CN112771653A - 顺应性裸晶附接工具、裸晶附接系统及其使用方法 - Google Patents

顺应性裸晶附接工具、裸晶附接系统及其使用方法 Download PDF

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CN112771653A
CN112771653A CN201980058096.8A CN201980058096A CN112771653A CN 112771653 A CN112771653 A CN 112771653A CN 201980058096 A CN201980058096 A CN 201980058096A CN 112771653 A CN112771653 A CN 112771653A
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die
substrate
bonding
bonding tool
supply
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CN112771653B (zh
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R·H·赫夫斯
R·布鲁韦尔
R·A·范德布尔格
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Abstract

提供了一种裸晶附接系统。裸晶附接系统包括：用于支撑基底的支撑结构；裸晶供应源，其包括用于附接到基底的多个裸晶；以及结合头，其用于将裸晶从裸晶供应源结合到基底，该结合头包括结合工具，该结合工具具有用于在从裸晶供应源到10基底的转移期间接触裸晶的接触部分，结合头包括与结合工具接合的弹簧部分使得弹簧部分被配置成在使用结合工具的接触部分将裸晶压靠基底期间压缩。

Description

顺应性裸晶附接工具、裸晶附接系统及其使用方法
相关申请的交叉引用
本申请要求2018年9月5日提交的美国临时申请No.62/727,395的权益，其内容通过引用合并于此。
技术领域
本发明涉及用于将裸晶/管芯(die)附接至基底的系统和方法，并且更具体地，涉及与将裸晶附接至基底而无需从裸晶供应源拾取裸晶结合使用的改进顺应性裸晶/管芯附接工具。
背景技术
与裸晶在基底上的放置有关(例如，半导体裸晶附接操作)，许多常规应用利用“拾取和放置”操作。在这种操作中，从半导体晶片或其他裸晶供应源“拾取”裸晶，并且然后将裸晶移动到(并“放置”在)目标基底上。这种操作还可以利用“拾取”工具和“放置”工具之间的一次或多次转移。
在其他裸晶附接操作中，裸晶供应源(例如，包括多个裸晶的晶片)可以位于结合工具和基底之间。当裸晶仍固定到裸晶供应源的膜/箔上时，可使用结合工具将裸晶压靠在基底上。因此，执行裸晶附接操作而无需任何“拾取”和“放置”操作。然而，这种操作趋于遭受许多缺陷，例如在结合操作期间对结合工具和裸晶之间的结合力的不良控制。
因此，期望提供改进的裸晶附接系统和相关方法，以克服常规裸晶附接系统的一个或多个缺陷。
发明内容
根据本发明的示例性实施例，提供了一种裸晶附接系统。所述裸晶附接系统包括：支撑结构，其用于支撑基底；裸晶供应源，其包括用于附接到基底的多个裸晶；以及结合头，其用于将裸晶从裸晶供应源结合到基底，所述结合头包括结合工具，所述结合工具具有用于在从裸晶供应源到基底的转移期间与裸晶接触的接触部分，结合头包括与结合工具接合的弹簧部分，使得弹簧部分被配置成在使用结合工具的接触部分将裸晶压靠基底期间压缩。
根据本发明的另一示例性实施例，提供了一种将裸晶附接到基底的方法。该方法包括以下步骤：提供裸晶供应源，该裸晶供应源包括用于附接到基底的多个裸晶，该裸晶供应源被定位于结合工具和支撑基底的支撑结构之间；以及向下移动由结合头承载的结合工具，使得结合工具的接触部分接触裸晶以将裸晶从裸晶供应源转移到基底。结合头包括与结合工具接合的弹簧部分，使得弹簧部分被配置为在使用结合工具的接触部分将裸晶压靠基底期间压缩。
附图说明
当结合附图阅读时，根据以下详细描述可以最好地理解本发明。要强调的是，根据惯例，附图的各种特征未按比例绘制。相反，为了清楚起见，各种特征的尺寸被任意扩大或缩小。
图1A至图1C是示出根据本发明示例性实施例的裸晶附接系统的元件的框图；以及
图2A至图2D是根据本发明的示例性实施例的裸晶附接系统的一部分的一系列侧视截面图。
具体实施方式
特定裸晶附接应用不利用拾取和放置操作。例如，裸晶供应源(例如，包括多个裸晶的晶片，诸如LED晶片或其他LED裸晶源)可以位于结合工具和基底之间。可以将包括在裸晶供应源中的裸晶(例如，LED裸晶)附接到膜/箔等。
根据本发明的特定示例性方面，在结合工具、待附接裸晶和基底的放置位置之间对准之后，结合工具将裸晶压靠在基底的放置位置。在裸晶的下表面上(和/或在基底的放置位置上)提供粘合剂，使得裸晶现在被固定到基底。这种结合工具可以包括多个引脚(pin)(例如，可彼此独立地致动的可致动引脚)，以用于与从裸晶供应源到基底的转移有关地接触裸晶。
如本文所用，术语“裸晶”旨在指代包括(或被配置为在随后的步骤中包括)半导体芯片或裸晶的任何结构。示例性“裸晶”元件包括裸露半导体裸晶，其包括裸露LED半导体裸晶、在基底(例如，引线框、PCB、载体、半导体芯片、半导体晶片、BGA基底，半导体元件等)上的半导体裸晶、封装半导体器件、倒装芯片半导体器件、嵌入基底裸晶等。
根据本发明的特定示例性实施例，在裸晶附接系统中，结合头用于将裸晶附接至基底。结合头包括保持器(例如，轴部分)以及耦接至该保持器的结合工具(例如，针)。结合工具可以悬置在结合头的壳体中并且可以沿至少一个方向(例如，沿着裸晶附接系统的竖直z轴线)移动。以这种方式，结合头的壳体部分与结合工具分离。结合头包括用于检测(例如，测量)结合工具相对于结合工具壳体的运动的检测系统(例如，用于检测在将裸晶结合至基底期间弹簧部分的压缩量的传感器)。裸晶附接系统基于检测系统传递的信号来控制结合工具的移动。在本发明的特定实施例中，不使用这种检测系统或传感器。例如，可以使用可获得的其他信息来完成对结合工具的控制。例如，z致动器(其作为运动系统的一部分，沿z轴线驱动结合头–参见图2A至图2D中的元件124)的电机电流可用于确定结合工具的高度和/或控制结合工具的运动。
使用裸晶附接系统的示例性情况包括：(i)结合头可以包括检测系统，以能够进行结合工具壳体和结合工具之间的相对位置测量；以及(ii)可以在没有这种检测系统的情况下使用结合头。
本发明的各种方面的示例性目的包括以下一项或多项：(i)减小在将裸晶附接到基底期间结合工具施加在裸晶上的冲击质量；(ii)控制由结合工具施加在正被附接的裸晶上的力；(iii)控制结合头的弹簧部分的压缩量；(iv)确定在附接期间裸晶在基底上的碰撞时间点；以及(v)确定裸晶在基底上的碰撞高度。
图1A示出了裸晶附接系统100。裸晶附接系统100包括：支撑结构102，其用于支撑基底104；裸晶供应源106，其包括被配置为附接到基底104的多个裸晶106a；以及结合头108(其被配置为使用运动系统124被沿z轴线驱动)，其包括用于在将裸晶106a从裸晶供应源106转移到基底104期间与裸晶106a接触的结合工具120。裸晶附接系统100还包括结合头支撑件126以及供应支撑件128。结合头支撑件126和供应支撑件128各自安装在机器结构130上，使得结合头支撑件126和供应支撑件128可相对于机器结构130独立移动。结合头支撑件126支撑中间支撑结构132(其可相对结合头支撑件126移动)，该中间支撑结构132支撑可移动结合头108。中间支撑结构132承载摄像机134(以及其他视觉系统部件)以与对准和/或检查操作结合使用。裸晶供应源106可移动地安装在供应支撑件128上。在图1A(和图1B)中所示的本发明的示例性实施例中，在裸晶附接操作期间，裸晶供应源106被定位于结合工具120和由支撑结构102支撑的基底104之间。图1B是裸晶附接系统100的元件的侧视截面图，其中摄像机134和结合工具120定位于基底104上方。两个“经结合”裸晶106a’已经在相应结合位置处结合到基底104，并且结合工具120示出为在基底104上的第三相应结合位置之上接合另一裸晶106a。图1C示出了结合工具120的示例的框图。更具体地，结合工具120可包括至少一个引脚120b以用于与从裸晶供应源106到基底104的转移有关地接触裸晶106a。此外，如图1C所示，结合工具120可包括多个引脚120b以用于与从裸晶供应源106到基底104的转移有关地接触裸晶106a。多个引脚120b中的每个均可以相对于结合工具120的其余部分可分离地或共同地移动(例如，沿着竖直轴线)以将裸晶106a转移到基底104。当然，包括一个或多个引脚120b(如图1C所示)的结合工具120是结合工具120的示例。在本发明的其他实施例中，结合工具120可以不包括引脚120b，但是可以在没有引脚120b的情况下转移裸晶106a。更进一步地，图2A至图2D示出了不具有引脚120b的结合工具120，使得沿z轴线驱动单个结构。在本发明的其中结合工具120包括多个引脚120b的实施例中，这种引脚可以包括用于根据需要使引脚120b彼此分开(或一起)移动以实现裸晶转移的额外(一个或多个)致动器。
图2A至图2D是裸晶附接系统100的元件的具体构造的一系列侧视截面图。如上所述，裸晶附接系统100包括用于支撑基底104的支撑结构102以及裸晶供应源106(例如，其中裸晶供应源包括LED晶片并且多个裸晶是多个LED裸晶)，该裸晶供应源106包括用于附接到基底104的多个裸晶106a。例如，裸晶供应源106包括柔性膜106b，其中多个裸晶106a附接到柔性膜106b。裸晶附接系统100包括用于将裸晶106a从裸晶供应源106结合到基底104的结合头108。结合头108包括结合工具120(例如，包括针、引脚、可沿竖直轴线分开移动的多个引脚等)(其中，诸如多个引脚的结合工具120与从裸晶供应源106到基底104的转移有关地接触裸晶106a)，所述结合工具具有接触部分120a用于在从裸晶供应源106到基底104的转移期间接触裸晶106a。结合头108包括与结合工具120接合的弹簧部分118，使得弹簧部分118被配置为在使用结合工具120的接触部分120a将裸晶106a压靠基底104期间压缩。因此，结合工具120是弹簧加载的。在图2A至图2D所示的示例中，弹簧部分118和结合工具120之间的接合是通过包括在结合头108中的轴部分114(例如，针保持器)实现的。结合工具120(直接或间接地)固定到轴部分114。轴部分114被配置为沿着竖直轴线(例如，裸晶附接系统100的z轴线)移动。
更具体地，结合头108包括z致动器部分110，该z致动器部分110(直接或间接地)耦接至结合工具壳体112。结合头108限定内部孔口108a，该内部孔口108a允许轴部分114沿着前述竖直轴线运动。弹簧部分118与轴部分114的一部分接合。多个线性引导件116(例如，无游隙、无摩擦的线性引导件)耦接在轴部分114和结合工具壳体112之间。轴114的台阶部分114b被配置成在内部孔口108a的一部分内行进。轴部分114包括被配置成抵靠内部孔口108a的成角度内表面的预张紧锥形部分114a。更具体地，由于弹簧部分118提供的推靠轴部分114的另一台阶部分114c的力，因此预张紧圆锥形部分114a处于“张力”下。
具体地参考图2A，结合工具120定位于多个裸晶106a中的一个裸晶上方(即，裸晶供应源106定位于基底104和结合工具120之间)。在图2A中，结合工具120(直接或间接耦接至轴114)相对于结合工具壳体112处于其运动范围内的更低位置处。在图2B中，结合头108已经向下移动，使得结合工具120的接触部分120a触及裸晶供应源106的裸晶106a。结合头108继续向下移动，使得膜106b开始朝着基底104向下移动(即，弯曲)。在使用结合工具120的接触部分120a将裸晶106a压靠基底104之前，在接触部分120a与裸晶106a之间的接触期间，弹簧部分118开始压缩(即，在图2B和图2C之间的差异中示出了弹簧部分118的压缩)。
图2C示出了裸晶106a被结合工具120(例如，用等于结合工具120的位移乘以弹簧部分118的弹簧常数的力)压靠基底104。也就是说，结合工具120(直接或间接耦接到轴114)相对于结合工具壳体112现在处于其运动范围内的上部位置中。结合工具120的位移由位移测量装置122(例如，其中，位移测量装置可以包括位置传感器)测量，所述位移测量装置被包括在z致动器部分110中。位移信号(例如，由位移测量装置122提供)由运动系统124(用于移动结合头108)使用以便在对应于预定向下按压力的位置(即，图2C中所示的位置)处停止结合头108的z轴线运动。应当理解，可以“实时”使用这种位移信号(与当前裸晶附接操作结合)，或者可以结合后续裸晶附接操作来使用这种位移信号。
在结合时间(也称为“驻留”时间，即，结合工具120维持预设向下按压力的时间)之后，运动系统124开始如图2D所示向上升高结合头108。裸晶106a现在被结合到基底104(例如，由于包括在基底104和/或裸晶106a上的粘合剂的保持力)(其中裸晶106a和基底104的结合位置中的至少一个包括用于在从裸晶供应源106转移到基底104之后将裸晶106a固定至结合位置的粘合剂)。即，随着结合工具120向上移动(由结合头108承载)，裸晶106a通过结合工具120的“急动(jerk)”运动而被从膜106b释放。结合工具120的这种急动运动是由结合工具120在其由于弹簧力而相对于结合工具壳体112返回至其运动范围内的更低位置时的向上运动所引起的。
裸晶附接系统100被配置为基于来自位移测量装置122的反馈，在将裸晶106a结合到基底104期间控制结合工具120(包括在结合头108中)的下降。例如，位移测量装置122包括位置传感器以用于检测在将裸晶106a结合到基底104期间弹簧部分118的压缩量。
位移测量装置122可以在本发明的范围内变化，并且可以与运动系统124结合地进行操作。此外，可以结合运动系统124的操作而使用预定数据。这种预定数据可以与以下有关：(i)弹簧部分118的为提供裸晶106a到基底104理想结合的压缩量，其中压缩量与(a)结合头108的一部分和(b)结合工具120的一部分中的至少一个的z轴线位置有关；和/或(ii)为提供裸晶106a到基底104期望结合的待施加的结合力的量，其中结合力的量与(a)结合头108的一部分和(b)结合工具120的一部分中的至少一个的z轴线位置有关。
与常规工具(和相关的裸晶附接系统)相比，示例性益处可包括：(i)减小裸晶附接期间施加在裸晶上的力；(ii)通过最小化移动距离来优化输出；(iii)在系统中实现精确高度示教；以及(iv)检测可能引起过程误差的不规则高度变化。示例为检测基底上的障碍物、检测源\基底上缺少裸晶以及检测系统故障。
虽然已经主要关于没有“拾取”操作的裸晶附接操作描述和示出了本发明，但是本发明不限于此。本发明在包括裸晶附接机(有时称为裸晶结合机)或其他封装机(例如，倒装芯片机/操作、高级封装操作等)的半导体结合工业中具有广泛的适用性。
尽管已经相对于本发明的示例性实施例描述和说明了本发明，但是本领域技术人员应当理解，在不脱离本发明的精神和范围的前提下，可以在其上以及对其做出前述和各种其他改变、省略和添加。而是，在不脱离本发明的情况下，可以在本发明的等同形式的范围内对细节进行各种修改。

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1.一种裸晶附接系统，包括：
支撑结构，其用于支撑基底；
裸晶供应源，其包括用于附接到所述基底的多个裸晶；以及
结合头，其用于将裸晶从所述裸晶供应源结合到所述基底，所述结合头包括结合工具，所述结合工具具有用于在从所述裸晶供应源到所述基底的转移期间接触所述裸晶的接触部分，所述结合头包括弹簧部分，所述弹簧部分与所述结合工具接合使得所述弹簧部分被配置成在使用所述结合工具的所述接触部分将所述裸晶压靠所述基底期间压缩。
2.根据权利要求1所述的裸晶附接系统，其中，在使用所述结合工具的所述接触部分将所述裸晶压靠所述基底之前，所述弹簧部分在所述接触部分与所述裸晶之间的接触期间开始压缩。
3.根据权利要求1所述的裸晶附接系统，还包括传感器，所述传感器用于检测在将所述裸晶结合到所述基底期间所述弹簧部分的压缩量。
4.根据权利要求3所述的裸晶附接系统，其中，所述裸晶附接系统被配置为基于来自所述传感器的反馈对在将所述裸晶结合到所述基底期间所述结合工具的下降进行控制。
5.根据权利要求1所述的裸晶附接系统，其中，确定预定数据，所述预定数据与所述弹簧部分的为提供所述裸晶到所述基底的期望结合的压缩量有关。
6.根据权利要求5所述的裸晶附接系统，其中，所述压缩量与(i)所述结合头的一部分和(ii)所述结合工具的一部分中的至少一个的z轴线位置有关。
7.根据权利要求1所述的裸晶附接系统，其中，确定预定数据，所述预定数据与将被施加以提供所述裸晶到所述基底的期望结合的结合力的量有关。
8.根据权利要求7所述的裸晶附接系统，其中，所述结合力的量与(i)所述结合头的一部分和(ii)所述结合工具的一部分中的至少一个的z轴线位置有关。
9.根据权利要求1所述的裸晶附接系统，其中，所述结合工具包括至少一个引脚用于与从所述裸晶供应源到所述基底的转移有关地接触所述裸晶。
10.根据权利要求1所述的裸晶附接系统，其中，所述结合工具包括多个引脚，用于与从所述裸晶供应源到所述基底的转移有关地接触所述裸晶。
11.根据权利要求1所述的裸晶附接系统，其中，所述裸晶供应源包括LED晶片，并且所述多个裸晶是多个LED裸晶。
12.根据权利要求1所述的裸晶附接系统，其中，(i)所述裸晶和(ii)被配置为接收所述裸晶的所述基底的结合位置中的至少一个包括粘合剂，以用于在从所述裸晶供应源到所述基底的转移之后将所述裸晶固定至所述结合位置。
13.根据权利要求1所述的裸晶附接系统，其中，所述裸晶供应源被配置为在结合操作期间定位在所述基底与所述结合工具之间。
14.一种将裸晶附接到基底的方法，所述方法包括以下步骤：
提供裸晶供应源，所述裸晶供应源包括用于附接到所述基底的多个裸晶，所述裸晶供应源定位于结合工具和支撑所述基底的支撑结构之间；以及
向下移动由结合头承载的所述结合工具，使得所述结合工具的接触部分接触裸晶以将所述裸晶从所述裸晶供应源转移到所述基底，结合头包括与所述结合工具接合的弹簧部分使得所述弹簧部分被配置为在使用所述结合工具的所述接触部分将所述裸晶压靠所述基底期间压缩。
15.根据权利要求14所述的方法，其中，所述弹簧部分在所述接触部分与所述裸晶之间的接触期间与使用所述结合工具的所述接触部分将所述裸晶转移到所述基底有关地压缩。
16.根据权利要求14所述的方法，还包括以下步骤：使用传感器检测在将所述裸晶结合到所述基底期间所述弹簧部分的压缩量。
17.根据权利要求16所述的方法，还包括以下步骤：基于来自所述传感器的反馈，对在移动步骤期间所述结合工具的下降进行控制。
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