CN112468617B - Electronic device - Google Patents

Abstract

The present application relates to an electronic device. Electronic equipment includes the body, the protection apron and connect in the camera module of body, camera module includes camera lens and image sensing module, image sensing module includes image sensor and infrared filter coating, image sensor has the income plain noodles and the back of carrying on the back of the body and setting up mutually, infrared filter coating is located and is gone into the plain noodles and cover whole income plain noodles, the protection apron covers the camera lens, one side and the protection apron at least one of the orientation protection apron of camera lens are equipped with the antireflection layer, the antireflection layer is used for weakening incident light's reflex action and ends ultraviolet ray. Above-mentioned electronic equipment subtracts the reflex action that the coherent principle that the anti-layer can utilize light weakens incident light, and simultaneously, subtracts anti-layer and ends ultraviolet light, and then promotes electronic equipment's the imaging quality of camera module.

Description

Electronic equipment

technical field

The present application relates to the technical field of imaging, in particular to an electronic device.

Background technique

Camera modules of mobile terminals such as mobile phones and tablet computers generally include an infrared filter, which can filter infrared light incident into the camera module to improve the imaging quality of the camera module. The infrared filter is generally fixed in the camera module through a bracket, and the infrared filter and the bracket occupy space in the thickness direction of the camera module, which is not conducive to the thin design of the camera module.

Contents of the invention

The first aspect of the embodiment of the present application discloses an image sensing module, which can be applied to a camera module, so as to facilitate the reduction of the overall thickness of the camera module.

An image sensing module, comprising:

An image sensor having a light incident surface and a back surface disposed opposite to each other; and

The infrared filter film is arranged on the light incident surface and covers the entire light incident surface.

For the above-mentioned image sensing module, since the entire light incident surface of the image sensor is covered with an infrared filter film, the infrared filter film can be formed on the light incident surface by coating or coating process. Compared with the traditional infrared filter film, the infrared filter film The chip has a smaller thickness, and because there is no need to set a bracket for installing the infrared filter, when the above-mentioned image sensing module is applied to the camera module, the overall thickness of the camera module can be reduced, which is beneficial to the camera module. thin design.

In one of the embodiments, the infrared filter film includes at least one of an infrared cut-off layer and a near-infrared absorbing pigment layer.

In one embodiment, the infrared cut-off layer or the near-infrared absorbing pigment layer is spin-coated on the light incident surface.

In one of the embodiments, the infrared filter film includes an infrared cut-off layer and a near-infrared absorbing pigment layer that are laminated, and one of the infrared cut-off layer and the near-infrared absorbing pigment layer is positioned between the other and the near-infrared absorbing pigment layer. between the light surfaces.

The second aspect of the embodiment of the present application discloses a camera module, which is beneficial to realize a thinner design of the camera module.

A camera module includes a lens and the above-mentioned image sensing module, the lens is arranged on the side where the light-incident surface is located, and the ambient light passing through the lens can directly enter the image sensing module.

The third aspect of the embodiment of the present application discloses an electronic device, which is beneficial to realize thinner and thinner design.

An electronic device comprising:

ontology; and

The camera module is connected to the body, the camera module includes a lens and an image sensor module, the image sensor module includes an image sensor and an infrared filter film, and the image sensor has an input On the light side and the back side, the infrared filter film is arranged on the light incident surface and covers all of the light incident surface, and the lens is arranged on the side where the light incident surface is located and is used for light incident.

In one of the embodiments, the infrared filter film includes at least one of an infrared cut-off layer and a near-infrared absorbing pigment layer.

In one of the embodiments, the electronic device includes a protective cover covering the lens, and at least one of the side of the lens facing the protective cover and the protective cover is provided with an anti-reflection layer .

In one of the embodiments, the electronic device includes a protective cover covering the lens, and the infrared filter film includes one of an infrared cut-off layer and a near-infrared absorbing pigment layer and is spin-coated on the light incident surface , the other of the infrared cut-off layer and the near-infrared absorbing pigment layer is spin-coated on the protective cover or the lens.

In one of the embodiments, at least one of the side of the lens facing the protective cover and the protective cover is provided with an anti-reflection layer.

In one of the embodiments, the infrared filter film includes an infrared cut-off layer and a near-infrared absorbing pigment layer stacked, one of the infrared cut-off layer and the near-infrared absorbing pigment layer is spin-coated on the The light surface is located between the other and the light incident surface.

In one of the embodiments, the electronic device includes a protective cover covering the lens, and the protective cover is provided with at least one of an anti-reflection layer, an infrared cut-off layer and a near-infrared absorbing pigment layer.

In one of the embodiments, at least one of the anti-reflection layer, the infrared cut-off layer and the near-infrared absorbing pigment layer is provided on the side of the lens facing the protective cover.

In one of the embodiments, the protective cover is provided with at least one of the infrared cut-off layer and the near-infrared-absorbing pigment layer, and the lens is provided with the infrared-cut layer and the near-infrared-absorbing pigment at least one of the layers.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present application. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic view of an electronic device according to an embodiment;

FIG. 2 is a schematic diagram of another viewing angle of an electronic device according to an embodiment;

Fig. 3 is a schematic diagram of the positions of the camera module and the protective cover of an embodiment;

Fig. 4 is the transmittance-wavelength graph of the infrared filter film of the camera module shown in Fig. 3;

Fig. 5 is the reflectance-wavelength graph of the infrared filter film of the camera module shown in Fig. 3;

Fig. 6 is a schematic diagram of the positions of the camera module and the protective cover in another embodiment;

Fig. 7 is a schematic diagram of the positions of the camera module and the protective cover in another embodiment;

Fig. 8 is a schematic diagram of the positions of the camera module and the protective cover in another embodiment;

FIG. 9 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

Reference signs:

10. Electronic equipment 11. Body 111. Middle frame

113. Display module 115. Protective cover 116. Anti-reflection layer

117. Rear cover 12. Camera module 121. Lens

123. Image sensor module 1231. Image sensor a1, light incident surface

a2, back side 1233, infrared filter film 123a, infrared cut-off layer

123b, near-infrared absorbing pigment layer

Detailed ways

In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the application more thorough and comprehensive.

"Electronic equipment" as used here refers to a device capable of receiving and/or sending communication signals, including but not limited to, connected via any one or several of the following connection methods:

(1) Connection via wired lines, such as public switched telephone network (Public Switched Telephone Networks, PSTN), digital subscriber line (Digital Subscriber Line, DSL), digital cable, direct cable connection;

(2) Via a wireless interface, such as a cellular network, a wireless local area network (Wireless Local Area Network, WLAN), a digital TV network such as a DVB-H network, a satellite network, and an AM-FM broadcast transmitter.

An electronic device arranged to communicate through a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1) satellite phone or cellular phone;

(2) Personal Communications System (PCS) terminals that can combine cellular radiotelephones with data processing, facsimile, and data communication capabilities;

(3) Radiotelephones, pagers, Internet/Intranet access, Web browsers, organizers, calendars, Personal Digital Assistants (PDAs) with Global Positioning System (GPS) receivers;

(4) Conventional laptop and/or palm-type receivers;

(5) Conventional laptop and/or palm-sized radiotelephone transceivers and the like.

Referring to FIG. 1 and FIG. 2 , in one embodiment, the electronic device 10 is a smart phone. The electronic device 10 includes a body 11 and a camera module 12 , and the camera module 12 is installed on the body 11 . The body 11 may include components such as a middle frame 111, a display module 113 and a circuit board (not shown), wherein the middle frame 111 may be used to install the display module 113 and the circuit board, and the camera module 12 is communicatively connected to the circuit board. In some implementations, the camera module 12 can be used to perform the function of the rear camera. For example, the user can use the camera module 12 to take close-up shots, long-range shots, or video recordings. In some other embodiments, the camera module 12 can be used to perform the function of the front camera, that is, the user can perform operations such as Selfie and video call through the camera module 12 . In other embodiments, the electronic device 10 may be a tablet computer, a notebook computer, and the like.

Referring to Fig. 3, the camera module 12 includes a lens 121 and an image sensing module 123, the lens 121 is spaced from the image sensing module 123, and the ambient light can pass through the lens 121 and directly enter the image sensing module 123, the image The sensing module 123 can convert the optical signal into an electrical signal, and after further processing, an image of the subject can be formed. The camera module 12 may also include a housing (not shown), the lens 121 and the image sensing module 123 are mounted on the housing and positioned through the housing, the housing may be mounted to the middle frame 111 or the circuit board of the electronic device 10, And the camera module 12 is communicatively connected to the processor of the electronic device 10, so that the image captured by the camera module 12 can be further processed by the processor.

Continuing to refer to FIG. 3, the image sensing module 123 includes an image sensor 1231 and an infrared filter film 1233. The image sensor 1231 has a light incident surface a1 and a back surface a2 arranged opposite to each other. The infrared filter film 1233 is arranged on the light incident surface a1 and Covering the entire light incident surface a1, the lens 121 is disposed on the side of the light incident surface a1 and used for light incident. Further, the infrared filter film 1233 includes at least one of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b. The infrared cut-off layer 123a is used to cut off the light in the infrared band (750nm-1mm), and the near-infrared absorbing pigment layer 123b is used to absorb the light in the near-infrared band (750nm-1100nm) to suppress the near-infrared light.

In some embodiments, the thickness of the infrared cut-off layer 123a may be 3 microns to 6 microns, for example, the thickness of the infrared cut-off layer 123a may be 4 microns, or 4.5 microns, or 5 microns, or 5.5 microns. The thickness of the near-infrared absorbing pigment layer 123b may be 2 micrometers to 10 micrometers. For example, the thickness of the near-infrared absorbing pigment layer 123b may be 3 microns, or 5 microns, or 8 microns. Further, the infrared cut-off layer 123a or the near-infrared-absorbing pigment layer 123b can be coated on the light-incident surface a1 by using a spin-coating process, so that the thickness of the infrared-cut layer 123a or the thickness of the near-infrared-absorbing pigment layer 123b is evenly distributed to ensure that the infrared light is filtered The consistency of the optical properties of the edge area and the center area of the film 1233 can ensure the normal imaging effect while obtaining better angle consistency, so that the edge color difference of the imaging area is extremely small, thereby preventing the color shift between the center area and the edge area. To improve the imaging quality of the image sensor 1231.

In the embodiment shown in FIG. 3 , the infrared filter film 1233 includes an infrared cut-off layer 123a and a near-infrared absorbing pigment layer 123b that are stacked, and one of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b is positioned at the other side. Between the light incident surface a1. For example, the infrared cut-off layer 123a can be spin-coated on the entire light incident surface a1 of the image sensor 1231 , and the near-infrared absorbing pigment layer 123b is coated on the side of the infrared cutoff layer 123a facing away from the light incident surface a1 . As another example, the near-infrared absorbing pigment layer 123b can be spin-coated on the entire light-incident surface a1 of the image sensor 1231 , and the infrared-cut layer 123a is coated on the side of the near-infrared-absorbing pigment layer 123b facing away from the light-incident surface a1 . Certainly, in other implementation manners, it is only necessary to set one of the infrared cut-off layer 123a and the near-infrared-absorbing pigment layer 123b on the light incident surface a1 of the image sensor 1231, and the other of the infrared-cut layer 123a and the near-infrared-absorbing pigment layer 123b or can be defaulted.

Referring to Fig. 4 and Fig. 5 in combination with Fig. 3, taking the infrared filter film 1233 including an infrared cut-off layer 123a and a near-infrared absorbing pigment layer 123b stacked as an example, the transmittance spectrum of the infrared filter film 1233 is shown in Fig. 4 , the reflectance spectrum of the infrared filter film 1233 is shown in FIG. 5 . The position of the incident angle γ is shown in FIG. 3 .

It can be seen from FIG. 4 that the comprehensive transmittance of the infrared filter film 1233 has achieved the effect of infrared cut-off filtering. For light in the human eye sensitive wavelength range of 430 nm to 640 nm, the infrared filter film 1233 of the present disclosure The average transmittance of visible light in the wavelength range of 435 nm to 565 nm reaches 90%, and the maximum transmittance can reach more than 93.6%, thus achieving high transmittance of visible light; for the wavelength range of 700 nm to 1100 nm The average transmittance of light is less than 0.2%, and the maximum transmittance is less than 5%, so the efficient cut-off of infrared light is realized; the average transmittance variation for the incident angle of 0-40° is less than 2%, and the angle consistency It is better, so that the normal imaging effect can be guaranteed and the effect of no chromatic aberration at the edge can be achieved.

It can be seen from Figure 5 that within the range of incident angles from 0° to 40°, the average reflectance of visible light in the wavelength range of 400 nm to 700 nm is below 2%, and the highest reflectance is below 6%; this shows that even in When the light is incident at a large angle, it can also achieve low reflectivity, so that the effect of reducing glare or ghosting can be achieved.

For the above-mentioned image sensing module 123, since the entire incident surface a1 of the image sensor 1231 is covered with an infrared filter film 1233, the infrared filter film 1233 may include at least one of an infrared cut-off layer 123a and a near-infrared absorbing pigment layer 123b, Moreover, the infrared filter film 1233 can be formed on the light incident surface a1 by coating or coating process, the processing technology is relatively simple, and high processing efficiency can be obtained, so as to obtain the infrared filter film 1233 with a relatively small thickness. On the one hand, compared with the blue glass or resin substrate surface coating scheme of 0.21 mm or 0.11 mm in the traditional infrared filter, the above-mentioned infrared filter film 1233 has a smaller thickness; on the other hand, due to the infrared filter The film 1233 is formed on the light incident surface a1 of the image sensor 1231, and the camera module 12 does not need to be provided with a bracket for installing a traditional infrared filter, and there is no need to reserve between the lens 121 and the bracket, and between the bracket and the image sensor 1231. Therefore, the overall thickness of the camera module 12 can be effectively reduced, which is beneficial to the thinner design of the camera module 12 . When the camera module 12 is applied to an electronic device 10 such as a smart phone, the solution of the present disclosure can reduce the height of the camera module 12 protruding from the housing of the electronic device 10, thereby facilitating the thinner and lighter design of the electronic device 10 to improve The appearance characteristics of the electronic device 10 .

In addition, in the related art, when the infrared filter is arranged on the bracket or the infrared filter is attached to the image sensor 1231 through optical glue, there is a gap between the infrared filter and the image sensor 1231 and the gap distance is relatively short. . The surface of the infrared filter will have a strong reflection effect on the light, especially for the light incident at a large angle, such as the incident light at 45°, there will be strong reflected light in the visible light band, and these strong reflected light Superimposed with the reflected light on the surface of the image sensor 1231 , obvious glare or ghosting will be formed, which will affect the imaging quality of the camera module 12 . Especially when the user takes pictures against the light, the glare or ghosting phenomenon will be more obvious due to the stronger incident light. In the solution of the present disclosure, an infrared filter film 1233 is arranged on the surface of the image sensor 1231, and the infrared filter film 1233 may include at least one of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b. 12 height, it can also effectively reduce the glare or ghosting problems caused by conventional infrared filters, thereby improving the shooting quality of the camera module 12.

Continuing to refer to FIG. 2 and FIG. 3 , the electronic device 10 may include a protective cover 115 covering the lens 121 , and at least one of the side of the lens 121 facing the protective cover 115 and the protective cover 115 is provided with an anti-reflection layer 116 . The material of the protective cover 115 can be white glass, sapphire or plastic, and the protective cover 115 is used to protect the lens 121 of the camera module 12 . The electronic device 10 may include a back cover 117 mounted on the middle frame 111. The back cover 117 and the display module 113 are arranged on opposite sides of the middle frame 111 to form an installation space. The installation space can be used to install the battery of the electronic device 10, Circuit board and camera module 12, etc. In some embodiments, the rear cover 117 is provided with a through hole for light transmission, and the camera module 12 and the protective cover 115 are disposed corresponding to the through hole. In other embodiments, the protective cover 115 is a part of the rear cover 117 . For example, in an embodiment where the material of the rear cover 117 is glass, a part of the inner surface of the rear cover 117 may not cover the decorative layer, and the part of the rear cover 117 that is not covered with the decorative layer may be set corresponding to the camera module 12, so that Ambient light can penetrate the rear cover 117 and enter the camera module 12 .

The thickness of the anti-reflection layer 116 may be 0.1 micron to 0.2 micron, for example, the thickness of the anti-reflection layer 116 may be 0.13 mm, or 0.15 mm, or 0.18 mm. In some embodiments, the anti-reflection layer 116 may be formed on at least one of the inner surface and the outer surface of the protective cover 115 by using a spin-coating process. For example, the anti-reflection layer 116 can be spin-coated on the inner surface of the protective cover 115 , can also be spin-coated on the outer surface of the protective cover 115 , or both the inner and outer surfaces of the protective cover 115 can be spin-coated with the anti-reflective layer 116 . The anti-reflection layer 116 can utilize the principle of light coherence to weaken the reflection of incident light, thereby improving the imaging quality of the camera module 12 . In some embodiments, the anti-reflection layer 116 can also be used to cut off ultraviolet light. For example, the anti-reflection layer 116 can include materials that absorb ultraviolet light, so as to reduce the 350 nm to 380 nm wavelength band with relatively high transmittance in the ultraviolet light band. of UV absorption. Certainly, in some embodiments, the near-infrared absorbing pigment layer 123b may also add materials for cutting off ultraviolet rays, so as to absorb ultraviolet rays in the 350nm-380nm band with relatively high transmittance in the ultraviolet band. In other embodiments, the anti-reflection layer 116 can be coated on the surface of the lens 121 . For example, in an embodiment where the lens 121 includes a plurality of lenses, the anti-reflection layer 116 can be coated on the surface of the lens of the lens 121 closest to the protective cover 115, so as to reduce the reflection of incident light and improve the performance of the camera module 12. image quality.

Further, referring to Fig. 6, Fig. 7 and Fig. 8, in some other embodiments, the infrared filter film 1233 includes one of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b and is spin-coated on the light incident surface a1, and the infrared The other of the cut-off layer 123 a and the near-infrared absorbing pigment layer 123 b is spin-coated on the protective cover 115 or the lens 121 . In other words, in this embodiment, one of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b can be spin-coated on the image sensor 1231, so that the image sensor 1231 has a smaller thickness. The other one of the infrared absorbing pigment layers 123 b can be spin-coated on the lens 121 or the protective cover 115 . For example, the light-incident surface a1 of the image sensor 1231 can be spin-coated with the infrared cut-off layer 123 a , and the near-infrared absorbing pigment layer 123 b can be spin-coated on the surface of the lens 121 , or can be spin-coated on the surface of the protective cover 115 . Specifically, when the near-infrared absorbing pigment layer 123b is spin-coated on the lens 121, it can be spin-coated on the lens closest to the protective cover 115, or can be spin-coated on the surface of the lens closest to the image sensor 1231, or can be spin-coated on the lens The surface of one or several lenses inside 121. When the near-infrared absorbing pigment layer 123b is spin-coated on the protective cover 115, it can be spin-coated on the surface (ie, the inner surface) of the protective cover 115 facing the lens 121, or can be spin-coated on the surface of the protective cover 115 facing away from the lens 121. The surface (that is, the outer surface), or the inner and outer surfaces of the protective cover 115 can be spin-coated with the near-infrared absorbing pigment layer 123b.

For another example, the light-incident surface a1 of the image sensor 1231 can be spin-coated with the near-infrared absorbing pigment layer 123b , and the infrared-cut layer 123a can be spin-coated on the surface of the lens 121 , or can be spin-coated on the surface of the protective cover 115 . Specifically, when the infrared cut-off layer 123a is spin-coated on the lens 121, it can be spin-coated on the lens closest to the protective cover 115, or can be spin-coated on the surface of the lens closest to the image sensor 1231, or can be spin-coated inside the lens 121. The surface of one or several lenses. When the infrared cut-off layer 123a is spin-coated on the protective cover 115, it can be spin-coated on the surface (ie, the inner surface) of the protective cover 115 facing the lens 121, or can be spin-coated on the surface of the protective cover 115 facing away from the lens 121 ( That is, the outer surface), or the inner and outer surfaces of the protective cover 115 can be spin-coated with the infrared cut-off layer 123a.

In other embodiments, the protective cover 115 may be provided with at least one of the anti-reflection layer 116 , the infrared cut-off layer 123 a and the near-infrared absorbing pigment layer 123 b. In other words, in this embodiment, the protective cover 115 is not limited to one of the anti-reflection layer 116 , the infrared cutoff layer 123 a and the near-infrared absorbing pigment layer 123 b. For example, the surface of the protective cover 115 can be provided with any one of the anti-reflection layer 116, the infrared cut-off layer 123a and the near-infrared absorption pigment layer 123b, and the anti-reflection layer 116, the infrared cut-off layer 123a and the near-infrared absorption pigment layer can also be set For any two of 123b, the anti-reflection layer 116 , the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b can also be arranged on the protective cover 115 . In this embodiment, any one of the anti-reflection layer 116, the infrared cut-off layer 123a, and the near-infrared absorbing pigment layer 123b can be arranged on the side where the outer surface is located, or on the side where the inner surface is located, and the anti-reflection layer 116 When any two of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b are stacked, the stacking order is not limited.

In the above-mentioned embodiment, for the film layer already provided by the protective cover 115, the lens 121 or the image sensor 1231 may not need to be repeatedly installed, thereby reducing the overall thickness of the image sensor 1231 and facilitating the thinner design of the camera module 12, In order to make the thickness of the electronic device 10 thinner. For example, when the protective cover 115 is provided with the infrared cut-off layer 123a, the image sensor 1231 or the lens 121 may not need to be provided with the infrared cut-off layer 123a, and the infrared filter film 1233 of the image sensing module 123 includes the near-infrared absorbing pigment layer 123b. . As another example, when the protective cover 115 is provided with the near-infrared absorbing pigment layer 123b, the image sensor 1231 or the lens 121 may not need to be provided with the near-infrared absorbing pigment layer 123b, and the infrared filter film 1233 of the image sensor module 123 includes an infrared cut-off layer 123a will do. For another example, when the protective cover 115 is provided with the anti-reflection layer 116 , the lens 121 does not need to be provided with the anti-reflection layer 116 .

Of course, it can be understood that, in the case of the infrared cut-off layer 123a (or the near-infrared absorbing pigment layer 123b) already provided by the protective cover 115, the light-incident surface a1 of the image sensor 1231 or the lens 121 can still be repeatedly provided with an infrared cut-off layer. 123a (or near-infrared absorbing pigment layer 123b) to further improve the imaging quality of the camera module 12. For example, the protective cover 115 can be provided with at least one of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b, and the lens 121 can also be provided with at least one of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b. The filter film 1233 may also include at least one of the infrared cut-off layer 123a and the near-infrared absorbing pigment layer 123b. In this embodiment, the anti-reflection layer 117 may be disposed on the side of the lens 121 facing the protective cover 115 or the protective cover 115 .

Referring to FIG. 9 , FIG. 9 is a schematic structural diagram of an electronic device 10 provided in an embodiment of the present application. The electronic device 10 may include a radio frequency (RF, Radio Frequency) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity ( WiFi (Wireless Fidelity) module 507, a processor 508 including one or more processing cores, and a power supply 509 (or battery) and other components. Those skilled in the art can understand that the structure of the electronic device 10 shown in FIG. 9 does not constitute a limitation on the electronic device 10, and may include more or less components than those shown in the illustration, or combine some components, or different components. layout.

The radio frequency circuit 501 can be used to send and receive information, or to receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is processed by one or more processors 508; in addition, the data related to the uplink is sent to the base station . Generally, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM, Subscriber Identity Module) card, a transceiver, a coupler, a low noise amplifier (LNA, Low Noise Amplifier), duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to Global System for Mobile Communications (GSM, Global System of Mobile communication), General Packet Radio Service (GPRS, General Packet Radio Service), Code Division Multiple Access (CDMA, Code Division Multiple Access), Wideband Code Division Multiple Access (WCDMA, Wideband Code Division Multiple Access), Long Term Evolution (LTE, Long Term Evolution), email, Short Message Service (SMS, Short Messaging Service), etc.

Memory 502 may be used to store applications and data. The application programs stored in the memory 502 include executable codes. Applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running the application programs stored in the memory 502 . The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application program required by a function (such as a sound playback function, an image playback function, etc.); The use of the electronic device 10 creates data (such as audio data, phonebook, etc.) and the like. In addition, the memory 502 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid-state storage devices. Correspondingly, the memory 502 may further include a memory controller to provide access to the memory 502 by the processor 508 and the input unit 503 .

The input unit 503 can be used to receive input numbers, character information or user characteristic information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. A touch-sensitive surface, also known as a touch display or trackpad, collects user touch operations on or near it (for example, the user uses a finger, stylus, etc. any suitable object or accessory on the touch-sensitive surface or on the touch-sensitive Operation near the surface), and drive the corresponding connection device according to the preset program. Optionally, the touch-sensitive surface may include two parts: a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, and detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into contact coordinates, and sends it to the to the processor 508, and can receive and execute commands sent by the processor 508.

The display unit 504 can be used to display information input by or provided to the user and various graphical user interfaces of the electronic device 10, and these graphical user interfaces can be composed of graphics, text, icons, videos and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel may be configured in the form of a liquid crystal display (LCD, Liquid Crystal Display), an organic light-emitting diode (OLED, Organic Light-Emitting Diode), or the like. Further, the touch-sensitive surface can cover the display panel. When the touch-sensitive surface detects a touch operation on or near it, it is sent to the processor 508 to determine the type of the touch event, and then the processor 508 displays on the display according to the type of the touch event. The corresponding visual output is provided on the panel. Although in FIG. 9, the touch-sensitive surface and the display panel are used as two independent components to realize the input and input functions, in some embodiments, the touch-sensitive surface and the display panel can be integrated to realize the input and output functions.

The electronic device 10 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor may turn off the display panel and/or when the electronic device 10 moves to the ear. or backlight. As a kind of motion sensor, the gravitational acceleration sensor can detect the magnitude of acceleration in various directions (generally three axes), and can detect the magnitude and direction of gravity when it is stationary, and can be used for applications that recognize the attitude of mobile phones (such as horizontal and vertical screen switching, related games, magnetometer attitude calibration), vibration recognition related functions (such as pedometer, knocking), etc.; as for other sensors such as gyroscope, barometer, hygrometer, thermometer, infrared sensor, etc. that can be configured in electronic device 10, here No longer.

The audio circuit 506 can provide an audio interface between the user and the electronic device 10 through a speaker or a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and the speaker converts it into a sound signal output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is converted into The audio data, after being processed by the audio data output processor 508, is sent to another electronic device 10 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the electronic device 10 .

Wireless Fidelity (WiFi) is a short-distance wireless transmission technology. The electronic device 10 can help users send and receive emails, browse web pages, and access streaming media through the Wi-Fi module 507. It provides users with wireless broadband Internet access. Although FIG. 9 shows the Wi-Fi module 507, it can be understood that it is not an essential component of the electronic device 10, and can be completely omitted as required without changing the essence of the invention.

The processor 508 is the control center of the electronic device 10. It uses various interfaces and lines to connect various parts of the entire electronic device 10. By running or executing the application program stored in the memory 502 and calling the data stored in the memory 502, the processor 508 executes Various functions and processing data of the electronic device 10 , so as to monitor the electronic device 10 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface and application programs, etc. , the modem processor mainly handles wireless communications. It can be understood that the foregoing modem processor may not be integrated into the processor 508 .

The electronic device 10 also includes a power supply 509 for powering various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so as to implement functions such as management of charging, discharging, and power consumption management through the power management system. The power supply 509 may also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators and other arbitrary components.

Although not shown in FIG. 9 , the electronic device 10 may also include a Bluetooth module, etc., which will not be repeated here. During specific implementation, each of the above modules may be implemented as an independent entity, or may be combined arbitrarily as the same or several entities. For the specific implementation of each of the above modules, please refer to the previous method embodiments, which will not be repeated here.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of protection of the patent application should be based on the appended claims.

Claims (10)

1. An electronic device, characterized in that, comprising: ontology; and The camera module is connected to the body, the camera module includes a lens and an image sensor module, the image sensor module includes an image sensor, and the image sensor has a light incident surface and a back surface arranged opposite to each other, The lens is arranged on the side where the light incident surface is located and is used for light incident; A protective cover, covering the lens, at least one of the side of the lens facing the protective cover and the protective cover is provided with an anti-reflection layer, and the anti-reflection layer is used to weaken the incident light Reflects and cuts off UV rays; Wherein, the electronic device includes an infrared cut-off layer and a near-infrared absorbing pigment layer, and the light incident surface is provided with at least one of the infrared cut-off layer and the near-infrared absorbing pigment layer by spin coating, and the protective cover plate or The lens is provided with at least the other one of the infrared cut-off layer and the near-infrared absorbing pigment layer by spin coating. 2 . The electronic device according to claim 1 , wherein the thickness of the anti-reflection layer is 0.1 micron to 0.2 micron. 3 . The electronic device according to claim 1 , wherein the anti-reflection layer comprises a material that absorbs ultraviolet light, so as to absorb ultraviolet rays in a wavelength range of 350 nanometers to 380 nanometers. 4 . 4 . The electronic device according to claim 1 , wherein the near-infrared absorbing pigment layer contains a material for cutting off ultraviolet rays, so as to absorb ultraviolet rays in a band of 350 nm to 380 nm. 5 . 5 . The electronic device according to claim 4 , wherein the anti-reflection layer comprises a material that absorbs ultraviolet light, so as to absorb ultraviolet rays in a wavelength range of 350 nanometers to 380 nanometers. 6. The electronic device according to claim 1, wherein the infrared cut-off layer and the near-infrared absorbing pigment layer are provided on the light incident surface at the same time, and the infrared cut-off layer positioned on the light incident surface and one of the near-infrared absorbing pigment layers is spin-coated on the light incident surface and is located between the other and the light incident surface, and the protective cover or the lens is at least spin-coated with the One of the infrared cut layer and the near infrared absorbing pigment layer. 7. The electronic device according to claim 1, wherein the protective cover is provided with the infrared cut-off layer and the near-infrared absorbing pigment layer at the same time. 8 . The electronic device according to claim 7 , wherein the infrared cut-off layer and the near-infrared absorbing pigment layer are provided on a side of the lens facing the protective cover. 9 . 9. The electronic device according to claim 7, wherein the thickness of the anti-reflection layer is 0.1 micron-0.2 micron. 10. The electronic device according to any one of claims 6-9, characterized in that the near-infrared absorbing pigment layer contains a material for cutting off ultraviolet rays, so as to absorb ultraviolet rays in a band of 350 nanometers to 380 nanometers.

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