CN112445273A - Electronic device and pressure-sensitive touch control assembly thereof - Google Patents
Electronic device and pressure-sensitive touch control assembly thereof Download PDFInfo
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- CN112445273A CN112445273A CN201910807296.0A CN201910807296A CN112445273A CN 112445273 A CN112445273 A CN 112445273A CN 201910807296 A CN201910807296 A CN 201910807296A CN 112445273 A CN112445273 A CN 112445273A
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- G—PHYSICS
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- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
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- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
Abstract
The application provides an electronic device and a pressure-sensitive touch control assembly thereof. The pressure-sensitive touch control assembly comprises a first substrate, a second substrate, a first patterned conductive layer, an insulating layer, a second patterned conductive layer, a plurality of variable pressure-sensitive materials and a third patterned conductive layer, wherein the first patterned conductive layer, the insulating layer, the second patterned conductive layer, the variable pressure-sensitive materials and the third patterned conductive layer are sequentially stacked between the first substrate and the second substrate from top to bottom.
Description
Technical Field
The application relates to an electronic device and a pressure-sensitive touch component thereof.
Background
At present, the structures for realizing the pressure-sensitive touch function are different, some adopt a cantilever type structure design and combine strain gauges (strain gauges) for pressure sensing purposes, and some adopt a pressure sensing film arranged between a display and a backlight module so as to achieve the purpose of collecting pressure (force application) information through the change of capacitance values. The foregoing approaches suffer from several drawbacks, such as increased complexity of the structural design. The requirement for assembly alignment is high, when the 2D plane coordinate needs to be matched with the 3D pressure value, if the alignment is inaccurate, the accuracy of each sensing position during pressure sensing can be influenced, and the accuracy and the stability of pressure value calculation can be influenced.
Disclosure of Invention
In view of the foregoing, the present disclosure provides a pressure-sensitive touch device, which includes a first substrate, a second substrate, and a first patterned conductive layer, an insulating layer, a second patterned conductive layer, a plurality of variable pressure-sensitive materials, and a third patterned conductive layer sequentially stacked from top to bottom between the first substrate and the second substrate.
The application further provides an electronic device comprising a processor and a pressure-sensitive touch component. The pressure-sensitive touch control assembly comprises a first substrate, a second substrate, a first patterned conductive layer, an insulating layer, a second patterned conductive layer, a plurality of variable pressure-sensitive materials and a third patterned conductive layer, wherein the first patterned conductive layer, the insulating layer, the second patterned conductive layer, the variable pressure-sensitive materials and the third patterned conductive layer are sequentially stacked from top to bottom between the first substrate and the second substrate, the first patterned conductive layer comprises a plurality of capacitance sensing electrodes, the second patterned conductive layer comprises a plurality of shared electrodes, the third patterned conductive layer comprises a plurality of pressure sensing electrodes, the vertical projection of the shared electrodes on the second substrate is staggered with the vertical projection of the capacitance sensing electrodes on the second substrate, and the vertical projection of the pressure sensing electrodes on the second substrate is staggered with the vertical projection of the shared electrodes on the second substrate. The processor is electrically connected with the pressure-sensitive touch control assembly. Each capacitive sensing electrode respectively transmits a touch sensing signal to the processor, each pressure sensing electrode respectively transmits a pressure sensing signal to the processor, the processor determines the occurrence position of the touch behavior according to the touch sensing signal transmitted by each capacitive sensing electrode, and the processor determines the pressing force of the touch behavior according to the pressure sensing signal transmitted by each pressure sensing electrode.
The application further provides an electronic device comprising a processor and a pressure-sensitive touch component. The pressure-sensitive touch control assembly comprises a first substrate, a second substrate, a first patterned conductive layer, an insulating layer, a second patterned conductive layer, a plurality of variable pressure-sensitive materials and a third patterned conductive layer, wherein the first patterned conductive layer, the insulating layer, the second patterned conductive layer, the variable pressure-sensitive materials and the third patterned conductive layer are sequentially stacked from top to bottom between the first substrate and the second substrate, the first patterned conductive layer comprises a plurality of capacitance sensing electrodes, the second patterned conductive layer comprises a plurality of shared electrodes, the third patterned conductive layer comprises a plurality of pressure sensing electrodes, the vertical projection of the shared electrodes on the second substrate is staggered with the vertical projection of the capacitance sensing electrodes on the second substrate, and the vertical projection of the pressure sensing electrodes on the second substrate is staggered with the vertical projection of the shared electrodes on the second substrate. The processor is electrically connected with the pressure-sensitive touch control assembly. Each capacitance sensing electrode respectively transmits a touch sensing signal to the processor, each sharing electrode respectively transmits a first partial pressure value to the processor, each pressure sensing electrode respectively transmits a second partial pressure value to the processor, the processor determines the occurrence position of the touch behavior according to the touch sensing signal transmitted by each capacitance sensing electrode, and the processor determines the pressing force of the touch behavior according to the first partial pressure value transmitted by each sharing electrode and the second partial pressure value transmitted by each pressure sensing electrode.
In summary, the present application provides a pressure-sensitive touch module and an electronic device for three-dimensional touch detection. Through the structural design of the pressure-sensitive touch control assembly, the problems of stability and accuracy caused by assembly alignment errors can be solved. Moreover, this application has electric capacity and pressure drag structural design concurrently, is responsible for the interpretation of two-dimensional coordinate by electric capacity structural design, is responsible for pressure sensing by pressure drag structural design to the mesh of multiple spot touch-control pressure sensing is accomplished in cooperation chronogenesis switching, except that providing the user and possessing the two-dimensional touch-control space, also integrates the function of degree of depth pressure sensing, and then provides more pluralism and rich application.
Other features and embodiments of the present application will be described in detail below with reference to the drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a pressure-sensitive touch device according to an embodiment of the present disclosure;
fig. 2A to 2I are schematic structural diagrams of steps of manufacturing an embodiment of the pressure-sensitive touch device of the present application;
FIG. 3 is a schematic diagram of a driving architecture of a pressure sensitive touch device according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of an equivalent circuit model of a sensing unit of the pressure-sensitive touch device according to an embodiment of the present disclosure;
FIG. 5 is a circuit diagram illustrating an embodiment of the present application using a multiplexer;
FIG. 6 is a block diagram of an electronic device according to an embodiment of the present disclosure;
FIG. 7 is a schematic diagram of an equivalent circuit of a pressure sensitive touch device according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of an equivalent circuit of a pressure sensitive touch device according to an embodiment of the present invention;
FIG. 9 is a block diagram of an electronic device according to another embodiment of the present application;
FIG. 10 is a schematic diagram of a first driving architecture of the common electrode and the pressure sensing electrode of the present application;
FIG. 11 is a schematic diagram of the equivalent circuit model of FIG. 10;
FIG. 12 is a schematic diagram of a second driving architecture of the common electrode and the pressure sensing electrode of the present application;
fig. 13 is a schematic diagram of an equivalent circuit model of fig. 12.
Detailed Description
In order to make the objects, features, and effects of the present application easier to understand, embodiments and drawings for describing the present application in detail are provided below.
Fig. 1 is a circuit block diagram of an embodiment of an electronic device with multiple antennas according to the present application. The electronic device 1 includes a main antenna 11, an auxiliary antenna 12, a switching circuit 13, a communication module 14, and a control circuit 15. In fig. 1, the electronic device 1 includes a set of communication modules 14 as an example, but the present application is not limited thereto. The electronic device 1 may also include two or more sets of communication modules. The switching circuit 13 is coupled between the main antenna 11 and the communication module 14 and between the auxiliary antenna 12 and the communication module 14, and the switching circuit 13 is coupled to the control circuit 15 and controlled by the control circuit 15. The control circuit 15 can control the switching circuit 13 to couple to the main antenna 11 or the auxiliary antenna 12 in real time according to the operating state of the electronic device 1, so that the communication module 14 correspondingly transmits and receives radio frequency signals through the main antenna 11 or the auxiliary antenna 12 according to the operating state of the electronic device 1. In one embodiment, the communication module 14 includes a modem, a radio frequency front end transceiver circuit, and other circuit components that support communication transmission.
Fig. 1 is a schematic structural diagram of a pressure-sensitive touch device 10 according to an embodiment of the present invention, and referring to fig. 1, the pressure-sensitive touch device 10 includes a first substrate 12, a second substrate 14 disposed opposite to the first substrate 12, and a first patterned conductive layer 16, an insulating layer 18, a second patterned conductive layer 20, a plurality of variable pressure-sensitive materials 24, and a third patterned conductive layer 22 sequentially stacked from top to bottom between the first substrate 12 and the second substrate 14. In detail, the first patterned conductive layer 16 is located on the lower surface of the first substrate 12 close to the second substrate 14, the insulating layer 18 is located on the surface of the first patterned conductive layer 16 close to the second substrate 14 and covers the first patterned conductive layer 16, the second patterned conductive layer 20 is located on the surface of the insulating layer 18 close to the second substrate 14, and a vertical projection of the second patterned conductive layer 20 on the second substrate 14 is staggered with a vertical projection of the first patterned conductive layer 16 on the second substrate 14. The third patterned conductive layer 22 is disposed on the second substrate 14 near the upper surface of the first substrate 12, and a vertical projection of the third patterned conductive layer 22 on the second substrate 14 is staggered from a vertical projection of the second patterned conductive layer 20 on the second substrate 14. The variable pressure sensitive material 24 is connected between the second patterned conductive layer 20 and the third patterned conductive layer 22. The pressure-sensitive touch device 10 further includes a plurality of spacers 26, wherein the spacers 26 are located between the second substrate 14 and the second patterned conductive layer 20 and in gaps between the variable pressure-sensitive materials 24 to support the first substrate 12 and the second substrate 14.
In one embodiment, the first patterned conductive layer 16 includes a plurality of capacitive sensing electrodes 161 arranged along a first direction for generating a touch sensing signal. The second patterned conductive layer 20 includes a plurality of common electrodes 201 disposed along the second direction for receiving the scanning signal, and the vertical projections of the common electrodes 201 on the second substrate 14 are staggered with the vertical projections of the capacitive sensing electrodes 161 on the second substrate 14. The third patterned conductive layer 22 includes a plurality of pressure sensing electrodes 221 disposed along the first direction for receiving pressure sensing signals, and vertical projections of the pressure sensing electrodes 221 on the second substrate 14 are staggered with vertical projections of the common electrodes 201 on the second substrate 14. In one embodiment, the first direction is perpendicular to the second direction. In the present embodiment, the first direction is a Y-axis direction, and the second direction is an X-axis direction, so that the overlapping position of each of the capacitive sensing electrodes 161 and each of the common electrodes 201 corresponds to the overlapping position of each of the common electrodes 201 and each of the pressure sensing electrodes 221 and the variable pressure sensitive material 24 therebetween, and the corresponding capacitive sensing electrode 161, each of the common electrodes 201, the variable pressure sensitive material 24 and the pressure sensing electrode 221 form a sensing unit 28. In one embodiment, the number of the capacitive sensing electrodes 161, the common electrode 201 and the pressure sensing electrodes 221 is the same.
In one embodiment, the variable pressure sensitive material 24 is an elastic body with conductive particles distributed therein, the conductive particles are arranged with a certain gap in a generally non-pressed state, and when a pressure is applied from the outside, the upper and lower adjacent conductive particles are contacted with each other to conduct electricity due to a vertical stress, so that the conductivity is improved, and the impedance is relatively reduced, so as to serve as the pressure sensing purpose of the present application according to the physical characteristics.
Fig. 2A to 2I are schematic structural diagrams of steps of manufacturing an embodiment of the pressure-sensitive touch device according to the present application. As shown in fig. 2A, a first substrate 12 is obtained and cleaned. In one embodiment, the first substrate 12 can be made of, but not limited to, glass or plastic, and can be designed to be transparent or opaque.
As shown in fig. 2B, a photolithography process of a conductive material is performed on a surface of the first substrate 12, and deposition, exposure, photolithography, etching and other steps are sequentially performed to form a first patterned conductive layer 16 (including a plurality of capacitive sensing electrodes 161 arranged along a first direction) on the first substrate 12. In one embodiment, the first patterned conductive layer 16 may be, but not limited to, Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), or metal.
As shown in fig. 2C, an insulating material is plated on the surface of the first patterned conductive layer 16 to form an insulating layer (insulator layer)18, which is used to protect the first patterned conductive layer 16 and serve as a capacitive coupling dielectric layer. In one embodiment, the material of the insulating layer 18 may be, but is not limited to, silicon dioxide (SiO)2) Or silicon nitride (SNx).
As shown in fig. 2D, a photolithography process of a conductive material is further performed on the surface of the insulating layer 18 on the first substrate 12, and deposition, exposure, photolithography, etching and other steps are sequentially performed to form a second patterned conductive layer 20 (including a plurality of common electrodes 201 disposed along a second direction) on the insulating layer 18. In one embodiment, the second patterned conductive layer 20 may be, but not limited to, Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), or metal.
As shown in FIG. 2E, a second substrate 14 is obtained and cleaned, and the second substrate 14 is preferably made of a hard material. In one embodiment, the second substrate 14 may be made of, but not limited to, glass or plastic, and may be a transparent or opaque structure.
As shown in fig. 2F, a photolithography process of a conductive material is performed on the upper surface of the second substrate 14, and deposition, exposure, photolithography, etching and other steps are sequentially performed to form a third patterned conductive layer 22 (including a plurality of pressure sensing electrodes 221 arranged along the first direction) on the second substrate 14. In one embodiment, the third patterned conductive layer 22 may be, but not limited to, Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), or metal.
As shown in fig. 2G, a spacer (spacer) spraying process is performed uniformly on the surface of the second substrate 14 on which the third patterned conductive layer 22 is formed, so as to uniformly form a plurality of spacers 26 on the second substrate 14, wherein the spacers 26 are used to prevent the occurrence of collapse during the subsequent assembly of the first substrate 12 and the second substrate 14. In one embodiment, the spacer 26 may be made of, but not limited to, a material such as aluminum, copper, or copperTransparent insulating glue of gram force, silicon dioxide (SiO)2) Or silicon nitride (SNx).
As shown in fig. 2H, a sealant (not shown) is applied on the second substrate 14 and is cured by uv irradiation, which prevents the liquid pressure-sensitive material from overflowing to the inactive area. In this step, a drop-filling (drop-filling) method is used to drop the liquid pressure-sensitive material on the surface of the third patterned conductive layer 22 on the second substrate 14 to form a plurality of variable pressure-sensitive materials 24.
As shown in fig. 2I, the first substrate 12 and the second substrate 14 are aligned and assembled, and the first substrate 12 and the second substrate 14 are combined by a photosensitive coupled device (CCD) to form a complete pressure-sensitive touch device 10.
Fig. 3 is a schematic diagram of a driving architecture of a pressure-sensitive touch device according to an embodiment of the present disclosure. Fig. 4 is a schematic diagram of an equivalent circuit model of a sensing unit 28 of the pressure-sensitive touch device according to an embodiment of the present invention. Referring to fig. 1, 3 and 4, a first parasitic resistor R is formed between the capacitance sensing electrode 161 and the common electrode 201TAnd a first parasitic capacitor CTWhen scanning the signal SDWhen the voltage is inputted to the common electrode 201, it will be applied to the first parasitic capacitance CTGenerate charge/discharge behavior, and change the first parasitic capacitance C when a finger or a conductive object touches the surface of the pressure-sensitive touch component 10 (when the touch behavior occurs)TThe original charging and discharging mechanism causes the touch sensing signal S received by the capacitive sensing electrode 161CWill be changed according to the touch sensing signal SCAnd confirming the occurrence position of the touch behavior. Due to the function of the variable pressure sensitive material 24, a parasitic variable resistor R is formed between the common electrode 201 and the pressure sensing electrode 221VAnd a second parasitic capacitor CVA Resistance Capacitance (RC) model of (1), wherein the variable resistance RVThe variable pressure-sensitive material 24 changes with the pressure applied to the surface of the pressure-sensitive touch device 10, and when a finger or a conductive object applies a pressure to the upper surface of the first substrate 12 of the pressure-sensitive touch device 10, the variable pressure-sensitive material 24 changes its impedance due to compression deformation,the corresponding voltage variation can be obtained properly through the impedance variation to generate the pressure sensing signal SFSo as to obtain the pressing force of the touch behavior through the voltage variation.
In each sensing unit 28, a first parasitic resistance R exists between the capacitive sensing electrode 161 and the common electrode 201TAnd a first parasitic capacitance CTParasitic variable resistance R exists between the shared electrode 201 and the pressure sensing electrode 221VAnd a second parasitic capacitor CVWherein the second parasitic capacitance C is caused by the extremely low dielectric coefficient of the variable pressure sensitive material 24VWill also be small when the second parasitic capacitance CVWhen the value of (A) is small, the second parasitic capacitance CVBecomes very large, and can be considered as an open circuit, so that only the variable resistor R can be considered in the circuit modelV。
In addition, in order to extract the deformation information of the variable pressure sensing material 24, a resistor R is connected to each pressure sensing electrode 2211. In one embodiment, the pressure sensing electrodes 221 may be connected to a resistor R respectively1Or share a resistor R1In the present embodiment, one resistor R is shared1. As shown in FIG. 5, the pressure sensing electrode 221 and the resistor R1A multiplexer 30 is connected between them. Each switch SW in the multiplexer 301～SWmIs correspondingly connected to the variable resistor RV1～RVm, the multiplexing selector 30 can receive the scanning signal S according to the shared electrode 201DTurn on the corresponding switch SW1～SWmTo selectively conduct the corresponding pressure sensing electrode 221 and resistor R1To thereby make one of the variable resistors RV(hereinafter referred to as R)VAs RV1～RVmRepresentative of (b) and a resistor R1Form a series relationship to pass through the variable resistor RVAnd resistor R of fixed resistance value1The function of the resistor is to calculate the voltage division when the variable resistor RVWhen the impedance of the variable pressure sensitive material 24 changes (i.e., when the variable pressure sensitive material 24 deforms), the overall impedance changes, causing a change in the divided voltage value, and the divided voltage value (i.e.,pressure sensing signal SF) The corresponding voltage change can be used to obtain the pressing force of the touch behavior.
FIG. 6 is a block diagram of an electronic device according to an embodiment of the present disclosure. Fig. 7 is an equivalent circuit diagram of an embodiment of a pressure-sensitive touch device without touch behavior according to the present application. Referring to fig. 1, 3 and 6-7, an electronic device 38 includes a processor 40 and a pressure-sensitive touch device 10 electrically connected thereto. The processor 40 is used for driving and sensing the aforementioned pressure-sensitive touch device 10. In one embodiment, the electronic device 38 may be a notebook computer or a tablet computer. The processor 40 includes a driving scan circuit 42, a capacitive touch sensing circuit 44, a resistive pressure sensing circuit 46, and a processing circuit 48. The driving scan circuit 42 is electrically connected to the common electrodes 201 through a plurality of driving scan lines 50 for sequentially transmitting a scan signal S through the driving scan lines 50DTo the corresponding shared electrode 201. The capacitive touch sensing circuit 44 is electrically connected to the capacitive sensing electrodes 161 through a plurality of capacitive sensing lines 52. The resistive pressure sensing circuit 46 is electrically connected to the pressure sensing electrodes 221 through a plurality of pressure sensing lines 54. Each capacitive sensing electrode 161 and the corresponding common electrode 201 form a capacitive touch sensing loop L1For detecting the touch sensing signal SC. Then, each capacitive sensing electrode 161 outputs the touch sensing signal SCThrough the capacitive sense lines 52 to the processor 40. The processor 40 generates a touch sensing signal S according to the capacitive sensing electrode 161CTo determine the occurrence location of the touch behavior. Similarly, when the common electrodes 201 sequentially receive the scan signal SDAt this time, each group of the corresponding common electrode 201, variable pressure sensitive material 24, pressure sensing electrode 221 and resistor R1Together form a voltage dependent resistor sensing loop L2For detecting the pressure sensing signal SF. Then, each pressure sensing electrode 221 outputs a pressure sensing signal SFTransmitted to the processor 40 through the pressure-sensitive sensing lines 54, and the processor 40 outputs the pressure-sensitive sensing signals SFThe pressing force of the touch behavior is determined. In other words, the scanning signals generated when the scanning circuit 42 is drivenNumber SDWhen the voltage is inputted to the common electrode 201, there will be a first parasitic resistance RTAnd a first parasitic capacitance CTComposed capacitive touch sensing loop L1And by a variable resistor RVAnd a resistor R1Composed piezoresistor sensing loop L2。
In detail, the processing circuit 48 is electrically connected to the driving scanning circuit 42, the capacitive touch sensing circuit 44 and the resistive pressure sensitive sensing circuit 46, and is used for generating the scanning signal SDWhen sequentially outputting to the common electrode 201, the capacitive touch sensing loop L in the pressure-sensitive touch device 101And a piezoresistor sensing loop L2Will simultaneously detect the signals and touch the capacitive touch sensing loop L1Detected touch sensing signal SCTo the capacitive touch sensing circuit 44 and the piezoresistive sensing circuit L2Detected pressure sensing signal SFTo the resistive pressure sensitive sensing circuit 46. Then, the capacitive touch sensing circuit 44 will receive the touch sensing signal SCConverts the coordinate information signal into a coordinate information signal (in this embodiment, the coordinate information signal is a digital signal) and transmits the coordinate information signal to the processing circuit 48, and the resistive and pressure sensitive sensing circuit 46 receives the pressure sensing signal SFConverts into a pressure information signal (in this embodiment, the pressure information signal is a digital signal) and transmits the pressure information signal to the processing circuit 48. After receiving the coordinate information signal and the pressure information signal, the processing circuit 48 can determine the occurrence position of the touch behavior (e.g., a capacitive touch coordinate point) according to the coordinate information signal, and determine the pressing force of the touch behavior according to the pressure information signal (e.g., perform a resistive and pressure sensitive Z-axis information comparison analysis according to the pressure information signal to determine the pressing force of the touch behavior).
In one embodiment, at least two of the driving scan circuit 42, the capacitive touch sensing circuit 44, the resistive pressure sensing circuit 46, or the processing circuit 48 may be integrated in the same Integrated Circuit (IC). In another embodiment, the driving scan circuit 42, the capacitive touch sensing circuit 44, the resistive-pressure sensing circuit 46, and the processing circuit 48 are independent ICs.
In one embodiment, the processing circuit 48 may be implemented by a system on a chip (SoC), a Microcontroller (MCU), a Central Processing Unit (CPU), an Application Specific Integrated Circuit (ASIC), or the like.
Referring to fig. 1, 6, 7 and 8, the capacitive touch sensing loop L1In, capacitive touch sensing loop L1Can be regarded as an RC charging/discharging circuit, when a finger or a conductive object exerts a pressure on the pressure-sensitive touch device 10, an additional finger capacitor C is generatedFingerTo change the capacitance touch sensing loop L1Thereby changing the first voltage of the first node a (i.e., the touch sensing signal S)C) Then, the capacitive touch sensing circuit 44 converts the first voltage into a coordinate information signal and transmits the coordinate information signal to the processing circuit 48, and the processing circuit 48 determines the occurrence position of the touch behavior according to the change of the coordinate information signal. At the same time, in the piezoresistor sensing loop L2In, the voltage dependent resistor sensing loop L2Can be regarded as a basic voltage dividing circuit, when there is a pressure (external force) to change the variable pressure-sensitive material 24, the variable resistance R will be causedVA change is made. When the pressing force is large, the variable resistor RVThe resistance value of (2) becomes small, and when the pressing force is small, the variable resistor R becomes smallVThe resistance value of (2) becomes large. Thus passing through the variable resistor RVResistance value change of and external resistor R1The voltage division process is performed to generate a second voltage (i.e., the pressure sensing signal S) of the second node BF). The resistive pressure sensing circuit 46 then converts the second voltage into a pressure information signal and transmits the pressure information signal to the processing circuit 48. The processing circuit 48 determines the pressing force of the touch behavior according to the change of the pressure information signal.
In one embodiment, resistor R is known1Is 1k omega, a first parasitic resistance RT30k omega, a first parasitic capacitance CTFor 100pF, sweep signal SDInput voltage V ofHIs 5V. In the non-pressed state, it means that no finger or conductive object is pressed on the surface of the pressure-sensitive touch device 10, and the variable resistor R is at this timeV10k omega, the processing circuit 48 is based on the input voltage VHIs 5V, resistor R1Is 1k omega and a variable resistor RVThe second voltage of the second node B is calculated to be 5 × 0.45V for the parametric information such as 10k Ω (1/(1+ 10)). In the light-pressing state, it indicates that a finger or a conductive object is pressed on the surface of the pressure-sensitive touch component 10, and at this time, the finger capacitor CFingerGenerated at 5pF, variable resistor RVBecomes 5k omega, the processing circuit 48 is responsive to the input voltage VHIs 5V, resistor R1Is 1k omega and a variable resistor RVThe second voltage of the second node B is calculated to be 5 × 0.83V for the parametric information such as 5k Ω (1/(1+ 5)).
FIG. 9 is a block diagram of an electronic device according to another embodiment of the present disclosure. Fig. 10 and 11 are schematic diagrams of a first driving architecture of the common electrode 201 and the pressure sensing electrode 221 according to the present application and equivalent circuit models thereof. Fig. 12 and 13 are schematic diagrams of a second driving architecture of the common electrode 201 and the pressure sensing electrode 221 according to the present application and equivalent circuit models thereof. Referring to fig. 1, fig. 3 and fig. 9 to fig. 13, an electronic device 38 includes a processor 40 and the pressure-sensitive touch device 10 electrically connected to the processor 40. In the processor 40, the driving scan circuit 42 is electrically connected to the common electrodes 201 through a plurality of driving scan lines 50 for sequentially generating scan signals to the corresponding common electrodes 201. The capacitive touch sensing circuit 44 is electrically connected to the capacitive sensing electrodes 161 through a plurality of capacitive sensing lines 52. The resistive-pressure sensing circuit 46 is electrically connected to the common electrodes 201 and the pressure sensing electrodes 221 through the pressure sensing lines 54 and the pressure driving lines 56. The resistive-pressure sensing circuit 46 receives the first divided voltage value and the second divided voltage value from the common electrodes 201 and the pressure sensing electrodes 221 through the pressure sensing lines 54 and the pressure driving lines 56. Each capacitive sensing electrode 161 and the corresponding common electrode 201 form a capacitive touch sensing loop L1For detecting the touch sensing signal SC. Then, each capacitive sensing electrode 161 outputs the touch sensing signal SCAnd transmitted to processor 40 via capacitive sense line 52. The processor 40 generates a touch sensing signal S according to the capacitive sensing electrodes 161CTo determine the occurrence location of the touch behavior. Each group consisting ofThe corresponding common electrode 201, variable pressure-sensitive material 24 and pressure-sensing electrode 221 form a pressure-sensitive resistance sensing loop L2The first and second voltage dividing values are detected. Then, each of the common electrodes 201 transmits the first divided voltage value to the processor 40, each of the pressure sensing electrodes 221 transmits the second divided voltage value to the processor 40, and the processor 40 determines the pressing force of the touch behavior according to the first divided voltage values and the second divided voltage values.
In detail, the capacitive touch sensing circuit 44 receives the touch sensing signal generated by each capacitive sensing electrode 161. Wherein, the capacitive touch sensing loop L1The detailed description of the operation of this portion is the same as that of the previous embodiment, and therefore, the detailed description thereof is omitted. At each of the capacitive touch sensing loops L1After detecting the touch sensing signal, the loop L is sensed in the voltage dependent resistor2In the driving and scanning circuit 42, a dc voltage is sequentially provided to the first terminals V11-V14 of each common electrode 201, and the pressure sensing electrode 221 is sequentially grounded to GND by the pressure sensing circuit 46, and the first divided voltage values are sequentially received by the second terminals C11-C14 of the common electrodes 201 and transmitted to the pressure sensing circuit 46. Then, the rc/vss circuit 46 sequentially provides a dc voltage to the first terminals V21-V24 of each of the pressure sensing electrodes 221, and the driving scan circuit 42 sequentially connects the common electrode 201 to GND, and receives the second divided voltage value from the second terminals C21-C24 of the pressure sensing electrodes 221, and transmits the second divided voltage value to the rc/vss circuit 46.
The processing circuit 48 is electrically connected to the driving scanning circuit 42, the capacitive touch sensing circuit 44 and the resistive pressure sensing circuit 46, the capacitive touch sensing circuit 44 converts the touch sensing signal into a coordinate information signal and transmits the coordinate information signal to the processing circuit 48, and the processing circuit 48 determines the occurrence position of the touch behavior according to the change of the coordinate information signal. The resistive pressure sensing circuit 46 converts the first voltage division value and the second voltage division value into a pressure information signal and transmits the pressure information signal to the processing circuit 48, and the processing circuit 48 determines the pressing force of the touch behavior according to the pressure information signal.
In one embodiment of the present invention, the substrate is,taking the sensing unit at the upper left corner as an example, the common electrode 201 has a second parasitic resistance RCThe voltage sensitive material 24 has a variable resistor RVAnd the pressure sensing electrode 221 has a third parasitic resistance RFTo utilize the second parasitic resistance RCVariable resistor RVAnd a third parasitic resistance RFForming a piezoresistor sensing loop L2. In detail, a DC voltage V is applied to the first terminal V11 of the common electrode 201DCThe corresponding pressure sensing electrode 221 is grounded to GND (as shown in fig. 11). At this time, the first partial pressure V is collected from the second end C11 of the common electrode 201C11Information, the equation of partial pressure is:
wherein the variable resistor RVThe resistance value of (2) varies depending on the pressing force. Each of the common electrodes 201 is applied with a DC voltage V in sequenceDCAnd outputs the first divided voltage values (including V) until all the common electrodes 201 output the first divided voltage valuesC11) Is transmitted to the resistive pressure sensing circuit 46 for signal processing. After all the common electrodes 201 output the first divided voltage value, the pressure sensing electrodes 221 are driven. Applying a DC voltage V to the first end V21 of the pressure sensing electrode 221DCThe corresponding common electrode 201 is grounded to GND (as shown in FIG. 13), and the pressure sensing is performed at this time
The second terminal C21 of the pole 221 collects the second divided voltage VC21The equation of partial pressure is:
wherein the variable resistor RVThe resistance value of (2) varies depending on the pressing force. Each pressure sensing electrode 221 is sequentially applied with a DC voltage VDCAnd outputs the second divided voltage value until all the pressure sensing electrodes 221 output the second divided voltage valueSo far, these second divided voltage values (including V)C21) Is transmitted to the resistive pressure sensing circuit 46 for signal processing.
After the resistive pressure sensing circuit 46 processes the corresponding first and second divided voltage values, a pressure information signal is generated and transmitted to the processing circuit 48. Then, the processing circuit 48 determines the pressing force of the touch behavior according to the change of the pressure information signal.
Therefore, the present application provides a pressure-sensitive touch component for three-dimensional touch detection and a driving device thereof. The pressure-sensitive touch control assembly is controlled and sensed by the upper two-dimensional capacitive structure in cooperation with the lower inductive resistive structure and three layers of electrodes (the capacitive sensing electrode, the shared electrode and the pressure sensing electrode) respectively, and is matched with time sequence switching, so that the pressure-sensitive touch control assembly can provide two-dimensional coordinate identification capability and three-dimensional space information acquisition (a depth pressure sensing function) at the same time, and diversified and rich application is provided. Moreover, through the structural design of the pressure-sensitive touch control assembly, the problems of stability and accuracy caused by assembly alignment errors can be solved.
The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the technology of the present application, and are not intended to limit the implementations of the technology of the present application in any way, and those skilled in the art can make modifications or changes to other equivalent embodiments without departing from the scope of the technology disclosed in the present application, but should be construed as technology or implementations substantially the same as the present application.
Claims (23)
1. A pressure-sensitive touch control assembly is characterized by comprising a first substrate, a second substrate, a first patterned conductive layer, an insulating layer, a second patterned conductive layer, a plurality of variable pressure-sensitive materials and a third patterned conductive layer, wherein the first patterned conductive layer, the insulating layer, the second patterned conductive layer, the plurality of variable pressure-sensitive materials and the third patterned conductive layer are sequentially stacked between the first substrate and the second substrate from top to bottom.
2. The pressure sensitive touch assembly of claim 1, further comprising a plurality of spacers located between the second patterned conductive layer and the second substrate and in gaps between the variable pressure sensitive materials.
3. The pressure-sensitive touch device according to claim 1, wherein the first patterned conductive layer comprises a plurality of capacitive sensing electrodes, the second patterned conductive layer comprises a plurality of common electrodes, the third patterned conductive layer comprises a plurality of pressure sensing electrodes, and a vertical projection of the common electrodes on the second substrate is staggered with a vertical projection of the capacitive sensing electrodes on the second substrate, and a vertical projection of the pressure sensing electrodes on the second substrate is staggered with a vertical projection of the common electrodes on the second substrate.
4. The pressure-sensitive touch device according to claim 3, wherein the common electrodes sequentially receive a scanning signal, so that each of the common electrodes and the corresponding capacitive sensing electrode form a capacitive touch sensing loop for detecting a touch sensing signal.
5. The pressure-sensitive touch assembly of claim 4, wherein each of the pressure-sensing electrodes is connected to a resistor, and when the common electrodes receive the scanning signals in sequence, each corresponding group of the common electrodes, the variable pressure-sensitive material, the pressure-sensing electrodes, and the resistors form a pressure-sensitive resistance sensing loop together for detecting pressure-sensing signals.
6. The pressure-sensitive touch device according to claim 4, wherein the pressure-sensing electrodes are further selectively connected to a resistor through a multiplexer, and the multiplexer selectively connects the corresponding pressure-sensing electrodes to the resistor according to the scanning signal, so that the common electrode, the variable pressure-sensitive material, the pressure-sensing electrodes, and the resistor in each group form a pressure-sensitive resistance sensing loop in sequence for detecting the pressure-sensing signal.
7. The pressure-sensitive touch device according to claim 4, wherein a dc voltage is sequentially applied to the first end of each of the common electrodes, and each of the pressure-sensing electrodes is grounded, so that each set of the corresponding common electrode, the variable pressure-sensitive material and the pressure-sensing electrode together form a pressure-sensitive resistance sensing loop, and the second end of each of the common electrodes is used to receive the first divided voltage value; and sequentially providing the direct-current voltage to the first end of each of the pressure sensing electrodes, grounding each of the shared electrodes, enabling each group of the corresponding shared electrodes, the variable pressure sensitive material and the pressure sensing electrodes to jointly form the piezoresistance sensing loop, and receiving a second voltage division value by using the second end of each of the pressure sensing electrodes.
8. An electronic device, comprising:
the pressure-sensitive touch control assembly comprises a first substrate, a second substrate, a first patterned conductive layer, an insulating layer, a second patterned conductive layer, a plurality of variable pressure-sensitive materials and a third patterned conductive layer, wherein the first patterned conductive layer, the insulating layer, the second patterned conductive layer, the plurality of variable pressure-sensitive materials and the third patterned conductive layer are sequentially stacked between the first substrate and the second substrate from top to bottom; and
a processor electrically connected to the pressure-sensitive touch component,
the processor determines the occurrence position of the touch behavior according to the touch sensing signal transmitted by each of the capacitive sensing electrodes, and the processor determines the pressing force of the touch behavior according to the pressure sensing signal transmitted by each of the pressure sensing electrodes.
9. The electronic device of claim 8, wherein the processor comprises:
the driving scanning circuit is electrically connected with the shared electrodes to sequentially generate scanning signals to the corresponding shared electrodes;
a capacitive touch sensing circuit electrically connected to the capacitive sensing electrodes, wherein each of the capacitive sensing electrodes and the corresponding shared electrode form a capacitive touch sensing loop for detecting the touch sensing signal, and the capacitive touch sensing circuit receives the touch sensing signal from each of the capacitive sensing electrodes;
a resistance-pressure sensing circuit electrically connected to the pressure sensing electrodes, each of the pressure sensing electrodes being connected to a resistor, each set of the corresponding common electrode, the variable pressure sensitive material, the pressure sensing electrode and the resistor together forming a pressure-sensitive resistance sensing loop for detecting the pressure sensing signal, the resistance-pressure sensing circuit receiving the pressure sensing signal from each of the pressure sensing electrodes; and
and the processing circuit is electrically connected with the driving scanning circuit, the capacitance touch sensing circuit and the resistance pressure-sensitive sensing circuit.
10. The electronic device as claimed in claim 9, wherein the capacitive touch sensing circuit converts each of the touch sensing signals received into coordinate information signals and transmits the coordinate information signals to the processing circuit, and the processing circuit determines the occurrence position of the touch behavior according to the coordinate information signals.
11. The electronic device according to claim 10, wherein the resistive pressure sensitive sensing circuit converts each of the received pressure sensing signals into a pressure information signal and transmits the pressure information signals to the processing circuit, and the processing circuit determines the pressing force of the touch behavior according to the pressure information signals.
12. The electronic device of claim 8, wherein the pressure sensitive touch component further comprises a plurality of spacers located between the second patterned conductive layer and the second substrate and at gaps between the variable pressure sensitive materials.
13. The electronic device of claim 9, wherein the pressure sensing electrodes are further connected to the resistors through a multiplexer, the multiplexer selectively turning on the connection between the corresponding pressure sensing electrode and the resistor according to the scan signal.
14. The electronic device of claim 9, wherein said resistor is plural, and each of said pressure sensing electrodes is connected to said resistor.
15. The electronic device of claim 9, wherein at least two of the driving circuit, the capacitive touch sensing circuit, the resistive pressure sensing circuit, or the processing circuit are integrated in a same integrated circuit.
16. The electronic device according to claim 9, wherein the driving scanning circuit is connected to the common electrodes through a plurality of driving scanning lines; the capacitance touch sensing circuit is connected with the capacitance sensing electrodes through a plurality of capacitance sensing lines; and the resistance pressure-sensitive sensing circuit is connected with the pressure sensing electrodes through a plurality of pressure-sensitive sensing lines.
17. An electronic device, comprising:
the pressure-sensitive touch control assembly comprises a first substrate, a second substrate, a first patterned conductive layer, an insulating layer, a second patterned conductive layer, a plurality of variable pressure-sensitive materials and a third patterned conductive layer, wherein the first patterned conductive layer, the insulating layer, the second patterned conductive layer, the plurality of variable pressure-sensitive materials and the third patterned conductive layer are sequentially stacked between the first substrate and the second substrate from top to bottom; and
a processor electrically connected to the pressure-sensitive touch component,
the processor determines the occurrence position of the touch behavior according to the touch sensing signal transmitted by each of the capacitive sensing electrodes, and the processor determines the pressing force of the touch behavior according to the first partial pressure value transmitted by each of the shared electrodes and the second partial pressure value transmitted by each of the pressure sensing electrodes.
18. The electronic device of claim 17, wherein the processor comprises:
the driving scanning circuit is electrically connected with the shared electrodes to sequentially generate scanning signals to the corresponding shared electrodes;
a capacitive touch sensing circuit electrically connected to the capacitive sensing electrodes, wherein each of the capacitive sensing electrodes and the corresponding shared electrode form a capacitive touch sensing loop for detecting a touch sensing signal, and the capacitive touch sensing circuit receives the touch sensing signal from each of the capacitive sensing electrodes; and
a resistance pressure sensitive sensing circuit electrically connected to the pressure sensing electrodes, wherein each group of the corresponding shared electrode, the variable pressure sensitive material and the pressure sensing electrode together form a pressure sensitive resistance sensing loop,
wherein, after each of the capacitive touch sensing loops detects the touch sensing signal, the driving scanning circuit sequentially provides a direct current voltage to the first end of each shared electrode, and the resistance pressure-sensitive sensing circuit enables each pressure sensing electrode to be grounded, and the second end of each of the shared electrodes is used for receiving a first voltage division value, the resistance-pressure sensitive sensing circuit sequentially provides the direct current voltage for the first end of each of the pressure sensing electrodes, and the driving scanning circuit enables each of the shared electrodes to be grounded, and receiving a second divided voltage value with a second end of each of said pressure sensing electrodes, said resistive pressure sensing circuit receiving said first divided voltage value from said second end of each of said shared electrodes and receiving said second divided voltage value from said second end of each of said pressure sensing electrodes; and
and the processing circuit is electrically connected with the driving scanning circuit, the capacitance touch sensing circuit and the resistance pressure-sensitive sensing circuit.
19. The electronic device as claimed in claim 18, wherein the capacitive touch sensing circuit converts each of the touch sensing signals received into coordinate information signals and transmits the coordinate information signals to the processing circuit, and the processing circuit determines the occurrence position of the touch behavior according to the coordinate information signals.
20. The electronic device according to claim 19, wherein the resistive-pressure sensing circuit performs signal processing on each of the received first partial pressure values and the corresponding second partial pressure value to generate a pressure information signal and transmits the pressure information signal to the processing circuit, and the processing circuit determines the pressing force of the touch behavior according to the pressure information signals.
21. The electronic device of claim 17, wherein the pressure sensitive touch component further comprises a plurality of spacers located between the second patterned conductive layer and the second substrate and at gaps between the variable pressure sensitive materials.
22. The electronic device of claim 18, wherein at least two of the driving circuit, the capacitive touch sensing circuit, the resistive pressure sensing circuit, or the processing circuit are integrated in a same integrated circuit.
23. The electronic device according to claim 18, wherein the driving scanning circuit is connected to the common electrodes through a plurality of driving scanning lines; the capacitance touch sensing circuit is connected with the capacitance sensing electrodes through a plurality of capacitance sensing lines; and the resistance pressure-sensitive sensing circuit is connected with the pressure sensing electrodes and the shared electrodes through a plurality of pressure-sensitive sensing lines and a plurality of pressure-sensitive driving lines.
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