CN112309898B - Resin plastic package mould - Google Patents
Resin plastic package mould Download PDFInfo
- Publication number
- CN112309898B CN112309898B CN202010579847.5A CN202010579847A CN112309898B CN 112309898 B CN112309898 B CN 112309898B CN 202010579847 A CN202010579847 A CN 202010579847A CN 112309898 B CN112309898 B CN 112309898B
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- China
- Prior art keywords
- die
- resin molding
- workpiece
- work
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229920005989 resin Polymers 0.000 title claims abstract description 110
- 239000011347 resin Substances 0.000 title claims abstract description 109
- 239000004033 plastic Substances 0.000 title description 5
- 238000000465 moulding Methods 0.000 claims abstract description 95
- 230000007246 mechanism Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 description 13
- 238000003825 pressing Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- -1 Polytetrafluoroethylene Polymers 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000008185 minitablet Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
本发明提供一种树脂塑封模具，即便是从树脂塑封模具受热因而成为翘曲状态的工件，也可不产生破损地进行树脂塑封。本发明的树脂塑封模具(10)将在基材(Wa)上保持电子零件(Wb)的工件(W)与塑封树脂(R)一起搬入并进行树脂塑封，且具有：工件位置规定部(50)，在将工件(W)安置于所述树脂塑封模具(10)时，规定工件(W)的容许外缘位置，工件位置规定部(50)设置成，在合模时承受工件(W)变形时的既定的作用力，可沿着模具面向外侧移动。
The present invention provides a resin molding mold, which can perform resin molding without damage even if the workpiece is heated and thus becomes warped by the resin molding mold. The resin molding mold (10) of the present invention moves a workpiece (W) holding an electronic component (Wb) on a substrate (Wa) together with a molding resin (R) and performs resin molding, and has: a workpiece position determining portion (50) that determines the allowable outer edge position of the workpiece (W) when the workpiece (W) is placed in the resin molding mold (10), and the workpiece position determining portion (50) is configured to withstand a predetermined force when the workpiece (W) is deformed during mold closing, and can move outward along the mold surface.
Description
Technical Field
The invention relates to a resin molding die for resin molding (resin mould) of a workpiece (work).
Background
With the miniaturization and thinning of electronic devices, a method for manufacturing a semiconductor device has been proposed in which a semiconductor chip or the like is attached to a carrier board CARRIER PLATE, resin-molded, and then cut into individual pieces, in order to improve the production efficiency of the semiconductor device. As an example, a semiconductor chip or the like is attached to a carrier using an adhesive tape, and resin molding is performed. Then, the carrier plate and the tape are peeled off, and then electrode molding or polishing is performed to form a single piece, thereby manufacturing a semiconductor device (see patent document 1: japanese patent application laid-open No. 2006-287335).
[ Prior Art literature ]
[ Patent literature ]
[ Patent document 1] Japanese patent laid-open No. 2006-287335
Disclosure of Invention
[ Problem to be solved by the invention ]
However, in the method for manufacturing a semiconductor device as exemplified in patent document 1, when a work for holding electronic components such as a semiconductor chip on a substrate such as a carrier is carried into a resin molding die heated to perform resin molding, it is not uncommon that the work is heated from the die due to a difference in linear expansion coefficient between the front and back surfaces of the work and is warped such that the outer edge portion is separated from the die surface.
When the resin molding is performed while maintaining this state, the outer edge portion deforms so as to extend outward by clamping the work by the mold and correcting the warp of the work when the resin molding mold is closed. In this case, the outer edge portion of the workpiece is pressed against the positioning member due to the deformation of the workpiece, and the breakage of the workpiece caused by the pressing becomes a problem.
[ Means of solving the problems ]
In view of the above, an object of the present invention is to provide a resin molding die that can perform resin molding without breakage even when a workpiece is heated from the resin molding die and thus becomes a warped state.
The present invention solves the above-described problems by the following means described as an embodiment.
The resin molding die of the present invention is characterized by comprising a workpiece position defining section for defining an allowable outer edge position of the workpiece when the workpiece is placed on the resin molding die, wherein the workpiece position defining section is provided so as to be movable outward along a die surface upon receiving a predetermined force when the workpiece is deformed during die clamping, and a resin molding process is performed by bringing the workpiece holding the electronic component on the substrate together with the molding resin.
Thus, when the workpiece is placed, the allowable outer edge position of the workpiece can be defined by including the workpiece position defining portion. Further, the workpiece position defining portion can be moved along the die surface by a force that corrects the warpage of the workpiece and deforms the outer edge portion so as to extend outward at the time of die clamping. Therefore, even if the outer edge portion of the workpiece deforms so as to extend outward in a state of abutting against the workpiece position defining portion, the workpiece is prevented from being broken by the reaction force from the workpiece position defining portion.
The work position defining portion is preferably provided with a protruding portion that protrudes from the die surface, and the predetermined force is set such that the work position defining portion is not movable under a force that contacts when the work is placed on the resin molding die, and the work position defining portion is movable under a force that deforms in an elongated manner while the work placed on the resin molding die in a state that the work is warped due to preheating is corrected in warpage when the die is clamped. Thus, the work can be positioned in the predetermined area without moving the protruding portion outward when the work is placed. Further, when the outer edge portion is deformed so as to be extended outward by the correction of the warp of the work at the time of clamping, the protruding portion can be moved outward, and therefore, breakage of the work can be prevented.
Further, it is preferable that the protruding portion is supported so as to be movable along the mold surface outward by rotation or sliding via a biasing member. Thus, a projection that receives a predetermined force when the workpiece is deformed during mold clamping and moves outward along the mold surface can be realized.
Preferably, the work position defining portion is provided so as to be movable from the die surface toward a direction into the die when the die is closed. This allows the workpiece position defining portion to be retracted into the mold during mold clamping.
Preferably, the work position defining portion is provided in a lower die, and the lower die includes a suction mechanism for sucking and holding a lower surface of the work. Thus, the workpiece can be reliably sucked and held at a predetermined position of the lower die during die clamping.
[ Effect of the invention ]
According to the present invention, even a workpiece which is heated from a resin molding die and thus becomes a warped state can be resin-molded without breakage.
Drawings
Fig. 1 is a device configuration diagram showing an example of a resin molding device including a resin molding die according to an embodiment of the present invention.
Fig. 2 is a schematic diagram (front cross-sectional view) showing an example of a resin molding die according to an embodiment of the present invention.
Fig. 3 is a schematic diagram (plan view) showing an example of a lower die of the resin molding die of fig. 1.
Fig. 4 is a schematic view (plan view) showing another example of the lower die of the resin molding die of fig. 1.
Fig. 5 is an enlarged view showing an example of the work position defining portion of the resin molding die of fig. 1.
Fig. 6 is an enlarged view showing another example of the work position defining portion of the resin molding die of fig. 1.
Fig. 7 is a schematic view (plan view) showing an example of a lower die of a resin molding die of a comparative example, and is an explanatory view for explaining a problem to be solved by the present invention.
Description of symbols
10 Resin plastic package mould
12 Lower die
12A, 14a mold surfaces (parting surfaces)
14 Upper die
14B, 14c, 46 suction paths
16 Mould cavity
22 Lower plate
24 Upper plate
26 Die cavity insert
28 Die clamping device
28A through hole
32 First force application member
34 Sealing member
36 Cavity plate
40 Suction mechanism
50 Workpiece position defining portion
52 Projecting part (pin)
54A third force application member
56 Second force application member
100 Resin plastic sealing device
100A workpiece/resin supply section
100B pressurizing portion
100C molded article accommodating section
100D conveying part
102. 118 Stocker
104. 114, Placing table
106 Dispenser
110 Pressure device
112 Film feeding mechanism
122. 124 Loader
126 Guide portion
F, release film
R plastic package resin
W is workpiece
Wa: substrate
Wb electronic parts
Wp molded article
V position
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a schematic diagram showing an example of the structure of a resin molding apparatus 100 including a resin molding die 10 according to an embodiment of the present invention. Fig. 2 is a front cross-sectional view (schematic view) showing an example of the resin molding die 10 according to the embodiment of the present invention. Here, for convenience of explanation, the up-down, left-right, front-back directions of the resin molding device 100 and the resin molding die 10 are sometimes explained by arrows indicated in the drawings. In all the drawings for explaining the embodiments, members having the same functions may be denoted by the same reference numerals, and the repeated explanation thereof may be omitted.
The resin molding die 10 of the present embodiment is a die used in a resin molding apparatus (not shown) for resin molding a work (molded article) W by using a molding resin (sometimes simply referred to as "resin") R. Here, a case of a compression molding apparatus is exemplified as the resin molding apparatus.
First, as an example of the workpiece W to be molded, a workpiece in which an electronic component Wb such as a semiconductor chip is held on a base material Wa such as a carrier plate can be used. Such a work W is used for, for example, a resin sealing method called embedded chip scale ball grid array (embedded WAFER LEVEL BGA, eWLB) or the like. Specifically, for example, a work in which a plurality of semiconductor chips Wb are attached in a matrix by using a thermally peelable tape (not shown) on a carrier plate Wa made of a metal (stainless steel (STAINLESS STEEL, SUS) or the like) having a circular shape with a diameter of 12 inches (about 300 mm) and the same size as the semiconductor chips is used. In addition, the carrier Wa may have a rectangular shape. The work W is not limited to the above configuration, and a work in which the semiconductor chip Wb is attached to the carrier Wa made of glass or the like with another adhesive may be used. Further, the workpiece W may be a rectangular workpiece W having a dimension of 500mm or more on one side.
Here, the adhesive tape is a heat-peelable tape having heat-foaming properties, and has a property that the adhesiveness is reduced by heating. Therefore, there is an advantage that only the base material Wa is easily peeled from the resin molded body obtained by molding the electronic component Wb by heating after the resin molding.
Meanwhile, the molding resin R is, for example, a thermosetting resin (for example, an epoxy resin containing a filler), and the state thereof may be a liquid, a powder, a sheet, a pellet, or a solid represented by a mini tablet.
Next, an outline of the resin molding apparatus 100 according to the present embodiment will be described. As shown in fig. 1, the resin molding device 100 includes a work/resin supply unit 100A for supplying a work W and a molding resin R, a pressurizing unit 100B for resin-molding the work W, a molded article housing unit 100C for housing a molded article Wp after resin-molding, and a conveying unit 100D for conveying the work W (including the molding resin R) and the molded article Wp. The heater may be provided with a preheating unit (not shown) or the like as needed.
First, the work/resin supply section 100A includes a stocker (stocker) 102, and the stocker 102 accommodates a cassette (magazine) accommodating the works W. The workpieces W are taken out from the cassettes and placed on the placing table 104.
The work/resin supply unit 100A includes a dispenser 106, and the dispenser 106 supplies the molding resin R to the work W placed on the placement stage 104. The work W on which the plastic resin R is mounted is transferred to the pressing portion 100B by a loader 122 of the transfer portion 100D.
Next, the pressing unit 100B includes a pressing device 110, and the pressing device 110 drives the heated resin molding die 10 to open and close, thereby clamping the work W and performing resin molding. The pressurizing device 110 includes a conventional mold locking mechanism for pushing the resin molding die 10 in the die opening and closing direction, a film supplying mechanism 112 for supplying a release film (RELEASE FILM) F to the die surface of the resin molding die 10, and the like. The molded article Wp after resin molding is transferred to the molded article storage section 100C by the loader 124 of the transfer section 100D.
Next, the molded article storage section 100C includes a placement stage 114, and the placement stage 114 mounts the molded article Wp after resin molding. The molded articles Wp placed on the placement table 114 by the loader 124 are stored in the storage cassettes and then sequentially stored in the stocker 118.
As described above, the conveying section 100D includes the loader 122 that carries the workpiece W into the pressing section 100B, and the loader 124 that carries the molded article Wp out of the pressing section 100B.
Here, the work/resin supply unit 100A, the pressing unit 100B, and the molded article storage unit 100C are configured to connect the unitized stands to each other. Guide portions 126 are provided on the rear sides of the respective units, and the guide portions 126 are assembled to be linearly connected to each other, thereby forming a guide rail. The loader 122 and the loader 124 are each provided so as to be linearly movable along a guide rail from a predetermined position on the guide portion 126 toward the work/resin supply portion 100A, the pressing portion 100B, and the molded article storage portion 100C.
Therefore, by changing the configuration of the unit, the configuration of the resin molding device 100 can be changed while maintaining the state in which the guide portions 126 are connected to each other. The example shown in fig. 1 is an example in which two sets of pressing portions 100B are provided, but may be a configuration of one set or three or more sets. The configuration of the work/resin supply unit 100A, the molded article storage unit 100C, the conveying unit 100D, and the like may be changed by increasing or decreasing as necessary.
Next, the structure of the resin molding die 10 will be described with reference to fig. 2 and the like.
The resin molding die 10 includes a pair of dies (for example, a plurality of die blocks including alloy tool steel are assembled) having a cavity and performing die opening and closing. In the present embodiment, one of the pair of molds on the lower side in the vertical direction is referred to as a lower mold 12, and the other mold on the upper side is referred to as an upper mold 14. The resin molding die 10 is closed and opened by approaching and separating the lower die 12 and the upper die 14 from each other. Therefore, the vertical direction is also the mold opening/closing direction.
The resin molding die 10 is opened and closed by a conventional die opening and closing mechanism (not shown). For example, the mold opening and closing mechanism includes a pair of platens (platen), a plurality of tie bars (tie bars) for erecting the pair of platens, a driving source (for example, an electric motor) for moving (lifting) the platens, a drive transmission mechanism (for example, toggle link), and the like (all not shown). Here, the resin molding die 10 is disposed between a pair of pressing plates of the die opening and closing mechanism. In the present embodiment, the lower die 12 serving as a fixed die is assembled to a fixed platen (platen fixed to a tie bar), and the upper die 14 serving as a movable die is assembled to a movable platen (platen that is elevated along the tie bar). However, the present invention is not limited to the above configuration, and the lower die 12 may be a movable die, the upper die 14 may be a fixed die, or both the lower die 12 and the upper die 14 may be movable dies.
First, the upper die 14 of the resin molding die 10 will be specifically described. The upper die 14 includes an upper plate 24, a cavity insert (CAVITY PIECE) 26, a clamp (clamper) 28, and the like, and is formed by assembling these parts.
The cavity insert 26 is fixedly assembled with respect to the lower surface (surface on the lower die 12 side) of the upper plate 24. The clamp 28 is formed in a ring shape so as to surround the cavity insert 26, and is assembled adjacent to the cavity insert 26 and away from the lower surface of the upper plate 24.
In the present embodiment, the upper die 14 has the cavity 16 recessed from the die surface (parting (parting) surface) 14a, but the cavity insert 26 forms the inside (bottom) of the cavity 16, and the clamp 28 forms the side of the cavity 16. Specifically, a through hole 28a having a circular shape in terms of parting plane view (planar view) is formed in the center of the die holder 28 in the thickness direction (die opening/closing direction). The cavity insert 26 is inserted into the through hole 28a of the mold clamp 28, and is assembled, thereby forming the bottom surface and the side surfaces of the cavity 16 having a concave shape. The lower surface of the cavity 16 is surrounded by the work W mounted on the lower die 12.
Here, the cavity 16 communicates with a pressure reducing device (not shown) via a vent groove (not shown) formed in the die surface 14a of the lower surface of the die holder 28 of the upper die 14. The entire resin molding die 10 may be placed in a decompression chamber (not shown) to decompress, or a suction hole (not shown) may be provided to a vent groove of the die surface 14a, and a full-periphery seal (not shown) may be provided outside the suction hole of the die surface 14a. According to the above configuration, the pressure is reduced by driving the pressure reducing device, and the degassing in the cavity 16 can be performed in the closed state. Further, as an example of the pressure reducing device, an existing vacuum pump or the like may be used.
The resin molding die 10 further includes a film suction mechanism for sucking a release film (sometimes simply referred to as "film") F from the die surface 14a side of the upper die 14. The film suction mechanism communicates with a pressure reducing device (not shown) via suction paths 14b and 14c disposed through the die holder 28. Specifically, one ends of the suction paths 14b and 14c are connected to the die surface 14a of the upper die 14, and the other ends thereof are connected to a pressure reducing device disposed outside the upper die 14. According to the above configuration, the pressure reducing device can be driven to suck the release film F from the suction paths 14b and 14c, and the release film F is sucked and held (attached) to the mold surface 14a including the inner surface of the cavity 16. As described above, as an example of the pressure reducing device, an existing vacuum pump or the like can be used.
In this way, by providing the release film F, the release film F covers the mold surface 14a of the upper mold 14 including the inner surface of the cavity 16, and the molded article (work W) can be easily peeled from the resin, so that it can be easily taken out from the resin molding mold 10. As an example, the release film F is a film material having heat resistance capable of withstanding the heating temperature of the resin molding die 10, being easily peeled from the resin, and having flexibility and stretchability. Specifically, for example, a resin film of Polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE) (Polytetrafluoroethylene polymer), or the like can be used.
Further, the resin molding die 10 includes a first urging member (for example, a spring such as a coil spring, an elastic body such as rubber) 32 as a movable member (elastic member). The first force application member 32 is disposed between the upper plate 24 and the die holder 28. The die holder 28 is movably assembled to the upper plate 24 via the first urging member 32. That is, the cavity insert 26 is surrounded by the mold clamp 28, and the cavity insert 26 and the mold clamp 28 are relatively movable back and forth in the mold opening and closing direction. At this time, the clearance between the inner peripheral surface of the through hole 28a of the clamp 28 and the outer peripheral surface of the cavity insert 26 is ensured to be a predetermined size, so that the clamp 28 is smoothly movable. In this way, in the resin molding die 10, the cavity insert 26 is fixedly held with respect to the upper plate 24, while the clamp 28 is movably held away from the upper plate via the first urging member 32.
The gap is included in the suction path 14c of the film suction mechanism, and sucks the release film F at the boundary (corner portion of the cavity 16) between the cavity insert 26 and the clamp 28. Thus, the membrane suction mechanism includes a sealing member 34 (e.g., an O-ring). The sealing member 34 is provided between (the upper part of) the cavity piece 26 and the clip 28 to seal the gap so as not to cause air leakage as the suction path 14 c.
The upper die 14 is heated and controlled by a heater (e.g., an electric heater), an auxiliary heater (e.g., an electric heater), a temperature sensor, a control unit, a power supply, and the like (all not shown). As an example, the heater of the upper die 14 is built in the upper plate 24 of the upper die 14, and mainly heats the entire upper die 14. The auxiliary heater is incorporated in the die holder 28, and the die holder 28, which is difficult to transfer heat from the heater of the upper die 14, is heated in an auxiliary manner. The heater and the auxiliary heater of the upper die 14 are supplied with electric power by a power supply, and emit heat. As an example, the upper die 14 is heated to a predetermined temperature (for example, 180 ℃) by a heater or an auxiliary heater. As another example, a lower die carrier may be provided below the lower die 12, an upper die carrier may be provided above the upper die 14, and a heater may be provided in the die carrier instead of providing a heater (not shown) in the upper plate 24, the cavity insert 26, and the die holder 28.
Next, the lower die 12 of the resin molding die 10 will be specifically described. The lower die 12 includes a lower plate 22, a cavity plate 36, and the like, and is formed by assembling these components. Here, fig. 3 is a plan view (schematic view) showing an example of the lower die 12 used when the workpiece W (the base material Wa) is circular, and fig. 4 is a plan view (schematic view) showing an example of the lower die 12 used when the workpiece W (the base material Wa) is rectangular. As described above, the configuration of the lower die 12 and the configuration of the upper die 14 corresponding thereto can be appropriately set according to the size and shape of the workpiece W (particularly, the base material Wa and the like).
In the lower die 12, a cavity plate 36 is used instead of the fixed cavity piece 26 and the movable clamp 28 provided in the upper plate 24 of the upper die 14 described above. The cavity plate 36 is fixedly assembled with respect to the upper surface (surface on the upper die 14 side) of the lower plate 22.
The lower die 12 includes a heater (e.g., an electric heater), a temperature sensor, a control unit, a power source, etc. (all not shown) and performs heating and control thereof. As an example, the heater of the lower die 12 is built in the lower plate 22 of the lower die 12, and mainly heats the entire lower die 12. The heater of the lower die 12 is supplied with electric power by a power source, thereby releasing heat. As an example, the lower die 12 is heated to a predetermined temperature (for example, 180 ℃) by a heater adjustment. In addition, as described above, a heater is sometimes provided in the lower mold frame, and a heater is not provided in the cavity plate 36 or the lower plate 22. In this case, since the heater is not provided in the resin molding die 10, there is an advantage in that the resin molding die 10 can be easily replaced when the variety is replaced.
Here, fig. 7 (a view of the same position as the V portion in fig. 2) shows the lower die 12 of the resin molding die of the comparative example, and the problem to be solved by the present invention will be described with reference to this view. When the workpiece W is placed on the lower die 12, as described above, heat is received from the heated lower die 12 (or other structure), resulting in a surface of the workpiece W facing the die (i.e., a lower surface of the workpiece W) being relatively greatly elongated as compared to a surface not facing the die (i.e., an upper surface of the workpiece W). Therefore, although the lower surface of the work W (the base material Wa) and the surface of the die surface 12a of the lower die 12 are arranged so as to be closely contacted with each other in design, in reality, there is a case where the outer edge portion of the work W (the base material Wa) is warped so as to be separated from the die surface 12a as shown in fig. 7 due to the influence of the heat (the difference in linear expansion coefficient or the like) (a state called a "smile curve"). Elongation of the work W, which may cause such a phenomenon, may cause a problem that breakage of the base material Wa may occur (details will be described later). Here, the effect of the problem is particularly large for a large-sized workpiece W exceeding 500mm on one side.
As shown in fig. 5, the lower die 12 of the present embodiment, which can solve the above-described problem, includes a work position defining portion 50 that defines an allowable outer edge position of the work W when the work W is placed, and a suction mechanism 40 that sucks and holds the lower surface of the work W.
First, the suction mechanism 40 includes a suction passage 46, which is disposed through the cavity plate 36 and the lower plate 22. The suction paths 46 are provided in a plurality at appropriate positions, and communicate with a pressure reducing device (not shown). By driving the pressure reducing device to cause the suction force to act from the suction path 46, the work W can be sucked and held on the die surface (parting surface) 12a of the lower die 12. Further, as an example of the pressure reducing device, an existing vacuum pump or the like may be used.
Next, the work position defining portion 50 includes a protruding portion 52 that is provided so as to protrude upward from the die surface (parting surface) 12a of the lower die 12. In the present embodiment, the protruding portion 52 is formed as a bar-shaped pin, but the present invention is not limited thereto, and a plate, a block, or the like (not shown) may be used. The pins 52 are disposed so as to surround the outer edge so as to restrict the movement of the workpiece W, and a plurality of pins 52 are provided, and the arrangement interval of the pins 52 is set to a dimension obtained by adding a predetermined tolerance to the dimension of the corresponding position of the workpiece W. Thereby, the work W can be smoothly placed through the gap. When the workpiece W is placed, the outer edge of the workpiece W is brought into contact with the pin 52, whereby an effect of defining the allowable outer edge position of the workpiece W and disposing the workpiece W in a predetermined region can be obtained.
Here, the pin 52 is fixed to the lower die 12 in an upward biased state by a second biasing member 56 (for example, a spring such as a coil spring or an elastic body such as rubber) that generates a biasing force. Thus, at the time of mold clamping, the tip of the pin 52 is pushed downward by abutting against the mold surface 14a of the upper mold 14, and the entire pin 52 can retreat (move) from the mold surface 12a in a direction of entering (being pulled into) the mold (in the lower mold 12). Therefore, the mold can be closed without providing a recess or the like corresponding to the pin 52, and the resin molding can be performed. At this time, the forming may be performed without causing deformation of the release film F due to, for example, the pins 52 being pushed in.
The workpiece position defining portion 50 includes a third urging member (e.g., a spring such as a coil spring, an elastic body such as rubber) 54, and the third urging member 54 urges the pin 52 in a direction to approach (contact) the outer edge of the workpiece W. Thus, the pin 52 can be held at a predetermined position defining the allowable outer edge position of the workpiece W. On the other hand, when a force exceeding the force applied by the third urging member 54 (set to a predetermined force described later) acts, the pin 52 can be moved outward along the die surface 12 a.
At this time, the force applied by the third urging member 54 to the pin 52 is set to a value of "predetermined urging force". More specifically, the "predetermined force" is a value set such that the pin 52 is not movable by a force that contacts the workpiece W when the workpiece W is placed on the resin molding die (here, the lower die 12), and the pin 52 is movable by a force that deforms the outer edge portion so as to extend outward when the workpiece W placed on the resin molding die (here, the lower die 12) in a state of being warped by preheating is corrected by warpage at the time of clamping. That is, the force applied to the pin 52 is set to be larger than the force applied to the pin 52 via the work W when the work W is carried by the loader 122 with a predetermined margin and placed on the molding die, and to be smaller than the force that does not cause the avoidance due to the linear expansion of the work W.
If the pin 52 is not moved outward along the die surface, there is no portion where the outer edge of the workpiece W comes into contact with the pin 52 and then comes away, and stress (compressive force) acts on the outer edge portion. Therefore, there is a possibility that breakage occurs when the type of the base material Wa constituting the work W is, for example, a glass carrier, and deformation occurs when the type is a stainless steel carrier. When the work W is placed on the lower die 12, the lower surface of the work W (here, the base material Wa) is sucked and held by the suction mechanism 40, and therefore, the breakage of the base material Wa occurs more remarkably.
In contrast, according to the configuration of the present embodiment, the warp is corrected and deformed to be elongated at the time of mold clamping, and the workpiece W generates a "predetermined force". As a result, the pin 52 is moved outward along the die surface by the "predetermined force" at the outer edge portion of the workpiece W. Thus, a solution to the problem can be achieved. The pin 52 may also be used to position the workpiece W.
As an example, as shown in fig. 5 (enlarged view of the V portion in fig. 2), the pin 52 is supported by the lower die 12 so as to be movable outward along the die surface by rotational movement in a state of being biased by the third biasing member 54.
Alternatively, as a modification, as shown in fig. 6 (a view of the same position as the V portion in fig. 2), the pin 52 may be supported by the lower die 12 so as to be movable along the die surface outward by sliding movement in a state of being biased by the third biasing member 54.
The above description has been given of the configuration in which the workpiece W is placed on the lower die 12, but the present invention is not limited to this, and is applicable to the configuration in which the workpiece W is placed on the upper die 14. In this case, the lower die 12 and the upper die 14 may be replaced with each other, and further, a holding claw or the like may be provided in the upper die 14 for reliably holding the workpiece W, which is preferable (not shown).
As described above, according to the resin molding die of the present invention, the work can be positioned at a predetermined position by including the work position defining portion when the work is placed on the resin molding die. On the other hand, in the case of a work piece which is heated from a resin molding die and thus becomes a warp state, the work piece is prevented from being broken by receiving a reaction force from the work piece position defining portion when the warp is corrected and deformed to be elongated at the time of die clamping.
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. In particular, if the pin is configured to be capable of being retracted outward, the second urging member does not necessarily need to be provided. In this case, the recess into which the pin can be inserted may be provided on the upper die side. With this configuration, breakage of the workpiece can also be prevented.
The configuration of mounting the semiconductor chip on the substrate is described as an example of the work, but the work is not limited thereto. For example, resin molding can be performed in the same manner even if a workpiece such as another substrate is used as a member to be mounted instead of a base material, or a workpiece such as another element is used as a member to be mounted instead of a semiconductor chip. Further, the larger the workpiece is, the larger the influence is, but even if a large workpiece having a side of 500mm is not necessary, breakage of the workpiece may occur, and therefore, the same configuration may be adopted for a workpiece having a normal size such as a so-called strip substrate.
The resin molding device of the compression molding method in which the upper die includes a cavity has been described as an example, but the device may be applied to a configuration in which the lower die includes a cavity, a transfer molding method, or the like.
Claims (4)
1. A resin molding die for carrying a work having an electronic component held on a base material together with a molding resin and performing resin molding, the resin molding die comprising:
a work position specifying unit for specifying an allowable outer edge position of the work when the work is placed on the resin molding die,
The workpiece position defining part is provided so as to be movable outward along the die surface upon receiving a predetermined force when the workpiece is deformed during clamping,
The work position defining part has a protruding part provided to stand so as to protrude from the die surface,
The predetermined force is set such that the work position defining portion is not movable under a force with which the work is brought into contact when the work is placed on the resin molding die, and the work position defining portion is movable under a force with which the work placed on the resin molding die in a state of being warped by preheating is corrected in warpage when the work is clamped and deformed in an elongated manner.
2. The resin molding die according to claim 1, wherein,
The protruding portion is supported so as to be movable outward along the die surface by rotation or sliding via a biasing member.
3. The resin molding die according to claim 1 or 2, wherein,
The workpiece position defining section is provided so as to be movable from the die surface toward a direction into the die during die closing.
4. The resin molding die according to claim 1 or 2, wherein,
The workpiece position defining portion is provided in the lower die,
The lower die is provided with a suction mechanism for sucking and holding the lower surface of the workpiece.
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| JP2019-138583 | 2019-07-29 | ||
| JP2019138583A JP7121705B2 (en) | 2019-07-29 | 2019-07-29 | resin mold |
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| CN112309898B true CN112309898B (en) | 2024-11-29 |
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| JP2018199231A (en) * | 2017-05-26 | 2018-12-20 | アピックヤマダ株式会社 | Resin molding die |
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| JP3735181B2 (en) * | 1997-04-08 | 2006-01-18 | Ｔｏｗａ株式会社 | Resin sealing molding method for electronic parts and mold |
| EP1207988A4 (en) * | 1999-03-18 | 2005-08-17 | David H Stewart | A method and machine for manufacturing molded structures using zoned pressure molding |
| JP2002187160A (en) | 2000-12-19 | 2002-07-02 | Canon Inc | Molding tool and moldings |
| JP4483572B2 (en) | 2004-12-24 | 2010-06-16 | パナソニック電工株式会社 | Insert product forming method, insert product forming device, electromagnetic device, discharge lamp lighting device, lighting fixture, and vehicle |
| JP2007109831A (en) * | 2005-10-13 | 2007-04-26 | Towa Corp | Resin sealing molding method for electronic component |
| JP5824765B2 (en) * | 2011-01-11 | 2015-12-02 | アピックヤマダ株式会社 | Resin molding method, resin molding apparatus, and supply handler |
| TWI689396B (en) * | 2014-07-22 | 2020-04-01 | 日商山田尖端科技股份有限公司 | Forming die, forming device, and method of manufacturing formed products |
| WO2017010319A1 (en) * | 2015-07-15 | 2017-01-19 | アピックヤマダ株式会社 | Molding die and resin molding device |
| JP6438913B2 (en) | 2015-07-15 | 2018-12-19 | アピックヤマダ株式会社 | Mold and resin molding equipment |
| CN206170556U (en) * | 2016-11-21 | 2017-05-17 | 北京远东德丰科技有限公司 | Charge -in system and injection mold |
| JP6742273B2 (en) | 2017-05-18 | 2020-08-19 | アピックヤマダ株式会社 | Molding die and resin molding method |
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| TW202120288A (en) | 2021-06-01 |
| CN112309898A (en) | 2021-02-02 |
| JP2021020383A (en) | 2021-02-18 |
| TWI737380B (en) | 2021-08-21 |
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