CN112437976B - 气体分配器和流量校验器 - Google Patents

气体分配器和流量校验器 Download PDF

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Publication number
CN112437976B
CN112437976B CN201980048175.0A CN201980048175A CN112437976B CN 112437976 B CN112437976 B CN 112437976B CN 201980048175 A CN201980048175 A CN 201980048175A CN 112437976 B CN112437976 B CN 112437976B
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CN
China
Prior art keywords
gas
array
outlets
central
distribution point
Prior art date
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Application number
CN201980048175.0A
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English (en)
Chinese (zh)
Other versions
CN112437976A (zh
Inventor
马克·塔斯卡尔
伊克巴尔·A·谢里夫
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Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN202510384181.0A priority Critical patent/CN120332666A/zh
Publication of CN112437976A publication Critical patent/CN112437976A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00—Pipe-line systems
    • F17D1/02—Pipe-line systems for gases or vapours
    • F17D1/04—Pipe-line systems for gases or vapours for distribution of gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D3/00—Arrangements for supervising or controlling working operations
    • F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
    • F16K11/10—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Automation & Control Theory (AREA)
  • Gas Separation By Absorption (AREA)
CN201980048175.0A 2018-07-19 2019-07-18 气体分配器和流量校验器 Active CN112437976B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202510384181.0A CN120332666A (zh) 2018-07-19 2019-07-18 气体分配器和流量校验器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/040,326 US10943769B2 (en) 2018-07-19 2018-07-19 Gas distributor and flow verifier
US16/040,326 2018-07-19
PCT/US2019/042490 WO2020018850A1 (en) 2018-07-19 2019-07-18 Gas distributor and flow verifier

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202510384181.0A Division CN120332666A (zh) 2018-07-19 2019-07-18 气体分配器和流量校验器

Publications (2)

Publication Number Publication Date
CN112437976A CN112437976A (zh) 2021-03-02
CN112437976B true CN112437976B (zh) 2025-04-22

Family

ID=69162522

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201980048175.0A Active CN112437976B (zh) 2018-07-19 2019-07-18 气体分配器和流量校验器
CN202510384181.0A Pending CN120332666A (zh) 2018-07-19 2019-07-18 气体分配器和流量校验器

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202510384181.0A Pending CN120332666A (zh) 2018-07-19 2019-07-18 气体分配器和流量校验器

Country Status (6)

Country Link
US (2) US10943769B2 (https=)
JP (2) JP7410120B2 (https=)
KR (2) KR102763394B1 (https=)
CN (2) CN112437976B (https=)
TW (2) TWI821336B (https=)
WO (1) WO2020018850A1 (https=)

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* Cited by examiner, † Cited by third party
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US10256075B2 (en) * 2016-01-22 2019-04-09 Applied Materials, Inc. Gas splitting by time average injection into different zones by fast gas valves
US10943769B2 (en) 2018-07-19 2021-03-09 Lam Research Corporation Gas distributor and flow verifier
US11495486B2 (en) * 2019-03-01 2022-11-08 Lam Research Corporation Integrated tool lift
CN114121585B (zh) * 2020-08-26 2023-10-31 中微半导体设备(上海)股份有限公司 一种等离子体处理装置及气体供应方法
US12068135B2 (en) 2021-02-12 2024-08-20 Applied Materials, Inc. Fast gas exchange apparatus, system, and method
KR102627141B1 (ko) * 2023-07-20 2024-01-23 (주)효진이앤하이 플라즈마 가스 변환 시스템

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JP3442604B2 (ja) * 1996-02-15 2003-09-02 株式会社フジキン 混合ガスの供給方法及び混合ガス供給装置並びにこれらを備えた半導体製造装置
JP4454725B2 (ja) * 1998-12-28 2010-04-21 株式会社オムニ研究所 ガス混合装置およびガス混合ブロック
JP4764574B2 (ja) * 2001-08-31 2011-09-07 東京エレクトロン株式会社 処理装置の運転方法
US7335396B2 (en) * 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US7510624B2 (en) * 2004-12-17 2009-03-31 Applied Materials, Inc. Self-cooling gas delivery apparatus under high vacuum for high density plasma applications
US20080102011A1 (en) * 2006-10-27 2008-05-01 Applied Materials, Inc. Treatment of effluent containing chlorine-containing gas
CN101556904B (zh) * 2008-04-10 2010-12-01 北京北方微电子基地设备工艺研究中心有限责任公司 一种气体分配装置及应用该分配装置的半导体处理设备
US8236133B2 (en) 2008-05-05 2012-08-07 Applied Materials, Inc. Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension bias
WO2011159690A2 (en) * 2010-06-15 2011-12-22 Applied Materials, Inc. Multiple precursor showerhead with by-pass ports
KR101693673B1 (ko) 2010-06-23 2017-01-09 주성엔지니어링(주) 가스분배수단 및 이를 포함한 기판처리장치
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JP6123208B2 (ja) * 2012-09-28 2017-05-10 東京エレクトロン株式会社 成膜装置
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Also Published As

Publication number Publication date
TW202407927A (zh) 2024-02-16
JP2021532581A (ja) 2021-11-25
TW202018888A (zh) 2020-05-16
WO2020018850A1 (en) 2020-01-23
JP7410120B2 (ja) 2024-01-09
KR102932651B1 (ko) 2026-02-27
CN120332666A (zh) 2025-07-18
US10943769B2 (en) 2021-03-09
KR102763394B1 (ko) 2025-02-04
US20200027702A1 (en) 2020-01-23
JP7686055B2 (ja) 2025-05-30
KR20250018563A (ko) 2025-02-06
US11532460B2 (en) 2022-12-20
KR20210024200A (ko) 2021-03-04
TWI821336B (zh) 2023-11-11
US20210183626A1 (en) 2021-06-17
CN112437976A (zh) 2021-03-02
TWI893498B (zh) 2025-08-11
JP2024029058A (ja) 2024-03-05

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