CN112652634A - Bionic electronic eye and preparation method thereof - Google Patents

Bionic electronic eye and preparation method thereof Download PDF

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Publication number
CN112652634A
CN112652634A CN202011518654.5A CN202011518654A CN112652634A CN 112652634 A CN112652634 A CN 112652634A CN 202011518654 A CN202011518654 A CN 202011518654A CN 112652634 A CN112652634 A CN 112652634A
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substrate
pixel structure
electronic eye
grids
preparation
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段永青
黄永安
张冠男
王琪璐
张瀚源
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Huazhong University of Science and Technology
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Huazhong University of Science and Technology
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/1446—Devices controlled by radiation in a repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14698—Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details

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  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The invention belongs to the technical field related to electronic eyes, and discloses a bionic electronic eye and a preparation method thereof, wherein the preparation method comprises the following steps: s1, preparing a pixel structure on a substrate, wherein the pixel structure comprises a plurality of arrayed grids, and the substrate is a plane or a curved surface; s2, printing functional materials in each grid one by adopting an electrohydrodynamic jet printing technology, and immediately performing laser irradiation at the center of each grid when the functional materials in the grids are printed, so as to solidify the functional materials, wherein the adjacent preset number of grids form a group, and the light absorption wavelengths of the functional materials printed in the grids of each group are different from each other; and S3, carrying out integral annealing and packaging on the structure obtained in the step S2 to obtain the bionic electronic eye. The method solves the technical problems of low imaging precision and poor imaging quality of the electronic eye prepared by the existing electronic eye preparation method by combining the laser local heating and the electrohydrodynamic jet printing technology.

Description

Bionic electronic eye and preparation method thereof
Technical Field
The invention belongs to the technical field related to electronic eyes, and particularly relates to a bionic electronic eye and a preparation method thereof.
Background
In the foreseeable future, the bionic robot is expected to play an important role in human life, and the realization of each function of the bionic robot depends strongly on the reaction to the surrounding environment, so that the shape and the color are perceived as the human visual system, and then the shape and the color are fed back to the nervous system to carry out the next action. Therefore, the electronic eye vision system imitating human beings has attracted much attention, and the most important component in the electronic eye bionic system is a photoelectric imaging sensor which is required to be capable of color recognition, excellent photoelectric performance, high imaging resolution, a curved surface and a wide field of view, and the like.
In order to realize color recognition of the photoelectric imaging sensor, the conventional photoelectric detection system needs to be integrated in other devices, and high-resolution material arrays with different spectral responses on the same substrate are very challenging in manufacturing, which seriously hinders the realization of future high-resolution, low-cost manufacturing and flexible full-color photoelectric imaging sensors. The full-color photoelectric imaging sensor has the characteristics of miniaturization and flexibility, the size can reach micron level or even submicron level, the requirement of wide visual field of a bionic electronic eye needs to be met, and high resolution of materials with different spectral responses needs to be printed on the same plane or curved substrate.
The electrohydrodynamic spray printing (EHD) technology is a micro-nano manufacturing process with great potential, has the characteristics of high printing precision, wide range of printable solution, high efficiency and low cost, and pulls out a Taylor cone at the tip of a nozzle through electric field force, thereby forming extremely small liquid drops, realizing the preparation of micron-level or even submicron-level structures, and being commonly used in the field of microelectronics. When preparing the pixel structure in the photoelectric field, need the fast curing shaping in order to guarantee stable structure and high quality pixel structure, and then guarantee the imaging accuracy, consequently, need heat the shaping liquid drop, current technique is all to heating whole base plate, the liquid drop is less makes the liquid drop circular-arc owing to the effect of surface tension, the edge is thinner, evaporation rate leads to the liquid in the middle of can taking the solute to flow to the edge soon than the centre and lead to the marginal solute to pile up, the centre is empty, and can strengthen coffee ring effect and lead to the film forming very poor, can show the imaging accuracy who reduces the pixel structure, and it is poor to the very low imaging quality of the sensitivity of photocurrent, if directly print with the electrohydrodynamic jet printing technique this moment, then can block up the tiny printer head that electrohydrodynamic jet printed and can not accomplish the preparation process. Therefore, it is highly desirable to design a new method for preparing a bionic electronic eye.
Disclosure of Invention
Aiming at the defects or improvement requirements of the prior art, the invention provides a bionic electronic eye and a preparation method thereof, and aims to solve the technical problems of low imaging precision and poor imaging quality of the electronic eye prepared by the existing electronic eye preparation method.
To achieve the above object, according to one aspect of the present invention, there is provided a method for preparing a bionic electronic eye, the method comprising: s1, preparing a pixel structure on a substrate, wherein the pixel structure comprises a plurality of arrayed grids, and the substrate is a plane or a curved surface; s2, printing functional materials in each grid one by adopting an electrohydrodynamic jet printing technology, and immediately performing laser irradiation at the center of each grid when the functional materials in the grids are printed, so as to solidify the functional materials, wherein the adjacent preset number of grids form a group, and the light absorption wavelengths of the functional materials printed in the grids of each group are different from each other; and S3, carrying out integral annealing and packaging on the structure obtained in the step S2 to obtain the bionic electronic eye.
Preferably, the pixel structure is one of a transistor structure, a diode structure or a photoconductive structure; when the pixel structure is a photoconductive structure, the pixel structure comprises an anode and a cathode; when the pixel structure is a transistor structure, the pixel structure comprises a source electrode, a drain electrode, a grid electrode and/or a carrier transmission layer; when the pixel structure is a diode structure, the pixel structure comprises an anode, a cathode and/or a carrier transport layer.
Preferably, the functional material comprises one or a mixture of more of perovskite, quantum dots, magnesium oxide, lead sulfide, indium antimonide, tellurium tin lead, indium gallium arsenic, tellurium cadmium mercury, lithium tantalate, lead germanate and high molecular polymer.
Preferably, the functional material is formed to have a thickness of 50nm to 3 mm.
Preferably, the printed functional material in the pixel structure is in a thin film structure or a linear structure after being cured and formed.
Preferably, the wavelength range of the laser beam is 190-1200 nm; the spot size of the laser beam is 1 nm-1 cm; the energy of the laser beam is 1 mJ-100 mJ.
Preferably, step S1 specifically includes: when the substrate is a plane, preparing a flexible substrate on the substrate, and preparing the pixel structure on the flexible substrate, wherein the pixel structure comprises a plurality of arrayed grids; step S3 further includes peeling the packaged bionic electronic eye from the substrate to be attached to other substrate planes.
Preferably, the material of the flexible substrate is one or a mixture of several of PI, polydimethylsiloxane, polyisoprene, methyl methacrylate, silicone adhesive, glass cement material, polymethyl methacrylate and SU-8 high molecular polymer.
Preferably, the substrate is made of one of glass, ITO glass, silicon wafer, metal, ceramic, plastic, photoelectric device or chip.
According to another aspect of the invention, the bionic electronic eye prepared by the preparation method of the bionic electronic eye is provided.
Generally, compared with the prior art, the bionic electronic edge and the preparation method thereof provided by the invention have the following beneficial effects:
1. the application is applied to the preparation that the bionical electronic eye is applied to the electrohydrodynamics of electron field and spouts the seal technique, because electrohydrodynamics spouts the seal technique can micron order even submicron level pixel's preparation, consequently can print out the bionical electronic eye equipment of high resolution, high performance to can go on curved surface or flexible substrate simultaneously, and then satisfy bionical electronic eye's wide view field and flexible preparation requirement.
2. Laser curing is adopted in the preparation process, and the center of a printing area in laser is heated, so that the problems of coffee ring effect and poor forming quality caused by integral heating when the pixels of the bionic electronic eye are printed are solved;
3. the crystallization and film forming processes of the crystal can be adjusted by adjusting the spot size, the laser energy, the irradiation time and the like of the laser, and the film forming quality can be controlled;
4. the printing process of the electrohydrodynamic jet printing and the curing process of the functional material are separated, so that the technical problem that the electrohydrodynamic jet printing head is blocked by solute after the solvent is volatilized in the heating process is solved;
5. because the curved surface shape of the substrate is not limited by adopting the electrohydrodynamic jet printing technology, the functional material of the bionic electronic edge can be arranged in the existing photoconductive structure, diode structure or transistor structure, and the application range and compatibility of the bionic electronic eye are greatly expanded;
6. the functional materials are widely selected, the same material can realize absorption adjustment of different optical wavelengths by adjusting the components or the thicknesses of the material, the material is easy to obtain and low in cost, and the preparation cost is obviously reduced;
7. the bionic electronic eye can be stripped from the substrate by arranging the flexible substrate, and the stripped structure can be matched with other curved surfaces or planes, so that batch preparation and transfer are facilitated.
Drawings
Fig. 1 schematically shows a process diagram of a method for producing a bionic electronic eye in the present embodiment;
fig. 2 schematically shows a flowchart of a method for producing a bionic electronic eye in the present embodiment;
fig. 3 schematically shows a diagram of an imaging device of a bionic electronic eye in the present embodiment;
fig. 4 is a schematic diagram showing an explosion structure of the bionic electronic eye in the embodiment 1;
fig. 5 is a schematic diagram showing the explosion structure of the bionic electronic eye after the electrode is expanded in example 1;
FIG. 6 is a graph schematically showing an absorption spectrum of the functional material in example 1;
FIG. 7 schematically shows an absorption spectrum of a thicker functional material in example 1;
fig. 8 schematically shows a PL intensity graph of the functional material in example 1.
The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein:
1-a substrate; 2-a flexible substrate; 3-pixel structure; 4-laser; 5-a laser beam; 6-electrohydrodynamic jet printing; 7-liquid droplet; 8-a functional material; 9-packaging material; 10-laser lift-off; 11-other component parts; 12-a prism; 13-mask plate; 14-bionic electronic eye; 15-a computer; 16-pattern; 17, 18, 19-sub-pixel, 20-pixel; 21-an expansion electrode; 22-an insulating structure; 23 a-an anode; 23 b-a cathode; 24-encapsulation layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to fig. 1 and 2, the present invention provides a method for manufacturing a bionic electronic eye, including the following steps S1-S3.
S1, preparing a pixel structure on the substrate, wherein the pixel structure comprises a plurality of arrayed grids, and the substrate is a plane or a curved surface.
The substrate 1 may be a planar or curved structure. Before use, the substrate needs to be cleaned and pretreated to obtain a clean substrate. The substrate 1 can be made of glass, ITO glass, silicon wafer, metal, ceramic, PI, plastic, photoelectric device, chip, etc. Further, in this embodiment, glass or conductive glass is preferable.
When the substrate 1 is a plane, if the pixel structure 3 needs to be peeled off from the substrate 1 after the preparation is completed, a layer of flexible substrate 2 needs to be prepared on the substrate before the pixel structure 3 is prepared on the substrate 1, and when the substrate 1 is a curved surface, peeling is not needed, so that the flexible substrate 2 does not need to be prepared. The flexible substrate 2 is preferably prepared on a substrate by spin coating, spraying, vapor deposition, evaporation, or the like.
The material of the flexible substrate 2 can be one or a mixture of several of PI, polydimethylsiloxane, polyisoprene, methyl methacrylate, silicone adhesive, glass cement material, polymethyl methacrylate and SU-8 high molecular polymer. The thickness of the flexible substrate 2 is preferably 1 to 50 μm.
The pixel structure 3 is a frame of a functional material 8 to be printed subsequently, and may be a frame composed of two electrodes, namely an anode and a cathode, in a photoconductive structure, a frame composed of a source, a drain, a gate and/or a carrier transport layer in a transistor structure, or a frame composed of an anode, a cathode and/or a carrier transport layer in a diode structure.
S2, printing functional materials in each grid one by adopting an electrohydrodynamic jet printing technology, and immediately performing laser irradiation at the center of each grid when the functional materials in the grids are printed, so as to solidify the functional materials, wherein the adjacent preset number of grids form a group, and the light absorption wavelengths of the functional materials printed in the grids of each group are different from each other;
the pixel structure 3 includes a plurality of arrayed grids, the functional materials 8 in adjacent predetermined number of grids are different and are used for absorbing different light wavelengths, the predetermined number in this embodiment is preferably 3, the functional materials in adjacent 3 grids are different and are respectively used for absorbing red light waves, green light waves and blue light waves, the number is not limited to 3 in practical application, the larger the number is, the higher the resolution is, and the scope of protection of the present application is not limited herein.
The functional material 8 is preferably one or a mixture of more of perovskite, quantum dots, magnesium oxide, lead sulfide, indium antimonide, tellurium tin lead, indium gallium arsenic, tellurium cadmium mercury, lithium tantalate, lead germanate and some high molecular polymers. The thickness of the film layer of the functional material 8 can also be adjusted to realize absorption of different wavelengths, and in this embodiment, the thickness of the film layer of the functional material 8 is preferably 50nm to 3 mm.
The laser 4 solidification and the electrohydrodynamic jet printing 6 work closely and synchronously, and the laser 4 solidification is carried out at the center of the printed structure immediately after the printing is finished, so that the forming quality and the working efficiency are improved. The structure of the functional material cured by the laser 4 can be a thin film structure or a linear structure such as a nanometer or micrometer structure. The printed liquid drop 7 can be adjusted by adjusting spray printing parameters such as voltage, frequency and duty ratio, hydrophilic and hydrophobic properties and roughness of the substrate, viscosity and conductivity of the functional material solution, added polymer, material and size of the nozzle, and the like, and a three-dimensional structure array such as a dot matrix, a film shape and a linear shape can be printed. In the printing process, in order to prevent the nozzle from being blocked when the whole substrate is heated, when the needle head is moved to the next positioning point to be printed, the movable point laser is adopted to irradiate the center of the previous printed liquid drop for local heating. The crystallization, film forming and other processes can be controlled by adjusting parameters such as laser wavelength, spot size, laser energy and the like, and meanwhile, the evaporation rates in the middle and at the edge of liquid drops are balanced, so that the coffee ring effect which often appears in the film forming process is weakened, and the film forming quality is improved.
The wavelength range of the laser beam 5 is 190-1200 nm; the spot size of the laser beam 5 is 1 nm-1 cm; the energy of the laser beam 5 is 1mJ to 100 mJ.
And S3, carrying out integral annealing and packaging on the structure obtained in the step S2 to obtain the bionic electronic eye.
And (4) annealing, packaging and other operations are carried out on the structure obtained in the step S2, annealing is carried out on the structure after solidification and crystallization, crystal grains grow further, and better device performance is obtained, the annealing temperature is preferably 80-200 ℃, and then a layer of organic-inorganic flexible packaging material 9 capable of isolating water oxygen, heavy metal ions and toxicity is spin-coated on the device.
If the flexible substrate is arranged, the flexible substrate needs to be peeled off from the substrate, the peeling mode can be laser peeling 10 or manual peeling, preferably laser peeling 10, the laser energy is preferably 10 mJ-50 mJ, and the repeated irradiation frequency is preferably 10-500 times. And attaching the stripped flexible complete device to other components 11 of the electronic eye or integrating with an integrated circuit signal processing part.
As shown in fig. 3, light passes through the prism 12 and the mask 13 and then irradiates the bionic electronic eye 14 manufactured in the present application, pixels on the bionic electronic eye 14 absorb light with different wavelengths in the light and convert the light into current, the bionic electronic eye 14 is connected to the computer 15, and the computer 15 generates the patterns 16 with different color intensities according to the functional material of the corresponding pixels and the current magnitude.
Example 1
As shown in fig. 4 and fig. 5, the bionic electronic eye is prepared on a planar glass substrate in this embodiment. The method comprises the following specific steps:
(1) selecting a 3cm multiplied by 3cm glass substrate, respectively ultrasonically cleaning the glass substrate with deionized water, acetone, isopropanol, ethanol and deionized water for 8min, and then drying the glass substrate with nitrogen. A PI solution with viscosity of 14000cP was spin-coated on a glass substrate at a speed of 1800rmp for 100 seconds to obtain a flexible substrate.
(2) And preparing a pixel structure of the bionic electronic eye on the flexible substrate. In the embodiment of the present application, a pixel structure is disposed on a photoconductive structure, so the pixel structure of the present application is a frame structure composed of an anode 23a and a cathode 23b in the photoconductive structure, as shown in fig. 4, in some cases, in order to facilitate power supply, an extended electrode 21 (as shown in fig. 5) is further obtained by expanding one of the electrodes, so as to facilitate power supply, and then the expanded motor structure is larger while an insulating structure 22 needs to be disposed in order to avoid direct contact with the other electrode, which is preferred in the present application.
Firstly, 5214 photoresist is spin-coated on a flexible substrate in multiple steps, for 30 seconds at a speed of 200rmp, for 2 seconds at a speed of 500rmp, for 30 seconds at a speed of 3000rmp, for 5 seconds at a speed of 4000rmp, and then baked at 95 ℃ for 1 minute. Followed by exposure to UV light for 6 seconds and development for 12 seconds. 10nm chromium and 80nm gold are evaporated, and the non-electrode portion is removed by a lift-off process to obtain an anode 23a and a cathode 23 b. Next, SU 82000.5 photoresist was spin-coated on the above substrate at 500rpm for 8 seconds, at 3000rpm for 30 seconds, then baked at 95 ℃ for 1 minute, exposed to light for 8 seconds, developed for 5 seconds, and baked at 95 ℃ for 5 minutes as an insulating layer. And finally evaporating the expansion structure of one of the electrodes in a mask evaporation mode.
(3) Controllable printing of functional materials in pixel structures by laser assisted electrohydrodynamic jet printing. The functional material is selected to apply 1850V voltage, 20Hz frequency, 60% duty cycle, and substrate speed of 1.6 mm/s. The functional material in the adjacent three pixel structures (i.e., sub-pixels 17, 18, and 19) is MAPbI respectively2.4Br0.6，MAPbI0.87Br2.13，MAPbBr2Cl, absorption spectra of the three functional materials are shown in fig. 6, and Photoluminescence (PL) intensities of the functional materials are shown in fig. 8. The three sub-pixels form a pixel 20, the thickness of the printed film is 50 nm-300 μm, further, the thickness of the thinner film is preferably 4.4 μm, and the thickness of the thicker film is preferably 100 μm, wherein the absorption spectrum of the thicker film is shown in fig. 7. The laser energy is preferably 25mJ, and the irradiation is repeated 20 times with a spot size of 1 μm.
(4) The device is annealed and packaged at 100 ℃ for 10 minutes, and then a layer of PDMS is spin-coated on the device as a packaging layer 24.
(5) And peeling the flexible complete device from the substrate. In the embodiment, a laser stripping method is adopted for implementation, the energy of laser is 23mJ, the irradiation is repeated for 20 times, and a flexible completed device is obtained after the device stripping is completed. The flexible intact device is attached to the other combined parts of the electronic eye. The integrated circuit signal processing part can be integrated by adopting epoxy resin glue or PDMS or metal wires, and the device can be cut for smooth jointing.
Example 2
In the embodiment, the bionic electronic eye is prepared on the curved plate without subsequent stripping. The method comprises the following specific steps.
(1) Selecting a curved surface substrate with the radius of 2cm, respectively ultrasonically cleaning the substrate for 8min by using deionized water, acetone, isopropanol, ethanol and deionized water, and drying the substrate by using nitrogen. Subsequent devices are fabricated directly on the substrate.
(2) And preparing a pixel structure of the bionic electronic eye on the curved substrate. And depositing the photoresist with the thickness of 1-5 mu m on the curved substrate by using electric spraying. And then exposed through a UV photoetching machine and developed. And (3) evaporating 10nm chromium and 80nm gold, and removing the non-electrode part through a stripping process. Then, photoresist with the thickness of about 100 nm-5 μm is sprayed on the substrate by an electrospray method, and the photoresist is used as an insulating layer after development. And finally evaporating an extended structure of an electrode in a mask evaporation mode.
(3) Controllable printing of functional materials in pixel structures by laser assisted electrohydrodynamic jet printing. And adjusting the applied voltage, frequency, duty ratio, substrate speed and the like in real time according to the height of the jet printing substrate. The photoconductive structure is selected as the pixel structure, one pixel comprises three sub-pixels, and MAPbI is selected respectively2.4Br0.6，MAPbI0.87Br2.13，MAPbBr2Cl, the thickness is 50nm to 300 μm, the thickness of the thin film layer is preferably 4.4 μm, and the thickness of the thick film layer is preferably 100 μm. The laser energy was 25mJ, and the irradiation was repeated 20 times with a spot size of 1 μm.
(4) And carrying out operations such as annealing, packaging and the like on the device. Annealing at 100 deg.c for 10 min, and spraying one layer of organic-inorganic flexible packing material to isolate water, oxygen, heavy metal ion and toxicity.
The application also provides a bionic electronic eye prepared by the preparation method of the bionic electronic edge.
In summary, the invention provides a bionic electronic eye and a preparation method thereof, and the bionic electronic eye and the preparation method thereof are used for solving the technical problems of low imaging precision and poor imaging quality of the electronic eye prepared by the existing electronic eye preparation method by combining the laser curing technology and the electrohydrodynamic jet printing technology, so that the preparation of the full-color, flexible and high-resolution bionic electronic eye is realized.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (10)

1. A preparation method of a bionic electronic eye is characterized by comprising the following steps:
s1, preparing a pixel structure on a substrate, wherein the pixel structure comprises a plurality of arrayed grids, and the substrate is a plane or a curved surface;
s2, printing functional materials in each grid one by adopting an electrohydrodynamic jet printing technology, and immediately performing laser irradiation at the center of each grid when the functional materials in the grids are printed, so as to solidify the functional materials, wherein the adjacent preset number of grids form a group, and the light absorption wavelengths of the functional materials printed in the grids of each group are different from each other;
and S3, carrying out integral annealing and packaging on the structure obtained in the step S2 to obtain the bionic electronic eye.
2. The method of claim 1, wherein the pixel structure is one of a transistor structure, a diode structure, or a photoconductive structure; when the pixel structure is a photoconductive structure, the pixel structure comprises an anode and a cathode; when the pixel structure is a transistor structure, the pixel structure comprises a source electrode, a drain electrode, a grid electrode and/or a carrier transmission layer; when the pixel structure is a diode structure, the pixel structure comprises an anode, a cathode and/or a carrier transport layer.
3. The preparation method according to claim 1, wherein the functional material comprises one or more of perovskite, quantum dot, magnesium oxide, lead sulfide, indium antimonide, lead tin telluride, indium gallium arsenide, mercury cadmium telluride, lithium tantalate, lead germanate and high molecular polymer.
4. The production method according to claim 1 or 3, wherein the functional material is formed to have a thickness of 50nm to 3 mm.
5. A preparation method according to claim 1, wherein the cured and formed shape of the functional material printed in the pixel structure is a film structure or a linear structure.
6. The method according to claim 1, wherein the laser beam has a wavelength ranging from 190 to 1200 nm; the spot size of the laser beam is 1 nm-1 cm; the energy of the laser beam is 1 mJ-100 mJ.
7. The method according to claim 1, wherein step S1 specifically includes: when the substrate is a plane, preparing a flexible substrate on the substrate, and preparing the pixel structure on the flexible substrate, wherein the pixel structure comprises a plurality of arrayed grids; step S3 further includes peeling the packaged bionic electronic eye from the substrate to be attached to other substrate planes.
8. The preparation method according to claim 7, wherein the material of the flexible substrate is one or a mixture of several of PI, polydimethylsiloxane, polyisoprene, methyl methacrylate, silicone adhesive, glass cement material, polymethyl methacrylate and SU-8 high molecular polymer.
9. The method according to claim 1, wherein the substrate is made of one of glass, ITO glass, silicon wafer, metal, ceramic, plastic, photoelectric device, and chip.
10. A bionic electronic eye prepared by the method for preparing the bionic electronic eye according to any one of claims 1 to 9.
CN202011518654.5A 2020-12-21 2020-12-21 Bionic electronic eye and preparation method thereof Pending CN112652634A (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106891614A (en) * 2017-02-28 2017-06-27 华中科技大学 A kind of curved surface prints the real-time sintering curing apparatus and method of laser
CN109461779A (en) * 2018-11-05 2019-03-12 吉林建筑大学 A kind of metal grid electrode preparation method based on inkjet printing technology
CN109616586A (en) * 2018-11-12 2019-04-12 华南理工大学 A kind of preparation method of high-resolution OLED display screen
CN110085623A (en) * 2018-05-09 2019-08-02 广东聚华印刷显示技术有限公司 Dot structure and preparation method thereof and display device
CN209734312U (en) * 2019-02-22 2019-12-06 固安翌光科技有限公司 Flexible eye patch
CN111579068A (en) * 2020-05-15 2020-08-25 合肥芯福传感器技术有限公司 Photoelectric imaging sensor
CN111916524A (en) * 2020-07-22 2020-11-10 华中科技大学 Molybdenum sulfide photodetector imitating retina imaging and preparation method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106891614A (en) * 2017-02-28 2017-06-27 华中科技大学 A kind of curved surface prints the real-time sintering curing apparatus and method of laser
CN110085623A (en) * 2018-05-09 2019-08-02 广东聚华印刷显示技术有限公司 Dot structure and preparation method thereof and display device
CN109461779A (en) * 2018-11-05 2019-03-12 吉林建筑大学 A kind of metal grid electrode preparation method based on inkjet printing technology
CN109616586A (en) * 2018-11-12 2019-04-12 华南理工大学 A kind of preparation method of high-resolution OLED display screen
CN209734312U (en) * 2019-02-22 2019-12-06 固安翌光科技有限公司 Flexible eye patch
CN111579068A (en) * 2020-05-15 2020-08-25 合肥芯福传感器技术有限公司 Photoelectric imaging sensor
CN111916524A (en) * 2020-07-22 2020-11-10 华中科技大学 Molybdenum sulfide photodetector imitating retina imaging and preparation method thereof

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