CN112420573A - Silicon chip inserting device - Google Patents

Silicon chip inserting device Download PDF

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Publication number
CN112420573A
CN112420573A CN202011307980.1A CN202011307980A CN112420573A CN 112420573 A CN112420573 A CN 112420573A CN 202011307980 A CN202011307980 A CN 202011307980A CN 112420573 A CN112420573 A CN 112420573A
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CN
China
Prior art keywords
tray
sub
silicon wafer
subslot
included angle
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Pending
Application number
CN202011307980.1A
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Chinese (zh)
Inventor
刘晓鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Original Assignee
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Xian Eswin Silicon Wafer Technology Co Ltd, Xian Eswin Material Technology Co Ltd filed Critical Xian Eswin Silicon Wafer Technology Co Ltd
Priority to CN202011307980.1A priority Critical patent/CN112420573A/en
Publication of CN112420573A publication Critical patent/CN112420573A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a silicon wafer inserting device. Silicon chip inserted sheet device includes first tray, second tray and drive assembly, first tray with the second tray sets up relatively, be provided with the orientation on the first tray side by side a plurality of first draw-in grooves of second tray, be provided with the orientation on the second tray side by side a plurality of second draw-in grooves of first tray, first tray with drive assembly's transmission end links to each other, drive assembly is used for the drive first tray is to being close to or keeping away from the direction of second tray removes. In the use, drive first tray through drive assembly and remove to the direction that is close to the second tray mutually to cooperate through first draw-in groove and second draw-in groove, remove the silicon chip to appointed position, further accomplish the inserted sheet operation, like this, the technical scheme simple structure of this embodiment helps reducing the inserted sheet cost.

Description

Silicon chip inserting device
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a silicon wafer inserting device.
Background
In the production, processing and detection processes of semiconductors such as silicon wafers and the like, multiple transfer operations may be involved, for example, in the detection process of the silicon wafers, the silicon wafers may need to be sucked out of a wafer box by using a mechanical arm with a suction cup, and after the detection is finished, the silicon wafers are restored into the wafer box. However, the wafer recovery operation can be implemented by a wafer inserting machine, but the existing wafer inserting machine has a complex structure and relatively high cost.
Disclosure of Invention
The embodiment of the invention provides a silicon wafer inserting device, which aims to solve the problems that the existing silicon wafer inserting device is complex in structure and relatively high in cost.
The embodiment of the invention provides a silicon wafer inserting device which comprises a first tray, a second tray and a transmission assembly, wherein the first tray and the second tray are oppositely arranged, a plurality of first clamping grooves facing the second tray are arranged on the first tray in parallel, a plurality of second clamping grooves facing the first tray are arranged on the second tray in parallel, the first tray is connected with a transmission end of the transmission assembly, and the transmission assembly is used for driving the first tray to move towards a direction close to or away from the second tray.
In some embodiments, the first card slot has a first centerline in a direction perpendicular to the first tray, the first card slot includes a first subslot and a second subslot sequentially disposed along a surface away from the first tray, the first subslot and the second subslot are both symmetrically disposed about the first centerline.
In some embodiments, the depth of the first subslot is greater than the depth of the second subslot along the direction of extension of the first centerline.
In some embodiments, the first subslot of two adjacent first card slots abut.
In some embodiments, the distance between each two adjacent first card slots is equal, and the distance between the first center lines of the two adjacent first card slots is 9 to 11 mm.
In some embodiments, the first subslot includes two side walls, a first included angle is formed between the two side walls of the first subslot, the second subslot includes two side walls and a bottom surface, a second included angle is formed between the two side walls of the second subslot, and the first included angle is greater than the second included angle.
In some embodiments, the second card slot has a second centerline in a direction perpendicular to the second tray, the second card slot includes a third subslot and a fourth subslot sequentially disposed along a surface away from the second tray, the third subslot and the fourth subslot are both symmetrically disposed about the second centerline;
the third subslot comprises two side walls, a third included angle is formed between the two side walls of the third subslot, the fourth subslot comprises two side walls and a bottom surface, a fourth included angle is formed between the two side walls of the fourth subslot, and the third included angle is larger than the fourth included angle.
In some embodiments, the first included angle ranges from 15 to 25 degrees, the second included angle ranges from 80 to 100 degrees, the first included angle is smaller than or equal to the third included angle, and the second included angle is smaller than or equal to the fourth included angle.
In some embodiments, the second tray is disposed on the base through the damping buffer member, and the buffering direction of the damping buffer member includes a first direction, and the first direction is the same as the moving direction of the transmission end of the transmission assembly.
In some embodiments, the buffering direction of the damping bumper further includes a second direction, the second direction is perpendicular to the first direction, and the second direction is perpendicular to the extending direction of the first slot.
The silicon chip inserting device comprises a first tray, a second tray and a transmission assembly, wherein the first tray and the second tray are arranged oppositely, the first tray is provided with a plurality of first clamping grooves facing the second tray side by side, and the second tray is provided with a plurality of second clamping grooves facing the first tray side by side. In this embodiment, drive first tray through drive assembly and remove to the direction that is close to the second tray mutually to cooperate through first draw-in groove and second draw-in groove, remove the silicon chip to appointed position, further accomplish the inserted sheet operation, like this, the technical scheme simple structure of this embodiment helps reducing the inserted sheet cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of a silicon wafer inserting apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first card slot in an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a silicon wafer inserting device.
In one embodiment, the silicon wafer tuck tab apparatus comprises a base 101, a first tray 102, a second tray 103, and a drive assembly 104.
In this embodiment, the first tray 102 and the second tray 103 are both disposed on the base 101, the first tray 102 and the second tray 103 are disposed opposite to each other, the first tray 102 is provided with a plurality of first engaging grooves 105 facing the second tray 103, and the second tray 103 is provided with a plurality of second engaging grooves 106 facing the first tray 102.
In this embodiment, the first tray 102 is disposed upward, and the second tray 103 is disposed downward. Here, the first tray 102 is disposed upward, which means that the first card slot 105 of the first tray 102 is directed upward and the second card slot 106 of the second tray 103 is directed downward when the silicon wafer inserting apparatus is in use.
The first tray 102 is connected to a driving end of a driving assembly 104, and the driving assembly 104 is used for driving the first tray 102 to move toward or away from the second tray 103.
The driving component 104 may be a manual driving component 104, for example, in an embodiment, the driving component 104 includes a worm wheel, a worm screw, and the like, and when implemented, the worm screw is driven by the handle to rotate, so as to further drive the worm wheel to move, thereby driving the first tray 102 to move toward or away from the second tray 103, that is, to move upward or downward as shown in fig. 1.
In another embodiment, the transmission assembly 104 may include a cylinder or an oil cylinder, and the gear may be driven by a motor to rotate, further drive the rack to move through the gear, and drive the first tray 102 to move up and down through the rack.
In some embodiments, a guide rail is further provided, and the first tray 102 is embedded in the guide rail, so that the first tray 102 can move back and forth along the guide rail, which helps to improve the stability of the movement of the first tray 102.
In this embodiment, as long as the first tray 102 can be driven to move toward or away from the second tray 103, the specific structure of the transmission assembly 104 is not further limited and described in this embodiment.
The shapes of the first card slot 105 and the second card slot 106 need to be set according to the shape of the silicon wafer, so that the silicon wafer can be embedded into the first card slot 105 and the second card slot 106.
In use, the wafer cassette is first placed on the susceptor 101 at a designated position where the wafer pocket in the wafer cassette is aligned with the first pocket 105. Specifically, a positioning member may be disposed on the base 101 to position the wafer cassette at a designated position, and the positioning member may be a baffle plate, and when the wafer cassette abuts against the baffle plate, the positioning member is located at the designated position; in this embodiment, a positioning groove with a size matched with that of the wafer cassette may be further disposed on the base 101, and when the wafer cassette is located in the groove, the wafer cassette is located at the above-mentioned designated position.
Next, the silicon wafer is transferred to the first tray 102, the transmission assembly 104 drives the first tray 102 to move towards the direction close to the second tray 103, and when the first tray 102 contacts the second tray 103, due to the limiting effect of the second slot 106, the position of each silicon wafer on the first tray 102 can be adjusted through the second slot 106, so that the silicon wafer moves to the first slot 105.
At this time, the position of the silicon wafer may be determined by visual inspection or by image sensor inspection or the like to ensure that the silicon wafer is located in the first card slot 105.
When the silicon wafers are all located in the first clamping groove 105, the first tray 102 is driven by the transmission assembly 104 to move to a position far away from the substrate second tray 103, namely to a position corresponding to the wafer box, and then the silicon wafers are transferred into the wafer box. Since the wafer slot on the wafer box corresponds to the position of the first slot 105, when the silicon wafer in the first slot 105 is transferred to the wafer box, the silicon wafer can be ensured to be in an accurate position.
It should be understood that in this embodiment, the positions of the first tray 102 and the second tray 103 may be interchanged, that is, the second tray 103 is disposed upward, the first tray 102 is disposed downward, in implementation, the wafer cassette is disposed corresponding to the second slot 106 on the second tray 103, and the silicon wafer is disposed on the second tray 103, and the position of the silicon wafer is adjusted through the first slot 105 on the first tray 102, so that the position of the silicon wafer can be adjusted, and the wafer inserting operation is completed.
In this embodiment, drive first tray 102 through drive assembly 104 and move to the direction that is close to second tray 103 mutually to cooperate through first draw-in groove 105 and second draw-in groove 106, move the silicon chip to appointed position, further accomplish the inserted sheet operation, like this, the technical scheme simple structure of this embodiment helps reducing the inserted sheet cost.
In some embodiments, first card slot 105 has a first centerline 1050 along a direction perpendicular to first tray 102, first card slot 105 includes a first sub-slot 1051 and a second sub-slot 1052 disposed in sequence along a surface away from first tray 102, and each of first sub-slot 1051 and second sub-slot 1052 is symmetrically disposed about first centerline 1050.
Similar to the first card slot 105, the second card slot 106 has a second center line along a direction perpendicular to the second tray 103, and the second card slot 106 includes a third sub-slot and a fourth sub-slot sequentially disposed along a surface away from the second tray 103, and both the third sub-slot and the fourth sub-slot are symmetrically disposed about the second center line.
It can be understood that the first slot 105 and the second slot 106 are symmetrical about their central axes, which is more convenient for adjusting the orientation of the silicon wafer.
The distance between the adjacent first card slot 105 and the second card slot 106 should be as small as possible, and in one embodiment, the first sub-slots 1051 of the two adjacent first card slots 105 are adjacent to each other, so as to fully utilize the space and improve the adjustment effect on the position of the silicon wafer.
In some embodiments, the depth of the first sub-groove 1051 is greater than the depth of the second sub-groove 1052 along the extension of the first centerline 1050, for example, the depth of the first sub-groove 1051 may be 4.5 millimeters and the thickness of the second sub-groove 1052 may be 3.5 millimeters. Similarly, the depth of the third sub-groove is greater than the depth of the fourth sub-groove.
In this embodiment, the first sub-groove 1051 and the third sub-groove are used to primarily adjust the direction of the silicon wafer, and the third sub-groove and the fourth sub-groove are used to receive and fix the silicon wafer so that the silicon wafer is located in a designated direction.
By controlling the depth of the first sub-groove 1051 to be greater than the depth of the second sub-groove 1052, more space is provided for adjusting the silicon wafer orientation.
In some embodiments, the distance between two adjacent first card slots 105 is equal, and the distance between the first center lines 1050 of two adjacent first card slots 105 is 9 to 11 mm, specifically, for example, 10 mm.
In some embodiments, the first sub-groove 1051 comprises two sidewalls, the two sidewalls of the first sub-groove 1051 form a first included angle therebetween, the second sub-groove 1052 comprises two sidewalls and a bottom surface, the two sidewalls of the second sub-groove 1052 form a second included angle therebetween, and the first included angle is greater than the second included angle. Similarly, the third subslot includes two sidewalls, a third included angle is formed between the two sidewalls of the third subslot, the fourth subslot includes two sidewalls and a bottom surface, a fourth included angle is formed between the two sidewalls of the fourth subslot, and the third included angle is greater than the fourth included angle. The method is favorable for further improving the adjusting effect on the silicon chip direction.
The bottom surface of the second sub-groove 1052 may be chamfered to have a circular arc shape, and in one embodiment, the radius of the chamfer is 0.2 mm, and the width of the bottom surface is about 0.7 mm in a direction perpendicular to the first center line 1050, i.e., in a transverse direction in fig. 2, which helps to improve the protection effect for the silicon wafer.
In some embodiments, the first included angle ranges from 15 to 25 degrees, such as 20 degrees, the second included angle ranges from 80 to 100 degrees, such as 90 degrees, the first included angle is less than or equal to the third included angle, and the second included angle is less than or equal to the fourth included angle.
In order to improve the protection effect on the silicon wafer, the surfaces of the first and second clamping grooves 105 and 106 may be polished to have a roughness Ra value of 12.5.
In some embodiments, the second tray 103 is disposed on the base 101 through a damping buffer, and a buffering direction of the damping buffer includes a first direction, and the first direction is the same as a moving direction of the driving end of the driving assembly 104. In some other embodiments, the buffering direction of the damping bumper further includes a second direction, the second direction is perpendicular to the first direction, and the second direction is perpendicular to the extending direction of the first slot 105.
It should be appreciated that the silicon wafer is generally a rigid structure, and thus, if the first tray 102 and the second tray 103 approach each other, the silicon wafer may be damaged by force. In order to reduce the possibility of damage to the silicon wafer, a damping buffer is further provided in the embodiment, and when the first tray 102 and the second tray 103 contact and press the silicon wafer, a certain buffer space and buffer size can be provided due to the existence of the damping buffer.
The damping buffer piece can comprise a spring or an elastic sheet, and can also be an air cylinder providing a certain buffering function. For example, a spring may be provided as a damping bumper between the second tray 103 and the base 101 shown in fig. 1, and the spring is compressed when the second tray 103 moves upward. When the first tray 102 and the second tray 103 are in contact, the first tray 102 and the second tray 103 press the silicon wafer longitudinally in fig. 1, and due to the existence of the spring serving as a damping buffer member, the second tray 103 can move up and down within a certain range, so that the possibility that the silicon wafer is directly pressed by the first tray 102 and the second tray 103 to damage the silicon wafer is reduced.
In another embodiment, a spring plate is provided as a damping buffer member, and the spring plate can enable the second tray 103 to move left and right within a certain range. When the two ends of a certain silicon wafer respectively enter the first clamping groove 105 and the second clamping groove 106 which are staggered, when the first tray 102 and the second tray 103 are close to each other, the silicon wafer can be extruded, the silicon wafer is enabled to be subjected to transverse force in the drawing, at the moment, due to the existence of the elastic sheet, the second tray 103 can be enabled to be left and right within a certain range to be certain, and the possibility of damaging the silicon wafer is reduced.
Through setting up the damping bolster that buffering direction edge first direction or second direction, can reduce the possibility that the inserted sheet in-process damaged the silicon chip.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a silicon chip inserted sheet device, its characterized in that includes first tray, second tray and drive assembly, first tray with the second tray sets up relatively, be provided with the orientation on the first tray side by side a plurality of first draw-in grooves of second tray, be provided with the orientation on the second tray side by side a plurality of second draw-in grooves of first tray, first tray with drive assembly's transmission end links to each other, drive assembly is used for the drive first tray is to being close to or keeping away from the direction removal of second tray.
2. The silicon wafer insert device according to claim 1, wherein the first pocket has a first centerline in a direction perpendicular to the first tray, the first pocket comprising a first subslot and a second subslot disposed in sequence away from the surface of the first tray, the first subslot and the second subslot each being symmetrically disposed about the first centerline.
3. The silicon wafer tab device according to claim 2, wherein the depth of the first sub-groove is greater than the depth of the second sub-groove along the extension direction of the first center line.
4. The silicon wafer insert device according to claim 2, wherein the first subslot of two adjacent first card slots abut.
5. The silicon wafer insert device according to claim 2, wherein the distance between each two adjacent first card slots is equal, and the distance between the first center lines of each two adjacent first card slots is 9 to 11 mm.
6. The silicon wafer insert device according to claim 2, wherein the first sub-groove comprises two side walls, a first included angle is formed between the two side walls of the first sub-groove, the second sub-groove comprises two side walls and a bottom surface, a second included angle is formed between the two side walls of the second sub-groove, and the first included angle is larger than the second included angle.
7. The silicon wafer insert device according to claim 6, wherein the second slot has a second centerline in a direction perpendicular to the second tray, the second slot comprising a third sub-slot and a fourth sub-slot sequentially disposed along a surface away from the second tray, the third sub-slot and the fourth sub-slot both being symmetrically disposed about the second centerline;
the third subslot comprises two side walls, a third included angle is formed between the two side walls of the third subslot, the fourth subslot comprises two side walls and a bottom surface, a fourth included angle is formed between the two side walls of the fourth subslot, and the third included angle is larger than the fourth included angle.
8. The silicon wafer tab device according to claim 7, wherein the first angle is in the range of 15 to 25 degrees, the second angle is in the range of 80 to 100 degrees, the first angle is less than or equal to the third angle, and the second angle is less than or equal to the fourth angle.
9. The silicon wafer inserting device according to claim 1, further comprising a base and a damping buffer member, wherein the second tray is disposed on the base through the damping buffer member, the buffering direction of the damping buffer member comprises a first direction, and the first direction is the same as the moving direction of the transmission end of the transmission assembly.
10. The silicon wafer insert device according to claim 9, wherein the damping direction of the damping cushion further comprises a second direction, the second direction is perpendicular to the first direction, and the second direction is perpendicular to the extending direction of the first slot.
CN202011307980.1A 2020-11-20 2020-11-20 Silicon chip inserting device Pending CN112420573A (en)

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Application Number Priority Date Filing Date Title
CN202011307980.1A CN112420573A (en) 2020-11-20 2020-11-20 Silicon chip inserting device

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Application Number Priority Date Filing Date Title
CN202011307980.1A CN112420573A (en) 2020-11-20 2020-11-20 Silicon chip inserting device

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CN112420573A true CN112420573A (en) 2021-02-26

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156163A (en) * 1999-11-24 2001-06-08 Kyoden:Kk Rack apparatus and board support rack used therein
US20020029852A1 (en) * 2000-02-28 2002-03-14 Koji Egashira Rotary processing apparatus
KR20060085294A (en) * 2005-01-21 2006-07-26 삼성전자주식회사 Wafer charger
CN106783710A (en) * 2016-12-31 2017-05-31 上海新阳半导体材料股份有限公司 Wafer transfer device
CN211017033U (en) * 2019-12-24 2020-07-14 苏州德克斯特新材料科技有限公司 PVDF silicon chip basket of flowers
CN211828700U (en) * 2020-05-15 2020-10-30 马玉水 Circular silicon chip handling device
CN211879352U (en) * 2020-06-02 2020-11-06 西安奕斯伟硅片技术有限公司 Silicon wafer bearing structure namely separating device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156163A (en) * 1999-11-24 2001-06-08 Kyoden:Kk Rack apparatus and board support rack used therein
US20020029852A1 (en) * 2000-02-28 2002-03-14 Koji Egashira Rotary processing apparatus
KR20060085294A (en) * 2005-01-21 2006-07-26 삼성전자주식회사 Wafer charger
CN106783710A (en) * 2016-12-31 2017-05-31 上海新阳半导体材料股份有限公司 Wafer transfer device
CN211017033U (en) * 2019-12-24 2020-07-14 苏州德克斯特新材料科技有限公司 PVDF silicon chip basket of flowers
CN211828700U (en) * 2020-05-15 2020-10-30 马玉水 Circular silicon chip handling device
CN211879352U (en) * 2020-06-02 2020-11-06 西安奕斯伟硅片技术有限公司 Silicon wafer bearing structure namely separating device

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