CN112331586A - Automatic paster assembly line of LED - Google Patents
Automatic paster assembly line of LED Download PDFInfo
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- CN112331586A CN112331586A CN202011149189.2A CN202011149189A CN112331586A CN 112331586 A CN112331586 A CN 112331586A CN 202011149189 A CN202011149189 A CN 202011149189A CN 112331586 A CN112331586 A CN 112331586A
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- side plate
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- positioning mechanism
- rack
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- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000000428 dust Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 238000010073 coating (rubber) Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an LED automatic chip mounting assembly line, which comprises a rack, a conveying mechanism, a positioning mechanism and a chip mounter, wherein the conveying mechanism is arranged on the rack, the positioning mechanism is arranged in the middle of the conveying mechanism, the chip mounter is arranged above the positioning mechanism, the conveying mechanism comprises a first side plate and a second side plate, the conveying second side plate is connected to the rack in a sliding manner, so that the width of the conveying mechanism can be adjusted to meet the requirement of conveying substrates with different widths, the conveying mechanism conveys the substrates to be chip mounted to the positioning mechanism, the positioning mechanism positions the substrates, the chip mounter carries out chip mounting on the substrates to ensure the chip mounting quality, the positioning mechanism resets after the chip mounting is finished, the conveying mechanism outputs the substrates, and the assembly line overcomes the defects of manual feeding and discharging through the conveying mechanism and the positioning mechanism, the working efficiency is greatly improved, the width of the conveying mechanism is adjustable, and the adaptability is stronger.
Description
Technical Field
The invention relates to the technical field of LED production, in particular to an automatic LED chip mounting assembly line.
Background
The drawback that traditional electronic component need the manual welding to the base plate has been solved in the appearance of LED paster, has improved the preparation efficiency of base plate greatly, and current LED paster assembly line needs the manual work to go up the unloading to the base plate, and efficiency is lower, and current base plate conveyor can only carry the base plate of single specification, can't satisfy the production demand of the base plate of different specifications, consequently, urgently need provide an automatic paster assembly line of LED.
Disclosure of Invention
In order to overcome the defects in the prior art, embodiments of the present invention provide an automatic LED mounting assembly line to solve the problems in the background art.
The embodiment of the application discloses: an automatic LED chip mounting assembly line comprises a rack, a conveying mechanism, a positioning mechanism and a chip mounter, wherein the conveying mechanism is arranged on the rack, the positioning mechanism is arranged in the middle of the conveying mechanism, the chip mounter is arranged above the positioning mechanism, the conveying mechanism comprises a first side plate and a second side plate which are arranged in parallel, a laser range finder is arranged on the inner side of the second side plate, the inner sides of the first side plate and the second side plate are both connected with a driving wheel and a driven wheel through a bearing seat, the driving wheel and the driven wheel are connected through a belt, a wear-resistant strip matched with the driving wheel is arranged at the bottom of the upper half part of the belt, two guide rails perpendicular to the length direction of the rack are arranged on the rack, a sliding block is connected on the guide rails in a sliding manner, a base is connected on the sliding block, the second side plate is fixed on the base, and a threaded hole, the threaded hole is internally connected with a screw rod matched with the threaded hole, the screw rod is connected with a first servo motor, the first servo motor is electrically connected with the laser range finder, the first servo motor is fixed on the rack, a second servo motor is fixed on the rack, the output end of the second servo motor is connected with a hexagonal rod, a driving wheel on the first side plate is connected with the end part of the hexagonal rod, a hexagonal through hole matched with the hexagonal rod is formed in the driving wheel on the second side plate, and the hexagonal rod is connected in the through hole in a sliding manner; the positioning mechanism comprises a jacking cylinder fixed on the rack, a supporting plate is fixed on a top rod of the jacking cylinder, a rubber coating is arranged on the upper end face of the supporting plate, baffle plates extending inwards are arranged at the top ends of the first side plate and the second side plate, a plurality of sleeves are arranged on the baffle plates, stepped holes are arranged in the sleeves, the minor diameters of the stepped holes are short and downward, movable rods matched with the stepped holes are movably connected in the stepped holes, limit blocks are arranged at the top ends of the movable rods, springs are connected between the upper end faces of the limit blocks and the top ends of the stepped holes, the springs are in an extending state, the bottom ends of the movable rods are connected with pressing plates matched with the supporting plate, two position sensors are arranged on the inner side of the second side plate and located at two ends of the supporting plate, and the conveying mechanism conveys the substrate to the positioning mechanism, the positioning mechanism positions the substrate, and the chip mounter mounts the substrate.
Preferably, the chip mounting head of the chip mounter is connected with a moving mechanism, the moving mechanism is arranged right above the positioning mechanism, the moving mechanism comprises two first guide rails which are arranged above the rack in parallel, the two first guide rails are connected with a movable frame in a sliding manner, the first guide rails are provided with first threaded rods along the length direction of the first threaded rods, the first threaded rods penetrate through the movable frame, one ends of the first threaded rods are rotatably connected with one ends of the first guide rails, the other ends of the first threaded rods are connected with third servo motors, the third servo motors are fixed at the other ends of the first guide rails, the movable frame is provided with second guide rails along the length direction of the second threaded rods, the second guide rails are connected with connecting blocks in a sliding manner, the movable frame is provided with second threaded rods along the length direction of the second threaded rods, and the second guide rails penetrate through the connecting blocks, one end rotatable coupling of second guide rail is in on the adjustable shelf, the other end of second guide rail is connected with fourth servo motor, fourth servo motor fixes on the adjustable shelf, the vertical servo cylinder that is fixed with on the connecting block, the paster head is fixed on servo cylinder's ejector pin.
Preferably, a pressure sensor is arranged in the stepped hole, the pressure sensor is installed between the upper end of the spring and the top end of the stepped hole, and the pressure sensor is electrically connected with the jacking cylinder.
Preferably, a dust collector is arranged on the conveying mechanism and is positioned on the left side of the positioning mechanism.
The invention has the following beneficial effects: the automatic paster assembly line of LED is through two the skin holds and treats the paster base plate and carry, improves work efficiency greatly, a servo motor drive the lead screw is rotatory, the lead screw drive the base is followed the guide rail slides, and then drives the second side panel is followed the guide rail slides, thereby adjusts conveying mechanism's width makes it can satisfy the demand of carrying the base plate of different specifications, the jacking cylinder drive the layer board upwards holds up the base plate, the clamp plate is pressed on the up end of base plate, makes the base plate is fixed, subsequent paster operation of being convenient for.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a part of an LED automatic chip mounting assembly line.
Fig. 2 is a partial structural schematic diagram of the conveying mechanism.
Fig. 3 is a schematic structural view of the positioning mechanism.
Fig. 4 is a schematic view of the movable rod structure.
Fig. 5 is a plan view of the moving mechanism.
Fig. 6 is a schematic view of a connecting block structure.
Reference numerals of the above figures: 1. a frame; 2. a conveying mechanism; 3. a positioning mechanism; 4. a chip mounter; 5. a substrate; 6. a first side plate; 7. a second side plate; 8. a laser range finder; 9. a drive wheel; 10. a driven wheel; 11. a belt; 12. a guide rail; 13. A slider; 14. a base; 15. a screw rod; 16. a first servo motor; 17. a second servo motor; 18. a hexagonal rod; 19. jacking a cylinder; 20. a support plate; 21. a baffle plate; 22. a sleeve; 23. a stepped hole; 24. a movable rod; 25. a limiting block; 26. a spring; 27. pressing a plate; 28. a position sensor; 29. a chip mounting head; 30. a moving mechanism; 31. a first guide rail; 32. a movable frame; 33. a first threaded rod; 34. a third servo motor; 35. a second guide rail; 36. connecting blocks; 37. a second threaded rod; 38. A fourth servo motor; 39. a servo cylinder; 40. a pressure sensor; 41. a vacuum cleaner.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, an automatic LED chip mounting assembly line includes a frame 1, a conveying mechanism 2, a positioning mechanism 3 and a chip mounter 4, wherein the conveying mechanism 2 is disposed on the frame 1, the positioning mechanism 3 is disposed at a middle portion of the conveying mechanism 2, the chip mounter 4 is disposed above the positioning mechanism 3, the conveying mechanism 2 conveys a substrate 5 to be mounted to the positioning mechanism 3, the positioning mechanism 3 positions the substrate 5, the chip mounter 4 mounts the substrate 5, after the mounting is completed, the conveying mechanism 2 outputs the conveyed substrate 5, the conveying mechanism 2 includes a first side plate 6 and a second side plate 7 which are disposed in parallel, a laser range finder 8 is disposed at an inner side of the second side plate 7, and the laser range finder 8 is used for monitoring a distance between the first side plate 6 and the second side plate 7, the inner sides of the first side plate 6 and the second side plate 7 are connected with a driving wheel 9 and a driven wheel 10 through bearing seats, the driving wheel 9 and the driven wheel 10 are connected through a belt 11, the bottom of the upper half part of the belt 11 is provided with wear-resistant strips matched with the wear-resistant strips to prevent the belt 11 from sinking downward and affecting transmission effect, the frame 1 is provided with two guide rails 12 perpendicular to the length direction of the frame 1, the guide rails 12 are connected with a sliding block 13 in a sliding manner, the sliding block 13 is connected with a base 14, the base 14 can freely slide along the length direction of the guide rails 12, the second side plate 7 is fixed on the base 14, the base 14 is provided with threaded holes parallel to the guide rails 12, the threaded holes are connected with screw rods 15 matched with the threaded holes, the screw rods 15 are connected with a first servo motor 16, and the first servo motor 16 is electrically connected with the laser range finder 8, the first servo motor 16 is fixed on the rack 1, the first servo motor 16 drives the screw rod 15 to rotate, the screw rod 15 drives the base 14 to slide along the guide rail 12, the base 14 drives the second side plate 7 to slide along the guide rail 12, so as to adjust the distance between the first side plate 6 and the second side plate 7, the conveying laser range finder 8 monitors and conveys the distance between the first side plate 6 and the second side plate 7 in real time, transmits a signal to the first servo motor 16, controls the driving process of the first servo motor 16, enables the conveying mechanism 2 to meet the conveying requirements of the substrates 5 with different specifications, the rack 1 is fixed with the second servo motor 17, the output end of the second servo motor 17 is connected with the hexagonal rod 18, and the driving wheel on the first side plate 6 is connected with the end of the hexagonal rod 18, a hexagonal through hole matched with the hexagonal rod 18 is formed in the driving wheel 9 on the second side plate 7, the hexagonal rod 18 is connected in the hexagonal through hole in a sliding mode, the driving wheel 9 can freely slide along the hexagonal rod 18, meanwhile, the hexagonal rod 18 can transmit torque to the driving wheel 9, the second servo motor 17 drives the hexagonal rod 18 to rotate, the hexagonal rod 18 drives the driving wheel 9 to rotate, and the driving wheel 9 drives the belt to run; the positioning mechanism 3 comprises a jacking cylinder 19 fixed on the frame 1, a supporting plate 20 is fixed on a top rod of the jacking cylinder 19, a rubber coating is arranged on the upper end face of the supporting plate 20 to prevent the base plate 5 from being damaged by friction, a baffle 21 extending inwards is arranged at the top ends of the first side plate 6 and the second side plate 7, a plurality of sleeves 22 are arranged on the baffle 21, stepped holes 23 are arranged in the sleeves 22, the small diameters of the stepped holes 23 are short downwards, a movable rod 24 matched with the stepped holes 23 is movably connected in the stepped holes 23, a limiting block 25 is arranged at the top end of the movable rod 24, the limiting block 25 is used for preventing the movable rod 24 from falling off, a spring 26 is connected between the upper end face of the limiting block 25 and the top end of the stepped holes 23, the spring 26 is in an extending state, and a pressing plate 27 matched with the supporting plate 20 is connected at the bottom end of the, two position sensors 28 are arranged on the inner side of the second side plate 7, the two position sensors 28 are located at two ends of the supporting plate 20 and are used for detecting the position of the substrate 5, when the substrate 5 is conveyed to the position above the supporting plate 20, the position sensors 28 detect the substrate 5 and send signals to the second servo motor 17 to control the second servo motor 17 to stop rotating, the jacking cylinder 19 drives the supporting plate 20 to push the substrate 5 upwards out of the upper end face of the belt 11, the pressing plate 27 presses the substrate 5 downwards to fix the substrate 5, the movable rod 24 presses the spring 26 upwards, the spring 26 is compressed to absorb partial potential energy, and the substrate 5 is prevented from being damaged due to overlarge pressure.
The chip mounter 4 is characterized in that a chip mounting head 29 is connected with a moving mechanism 30, the moving mechanism 30 is arranged right above the positioning mechanism 3, the moving mechanism 30 comprises two first guide rails 31 arranged above the rack 1 in parallel, two first guide rails 31 are connected with a movable frame 32 in a sliding manner, a first threaded rod 33 arranged on each first guide rail 31 along the length direction of the first guide rail 31 is penetrated through the movable frame 32, one end of each first threaded rod 33 can be rotatably connected with one end of each first guide rail 31, the other end of each first threaded rod 33 is connected with a third servo motor 34, each third servo motor 34 is fixed at the other end of each first guide rail 31, each third servo motor 34 drives each first threaded rod 33 to rotate, each first threaded rod 33 drives each movable frame to slide back and forth along each first guide rail 31, be equipped with on the adjustable shelf 32 along its length direction's second guide rail 35, sliding connection has connecting block 36 on the second guide rail 35, be equipped with on the adjustable shelf 32 along its length direction's second threaded rod 37, second threaded rod 37 runs through connecting block 36, the one end rotatable coupling of second threaded rod 37 is in on the adjustable shelf 32, the other end of second threaded rod 37 is connected with fourth servo motor 38, fourth servo motor 38 is fixed on the adjustable shelf 32, fourth servo motor 38 drive second threaded rod 37 is rotatory, second threaded rod 37 drive connecting block 36 is followed second guide rail 35 carries out the horizontal slip, vertically be fixed with servo cylinder 39 on connecting block 36, paster head 29 is fixed on servo cylinder 39's the ejector pin, servo cylinder 39 drives paster head 29 reciprocates, the substrate 5 is subjected to the mounting.
Be equipped with pressure sensor 40 in the shoulder hole 23, pressure sensor 40 installs the upper end of spring 26 with between the top of shoulder hole 23, pressure sensor 40 with jacking cylinder 19 electric connection, pressure sensor 40 is used for monitoring spring 26's pressurized condition to give the signal transmission jacking cylinder 19, control jacking cylinder 19's process prevents base plate 5 is pressed too big and is damaged.
The conveying mechanism 2 is provided with a dust collector 41, the dust collector 41 is positioned on the left side of the positioning mechanism 3, and the dust collector 41 is used for absorbing impurities attached to the surface of the substrate 5 to ensure the quality of the patch.
The working process of the assembly line is as follows: the first servo motor drives the 16 to drive the screw rod 15 to rotate, the screw rod drives the second side plate 7 to slide along the guide rail 12, so as to adjust the width of the conveying mechanism 2, and the conveying mechanism meets the width requirement of the substrate 5, the second servo motor 17 drives the belt 11 to operate, so as to convey the substrate 5 to the right side, the dust collector 41 sucks impurities attached to the surface of the substrate 5, when the position sensor 28 detects the substrate 5, the position sensor 28 sends a signal to the second servo motor 17, the second servo motor stops rotating, meanwhile, the jacking cylinder 19 drives the supporting plate 20 to move upwards to jack up the substrate 5 for positioning, the third servo motor 34 drives the movable frame 32 to slide back and forth along the first guide rail 31, and the movable frame 32 drives the connecting block 36 to slide back and forth, and then drive the paster head 29 slides back and forth, the fourth servo motor 38 drives the connecting block 36 to slide left and right along the second guide rail 35, so as to drive the paster head 29 to slide left and right, so as to enable the paster head 29 to freely move in the horizontal plane, the servo cylinder 39 drives the paster head 29 to move up and down, and to paster the substrate 5, after paster is completed, the jacking cylinder 19 drives the supporting plate 20 to reset, the substrate 5 returns to the upper end surface of the belt 11, and the second servo motor 17 continues to drive the belt 11 to operate, so that the substrate 5 is output.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (4)
1. The utility model provides an automatic paster assembly line of LED which characterized in that: the automatic feeding device comprises a rack, a conveying mechanism, a positioning mechanism and a chip mounter, wherein the conveying mechanism is arranged on the rack, the positioning mechanism is arranged in the middle of the conveying mechanism, the chip mounter is arranged above the positioning mechanism, the conveying mechanism comprises a first side plate and a second side plate which are arranged in parallel, a laser range finder is arranged on the inner side of the second side plate, the inner sides of the first side plate and the second side plate are connected with a driving wheel and a driven wheel through bearing seats, the driving wheel and the driven wheel are connected through a belt, a wear-resistant strip matched with the driving wheel is arranged at the bottom of the upper half part of the belt, two guide rails perpendicular to the length direction of the rack are arranged on the rack, a sliding block is connected on the guide rails in a sliding manner, a base is connected on the sliding block, the second side plate is fixed on the base, and threaded, the threaded hole is internally connected with a screw rod matched with the threaded hole, the screw rod is connected with a first servo motor, the first servo motor is electrically connected with the laser range finder, the first servo motor is fixed on the rack, a second servo motor is fixed on the rack, the output end of the second servo motor is connected with a hexagonal rod, a driving wheel on the first side plate is connected with the end part of the hexagonal rod, a hexagonal through hole matched with the hexagonal rod is formed in the driving wheel on the second side plate, and the hexagonal rod is connected in the through hole in a sliding manner; the positioning mechanism comprises a jacking cylinder fixed on the rack, a supporting plate is fixed on a top rod of the jacking cylinder, a rubber coating is arranged on the upper end face of the supporting plate, baffle plates extending inwards are arranged at the top ends of the first side plate and the second side plate, a plurality of sleeves are arranged on the baffle plates, stepped holes are arranged in the sleeves, the minor diameters of the stepped holes are short and downward, movable rods matched with the stepped holes are movably connected in the stepped holes, limit blocks are arranged at the top ends of the movable rods, springs are connected between the upper end faces of the limit blocks and the top ends of the stepped holes, the springs are in an extending state, the bottom ends of the movable rods are connected with pressing plates matched with the supporting plate, two position sensors are arranged on the inner side of the second side plate and located at two ends of the supporting plate, and the conveying mechanism conveys the substrate to the positioning mechanism, the positioning mechanism positions the substrate, and the chip mounter mounts the substrate.
2. The automatic LED chip mounting assembly line of claim 1, wherein: the chip mounter is characterized in that a chip mounting head of the chip mounter is connected with a moving mechanism, the moving mechanism is arranged right above the positioning mechanism, the moving mechanism comprises two first guide rails which are arranged above the rack in parallel, two first guide rails are connected with a movable frame in a sliding manner, first threaded rods along the length direction of the first guide rails are arranged on the first guide rails, the first threaded rods penetrate through the movable frame, one ends of the first threaded rods are rotatably connected with one ends of the first guide rails, the other ends of the first threaded rods are connected with a third servo motor, the third servo motor is fixed at the other ends of the first guide rails, second guide rails along the length direction of the movable frame are arranged on the movable frame, connecting blocks are connected on the second guide rails in a sliding manner, second threaded rods along the length direction of the movable frame are arranged on the movable frame, and the second guide rails penetrate through the, one end rotatable coupling of second guide rail is in on the adjustable shelf, the other end of second guide rail is connected with fourth servo motor, fourth servo motor fixes on the adjustable shelf, the vertical servo cylinder that is fixed with on the connecting block, the paster head is fixed on servo cylinder's ejector pin.
3. The automatic LED chip mounting assembly line of claim 1, wherein: the pressure sensor is arranged in the stepped hole, the pressure sensor is installed between the upper end of the spring and the top end of the stepped hole, and the pressure sensor is electrically connected with the jacking cylinder.
4. The automatic LED chip mounting assembly line of claim 1, wherein: and a dust collector is arranged on the conveying mechanism and is positioned on the left side of the positioning mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011149189.2A CN112331586B (en) | 2020-10-23 | 2020-10-23 | Automatic LED (light emitting diode) surface mounting assembly line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011149189.2A CN112331586B (en) | 2020-10-23 | 2020-10-23 | Automatic LED (light emitting diode) surface mounting assembly line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112331586A true CN112331586A (en) | 2021-02-05 |
| CN112331586B CN112331586B (en) | 2024-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011149189.2A Active CN112331586B (en) | 2020-10-23 | 2020-10-23 | Automatic LED (light emitting diode) surface mounting assembly line |
Country Status (1)
| Country | Link |
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| CN (1) | CN112331586B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112993715A (en) * | 2021-04-19 | 2021-06-18 | 青岛鑫圣林电子有限公司 | Automatic chip mounter |
| CN114798951A (en) * | 2022-03-11 | 2022-07-29 | 浙江优格科技有限公司 | Cutting equipment is used in processing of hard copper bar |
| CN116978819A (en) * | 2023-07-04 | 2023-10-31 | 深圳源明杰科技股份有限公司 | Wafer paster mechanism and wafer paster device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6571530B1 (en) * | 1997-01-17 | 2003-06-03 | Matsushita Electric Industrial Co., Ltd | Component taping method and apparatus |
| CN104386508A (en) * | 2014-09-05 | 2015-03-04 | 常州先进制造技术研究所 | Automatic plate feeding device of LED chip mounter |
| CN105307471A (en) * | 2015-11-03 | 2016-02-03 | 江苏海天微电子科技有限公司 | Automatic chip mounting production line |
| US20180244480A1 (en) * | 2015-10-27 | 2018-08-30 | Hirata Corporation | Transport unit, transfer apparatus, and transfer method |
| CN108538753A (en) * | 2018-03-06 | 2018-09-14 | 绍兴舜宇照明工程有限公司 | A kind of LED chip mounter |
| CN208222296U (en) * | 2018-06-21 | 2018-12-11 | 江苏辉皓正电气有限公司 | Pendent lamp structure and dust free room pendent lamp |
| CN208657178U (en) * | 2018-07-05 | 2019-03-26 | 深圳市世纪兴电子有限公司 | A kind of full-automatic precision site machine |
| CN209336228U (en) * | 2018-11-23 | 2019-09-03 | 天津必利优科技发展有限公司 | A kind of chip mounter |
| CN110958833A (en) * | 2019-12-23 | 2020-04-03 | 深圳市易通自动化设备有限公司 | Improved full-automatic efficient chip mounter |
-
2020
- 2020-10-23 CN CN202011149189.2A patent/CN112331586B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6571530B1 (en) * | 1997-01-17 | 2003-06-03 | Matsushita Electric Industrial Co., Ltd | Component taping method and apparatus |
| CN104386508A (en) * | 2014-09-05 | 2015-03-04 | 常州先进制造技术研究所 | Automatic plate feeding device of LED chip mounter |
| US20180244480A1 (en) * | 2015-10-27 | 2018-08-30 | Hirata Corporation | Transport unit, transfer apparatus, and transfer method |
| CN105307471A (en) * | 2015-11-03 | 2016-02-03 | 江苏海天微电子科技有限公司 | Automatic chip mounting production line |
| CN108538753A (en) * | 2018-03-06 | 2018-09-14 | 绍兴舜宇照明工程有限公司 | A kind of LED chip mounter |
| CN208222296U (en) * | 2018-06-21 | 2018-12-11 | 江苏辉皓正电气有限公司 | Pendent lamp structure and dust free room pendent lamp |
| CN208657178U (en) * | 2018-07-05 | 2019-03-26 | 深圳市世纪兴电子有限公司 | A kind of full-automatic precision site machine |
| CN209336228U (en) * | 2018-11-23 | 2019-09-03 | 天津必利优科技发展有限公司 | A kind of chip mounter |
| CN110958833A (en) * | 2019-12-23 | 2020-04-03 | 深圳市易通自动化设备有限公司 | Improved full-automatic efficient chip mounter |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112993715A (en) * | 2021-04-19 | 2021-06-18 | 青岛鑫圣林电子有限公司 | Automatic chip mounter |
| CN114798951A (en) * | 2022-03-11 | 2022-07-29 | 浙江优格科技有限公司 | Cutting equipment is used in processing of hard copper bar |
| CN116978819A (en) * | 2023-07-04 | 2023-10-31 | 深圳源明杰科技股份有限公司 | Wafer paster mechanism and wafer paster device |
| CN116978819B (en) * | 2023-07-04 | 2024-06-11 | 深圳源明杰科技股份有限公司 | Wafer paster mechanism and wafer paster device |
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| CN112331586B (en) | 2024-04-09 |
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