CN112789331B - Uv可烧结分子油墨以及使用广谱uv光对其加工 - Google Patents

Uv可烧结分子油墨以及使用广谱uv光对其加工 Download PDF

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Publication number
CN112789331B
CN112789331B CN201980064477.7A CN201980064477A CN112789331B CN 112789331 B CN112789331 B CN 112789331B CN 201980064477 A CN201980064477 A CN 201980064477A CN 112789331 B CN112789331 B CN 112789331B
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China
Prior art keywords
ink
silver
substrate
traces
sintering
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Chinese (zh)
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CN112789331A (zh
Inventor
刘向阳
丁建夫
帕特里克·罗兰·卢西恩·马朗方
尚塔尔·帕凯
巴瓦纳·代奥雷
阿诺德·J·凯尔
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National Research Council of Canada
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National Research Council of Canada
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Methods (AREA)
CN201980064477.7A 2018-08-03 2019-08-02 Uv可烧结分子油墨以及使用广谱uv光对其加工 Active CN112789331B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862714363P 2018-08-03 2018-08-03
US62/714,363 2018-08-03
PCT/IB2019/056612 WO2020026207A1 (en) 2018-08-03 2019-08-02 Uv-sinterable molecular ink and processing thereof using broad spectrum uv light

Publications (2)

Publication Number Publication Date
CN112789331A CN112789331A (zh) 2021-05-11
CN112789331B true CN112789331B (zh) 2024-05-28

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CN201980064477.7A Active CN112789331B (zh) 2018-08-03 2019-08-02 Uv可烧结分子油墨以及使用广谱uv光对其加工

Country Status (8)

Country Link
US (1) US11873413B2 (https=)
EP (1) EP3830200A4 (https=)
JP (1) JP7374177B2 (https=)
KR (1) KR102790704B1 (https=)
CN (1) CN112789331B (https=)
CA (1) CA3108631A1 (https=)
TW (1) TWI825140B (https=)
WO (1) WO2020026207A1 (https=)

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TWI853828B (zh) 2018-08-07 2024-09-01 加拿大國家研究委員會 包覆成型的印刷電子零件和其製造方法
US11043729B2 (en) * 2019-02-05 2021-06-22 Best Medical Canada Ltd. Flexible antenna for a wireless radiation dosimeter
US11741329B2 (en) 2019-09-26 2023-08-29 Best Theratronics, Ltd. Low power non-volatile non-charge-based variable supply RFID tag memory
EP3882038A1 (en) * 2020-03-18 2021-09-22 Heraeus Deutschland GmbH & Co. KG Assembly for an inkjet printer, inkjet printer and method for printing a functional layer on a surface of a three-dimensional electronic device
CN116013890A (zh) * 2023-01-05 2023-04-25 哈尔滨理工大学 一种半导体封装用低温烧结铜浆料及其制备方法
CN116321774A (zh) * 2023-02-17 2023-06-23 潍坊东大电子材料有限公司 一种基于无颗粒墨水制备超细导电线路的工艺

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CN104341860A (zh) * 2013-08-01 2015-02-11 索尼公司 纳米导电墨水及其制备方法
EP3085811A1 (en) * 2015-04-20 2016-10-26 Heraeus Deutschland GmbH & Co. KG Low temperature ag-compositions
TW201815994A (zh) * 2016-07-28 2018-05-01 加拿大國家研究委員會 銅墨水及由其製成的導電可焊接銅線

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US5527627A (en) * 1993-03-29 1996-06-18 Delco Electronics Corp. Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit
US20060000172A1 (en) 2001-06-22 2006-01-05 Amazon Forms One, Inc. Lightweight concrete composite blocks
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
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WO2007043664A1 (ja) 2005-10-14 2007-04-19 Toyo Ink Mfg. Co., Ltd. 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および導電性被膜
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JP5527060B2 (ja) 2010-07-06 2014-06-18 コニカミノルタ株式会社 有機光電変換素子、その製造方法及び太陽電池
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CN104284952A (zh) * 2012-02-29 2015-01-14 耶路撒冷希伯来大学伊森姆研究发展有限公司 包含金属前体纳米颗粒的油墨
CN104341860A (zh) * 2013-08-01 2015-02-11 索尼公司 纳米导电墨水及其制备方法
EP3085811A1 (en) * 2015-04-20 2016-10-26 Heraeus Deutschland GmbH & Co. KG Low temperature ag-compositions
TW201815994A (zh) * 2016-07-28 2018-05-01 加拿大國家研究委員會 銅墨水及由其製成的導電可焊接銅線

Also Published As

Publication number Publication date
KR20210042937A (ko) 2021-04-20
KR102790704B1 (ko) 2025-04-02
JP7374177B2 (ja) 2023-11-06
TW202016228A (zh) 2020-05-01
CA3108631A1 (en) 2020-02-06
CN112789331A (zh) 2021-05-11
US11873413B2 (en) 2024-01-16
TWI825140B (zh) 2023-12-11
EP3830200A1 (en) 2021-06-09
EP3830200A4 (en) 2022-07-27
JP2021533229A (ja) 2021-12-02
US20210301166A1 (en) 2021-09-30
WO2020026207A1 (en) 2020-02-06

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