CN112588602A - Control method for full-automatic flatness measurement - Google Patents
Control method for full-automatic flatness measurement Download PDFInfo
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- CN112588602A CN112588602A CN202011279851.6A CN202011279851A CN112588602A CN 112588602 A CN112588602 A CN 112588602A CN 202011279851 A CN202011279851 A CN 202011279851A CN 112588602 A CN112588602 A CN 112588602A
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000005259 measurement Methods 0.000 title claims abstract description 21
- 238000012360 testing method Methods 0.000 claims abstract description 43
- 238000006073 displacement reaction Methods 0.000 claims abstract description 18
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/04—Sorting according to size
- B07C5/10—Sorting according to size measured by light-responsive means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention relates to the technical field of flatness measurement, in particular to a control method for full-automatic flatness measurement. Identifying and reading the two-dimensional code on the module through the grabbing device, positioning the module through the two-dimensional code and transferring the module to a test platform; the test platform takes values on the surface of the module according to preset value points and calculates the actual flatness of the module; have grabbing device through control, test platform's measuring equipment measures the plane degree on PCB module surface, the realization need not the manual work and adopts micrometer and feeler gauge to carry out the plane degree measurement to the PCB module, finally reach the result of module automatic test plane degree and letter sorting, promote the efficiency that detects production greatly when using manpower and materials sparingly, and adopt laser displacement sensor to carry out the nine points of "field" font to the module and get the point, the advantage of this mode of getting is located not influenced by factors such as module surface and length, the compatibility is applicable to each specification PCB module greatly, and it is high to detect the precision.
Description
Technical Field
The invention relates to the technical field of flatness measurement, in particular to a control method for full-automatic flatness measurement.
Background
In the course of working at present PCB board, because the PCB board need bear high temperature when SMT paster, cross the stove, on the super high temperature can transmit the PCB board, because of different areas on the PCB board have different devices and wiring, lead to easily crossing the cooling rate nonconformity in different areas on the stove back PCB board, finally lead to the PCB board after the cooling to take place deformation to form the relatively poor semi-manufactured goods PCB board of plane degree. Because the flatness of the semi-finished PCB is poor, when the PCB is subjected to secondary surface mounting, the heights of different semi-finished PCB pins are inconsistent, so that the semi-finished PCB cannot be normally welded to the base plate, and material scrapping and loss are caused.
The existing method for measuring the flatness of the PCB needs to measure the PCB manually by using a micrometer and a feeler gauge, and for the PCBs with different specifications, the manual measurement accuracy is low, the labor intensity is high, and the production efficiency of the measuring method is low.
Disclosure of Invention
The invention aims to provide a control method for full-automatic flatness measurement, and the technical scheme provided by the invention solves the problem of low accuracy in measuring the flatness of a PCB in the prior art.
In order to solve the technical problem, the invention provides a control method for full-automatic flatness measurement, which is used for measuring the flatness of the surface of a module, wherein the measurement process is completed by adopting measurement equipment with a gripping device and a test platform, and the control method comprises the following steps:
s100: the grabbing device identifies and reads the two-dimensional code on the module, positions the module through the two-dimensional code and transfers the module to a test platform;
s200: the test platform takes values on the surface of the module according to preset value points and calculates the actual flatness of the module;
s300: comparing the actual flatness of the module with the preset flatness, and if the actual flatness is smaller than the preset flatness, moving the module to a qualified area by the grabbing device; and if the actual flatness is larger than the preset flatness, the module is moved to a unqualified area by the grabbing device, and the step S100 is repeated.
Preferably, in step S100, the step of positioning the module by the grasping device includes the following steps:
s101, moving the grabbing device to the position above the module, and identifying the two-dimensional code on the stainless steel shielding cover on the surface of the module;
s102, scanning the two-dimension code and obtaining the position of the two-dimension code, moving the grabbing device to the position of the two-dimension code, grabbing the module and placing the module on a test platform.
Preferably, a laser displacement sensor is mounted on the test platform, and in step S200, calculating the actual flatness of the module includes the following steps:
s201: presetting n points of the test platform on the surface of the module;
s202: the test platform drives the laser displacement sensor to carry out value taking point by point to obtain n spatial coordinate points;
s203: fitting the n spatial coordinate points to form a plane A by a least square method, calculating the maximum distance value S1 and the minimum distance value S2 of the n points relative to the plane A, and calculating the values of S1-S2, namely the actual flatness of the module.
Preferably, in step S201, the test platform takes 9 points distributed in a shape like a Chinese character 'tian' on the surface of the module
From the above, the following beneficial effects can be obtained by applying the invention: the control method of the embodiment of the invention measures the flatness of the surface of the PCB module by controlling the measuring equipment with the gripping device and the test platform, realizes that the flatness of the PCB module is measured without manually adopting a micrometer and a feeler gauge, saves manpower and material resources, greatly improves the efficiency of detection production, and adopts the laser displacement sensor to carry out nine-point taking on the module in a shape like Chinese character 'tian', and the point taking mode has the advantages of no influence of factors such as the surface and the length of the module, high compatibility, suitability for various specifications of PCB modules and high detection precision.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments of the present invention or the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a flow chart of a control method for full-automatic flatness measurement according to an embodiment of the present invention;
FIG. 2 is a block diagram illustrating a process of positioning a module by a capturing device according to an embodiment of the present invention;
FIG. 3 is a block diagram illustrating a method for calculating the actual flatness of the module according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a test platform according to an embodiment of the present invention;
fig. 5 is a flowchart of a control method for full-automatic flatness measurement according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the above technical problem, the present embodiment provides a control method for full-automatic flatness measurement, which is used to measure the flatness of the surface of a PCB by using a measuring device having a gripping device and a testing platform, and the PCB specification is in a module form, and therefore is hereinafter referred to as a module. Wherein, grabbing device can move to test platform on, test platform is formed with the test card groove of placing the module.
As shown in fig. 1, the method specifically comprises the following steps:
s100: the grabbing device identifies and reads the two-dimensional code on the module, positions the module through the two-dimensional code and transfers the module to a test platform;
in this step, the module has stainless steel shielding cover on the surface, and radium carving has the two-dimensional code on shielding cover, can set up on grabbing device and sweep a yard camera, through discerning and reading the two-dimensional code that the module shielding was covered to the analysis two-dimensional code is realized fixing a position the module, and then shifts the module to test platform.
Specifically, as shown in fig. 2, the positioning of the module by the gripping device includes the following steps:
s101, moving the gripping device to the position above the module, and identifying the two-dimensional code on the stainless steel shielding cover on the surface of the module;
in this step, grabbing device moves to the module top, sweeps a yard camera through grabbing device and discerns the two-dimensional code on the module stainless steel shielding lid.
S102, scanning the two-dimensional code and obtaining the position of the two-dimensional code, moving the grabbing device to the position of the two-dimensional code, and placing the grabbing module on the test platform.
Through scanning the two-dimensional code and obtaining the information of two-dimensional code, through the content of analysis two-dimensional code, confirm the position of two-dimensional code, because the two-dimensional code is located the shielding lid, the shielding lid is in the fixed position of module, and then the position of confirming the two-dimensional code through the analysis realizes the location module, and then grabbing device removes the position of two-dimensional code and snatchs the module and place in test platform's test card groove.
S200: the test platform takes values on the surface of the module according to preset value points and calculates the actual flatness of the module;
in the step, a laser displacement sensor is arranged on the test platform, and the test platform can drive the laser displacement sensor to horizontally move along the horizontal XY axes above the test card slot.
As shown in fig. 3, calculating the actual flatness of the module includes the following steps:
s201: presetting a test platform to take n points on the surface of the module;
the point-taking mode of the test platform is preset, n points are set on the surface of the module, wherein the value of n is 9, as shown in fig. 4, namely 9 points distributed in a 'tian' -shape are taken on the surface of the module.
S202: the test platform drives the laser displacement sensor to take values point by point to obtain 9 spatial coordinate points;
after the point taking of the test platform is set, the test platform drives the laser displacement sensor to move above the module, and the laser displacement sensor moves to the corresponding value taking points one by one. Wherein, laser displacement sensor theory of operation: the laser emitter emits visible red laser to the surface of the measured object through the lens, the laser scattered by the surface of the object passes through the receiver lens and is received by the internal CCD linear camera, and then the digital signal processor can calculate the distance between the sensor and the measured object. The laser displacement sensor transmits laser to the module, a CCD linear camera in the laser displacement sensor receives the laser scattered by the surface of the module, the distance value between the laser displacement sensor and the value taking point is further calculated, then the space coordinate point (X1, Y1 and Z1) of the value taking point is obtained according to the moving distance of the XY axis of the laser displacement sensor, the test platform drives the laser displacement sensor to take values point by point, and 9 space coordinate points (X1, Y1 and Z1), (X2, Y2 and Z2) are obtained (X9, Y9 and Z9).
S203: and fitting the 9 spatial coordinate points to form a plane A by a least square method, calculating a maximum distance value S1 and a minimum distance value S2 of the 9 points relative to the plane A, and calculating values from S1 to S2, namely the actual flatness of the module.
Fitting the 9 spatial coordinate points obtained in step S202 by a least square method to form a plane a, sequentially calculating distance values of the 9 spatial coordinate points (X1, Y1, Z1), (X2, Y2, Z2). (X9, Y9, Z9) with respect to the plane a, screening out a maximum distance value S1 and a minimum distance value S2, and determining a value of S1 to S2, that is, the actual flatness of the module.
S300: comparing the actual flatness of the module with the preset flatness, and if the actual flatness is smaller than the preset flatness, moving the module to a qualified area by the grabbing device; and if the actual flatness is larger than the preset flatness, the module is moved to a unqualified area by the grabbing device, and the step S100 is repeated.
And comparing the actual flatness of the module with the preset ideal flatness according to the actual flatness of the module obtained in the step S200. The flatness measurement refers to the variation of the measured actual surface to the ideal plane, the flatness error is the flatness error value obtained by comparing the measured actual surface with the ideal plane, and the line value distance between the measured actual surface and the ideal plane is the flatness error value, or the flatness error value represented by the line value is converted by measuring the relative height difference of a plurality of points on the actual surface.
As shown in fig. 5, by comparing the actual flatness of the module with the preset ideal flatness, if the actual flatness is smaller than the preset flatness, the gripping device moves the module to a qualified area, and if the actual flatness is larger than the preset flatness, the gripping device moves the module to an unqualified area, and step S100 is repeated until all modules are detected, so that the automatic flatness testing and sorting results of the module are finally achieved.
The control method of the embodiment of the invention measures the flatness of the surface of the PCB module by controlling the measuring equipment with the gripping device and the test platform, realizes that the flatness of the PCB module is measured without manually adopting a micrometer and a feeler gauge, saves manpower and material resources, greatly improves the efficiency of detection production, and adopts the laser displacement sensor to carry out nine-point taking on the module in a shape like Chinese character 'tian', and the point taking mode has the advantages of no influence of factors such as the surface and the length of the module, high compatibility, suitability for various specifications of PCB modules and high detection precision.
The above-described embodiments do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the above-described embodiments should be included in the protection scope of the technical solution.
Claims (4)
1. The utility model provides a control method of full-automatic flatness measurement for measure the flatness on module surface, measurement process adopts the measuring equipment who has grabbing device, test platform to accomplish, its characterized in that: the method comprises the following steps:
s100: the grabbing device identifies and reads the two-dimensional code on the module, positions the module by reading the information of the two-dimensional code and transfers the module to a test platform;
s200: the test platform takes values on the surface of the module according to preset value points and calculates the actual flatness of the module;
s300: comparing the actual flatness of the module with the preset flatness, and if the actual flatness is smaller than the preset flatness, moving the module to a qualified area by the grabbing device; and if the actual flatness is larger than the preset flatness, the module is moved to a unqualified area by the grabbing device, and the step S100 is repeated.
2. The control method of full-automatic flatness measurement according to claim 1, characterized in that: in step S100, the step of positioning the module by the grasping apparatus includes:
s101, moving the grabbing device to the position above the module, and identifying the two-dimensional code on the stainless steel shielding cover on the surface of the module;
s102, scanning the two-dimension code and obtaining the position of the two-dimension code, moving the grabbing device to the position of the two-dimension code, grabbing the module and placing the module on a test platform.
3. The control method of full-automatic flatness measurement according to claim 1, characterized in that: the laser displacement sensor is installed on the test platform, and in the step S200, the step of calculating the actual flatness of the module comprises the following steps:
s201: presetting n points of the test platform on the surface of the module;
s202: the test platform drives the laser displacement sensor to carry out value taking point by point to obtain n spatial coordinate points;
s203: fitting the n spatial coordinate points to form a plane A by a least square method, calculating the maximum distance value S1 and the minimum distance value S2 of the n points relative to the plane A, and calculating the difference value of S1-S2, namely the actual flatness of the module.
4. The control method of full-automatic flatness measurement according to claim 3, characterized in that: in step S201, the test platform takes 9 points distributed in a shape like a Chinese character tian on the surface of the module.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011279851.6A CN112588602A (en) | 2020-11-16 | 2020-11-16 | Control method for full-automatic flatness measurement |
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| CN202011279851.6A CN112588602A (en) | 2020-11-16 | 2020-11-16 | Control method for full-automatic flatness measurement |
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|---|---|---|---|---|
| US6111419A (en) * | 1998-05-19 | 2000-08-29 | Motorola Inc. | Method of processing a substrate including measuring for planarity and probing the substrate |
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| US20160080709A1 (en) * | 2014-09-11 | 2016-03-17 | Microvision, Inc. | Scanning Laser Planarity Detection |
| CN106152979A (en) * | 2016-08-30 | 2016-11-23 | 苏州博众精工科技有限公司 | A kind of flatness checking device |
| CN106643579A (en) * | 2015-10-28 | 2017-05-10 | 南京理工大学 | System and method for automatically detecting flatness of T-shaped guide rail of elevator |
| CN208125081U (en) * | 2018-04-24 | 2018-11-20 | 安庆瑞钼特金属新材料有限公司 | Grating collimates plate plane degree automatic checkout system |
| CN109397249A (en) * | 2019-01-07 | 2019-03-01 | 重庆大学 | The two dimensional code positioning crawl robot system algorithm of view-based access control model identification |
| CN111397546A (en) * | 2020-03-23 | 2020-07-10 | 北京交通大学 | A splicing blackbody flatness, angle and gap width measuring device |
| CN211393000U (en) * | 2019-11-25 | 2020-09-01 | 南京欧米麦克机器人科技有限公司 | Load compound AGV of arm |
-
2020
- 2020-11-16 CN CN202011279851.6A patent/CN112588602A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6111419A (en) * | 1998-05-19 | 2000-08-29 | Motorola Inc. | Method of processing a substrate including measuring for planarity and probing the substrate |
| CN104422406A (en) * | 2013-08-30 | 2015-03-18 | 鸿富锦精密工业（深圳）有限公司 | Planeness measurement system and method |
| CN103940380A (en) * | 2014-04-08 | 2014-07-23 | 广东正业科技股份有限公司 | A flatness testing method and device thereof |
| US20160080709A1 (en) * | 2014-09-11 | 2016-03-17 | Microvision, Inc. | Scanning Laser Planarity Detection |
| CN106643579A (en) * | 2015-10-28 | 2017-05-10 | 南京理工大学 | System and method for automatically detecting flatness of T-shaped guide rail of elevator |
| CN106152979A (en) * | 2016-08-30 | 2016-11-23 | 苏州博众精工科技有限公司 | A kind of flatness checking device |
| CN208125081U (en) * | 2018-04-24 | 2018-11-20 | 安庆瑞钼特金属新材料有限公司 | Grating collimates plate plane degree automatic checkout system |
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Application publication date: 20210402 |