CN112802914A - Flexible solar cell module and packaging method thereof - Google Patents
Flexible solar cell module and packaging method thereof Download PDFInfo
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- CN112802914A CN112802914A CN202011596240.4A CN202011596240A CN112802914A CN 112802914 A CN112802914 A CN 112802914A CN 202011596240 A CN202011596240 A CN 202011596240A CN 112802914 A CN112802914 A CN 112802914A
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- solar cell
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000002313 adhesive film Substances 0.000 claims abstract description 19
- 239000013039 cover film Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000010408 film Substances 0.000 claims abstract description 17
- 238000009501 film coating Methods 0.000 claims abstract description 5
- 230000005496 eutectics Effects 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 4
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 abstract description 5
- 238000001125 extrusion Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000005001 laminate film Substances 0.000 description 3
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a flexible solar cell module and a packaging method thereof, wherein the flexible solar cell module comprises a packaging cover film, a flexible solar cell and a packaging bottom film; the surface of the packaging cover film is provided with a patterned circuit area and a laminated adhesive film coating prepolymer material area; the flexible solar cell electrode is connected with the patterned circuit; the flexible solar cell is fixed in the laminated adhesive film prepolymer area. The flexible batteries are packaged in a freely stretched state, so that mutual extrusion among the flexible batteries caused by the traditional laminating process is avoided, the yield of the assembly is improved, and the reliability of the flexible battery assembly is improved; meanwhile, the arrangement mode of the flexible solar cell is different from the traditional mode of firstly connecting in series and then connecting in parallel, so that the flexible cell module can not generate the phenomenon of circuit break caused by the abnormity of a single cell under the condition of not needing a bypass diode.
Description
Technical Field
The invention relates to the field of solar cells, in particular to a flexible solar cell module and a packaging method thereof.
Background
Solar photovoltaic power generation is the most promising way of new energy and renewable energy. The most basic elements of solar photovoltaic power generation are solar cell units, such as monocrystalline silicon, polycrystalline silicon, amorphous silicon, thin film batteries and the like. Solar panels consisting of one or more solar cell sheets are called photovoltaic modules, or solar cell modules. Due to the economic advantage of solar cells, the position of the solar cell field in the energy field is rapidly increasing, and the solar cell is the key point of energy planning in some developed countries.
Solar cells are classified into two broad categories, a hard substrate and a flexible substrate, according to the substrate. Flexible substrate solar cells have recently become more popular and important as a new variety of solar cells. The flexible substrate solar cell refers to a solar cell made of a flexible material (such as stainless steel and polymer) as a substrate. The greatest features are light, thin and flexible (or curled).
The flexible solar cell has the problem of material system mismatch between a commonly used flexible substrate material and a cell chip material because the thickness of the cell chip is very thin, and when the cell is warped, the warping of a packaged cell module is serious. In the related art, as shown in fig. 1, when a flexible assembly is cured by a laminator, a warped portion of a flexible battery is randomly pressed by an external force, so that the battery has a risk of dark crack failure, the production yield of the flexible battery assembly is affected, the reliability of the flexible battery assembly is affected, and even the assembly fails directly. Therefore, a new flexible solar cell module and a packaging method thereof are needed to improve the reliability of the cell module.
Disclosure of Invention
The first technical problem to be solved by the invention is as follows: a flexible solar cell module having high reliability.
The second technical problem to be solved by the invention is as follows: the packaging method of the flexible solar cell module is high in production yield.
In order to solve the first technical problem, the technical scheme of the invention is as follows: a flexible solar cell module comprises a packaging cover film, a flexible solar cell and a packaging bottom film;
the surface of the packaging cover film is provided with a patterned circuit area and a laminated adhesive film coating prepolymer material area;
the flexible solar cell electrode is connected with the patterned circuit;
the flexible solar cell is fixed in the reserved pattern area of the laminated adhesive film prepolymer material.
According to some embodiments of the present invention, the laminate film pre-polymer material includes at least one of ethylene-vinyl acetate copolymer (EVA) and ethylene-octene copolymer thermoplastic elastomer (POE).
According to some embodiments of the invention, the flexible solar cell assembly comprises at least one sheet of flexible solar cells.
According to some embodiments of the invention, the flexible solar cells of the flexible solar cell assembly are interconnected by a back-gold interconnection sheet.
According to some embodiments of the invention, the flexible solar cell module further comprises an encapsulating base film; preferably, the encapsulation base film is connected to the flexible solar cell through a laminate adhesive film.
According to some embodiments of the present invention, the laminate adhesive film comprises at least one of ethylene-vinyl acetate copolymer (EVA) and thermoplastic elastomer copolymerized with ethylene and octene (POE).
The flexible solar cell module according to the embodiment of the invention has at least the following beneficial effects: the invention is used for forming a component circuit by forming a patterned circuit on a packaging cover film; and other areas on the packaging cover film are covered with the laminated adhesive film pre-polymer material in advance, so that the flexible solar cell is bonded on the packaging cover film in a free stretching state, and then back surface curing packaging is carried out.
To solve the second technical problem, the technical solution of the present invention is: a packaging method of a flexible solar cell module comprises the following steps:
s1, forming a patterned circuit area and a laminated adhesive film coating prepolymer area on the packaging cover film;
s2, sequentially pasting the front side of the flexible battery on the reserved pattern, and performing primary curing;
and S3, interconnecting the back electrodes of the battery by using a back gold interconnection sheet, and leading out the other end electrode.
According to some embodiments of the invention, the patterned circuit is formed using low temperature eutectic bonding.
According to some embodiments of the invention, the low temperature eutectic solder is at least one of Sn-Bi and Au-In.
According to some embodiments of the invention, the difference between the temperature during the low temperature eutectic soldering process and the temperature of the lowest melting point of the metal component in the solder does not exceed 50 ℃.
According to some embodiments of the invention, the primary cure temperature does not exceed 200 ℃; the curing time is not more than 10 min.
The curing temperature and curing time can be adjusted according to the pre-polymerization bonding strength.
According to some embodiments of the present invention, when the encapsulation base film is used, the flexible battery pack is cured again on the encapsulation base film using the laminate film.
According to some embodiments of the invention, the re-curing temperature is greater than the primary curing temperature and does not exceed 200 ℃; the curing time is not more than 10 min.
According to some embodiments of the present invention, when the encapsulation base film is not used, the flexible battery module is cured again on the use body case using the laminate film.
The flexible solar cell module packaging method provided by the embodiment of the invention has at least the following beneficial effects: the packaging method provided by the invention packages the flexible batteries in a freely stretched state, so that mutual extrusion among the flexible batteries caused by the traditional laminating process is avoided, the yield of the assembly is improved, and the reliability of the flexible battery assembly is improved; meanwhile, the arrangement mode of the flexible solar cell is different from the traditional mode of firstly connecting in series and then connecting in parallel, so that the flexible cell module can not generate the phenomenon of circuit break caused by the abnormity of a single cell under the condition of not needing a bypass diode.
Drawings
Fig. 1 is a schematic diagram illustrating a process of packaging a flexible solar cell module according to the related art;
fig. 2 is a schematic structural diagram of a flexible solar cell module according to a first embodiment and a second embodiment of the invention;
fig. 3 is a schematic view of a flexible solar cell and a packaging cover film according to a second embodiment of the invention;
FIG. 4 is a schematic diagram illustrating a structure of forming a patterned cap film of a package according to a second embodiment of the present invention;
fig. 5 is a schematic structural diagram of a primary cured battery assembly according to a second embodiment of the present invention.
Description of reference numerals:
100. packaging the cover film; 101. a flexible solar cell; 200. a patterned circuit; 201. laminating a glue film prepolymer material; 300. An electrode back gold interconnection sheet; 301. laminating an adhesive film; 302. packaging a bottom film; 303. and a gold-backed region of the electrode.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments. The test methods used in the examples are all conventional methods unless otherwise specified; the materials, reagents and the like used are commercially available reagents and materials unless otherwise specified.
The first embodiment of the invention is as follows: a flexible solar cell module, as shown in FIG. 2, comprises a packaging cover film 100, a flexible solar cell 101 and a packaging base film 302; a patterned circuit 200 and a laminating adhesive film prepolymer material 201 are arranged on the packaging cover film 100; fixing the flexible solar cell 101 at the patterned circuit 200; the flexible solar cells 101 are connected by 300 electrode back gold interconnection pieces; the flexible solar cell 101 is bonded to the encapsulating base film 302 by a laminate adhesive film 301.
The second embodiment of the invention is as follows: a method for encapsulating a flexible solar cell module, as shown in fig. 2 to 5, comprises the following steps:
s1, forming a patterned mask material through a photomask process, and then sputtering Sn-Bi alloy on the packaging cover film 100; stripping the sputtered Sn-Bi alloy to form the required patterned metal circuit 200; then forming a required patterning film covering area through a mask material, and spraying and spin-coating EVA on the packaging cover film 100 to form a laminated adhesive film prepolymer material 201; heating to 100 deg.C, and maintaining the temperature for 10min to obtain the patterned packaging cover film shown in FIG. 3;
s2, pasting the front side of the flexible solar cell 101 on the laminated adhesive film prepolymer material 201, and heating the laminated adhesive film prepolymer material 201 to perform primary curing to obtain a primary cured cell assembly shown in FIG. 4; wherein the temperature of the primary curing is 150 ℃ and the time is 10 min;
s3, interconnecting the back electrodes of the flexible solar cells 101 of the primarily solidified cell module, and leading out the electrode at the other end to obtain an interconnected cell module;
s4, sequentially covering the laminated adhesive film 301 and the packaging base film 302 on the interconnected cell module to obtain a product with the structure shown in FIG. 5, and curing and packaging again to obtain the flexible solar cell module shown in FIG. 2; wherein the temperature for re-curing is 200 deg.C and the time is 10 min.
In conclusion, the packaging method provided by the invention packages the flexible batteries in a freely stretched state, so that mutual extrusion among the flexible batteries caused by the traditional laminating process is avoided, the yield of the assembly is improved, and the reliability of the flexible battery assembly is improved; meanwhile, the arrangement mode of the flexible solar cell is different from the traditional mode of firstly connecting in series and then connecting in parallel, so that the flexible cell module can not generate the phenomenon of circuit break caused by the abnormity of a single cell under the condition of not needing a bypass diode.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (10)
1. A flexible solar cell module, characterized by: the packaging cover film and the flexible solar cell are included;
the surface of the packaging cover film is provided with a patterned circuit area and a laminated adhesive film coating prepolymer material area;
the flexible solar cell electrode is connected with the patterned circuit;
the flexible solar cell is fixed in the laminated adhesive film prepolymer area.
2. The flexible solar cell module of claim 1, wherein: the laminated adhesive film prepolymer material comprises at least one of EVA and POE.
3. The flexible solar cell module of claim 1, wherein: the flexible solar cell module comprises at least one flexible solar cell.
4. A flexible solar module according to claim 3, characterized in that: the flexible solar cell module comprises a plurality of flexible solar cells, and the flexible solar cells are connected with each other through a back gold interconnection sheet.
5. The flexible solar cell module of claim 1, wherein: the flexible solar cell module further comprises a packaging base film; preferably, the encapsulation base film is connected to the flexible solar cell through a laminate adhesive film.
6. A method of making the flexible solar cell module of claim 1, wherein: comprises the following steps:
s1, forming a patterned circuit area and a laminated adhesive film coating prepolymer area on the packaging cover film;
s2, sequentially pasting the front side of the flexible battery on the reserved pattern, and performing primary curing;
and S3, interconnecting one end of the back electrode of the battery by using a back gold interconnection sheet, and leading out the other end of the back electrode.
7. The method of claim 6, wherein the method comprises: the patterned circuit is formed by low-temperature eutectic soldering.
8. The method of claim 7, wherein the method comprises: the solder of the low-temperature eutectic soldering comprises at least one of Sn-Bi and Au-In.
9. The method of claim 7, wherein the method comprises: the difference between the temperature in the low-temperature eutectic soldering process and the temperature of the lowest melting point of the metal component in the solder is not more than 50 ℃.
10. The method of claim 6, wherein the method comprises: the temperature of the primary curing is not more than 200 ℃; the curing time is not more than 10 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011596240.4A CN112802914A (en) | 2020-12-29 | 2020-12-29 | Flexible solar cell module and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011596240.4A CN112802914A (en) | 2020-12-29 | 2020-12-29 | Flexible solar cell module and packaging method thereof |
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| CN112802914A true CN112802914A (en) | 2021-05-14 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102676068A (en) * | 2011-10-24 | 2012-09-19 | 浙江大东南包装股份有限公司 | Ethylene-vinyl acetate (EVA) adhesive film production technology based on on-line crosslinking |
| CN106531819A (en) * | 2015-09-11 | 2017-03-22 | 财团法人工业技术研究院 | Packaging film for solar cell, manufacturing method of packaging film and solar cell module packaging structure |
| CN107994089A (en) * | 2017-09-01 | 2018-05-04 | 北京汉能光伏投资有限公司 | Solar cell module and its method for packing |
| CN110767770A (en) * | 2018-07-25 | 2020-02-07 | 元创绿能科技股份有限公司 | Circuit board, method for manufacturing circuit board, and circuit board incorporated in solar cell |
| CN111710739A (en) * | 2020-08-03 | 2020-09-25 | 常州斯威克新材料科技有限公司 | Reflection of light photovoltaic module encapsulation glued membrane |
| CN111933735A (en) * | 2020-08-06 | 2020-11-13 | 中节能太阳能科技（镇江）有限公司 | Laminated photovoltaic module and solder strip for same |
-
2020
- 2020-12-29 CN CN202011596240.4A patent/CN112802914A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102676068A (en) * | 2011-10-24 | 2012-09-19 | 浙江大东南包装股份有限公司 | Ethylene-vinyl acetate (EVA) adhesive film production technology based on on-line crosslinking |
| CN106531819A (en) * | 2015-09-11 | 2017-03-22 | 财团法人工业技术研究院 | Packaging film for solar cell, manufacturing method of packaging film and solar cell module packaging structure |
| CN107994089A (en) * | 2017-09-01 | 2018-05-04 | 北京汉能光伏投资有限公司 | Solar cell module and its method for packing |
| CN110767770A (en) * | 2018-07-25 | 2020-02-07 | 元创绿能科技股份有限公司 | Circuit board, method for manufacturing circuit board, and circuit board incorporated in solar cell |
| CN111710739A (en) * | 2020-08-03 | 2020-09-25 | 常州斯威克新材料科技有限公司 | Reflection of light photovoltaic module encapsulation glued membrane |
| CN111933735A (en) * | 2020-08-06 | 2020-11-13 | 中节能太阳能科技（镇江）有限公司 | Laminated photovoltaic module and solder strip for same |
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Application publication date: 20210514 |
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