CN112323130A - Method for cleaning electroplating processing pendant with surface containing plating layer metal nickel - Google Patents
Method for cleaning electroplating processing pendant with surface containing plating layer metal nickel Download PDFInfo
- Publication number
- CN112323130A CN112323130A CN202011075535.7A CN202011075535A CN112323130A CN 112323130 A CN112323130 A CN 112323130A CN 202011075535 A CN202011075535 A CN 202011075535A CN 112323130 A CN112323130 A CN 112323130A
- Authority
- CN
- China
- Prior art keywords
- tank
- nickel
- plating solution
- pendant
- containing plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/20—Regeneration of process solutions of rinse-solutions
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for cleaning an electroplating processing pendant with a surface containing plating metal nickel, which comprises the following steps: s1, fixing the electroplating processing pendant with the surface containing the plating layer metal nickel in an electroplating bath; s2, cleaning the electroplating processing pendant in the electroplating bath to generate nickel-containing plating solution; s3, allowing nickel-containing plating solution to flow through the primary tank, the secondary tank and the tertiary tank; s4, recycling the nickel-containing plating solution in the third-stage tank to the second-stage tank; s5, recycling the nickel-containing plating solution in the secondary tank to the primary tank; s6, recycling the plating solution in the primary tank to the plating tank; s7, repeating the steps S4 to S6; s8, allowing the nickel-containing plating solution to flow to a third-stage tank through a first-stage tank and a second-stage tank; and S9, discharging the nickel-containing plating solution from the third-stage tank. The invention improves the processing and cleaning quality of the workpiece, can effectively reduce the concentration of plating solution, reduces the discharge of metallic nickel, ensures that the final waste water discharge is less, and meets the requirement of environmental protection.
Description
Technical Field
The invention relates to a method for cleaning an electroplating processing pendant with a plating layer metal nickel on the surface.
Background
After the electroplating processing is finished, workpieces containing plated metal copper need to be cleaned, most of the existing electroplating processing cleaning methods do not meet the requirement of environmental protection, and metal nickel is often discharged along with high-concentration waste liquid, so that certain pollution is caused to the environment.
Disclosure of Invention
The invention aims to provide a method for cleaning an electroplating processing pendant with a plating layer containing metallic nickel on the surface, so as to reduce the discharge of the metallic nickel and avoid environmental pollution.
In order to achieve the above purpose, the solution of the invention is:
a method for cleaning an electroplating processing pendant with a plating layer metal nickel on the surface comprises the following steps:
s1, fixing the electroplating processing pendant with the surface containing the plating layer metal nickel in an electroplating bath;
s2, cleaning the electroplating processing pendant in the electroplating bath to generate nickel-containing plating solution;
s3, allowing nickel-containing plating solution to flow through the primary tank, the secondary tank and the tertiary tank;
s4, recycling the nickel-containing plating solution in the third-stage tank to the second-stage tank, standing for a period of time and then reusing;
s5, recycling the nickel-containing plating solution in the secondary tank to the primary tank, standing for a period of time and then reusing;
s6, recycling the plating solution in the primary tank to the plating tank, standing for a period of time and then reusing;
s7, repeating the steps S4 to S6;
s8, allowing the repeatedly-utilized nickel-containing plating solution to flow to a third-stage tank through a first-stage tank and a second-stage tank;
and S9, discharging the nickel-containing plating solution from the third-stage tank after the nickel-containing plating solution is kept still for a period of time.
After the scheme is adopted, the invention has the following beneficial effects:
the invention improves the processing and cleaning quality of the workpiece, can effectively reduce the concentration of plating solution, reduces the discharge of metallic nickel, ensures that the final waste water discharge is less, and meets the requirement of environmental protection.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following specific examples.
The invention provides a method for cleaning an electroplating processing pendant with a surface containing plating metal nickel, which comprises the following steps:
s1, fixing the electroplating processing pendant with the surface containing the plating layer metal nickel in an electroplating bath;
s2, cleaning the electroplating processing pendant in the electroplating bath to generate nickel-containing plating solution;
s3, allowing nickel-containing plating solution to flow through the primary tank, the secondary tank and the tertiary tank;
s4, recycling the nickel-containing plating solution in the third-stage tank to the second-stage tank, standing for a period of time and then reusing;
s5, recycling the nickel-containing plating solution in the secondary tank to the primary tank, standing for a period of time and then reusing;
s6, recycling the plating solution in the primary tank to the plating tank, standing for a period of time and then reusing;
s7, repeating the steps S4 to S6;
s8, allowing the repeatedly-utilized nickel-containing plating solution to flow to a third-stage tank through a first-stage tank and a second-stage tank;
and S9, discharging the nickel-containing plating solution from the third-stage tank after the nickel-containing plating solution is kept still for a period of time.
The invention has the following beneficial effects:
the invention improves the processing and cleaning quality of the workpiece, can effectively reduce the concentration of plating solution, reduces the discharge of metallic nickel, ensures that the final waste water discharge is less, and meets the requirement of environmental protection.
The above embodiments are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modifications made on the basis of the technical scheme according to the technical idea of the present invention fall within the protection scope of the present invention.
Claims (1)
1. A method for cleaning an electroplating processing pendant with a plating layer metal nickel on the surface is characterized by comprising the following steps:
s1, fixing the electroplating processing pendant with the surface containing the plating layer metal nickel in an electroplating bath;
s2, cleaning the electroplating processing pendant in the electroplating bath to generate nickel-containing plating solution;
s3, allowing nickel-containing plating solution to flow through the primary tank, the secondary tank and the tertiary tank;
s4, recycling the nickel-containing plating solution in the third-stage tank to the second-stage tank, standing for a period of time and then reusing;
s5, recycling the nickel-containing plating solution in the secondary tank to the primary tank, standing for a period of time and then reusing;
s6, recycling the plating solution in the primary tank to the plating tank, standing for a period of time and then reusing;
s7, repeating the steps S4 to S6;
s8, allowing the repeatedly-utilized nickel-containing plating solution to flow to a third-stage tank through a first-stage tank and a second-stage tank;
and S9, discharging the nickel-containing plating solution from the third-stage tank after the nickel-containing plating solution is kept still for a period of time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011075535.7A CN112323130A (en) | 2020-10-09 | 2020-10-09 | Method for cleaning electroplating processing pendant with surface containing plating layer metal nickel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011075535.7A CN112323130A (en) | 2020-10-09 | 2020-10-09 | Method for cleaning electroplating processing pendant with surface containing plating layer metal nickel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112323130A true CN112323130A (en) | 2021-02-05 |
Family
ID=74314790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011075535.7A Pending CN112323130A (en) | 2020-10-09 | 2020-10-09 | Method for cleaning electroplating processing pendant with surface containing plating layer metal nickel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112323130A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101255595A (en) * | 2007-12-07 | 2008-09-03 | 王树宣 | Electroplating device and method with zero-discharge of sewage water |
| CN102586849A (en) * | 2012-03-16 | 2012-07-18 | 王树萱 | Chromium plating production equipment without discharge of electroplating waste liquid, waste gas and waste residues (three wastes) |
| CN203530472U (en) * | 2013-11-15 | 2014-04-09 | 厦门绿邦膜技术有限公司 | Electroplating countercurrent rinsing device |
| CN105986307A (en) * | 2016-03-11 | 2016-10-05 | 合肥汇通控股股份有限公司 | Water saving type electroplating three-level washing tank |
| CN107065947A (en) * | 2017-02-27 | 2017-08-18 | 环境保护部华南环境科学研究所 | The intelligent water-controlled equipment and its automatic control water method of batch (-type) backwash plating piece |
| CN107460529A (en) * | 2017-08-28 | 2017-12-12 | 厦门市韩江环保科技有限公司 | A kind of electroplating cleaning equipment and its cleaning method |
-
2020
- 2020-10-09 CN CN202011075535.7A patent/CN112323130A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101255595A (en) * | 2007-12-07 | 2008-09-03 | 王树宣 | Electroplating device and method with zero-discharge of sewage water |
| CN102586849A (en) * | 2012-03-16 | 2012-07-18 | 王树萱 | Chromium plating production equipment without discharge of electroplating waste liquid, waste gas and waste residues (three wastes) |
| CN203530472U (en) * | 2013-11-15 | 2014-04-09 | 厦门绿邦膜技术有限公司 | Electroplating countercurrent rinsing device |
| CN105986307A (en) * | 2016-03-11 | 2016-10-05 | 合肥汇通控股股份有限公司 | Water saving type electroplating three-level washing tank |
| CN107065947A (en) * | 2017-02-27 | 2017-08-18 | 环境保护部华南环境科学研究所 | The intelligent water-controlled equipment and its automatic control water method of batch (-type) backwash plating piece |
| CN107460529A (en) * | 2017-08-28 | 2017-12-12 | 厦门市韩江环保科技有限公司 | A kind of electroplating cleaning equipment and its cleaning method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210205 |
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| RJ01 | Rejection of invention patent application after publication |