CN112601366A - Multilayer circuit board laser drilling machine and drilling method thereof - Google Patents
Multilayer circuit board laser drilling machine and drilling method thereof Download PDFInfo
- Publication number
- CN112601366A CN112601366A CN202011549912.6A CN202011549912A CN112601366A CN 112601366 A CN112601366 A CN 112601366A CN 202011549912 A CN202011549912 A CN 202011549912A CN 112601366 A CN112601366 A CN 112601366A
- Authority
- CN
- China
- Prior art keywords
- plate
- cylinder
- circuit board
- outer frame
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims description 14
- 230000007306 turnover Effects 0.000 claims abstract description 24
- 238000009434 installation Methods 0.000 claims abstract description 7
- 238000003698 laser cutting Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000009826 distribution Methods 0.000 description 9
- 238000004080 punching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000010009 beating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1563—Reversing the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser drilling machine for multilayer circuit boards, which comprises a frame, wherein support rods distributed in an array manner are arranged in the frame, an upper cover is arranged at the top end of the frame, a closed door is arranged at the front end of the frame, first air cylinders distributed in a mirror image manner are arranged below the closed door, a laser drilling device is arranged in the upper cover, an adjusting plate is arranged below the laser drilling device, a first fixing plate is arranged below the adjusting plate, an installation assembly is arranged on the support rods and comprises a second fixing plate, a lifting plate is arranged above the second fixing plate, and a turnover plate is arranged on the lifting plate. The laser perforating machine is stable and reliable in structure and practical in function, can automatically perform laser perforation on a multilayer circuit board, reduces labor cost, improves working efficiency, and is provided with the mounting assembly, and the mounting assembly can automatically drive the multilayer circuit board to turn over, so that the laser perforating device can effectively perform through perforation on the multilayer circuit board.
Description
Technical Field
The invention relates to the field of circuit board production, in particular to a multilayer circuit board laser drilling machine and a drilling method thereof.
Background
The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, the English name is PCB, FPC circuit board (FPC circuit board is also called as flexible circuit board which is made of polyimide or polyester film as a base material, has the characteristics of high reliability and excellent flexibility, and has high wiring density, light weight, thin thickness and good bending property), and the birth and development of a rigid-flexible printed circuit board (FPC) and PCB, and promotes the birth of a new product of the rigid-flexible printed circuit board. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like. The circuit board need punch when production, and current circuit board punches and is laser beam drilling, nevertheless because the unable phenomenon that runs through appears in laser beam drilling machine power restriction easily when carrying out laser beam drilling to multilayer circuit board, leads to the yield low, still needs the manual work to carry out the secondary upset and punches once more, and work efficiency is low. In view of the situation, a laser drilling machine for multilayer circuit boards and a drilling method thereof are provided.
Disclosure of Invention
The invention aims to provide a laser drilling machine for a multilayer circuit board and a drilling method thereof, which can effectively solve the problems that the circuit board needs to be drilled during production, the existing circuit board drilling is laser drilling, but the multilayer circuit board is easy to have the phenomenon of incapability of penetrating due to the power limitation of the laser drilling machine during the laser drilling, the yield is low, secondary overturning is needed manually for secondary drilling, and the working efficiency is low. The laser perforating machine is stable and reliable in structure and practical in function, can automatically perform laser perforation on a multilayer circuit board, reduces labor cost, improves working efficiency, and is provided with the mounting assembly, and the mounting assembly can automatically drive the multilayer circuit board to turn over, so that the laser perforating device can effectively perform through perforation on the multilayer circuit board.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides a multilayer circuit board laser-beam drilling machine, laser-beam drilling machine includes the frame, is equipped with array distribution's bracing piece in the frame, and the frame top is equipped with the upper shield, and the frame front end is equipped with the closed door, is equipped with the first cylinder that the mirror image distributes below the closed door, is equipped with laser perforating device in the upper shield, and laser perforating device has the adjusting plate, and the adjusting plate below is equipped with first fixed plate, is equipped with the installation component on the bracing piece, and the installation component includes the second fixed plate, and second fixed plate top is equipped with the lifter plate, is.
Furthermore, a second fixed plate is fixedly connected with the support rod, so that the mounting assembly is fixed on the support rod, a second cylinder and sliding rails distributed in an array are arranged on the second fixed plate, sliding blocks are arranged on the sliding rails, a second cylinder sliding block is arranged on the second cylinder, a moving plate is arranged on the sliding blocks and the second cylinder sliding block together, a third cylinder is arranged on the moving plate, a lifting plate is arranged on the third cylinder, the third cylinder drives the lifting plate to lift up and down, a first bracket and a second bracket are arranged on the lifting plate, a first rotating plate is arranged on one side of the first bracket, the first rotating plate is in rotating fit with the first bracket, a second rotating plate is arranged on one side of the second bracket, the second rotating plate is in rotating fit with the second bracket, a turnover plate is arranged between the first rotating plate and the second rotating plate, pneumatic suckers distributed in an array are arranged on the turnover plate, a motor is arranged on one side of the first bracket, the motor drives the first rotating plate to rotate, and the first rotating plate drives the overturning plate to rotate.
Further, the frame front end is equipped with down the side shield that shrouding and mirror image distribute, and the frame both sides all are equipped with the side seal board, and the frame rear end is equipped with the back shrouding, is equipped with the air exhauster on the back shrouding, and frame, side seal board and back shrouding pass through connection panel beating fixed connection.
Further, the upper end of the closed door is provided with an anti-falling buckle plate, a sliding block with array distribution is arranged in the closed door, a guide rod is arranged in the sliding block, first fixing blocks are arranged at two ends of the guide rod, the guide rod is fixedly connected with the outer frame through the first fixing blocks, a second fixing block with array distribution is further arranged in the closed door, a third fixing block with array distribution is arranged on the first cylinder, the first cylinder is fixedly connected with the outer frame through the third fixing blocks, the top end of the first cylinder is provided with a first telescopic rod, the upper end of the first telescopic rod is fixedly connected with the second fixing block, and the first cylinder pushes the closed door to ascend and descend in the side baffle.
Further, laser beam drilling device one end is equipped with the laser cutting head, be equipped with the fourth fixed block on the adjusting plate, the fourth fixed block is with laser beam drilling device and adjusting plate fixed connection, still be equipped with the lead screw slider on the adjusting plate, lead screw slider and adjusting plate fixed connection, be equipped with the lead screw in the lead screw slider, lead screw and lead screw slider screw-thread fit, the lead screw top is equipped with the rolling disc, lead screw lower extreme and first fixed plate normal running fit, first fixed plate and upper shield fixed connection, the height of the adjustable adjusting plate of rotatory rolling disc, the adjusting plate drives laser beam drilling device height-adjusting.
Further, the punching method comprises the following steps:
the method comprises the following steps: the first cylinder pushes the closing door to ascend, the closing door opens the front end of the outer frame, the rotating disc is rotated to adjust the height of the adjusting plate, and the adjusting plate drives the laser drilling device to adjust the height;
step two: the second cylinder drives the moving plate to move, the moving plate drives the turnover plate to move out of the outer frame, the circuit board production equipment places the produced circuit board on the turnover plate, and the pneumatic sucker sucks the circuit board;
step three: the second cylinder drives the moving plate to move, and the moving plate drives the turnover plate to move to a specified position below the laser cutting head;
step four: the first cylinder drives the closing door to descend, the closing door closes the front end of the outer frame, and the exhaust fan starts to exhaust dust;
step five: the third cylinder drives the circuit board to ascend, the laser cutting head punches the circuit board, and after punching, the motor drives the turnover plate to turn over by 180 degrees, and the laser cutting head punches again;
step six: the third cylinder drives the circuit board to descend, the first cylinder pushes the sealing door to ascend, the sealing door opens the front end of the outer frame, the second cylinder drives the moving plate to move, the moving plate drives the circuit board to move out of the outer frame, and the circuit board is taken away.
The invention has the beneficial effects that:
1. the laser drilling machine is stable and reliable in structure and practical in function, can perform automatic laser drilling on a multilayer circuit board, reduces the labor cost and improves the working efficiency;
2. the laser drilling machine is provided with the mounting assembly, and the mounting assembly can automatically drive the multilayer circuit board to turn over, so that the laser drilling device can effectively punch through the multilayer circuit board.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of the laser-beam drilling machine of the present invention;
FIG. 2 is a schematic view of the outer frame structure of the present invention;
FIG. 3 is a schematic view of the closure door of the present invention;
FIG. 4 is a schematic structural view of a laser drilling apparatus according to the present invention;
fig. 5 is a schematic view of the mounting assembly of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "opening," "upper," "lower," "thickness," "top," "middle," "length," "inner," "peripheral," and the like are used in an orientation or positional relationship that is merely for convenience in describing and simplifying the description, and do not indicate or imply that the referenced component or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present invention.
The utility model provides a multilayer circuit board laser-beam drilling machine, laser-beam drilling machine includes frame 1, as shown in fig. 1-5, be equipped with array distribution's bracing piece 11 in the frame 1, frame 1 top is equipped with upper shield 16, frame 1 front end is equipped with closed door 2, closed door 2 below is equipped with the first cylinder 24 of mirror image distribution, be equipped with laser perforating device 3 in the upper shield 16, laser perforating device 3 has adjusting plate 32, adjusting plate 32 below is equipped with first fixed plate 33, be equipped with installation component 4 on the bracing piece 11, installation component 4 includes second fixed plate 41, second fixed plate 41 top is equipped with lifter plate 45, be equipped with returning face plate 48 on the lifter plate 45.
The side shield 13 that shrouding 12 and mirror image distribute under the frame 1 front end was equipped with, and 1 both sides of frame all are equipped with side shrouding 14, and 1 rear end of frame is equipped with back shrouding 17, is equipped with air exhauster 171 on the back shrouding 17, and frame 1, side shrouding 14 and back shrouding 17 are through connecting 15 fixed connection of panel beating.
The upper end of the closed door 2 is provided with the anti-falling buckle plate 21, the closed door 2 is internally provided with a sliding block 22 with array distribution, the sliding block 22 is internally provided with a guide rod 221, two ends of the guide rod 221 are respectively provided with a first fixed block 222, the guide rod 221 is fixedly connected with the outer frame 1 through the first fixed block 222, the closed door 2 is internally provided with a second fixed block 23 with array distribution, the first cylinder 24 is provided with a third fixed block 241 with array distribution, the first cylinder 24 is fixedly connected with the outer frame 1 through the third fixed block 241, the top end of the first cylinder 24 is provided with a first telescopic rod 242, the upper end of the first telescopic rod 242 is fixedly connected with the second fixed block 23, the first cylinder 24 pushes the closed door 2 to ascend and descend in the side baffle plate 13, the anti-falling buckle plate 21 and the upper cover 16 can interfere with the upper portion for limiting, and the closed door 2 can.
The laser drilling device 3 one end is equipped with laser cutting head 31, be equipped with fourth fixed block 321 on the adjusting plate 32, fourth fixed block 321 is with laser drilling device 3 and adjusting plate 32 fixed connection, still be equipped with lead screw slider 322 on the adjusting plate 32, lead screw slider 322 and adjusting plate 32 fixed connection, be equipped with lead screw 34 in the lead screw slider 322, lead screw 34 and lead screw slider 322 screw-thread fit, lead screw 34 top is equipped with rolling disc 341, lead screw 34 lower extreme and first fixed plate 33 normal running fit, first fixed plate 33 and upper shield 16 fixed connection, the height of the adjustable adjusting plate 32 of rotatory rolling disc 341, adjusting plate 32 drives the 3 height-adjusters of laser drilling device.
The second fixing plate 41 is fixedly connected with the supporting rod 11, so that the mounting assembly 4 is fixed on the supporting rod 11, the second fixing plate 41 is provided with a second cylinder 43 and sliding rails 42 distributed in an array manner, the sliding rails 42 are provided with sliding blocks 421, the second cylinder 43 is provided with a second cylinder sliding block 431, the sliding blocks 421 and the second cylinder sliding block 431 are provided with a moving plate 44 together, the moving plate 44 is provided with a third cylinder 441, the third cylinder 441 is provided with a lifting plate 45, the third cylinder 441 drives the lifting plate 45 to lift up and down, the lifting plate 45 is provided with a first bracket 46 and a second bracket 47, one side of the first bracket 46 is provided with a first rotating plate 461, the first rotating plate 461 is in rotating fit with the first bracket 46, one side of the second bracket 47 is provided with a second rotating plate 471, the second rotating plate 471 is in rotating fit with the second bracket 47, a turnover plate 48 is arranged between the first rotating plate 461 and the second rotating plate 471, the turnover plate 48 is provided, the motor 49 is disposed on one side of the first support 46, the motor 49 is connected to the first rotating plate 461 through the coupling 491, the motor 49 drives the first rotating plate 461 to rotate, and the first rotating plate 461 drives the rotating plate 48 to rotate.
A multilayer circuit board punching method comprises the following steps:
the method comprises the following steps: the first air cylinder 24 pushes the closing door 2 to ascend, the closing door 2 opens the front end of the outer frame 1, the rotating disc 341 is rotated to adjust the height of the adjusting plate 32, and the adjusting plate 32 drives the laser drilling device 3 to adjust the height;
step two: the second cylinder 43 drives the moving plate 44 to move, the moving plate 44 drives the turnover plate 48 to move out of the outer frame 1, the circuit board production equipment places the produced circuit board on the turnover plate 48, and the pneumatic sucker 481 sucks the circuit board;
step three: the second cylinder 43 drives the moving plate 44 to move, and the moving plate 44 drives the turnover plate 48 to move to a specified position below the laser cutting head 31;
step four: the first cylinder 24 drives the closing door 2 to descend, the closing door 2 closes the front end of the outer frame 1, and the exhaust fan 171 starts to exhaust dust;
step five: the third cylinder 441 drives the circuit board to ascend, the laser cutting head 31 punches the circuit board, and after punching, the motor 49 drives the turnover plate 48 to turn over by 180 degrees, and the laser cutting head 31 punches again;
step six: the third cylinder 441 drives the circuit board to descend, the first cylinder 24 pushes the closing door 2 to ascend, the closing door 2 opens the front end of the outer frame 1, the second cylinder 43 drives the moving plate 44 to move, the moving plate 44 drives the circuit board to move out of the outer frame 1, and the circuit board is taken away.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (5)
1. A laser drilling machine for multilayer circuit boards comprises an outer frame (1) and is characterized in that supporting rods (11) distributed in an array mode are arranged in the outer frame (1), an upper cover (16) is arranged at the top end of the outer frame (1), a sealing door (2) is arranged at the front end of the outer frame (1), first air cylinders (24) distributed in a mirror image mode are arranged below the sealing door (2), a laser drilling device (3) is arranged in the upper cover (16), an adjusting plate (32) is arranged below the laser drilling device (3), a first fixing plate (33) is arranged below the adjusting plate (32), an installation assembly (4) is arranged on the supporting rods (11), the installation assembly (4) comprises a second fixing plate (41), a lifting plate (45) is arranged above the second fixing plate (41), and a turnover plate (48) is arranged on the;
the second fixing plate (41) is fixedly connected with the supporting rod (11), so that the mounting assembly (4) is fixed on the supporting rod (11), the second fixing plate (41) is provided with a second cylinder (43) and sliding rails (42) distributed in an array manner, the sliding rails (42) are respectively provided with a sliding block (421), the second cylinder (43) is provided with a second cylinder sliding block (431), the sliding blocks (421) and the second cylinder sliding blocks (431) are jointly provided with a moving plate (44), the moving plate (44) is provided with a third cylinder (441), the third cylinder (441) is provided with a lifting plate (45), the third cylinder (441) drives the lifting plate (45) to lift up and down, the lifting plate (45) is provided with a first bracket (46) and a second bracket (47), one side of the first bracket (46) is provided with a first rotating plate (461), the first rotating plate (461) is in rotating fit with the first bracket (46), one side of the second bracket (47) is provided with a second rotating plate (471), second commentaries on classics board (471) and second support (47) normal running fit, be equipped with returning face plate (48) between first commentaries on classics board (461) and the second commentaries on classics board (471), be equipped with pneumatic sucking disc (481) that the array distributes on returning face plate (48), first support (46) one side is equipped with motor (49), motor (49) are connected with first commentaries on classics board (461) through shaft coupling (491), motor (49) drive first commentaries on classics board (461) and rotate, first commentaries on classics board (461) drive returning face plate (48) and rotate.
2. The laser drilling machine for the multilayer circuit boards as claimed in claim 1, wherein the front end of the outer frame (1) is provided with a lower sealing plate (12) and side baffles (13) distributed in a mirror image manner, the two sides of the outer frame (1) are provided with side sealing plates (14), the rear end of the outer frame (1) is provided with a rear sealing plate (17), the rear sealing plate (17) is provided with an exhaust fan (171), and the outer frame (1), the side sealing plates (14) and the rear sealing plate (17) are fixedly connected through a connecting metal plate (15).
3. The laser drilling machine for the multilayer circuit board according to claim 1, characterized in that the upper end of the closing door (2) is provided with an anti-dropping buckle plate (21), the closing door (2) is internally provided with sliding blocks (22) distributed in an array manner, the sliding blocks (22) are internally provided with guide rods (221), both ends of the guide rods (221) are provided with first fixed blocks (222), the guide rods (221) are fixedly connected with the outer frame (1) through the first fixed blocks (222), the closing door (2) is also internally provided with second fixed blocks (23) distributed in an array manner, the first cylinder (24) is provided with third fixed blocks (241) distributed in an array manner, the first cylinder (24) is fixedly connected with the outer frame (1) through the third fixed blocks (241), the top end of the first cylinder (24) is provided with a first telescopic rod (242), the upper end of the first telescopic rod (242) is fixedly connected with the second fixed blocks, the first cylinder (24) pushes the closing door (2) to lift up and down in the side baffle (13).
4. The laser-beam drilling machine for multilayer wiring boards of claim 1, laser perforating device (3) one end is equipped with laser cutting head (31), be equipped with fourth fixed block (321) on adjusting plate (32), fourth fixed block (321) are with laser perforating device (3) and adjusting plate (32) fixed connection, still be equipped with lead screw slider (322) on adjusting plate (32), lead screw slider (322) and adjusting plate (32) fixed connection, be equipped with lead screw (34) in lead screw slider (322), lead screw (34) and lead screw slider (322) screw-thread fit, lead screw (34) top is equipped with rolling disc (341), lead screw (34) lower extreme and first fixed plate (33) normal running fit, first fixed plate (33) and upper shield (16) fixed connection, the height of adjustable adjusting plate (32) of rotatory rolling disc (341), adjusting plate (32) drive laser perforating device (3) height-adjusting.
5. The method for perforating a multilayer wiring board by using a laser-beam drilling machine as claimed in any one of claims 1 to 4, wherein the perforating method comprises the steps of:
the method comprises the following steps: the first cylinder (24) pushes the closing door (2) to ascend, the closing door (2) opens the front end of the outer frame (1), the rotating disc (341) is rotated to adjust the height of the adjusting plate (32), and the adjusting plate (32) drives the laser drilling device (3) to adjust the height;
step two: the second cylinder (43) drives the moving plate (44) to move, the moving plate (44) drives the turnover plate (48) to move out of the outer frame (1), the circuit board production equipment places the produced circuit board on the turnover plate (48), and the pneumatic sucker (481) sucks the circuit board;
step three: the second cylinder (43) drives the moving plate (44) to move, and the moving plate (44) drives the turnover plate (48) to move to a specified position below the laser cutting head (31);
step four: the first cylinder (24) drives the closing door (2) to descend, the closing door (2) closes the front end of the outer frame (1), and the exhaust fan (171) is started to exhaust dust;
step five: the third cylinder (441) drives the circuit board to ascend, the laser cutting head (31) punches holes on the circuit board, after the holes are punched, the motor (49) drives the turnover plate (48) to turn over for 180 degrees, and the laser cutting head (31) punches the holes again;
step six: the third cylinder (441) drives the circuit board to descend, the first cylinder (24) pushes the sealing door (2) to ascend, the sealing door (2) opens the front end of the outer frame (1), the second cylinder (43) drives the moving plate (44) to move, the moving plate (44) drives the circuit board to move out of the outer frame (1), and the circuit board is taken away.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011549912.6A CN112601366A (en) | 2020-12-24 | 2020-12-24 | Multilayer circuit board laser drilling machine and drilling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011549912.6A CN112601366A (en) | 2020-12-24 | 2020-12-24 | Multilayer circuit board laser drilling machine and drilling method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112601366A true CN112601366A (en) | 2021-04-02 |
Family
ID=75200890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011549912.6A Pending CN112601366A (en) | 2020-12-24 | 2020-12-24 | Multilayer circuit board laser drilling machine and drilling method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112601366A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942452A (en) * | 2015-05-22 | 2015-09-30 | 广东正业科技股份有限公司 | Laser-beam drilling machine and punching method utilizing same |
| CN208304173U (en) * | 2018-05-23 | 2019-01-01 | 张亚平 | Linear module type high-precision laser puncher |
| CN208929476U (en) * | 2018-10-29 | 2019-06-04 | 温州长迅科技有限公司 | A kind of wiring board laser drilling device |
| CN110282431A (en) * | 2019-08-01 | 2019-09-27 | 苏州锦帛方精密设备有限公司 | A kind of FPC bad product plate punching paint point device |
-
2020
- 2020-12-24 CN CN202011549912.6A patent/CN112601366A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942452A (en) * | 2015-05-22 | 2015-09-30 | 广东正业科技股份有限公司 | Laser-beam drilling machine and punching method utilizing same |
| CN208304173U (en) * | 2018-05-23 | 2019-01-01 | 张亚平 | Linear module type high-precision laser puncher |
| CN208929476U (en) * | 2018-10-29 | 2019-06-04 | 温州长迅科技有限公司 | A kind of wiring board laser drilling device |
| CN110282431A (en) * | 2019-08-01 | 2019-09-27 | 苏州锦帛方精密设备有限公司 | A kind of FPC bad product plate punching paint point device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112601366A (en) | Multilayer circuit board laser drilling machine and drilling method thereof | |
| CN112996248A (en) | Circuit board blind hole processing method and related device | |
| CN112643780B (en) | Automatic punching equipment for mounting hole for PCB | |
| CN118201223B (en) | Automatic machine tool for flexible circuit board processing | |
| CN209830169U (en) | Riveting device for new energy automobile production | |
| CN209868838U (en) | High-efficient perforating device suitable for furniture board | |
| CN216966677U (en) | Laser perforating equipment for FPC flexible circuit board | |
| CN212602281U (en) | Precision drilling machine for multilayer circuit board | |
| CN218286681U (en) | Turnover bending mechanism | |
| CN216721687U (en) | Circuit board positioning device | |
| CN216634588U (en) | Cutting device is used in processing of circuit board of cutting length controllable | |
| CN220493221U (en) | Accurate positioning and punching device for PCB single panel | |
| CN216633085U (en) | Perforating equipment for perforating in FPC circuit board production | |
| CN212070119U (en) | Automatic turning device of work piece in mould and inclined plane cut-out press | |
| CN218253517U (en) | A laser drilling machine | |
| CN209861290U (en) | Perforating device is used in circuit board processing | |
| CN220994551U (en) | Continuous cutting machine with positioning structure | |
| CN222470791U (en) | Positioning and punching device for processing connecting shaft of bundling machine | |
| CN222712349U (en) | Accurate perforating device is used in preparation of imitation leather board back lid | |
| CN216399877U (en) | Flexible circuit board punching machine | |
| CN220880627U (en) | Photovoltaic board support shaping perforating device | |
| CN223488485U (en) | A device for processing a printed circuit board with a stepped plug-in hole | |
| CN220457642U (en) | Circuit board convenient to heat dissipation | |
| CN220838016U (en) | A punching device for producing electrical cabinet doors | |
| CN113245660A (en) | Electrical PCB clamping equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210402 |