异丙苯、氧化镁和硬脂酸锌,在800r/min的搅拌速度下混合均匀,然后分多次同步加入空心玻璃微珠和苯乙烯,持续搅拌均匀得到树脂糊;
(2)上糊及玻璃纤维沉降
将上述制得的树脂糊涂布到聚乙烯薄膜上分别制得上承载薄膜和下承载薄膜,接着将玻璃纤维均匀沉降在涂布有树脂糊的下承载薄膜上,然后将沉降好的下承载薄膜与上承载薄膜相叠合制得SMC片状模塑料;
(3)浸渍和成型
将步骤(2)制得的SMC片状模塑料放入错落排列的辊阵中进行挤压,使得SMC片状模塑料中的玻璃纤维浸渍树脂并赶走其中的气泡,然后静止24h,接着采用模压机在30MPa压力下,先热压3min后冷压3min成型得天线外罩。
实施例2
本实施例与实施例1基本相同,不同之处在于,一种5G通讯用新型SMC天线外罩,由包括以下重量份数的原料配制而成:
对比例1
对比例1与本发明实施例1原料组分配比及制备方法基本相同,不同之处在于,对比例中采用除去金属的碳酸钙作为填料,检测上述制得的玻璃钢天线外罩的力学及电学性能见表1。
表1为本发明实施例1-2和对比例1制得的天线外罩的性能测试结果。
由表1可知,相对于传统的以碳酸钙为填料的玻璃钢天线外罩,本发明实施例制得的玻璃钢天线外罩不仅具有较低的介电常数和较高的透波率,而且具有较低的密度,同时还具有良好的力学性能,能够满足不同天线基站的应用需求。
对所公开的实施例的上述说明,使本领域技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下,在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要+符合与本文所公开的原理和新颖特点相一致的最宽的范围。
Claims (1)
1.一种5G通讯用SMC天线外罩的制备方法,其特征在于,包括以下步骤:
由以下重量份数的原料制备而成:100重量份196不饱和聚酯树脂、20重量份聚氯乙烯、1重量份过氧化二异丙苯、3重量份氧化镁、2重量份硬脂酸锌、30重量份空心玻璃微珠、20重量份苯乙烯和20重量份玻璃纤维;
(1)树脂糊制备
所述树脂糊的制备方法如下:
将100重量份196不饱和聚酯树脂进行烘干处理,然后加入20重量份聚氯乙烯、1重量份过氧化二异丙苯、3重量份氧化镁和2重量份硬脂酸锌,在800r/min的搅拌速度下混合均匀,然后分多次同步加入30重量份空心玻璃微珠和20重量份苯乙烯,持续搅拌均匀得到树脂糊;
(2)上糊及玻璃纤维沉降
将上述制得的树脂糊涂布到聚乙烯薄膜上分别制得上承载薄膜和下承载薄膜,接着将20重量份玻璃纤维均匀沉降在涂布有树脂糊的下承载薄膜上,然后将沉降好的下承载薄膜与上承载薄膜相叠合制得SMC片状模塑料;
(3)浸渍和成型
将步骤(2)制得的SMC片状模塑料放入错落排列的辊阵中进行挤压,使得SMC片状模塑料中的玻璃纤维浸渍树脂并赶走其中的气泡,然后静止24h,接着采用模压机在30MPa压力下,先热压3min后冷压3min成型得天线外罩。
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JPH08176313A (ja) * | 1994-12-27 | 1996-07-09 | Mitsubishi Plastics Ind Ltd | シートモールディングコンパウンド及びsmc成形品 |
CN107556721A (zh) * | 2017-10-10 | 2018-01-09 | 无锡新宏泰电器科技股份有限公司 | 一种smc聚酯模塑料及其制备方法 |
CN110951227A (zh) * | 2019-12-23 | 2020-04-03 | 无锡新宏泰电器科技股份有限公司 | 一种smc聚酯模塑料及其制备方法和应用 |
CN111171540A (zh) * | 2020-02-03 | 2020-05-19 | 武汉理工大学 | 低密度低压片状模塑料及其制备方法 |
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JPH08176313A (ja) * | 1994-12-27 | 1996-07-09 | Mitsubishi Plastics Ind Ltd | シートモールディングコンパウンド及びsmc成形品 |
CN107556721A (zh) * | 2017-10-10 | 2018-01-09 | 无锡新宏泰电器科技股份有限公司 | 一种smc聚酯模塑料及其制备方法 |
CN110951227A (zh) * | 2019-12-23 | 2020-04-03 | 无锡新宏泰电器科技股份有限公司 | 一种smc聚酯模塑料及其制备方法和应用 |
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