CN112601348A - Manufacturing process for realizing interlayer connection of single-sided copper substrate - Google Patents
Manufacturing process for realizing interlayer connection of single-sided copper substrate Download PDFInfo
- Publication number
- CN112601348A CN112601348A CN202011534579.1A CN202011534579A CN112601348A CN 112601348 A CN112601348 A CN 112601348A CN 202011534579 A CN202011534579 A CN 202011534579A CN 112601348 A CN112601348 A CN 112601348A
- Authority
- CN
- China
- Prior art keywords
- copper substrate
- circuit layer
- dielectric layer
- interlayer connection
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 41
- 239000010949 copper Substances 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 title claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000011229 interlayer Substances 0.000 title claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 51
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 8
- 238000009713 electroplating Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing process for realizing interlayer connection of a single-sided copper substrate, which comprises the following steps of: step 1, preparing a copper substrate, a PP dielectric layer to be laminated and a circuit layer, and manufacturing a stepped groove at a position, corresponding to a position where interlayer connection with the circuit layer is required, on a use outer layer of the copper substrate, wherein the height of the stepped groove is required to be equal to the thickness sum of the PP dielectric layer to be laminated and the circuit layer; step 2, routing through hole grooves in positions, corresponding to the stepped grooves of the copper substrate, on the PP dielectric layer and the circuit layer; and 3, sequentially laminating the copper substrate, the PP dielectric layer and the circuit layer, correspondingly clamping the stepped grooves on the copper substrate into the through hole grooves on the PP dielectric layer and the circuit layer, and then pressing the through hole grooves into a whole to form the single-sided copper substrate. According to the invention, the stepped groove is used for replacing laser hole filling hole electroplating, so that the heat conduction area of the circuit and the base material is effectively increased, the heat dissipation effect is enhanced, and the manufacturing cost is reduced.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a manufacturing process for realizing interlayer connection of a single-sided copper substrate.
Background
With the rapid development of the electronic information industry, customers have higher and higher requirements on heat conduction in the field of high-power LEDs, so a copper substrate is selected as a material for manufacturing a PCB in pursuit of extremely high heat dissipation. However, the existing copper substrate generally adopts a method of filling holes and electroplating after laser drilling to complete the connection between the circuit and the copper substrate and realize heat conduction, but the processing method has high cost and unsatisfactory heat dissipation effect.
Disclosure of Invention
In order to overcome the defects, the invention provides the manufacturing process for realizing interlayer connection of the single-sided copper substrate, which is low in processing cost and high in heat dissipation effect.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a manufacturing process for realizing interlayer connection of a single-sided copper substrate comprises the following steps:
and 3, sequentially laminating the copper substrate, the PP dielectric layer and the circuit layer, correspondingly clamping the stepped grooves on the copper substrate into the through hole grooves on the PP dielectric layer and the circuit layer, and then pressing the through hole grooves into a whole to form the single-sided copper substrate.
As a further improvement of the invention, in the step 1, the height of the stepped groove is maintained within a tolerance of +/-5 um.
As a further improvement of the present invention, in step 2, the shape of the through hole groove is consistent with that of the stepped groove, and a single side of the size of the through hole groove is 3-6mil larger than that of the stepped groove.
As a further improvement of the present invention, in the step 3, during the pressing, the fixing by the rivet is performed first, and then the pressing is performed.
The invention has the beneficial effects that: according to the invention, the stepped groove is used for replacing laser hole filling hole electroplating, so that the heat conduction area of the circuit and the base material is effectively increased, the heat dissipation effect is enhanced, and the manufacturing cost is reduced.
Drawings
FIG. 1A is a schematic perspective view of step 1 of the present invention;
FIG. 1B is a side view of step 1 of the present invention;
FIG. 2 is a schematic view of the structure of step 2 of the present invention;
FIG. 3A is a schematic structural view of the present invention before pressing in step 3;
fig. 3B is a schematic structural view after pressing in step 3 of the present invention.
The following description is made with reference to the accompanying drawings:
1-copper substrate; 2-PP dielectric layer;
3-a line layer; 4-step groove;
5-through hole groove.
Detailed Description
A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
Referring to the attached drawings 1-3, the manufacturing process for realizing interlayer connection of the single-sided copper substrate comprises the following steps:
and 3, sequentially laminating the copper substrate 1, the PP dielectric layer 2 and the circuit layer 3, correspondingly clamping the stepped groove on the copper substrate 1 into the through hole grooves on the PP dielectric layer 2 and the circuit layer 3, fixing by using a rivet, and then pressing into a whole to form the single-sided copper substrate.
The invention not only reduces the manufacturing cost of the copper substrate, but also meets the heat dissipation effect. The flow used in the process is as follows: the outer layer, the pressing and the forming are conventional processes of common PCB manufacturers, laser drilling and hole filling electroplating processes required by HDI board production are not needed, the cost is reduced, and the applicability is wider.
The invention also improves the heat dissipation effect: the hole-filling electroplating design inevitably causes the problem of hole-filling depression, uneven surface and insufficient contact of the component assembly with a heat dissipation area. The step groove designed by the invention is originally integrated with the copper substrate, so that the heat conduction is fast, the heat dissipation area is sufficient, and the heat dissipation effect is better.
Therefore, the stepped groove is used for replacing laser hole filling hole electroplating, so that the heat conduction area of the circuit and the base material is effectively increased, the heat dissipation effect is enhanced, and the manufacturing cost is reduced.
In the previous description, numerous specific details were set forth in order to provide a thorough understanding of the present invention. The foregoing description is only a preferred embodiment of the invention, which can be embodied in many different forms than described herein, and therefore the invention is not limited to the specific embodiments disclosed above. And that those skilled in the art may, using the methods and techniques disclosed above, make numerous possible variations and modifications to the disclosed embodiments, or modify equivalents thereof, without departing from the scope of the claimed embodiments. Any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present invention are within the scope of the technical solution of the present invention.
Claims (4)
1. A manufacturing process for realizing interlayer connection of a single-sided copper substrate is characterized by comprising the following steps:
step 1, preparing a copper substrate (1), a PP dielectric layer (2) to be laminated and a circuit layer (3), and manufacturing a step groove (4) at a position on a use outer layer of the copper substrate, which corresponds to a position where interlayer connection with the circuit layer is required to be realized, wherein the height of the step groove is required to be equal to the thickness of the PP dielectric layer (2) to be laminated and the thickness of the circuit layer (3);
step 2, routing through hole grooves (5) in positions, corresponding to the stepped grooves (4) of the copper substrate (1), on the PP dielectric layer (2) and the circuit layer (3);
and 3, sequentially laminating the copper substrate (1), the PP dielectric layer (2) and the circuit layer (3), correspondingly clamping the stepped grooves in the copper substrate (1) into the through hole grooves in the PP dielectric layer (2) and the circuit layer (3), and then pressing the through hole grooves into a single-sided copper substrate.
2. The manufacturing process for realizing interlayer connection of the single-sided copper substrate according to claim 1, wherein: in step 1, the height of the stepped slot is maintained to a tolerance of +/-5 um.
3. The manufacturing process for realizing interlayer connection of the single-sided copper substrate according to claim 1, wherein: in the step 2, the through hole groove is consistent with the shape of the stepped groove, and the single side of the size of the through hole groove is larger than the 3-6mil size of the stepped groove (4).
4. The manufacturing process for realizing interlayer connection of the single-sided copper substrate according to claim 1, wherein: in the step 3, during pressing, the fixing is performed through the rivet, and then pressing is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011534579.1A CN112601348A (en) | 2020-12-23 | 2020-12-23 | Manufacturing process for realizing interlayer connection of single-sided copper substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011534579.1A CN112601348A (en) | 2020-12-23 | 2020-12-23 | Manufacturing process for realizing interlayer connection of single-sided copper substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112601348A true CN112601348A (en) | 2021-04-02 |
Family
ID=75200340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011534579.1A Pending CN112601348A (en) | 2020-12-23 | 2020-12-23 | Manufacturing process for realizing interlayer connection of single-sided copper substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112601348A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030006007A1 (en) * | 2001-07-03 | 2003-01-09 | Chia-Pin Lin | Method of laminating copper foil onto a printed circuit board |
| US20060270232A1 (en) * | 2005-05-31 | 2006-11-30 | Toshinori Kawamura | Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor |
| CN104812173A (en) * | 2015-03-01 | 2015-07-29 | 四会富士电子科技有限公司 | Method of producing copper substrate with step platforms |
| CN112040657A (en) * | 2020-09-22 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of special-shaped step plate |
-
2020
- 2020-12-23 CN CN202011534579.1A patent/CN112601348A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030006007A1 (en) * | 2001-07-03 | 2003-01-09 | Chia-Pin Lin | Method of laminating copper foil onto a printed circuit board |
| US20060270232A1 (en) * | 2005-05-31 | 2006-11-30 | Toshinori Kawamura | Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor |
| CN104812173A (en) * | 2015-03-01 | 2015-07-29 | 四会富士电子科技有限公司 | Method of producing copper substrate with step platforms |
| CN112040657A (en) * | 2020-09-22 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of special-shaped step plate |
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