CN112289758B - Heat dissipation device of integrated circuit board - Google Patents

Heat dissipation device of integrated circuit board Download PDF

Info

Publication number
CN112289758B
CN112289758B CN202011201896.1A CN202011201896A CN112289758B CN 112289758 B CN112289758 B CN 112289758B CN 202011201896 A CN202011201896 A CN 202011201896A CN 112289758 B CN112289758 B CN 112289758B
Authority
CN
China
Prior art keywords
circuit board
integrated circuit
wire
radiator
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011201896.1A
Other languages
Chinese (zh)
Other versions
CN112289758A (en
Inventor
闻国平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ruisheng Electronic Technology ( Shenzhen ) Ltd.
Original Assignee
Ruisheng Electronic Technology Shenzhen Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruisheng Electronic Technology Shenzhen Ltd filed Critical Ruisheng Electronic Technology Shenzhen Ltd
Priority to CN202011201896.1A priority Critical patent/CN112289758B/en
Publication of CN112289758A publication Critical patent/CN112289758A/en
Application granted granted Critical
Publication of CN112289758B publication Critical patent/CN112289758B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/22Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/60Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611Bolts or screws

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a heat dissipation device of an integrated circuit board, which comprises an upper cover plate, a radiator, a bottom plate, a wire anti-pulling mechanism, a sealing connection assembly, a power supply, a mounting plate, the integrated circuit board, a screw and a binding post, wherein the upper cover plate and the bottom plate are arranged at the upper end and the lower end of the radiator to seal the integrated circuit board in the radiator, so that the heat dissipation effect can be achieved, the dustproof effect can be achieved, dust can be prevented from being accumulated on the integrated circuit board, and the heat dissipation performance of the integrated circuit board and the power supply is greatly improved; the setting of mounting panel, mounting panel fixed mounting are at the inside intermediate position of radiator, cut apart into two solitary working chambers from top to bottom with the radiator, and the top of mounting panel is provided with the power that is used for the integrated circuit board power supply, and integrated circuit board is installed to the bottom of mounting panel, and independent work is accomplished in respective cavity to power and integrated circuit board, mutual noninterference, and the radiating effect is good moreover, and operational environment is stable.

Description

Heat dissipation device of integrated circuit board
Technical Field
The invention relates to the technical field of heat dissipation devices, in particular to an integrated circuit board heat dissipation device.
Background
An integrated circuit board is a miniature electronic device or component, and adopts a certain process to interconnect elements such as transistors, resistors, capacitors, inductors and the like required in a circuit and wiring, and the elements are manufactured on one or more small semiconductor wafers or medium substrates and then packaged in a tube shell to form a miniature structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability.
Most of the traditional integrated circuit boards adopt small fans for cooling and radiating, but the cooling effect can be ensured only by ensuring the air circulation in the radiating mode, and accordingly, the open space causes the accumulation of a large amount of dust, so that the radiating effect of the integrated circuit board is poor, and the service life of the integrated circuit board is shortened; the outside wire and circuit board adopt the welded means to fix, if the external world appears dragging force to the wire, just very big possible has caused droing of wire, does not have the safety protection effect.
Disclosure of Invention
In view of the above, the present invention is directed to the defects in the prior art, and a main object of the present invention is to provide a heat dissipation apparatus for an integrated circuit board, so as to solve the problems mentioned in the above background that most of the conventional integrated circuit boards employ a small fan for cooling and heat dissipation, but the cooling effect can be ensured only by ensuring the air circulation in such a heat dissipation manner, and accordingly, the open space causes a large amount of dust accumulation, so that the heat dissipation effect of the integrated circuit board is poor, and the service life of the integrated circuit board is also shortened; the outside wire and circuit board adopt the welded means to fix, if the external world appears dragging force to the wire, just very big possible has caused droing of wire, does not have the problem of safety protection effect.
In order to achieve the purpose, the invention adopts the following technical scheme:
an integrated circuit board heat dissipation device comprises
The periphery of the upper cover plate used for sealing the top of the radiator is provided with a plurality of threaded holes, and the upper cover plate is arranged on the top of the radiator through screws;
the radiator is used for radiating the integrated circuit board, and the radiator is internally provided with an installation space which can be used for installing the integrated circuit board;
the bottom plate is used for sealing the bottom of the radiator, a plurality of threaded holes are formed in the periphery of the bottom plate, and the bottom plate is installed at the bottom of the radiator through screws;
the wire anti-pulling mechanism arranged on one side of the radiator can be used for fixing a wire connected to the outside of the integrated circuit board and preventing the wire from falling off due to external force pulling;
the sealing connection assembly arranged on one side of the wire anti-pulling mechanism can achieve a sealing effect on the wire, prevent external dust from entering the radiator along with the wire and also have a good waterproof effect;
the power supply for supplying power to the integrated circuit board is arranged in the radiator and fixedly arranged on the mounting plate; the mounting plate is fixed in the middle of the inside of the radiator and divides the radiator into two independent working spaces;
the integrated circuit board is fixedly arranged at the bottom of the mounting plate and is connected with a power supply through a lead; and a binding post for connecting a power supply with an external lead is also arranged in the radiator.
Furthermore, the radiator comprises a radiator body, a side fixing plate, convex blocks, a binding post mounting plate and a threading hole, wherein a plurality of side convex blocks used for fixing the mounting plate are uniformly distributed on the inner wall of the radiator body; the side raised blocks are provided with threaded holes; the outer part of one end of the radiator body is fixedly connected with a side fixing plate for installing a wire anti-pulling mechanism; the radiator body is provided with a side fixing plate and a side end, and is transversely provided with a threading hole for an external wire to penetrate conveniently; and a terminal mounting plate convenient for fixing a terminal is arranged below the threading hole.
Furthermore, the wire anti-pulling mechanism comprises a groove-shaped block, a wire fixing component and a sealing component, wherein the groove-shaped block is fixedly arranged on the side fixing plate, and the wire fixing component for fixing the wire is arranged in the groove-shaped block; the sealing assembly is arranged above the lead fixing assembly and is detachably connected with the groove-shaped block.
Furthermore, the sealing and connecting assembly comprises a threading opening, a rubber conduit, a sealing stud sleeve and a rubber sealing ring, the threading opening is arranged on one side of the groove-shaped block, which is far away from the radiator body, and the rubber conduit for water and dust prevention is sleeved in the threading opening; the sealing stud sleeve is in threaded connection with the threading opening.
Furthermore, the sealing stud sleeve is arranged in a hollow mode and is matched with the rubber sealing ring for use when a lead is installed.
Furthermore, the lead fixing assembly is formed by a plurality of wire clamping shells in parallel; both ends of each wire clamping shell are respectively provided with a wire inlet hole and a wire outlet hole; a wire clamping piece for clamping a wire is movably connected in the wire clamping shell through a rotating shaft; and a rubber bottom pad is bonded on the bottom side in the wire clamping shell.
Furthermore, the sealing assembly comprises an outer shell, a threaded hole, a guide post, a pushing block, a clamping block, a reset spring, a stud, a trapezoidal sliding block and a through groove, the top of the outer shell is provided with the threaded hole for matching and connecting the stud, and the two sides of the outer shell are also provided with the through grooves;
the two guide columns are arranged in parallel inside the outer shell; the two pushing blocks are adopted, and through holes are formed in the two ends of each pushing block and sleeved on the guide columns in a sliding connection mode; a clamping block is also fixed on the outer side of the pushing block; a reset spring is arranged between the pushing block and the inner wall of the outer shell, and the reset spring is sleeved on the guide post.
Furthermore, the upper ends of the adjacent sides of the two pushing blocks are provided with inclined planes with an angle of 45 degrees; two the top that promotes the piece still is provided with the trapezoidal slider that is used for promoting the piece driven, and trapezoidal slider is located the double-screw bolt under.
Furthermore, clamping grooves clamped with the clamping blocks are formed in two sides of the inner portion of the groove-shaped block.
Further, the bottom of the outer shell adopts a flat bottom design, and the flat bottom is used for pressing the wire by the wire clamping piece to prevent the wire from loosening.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
1. according to the invention, the upper cover plate and the bottom plate are arranged at the upper end and the lower end of the radiator to seal the integrated circuit board in the radiator, so that the radiating effect can be achieved, the dustproof effect can be achieved, dust is prevented from being accumulated on the integrated circuit board, and the radiating performance of the integrated circuit board and the power supply is greatly improved;
the setting of mounting panel, mounting panel fixed mounting are at the inside intermediate position of radiator, cut apart into two solitary working chambers from top to bottom with the radiator, and the top of mounting panel is provided with the power that is used for the integrated circuit board power supply, and integrated circuit board is installed to the bottom of mounting panel, and independent work is accomplished in respective cavity to power and integrated circuit board, mutual noninterference, and the radiating effect is good moreover, and operational environment is stable.
2. In the invention, the wiring terminal is arranged in the radiator, so that the wiring terminal can be prevented from being affected with damp or accumulating dust, and the radiating effect can be achieved.
3. According to the invention, the lead fixing assembly is arranged in the groove-shaped block, the lead penetrates through the lead fixing assembly and enters the binding post, and after the lead is clamped and fixed by the lead fixing assembly, the fixing effect of the lead can be ensured, the situation that the lead is separated from the binding post when the lead is pulled is prevented, and the connection effect of the lead is ensured;
4. according to the invention, the lead passes through the rubber sealing ring, the sealing stud sleeve and the rubber guide pipe and then enters the lead fixing assembly, the wear of the lead can be prevented through the rubber guide pipe, the rubber sealing ring can play a better sealing effect through the sealing stud sleeve, the entrance of external dust is prevented, and the integrated circuit board is greatly ensured to be in a dust-free working environment.
5. According to the invention, after the wire fixing component is clamped to the groove-shaped block, the sealing component is required to seal the wire fixing component, when the wire fixing component is used, the outer shell is firstly clamped at the upper end of the wire fixing component, then the stud is rotated clockwise, the two pushing blocks are forced by the trapezoidal sliding block to drive the clamping blocks to move towards two sides on the guide post when the stud moves downwards continuously, and then the clamping blocks penetrate through the through grooves and are clamped with the grooves on the inner side of the groove-shaped block, so that the sealing component is fixed;
when dismantling, anticlockwise rotation double-screw bolt, trapezoidal slider loses the apical force back of double-screw bolt, and reset spring will promote and promote the piece and move to the inboard side, and the fixture block separates with the inboard recess of groove type piece, alright take off seal assembly, simple structure, easy dismounting.
6. According to the invention, when a lead passes through the lead fixing assembly and fixes the lead, the lead firstly enters from the wire inlet hole and then passes out from the wire outlet hole, and after wiring is finished, the lead clamping piece is pressed downwards, so that the lead is clamped.
7. According to the invention, the plurality of wire clamping shells are arranged in parallel, so that different wires can be separately clamped, the phenomenon of adhesion among the wires is prevented, the classification during wiring is facilitated, and the condition of wrong wiring is avoided.
8. According to the invention, the rubber bottom pad is bonded on the bottom side inside the wire clamping shell and matched with the arc-shaped groove at the bottom of the wire clamping piece, so that the clamping effect can be realized, and the wire can be prevented from being damaged by clamping.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a schematic view of the heat dissipation device of the integrated circuit board of the present invention;
FIG. 2 is an exploded view of the heat sink of the present invention;
FIG. 3 is a top view of a heat sink in the heat dissipation device of the integrated circuit board of the present invention;
fig. 4 is a sectional view of a-a of the heat dissipating device of the ic board of the present invention.
FIG. 5 is a schematic view of a structure of a wire anti-pulling mechanism in the heat dissipation device of the integrated circuit board of the present invention;
FIG. 6 is a schematic view of a sealing connection assembly of the heat dissipation device of the integrated circuit board of the present invention;
FIG. 7 is a schematic view of a sealing assembly of the heat sink device of the integrated circuit board of the present invention;
fig. 8 is a cross-sectional view B-B of the heat dissipating device of the ic board of the present invention.
FIG. 9 is a cross-sectional view of a heat sink C-C of the integrated circuit board of the present invention;
FIG. 10 is a schematic view of a lead fixing assembly of the heat dissipating device of an integrated circuit board according to the present invention;
FIG. 11 is a schematic diagram of the internal structure of the wire-clamping housing of the heat dissipation device of the integrated circuit board of the present invention.
The reference numbers are as follows:
1. an upper cover plate; 2. a heat sink; 21. a heat sink body; 22. a side fixing plate; 23. a raised block; 24. a wiring terminal mounting plate; 25. threading holes; 3. a base plate; 4. a wire anti-drag mechanism; 41. a trough-shaped block; 42. a wire fixing assembly; 421. a wire clamping shell; 422. a wire inlet hole; 423. a wire outlet hole; 424. a rubber bottom pad; 425. a wire clamp; 43. a seal assembly; 431. an outer housing; 432. a threaded hole; 433. a guide post; 434. a pushing block; 435. a clamping block; 436. a return spring; 437. a stud; 438. a trapezoidal slider; 439. a through groove; 5. sealing the connecting assembly; 51. a threading opening; 52. a rubber conduit; 53. sealing the stud sleeve; 54. a rubber seal ring; 6. a power source; 7. mounting a plate; 8. an integrated circuit board; 9. a screw; 10. and (4) binding posts.
Detailed Description
Referring to fig. 1 to 11, which show specific structures of preferred embodiments of the present invention, an integrated circuit heat dissipation device includes the following structures.
The radiator comprises an upper cover plate 1, a plurality of screw holes are formed in the periphery of the upper cover plate 1 for sealing the top of a radiator 2, and the upper cover plate 1 is installed on the top of the radiator 2 through screws; the radiator 2, the inside of the radiator 2 used for radiating the integrated circuit board 8 has installation space, can be used for the installation of the integrated circuit board 8; the bottom plate 3, the bottom plate 3 used for sealing the bottom of the radiator 2 is equipped with a plurality of screwed holes all around, the bottom plate 3 is installed on the bottom of the radiator 2 through the screw 9;
the lead anti-pulling mechanism 4 is arranged on one side of the radiator 2 and can be used for fixing the lead connected to the outside of the integrated circuit board 8 so as to prevent the lead from falling off due to external force pulling;
the sealing connection assembly 5 is arranged on one side of the wire anti-pulling mechanism 4, can seal the wire, prevents external dust from entering the radiator 2 along with the wire, and has a good waterproof effect;
the power supply 6 is used for supplying power to the integrated circuit board 8, is arranged in the radiator 2 and is fixedly arranged on the mounting plate 7; the mounting plate 7 is fixed in the middle position inside the radiator 2, and the mounting plate 7 divides the radiator 2 into two independent working spaces;
the integrated circuit board 8 is fixedly arranged at the bottom of the mounting plate 7 and is connected with the power supply 6 through a lead; the radiator 2 is also internally provided with a binding post 10 for connecting the power supply 6 with an external lead.
Specifically, the upper cover plate 1 and the bottom plate 3 are arranged at the upper end and the lower end of the radiator 2 to seal the integrated circuit board 8 in the radiator 2, so that the radiating effect can be achieved, the dustproof effect can be achieved, and dust accumulation on the integrated circuit board 8 is prevented.
In this embodiment, the heat sink 2 includes a heat sink body 21, a side fixing plate 22, a protrusion 23, a terminal mounting plate 24 and a threading hole 25, wherein a plurality of side protrusions 23 for fixing the mounting plate 7 are uniformly distributed on an inner wall of the heat sink body 21; the side raised blocks 23 are provided with threaded holes; a side fixing plate 22 for installing the wire anti-pulling mechanism 4 is fixedly connected to the outside of one end of the radiator body 21; the radiator body 21 is provided with a side fixing plate 22 at the same side end, and is transversely provided with a threading hole 25 for an external wire to penetrate conveniently; a terminal mounting plate 24 convenient for fixing the terminal 10 is arranged below the threading hole 25.
Specifically, two upper and lower solitary working chambers are cut apart into with radiator 2 in the inside intermediate position of mounting panel 7, mounting panel 7's setting, mounting panel 7 fixed mounting, and mounting panel 7's top is provided with power 6 that is used for integrated circuit board 8 to supply power, and integrated circuit board 8 is installed to mounting panel 7's bottom, and power 6 and integrated circuit board 8 accomplish independent work in respective cavity, mutual noninterference, and the radiating effect is good moreover, and operational environment is stable.
In this embodiment, the wire anti-pulling mechanism 4 includes a groove block 41, a wire fixing component 42 and a sealing component 43, the groove block 41 is fixedly installed on the side fixing plate 22, and the wire fixing component 42 for fixing the wire is arranged inside the groove block 41; the sealing member 43 is disposed above the wire fixing member 42 and detachably coupled to the channel block 41.
Specifically, when a wire passes through the wire fixing component 42 and is fixed, the wire firstly enters from the wire inlet 422 and then passes out from the wire outlet 423, and after the wire connection is finished, the wire clamping piece 425 is pressed down, so that the wire is clamped.
In this embodiment, the sealing connection assembly 5 includes a threading opening 51, a rubber conduit 52, a sealing stud sleeve 53 and a rubber sealing ring 54, the threading opening 51 is disposed on one side of the groove-shaped block 41 away from the radiator body 21, and the rubber conduit 52 for water and dust prevention is sleeved inside the threading opening 51; the sealing stud sleeve 53 is in threaded connection with the threading opening 51.
Specifically, the wire passes through rubber seal 54, sealed stud cover 53 and rubber pipe 52 and then gets into fixed subassembly 42 of wire, can prevent the wearing and tearing of wire through rubber pipe 52, and through sealed stud cover 53, rubber seal 54 can play better sealed effect, prevents the entering of external dust, very big assurance integrated circuit board 8 is in dustless operational environment.
In this embodiment, the sealing screw sleeve 53 is hollow, and is used in cooperation with the rubber sealing ring 54 when the lead is installed.
In this embodiment, the wire fixing assembly 42 is formed by a plurality of wire clamping housings 421 in parallel; both ends of each wire clamping shell 421 are respectively provided with a wire inlet hole 422 and a wire outlet hole 423; a wire clamping piece 425 for clamping a wire is movably connected in the wire clamping shell 421 through a rotating shaft; a rubber bottom pad 424 is adhered to the bottom side of the inside of the card wire housing 421.
Specifically, after the lead fixing assembly 42 is clamped to the groove-shaped block 41, the sealing assembly 43 is required to seal the lead fixing assembly 42, when the lead fixing assembly is used, the outer shell 431 is firstly clamped at the upper end of the lead fixing assembly 42, then the stud 437 is rotated clockwise, the trapezoidal sliding block 438 forces the two pushing blocks 434 to drive the fixture blocks 435 to move towards two sides on the guide post 433 under the continuous downward movement of the stud 437, and then the fixture blocks 435 pass through the through grooves 439 and are clamped with the grooves in the inner side of the groove-shaped block 41, so that the sealing assembly 43 is fixed.
In this embodiment, the sealing assembly 43 includes an outer shell 431, a threaded hole 432, a guide post 433, a pushing block 434, a clamping block 435, a return spring 436, a stud 437, a trapezoidal sliding block 438, and a through groove 439, the top of the outer shell 431 is provided with the threaded hole 432 for the stud 437 to be matched and connected, and the two sides of the outer shell 431 are further provided with the through groove 439;
two guide posts 433 are adopted and arranged in parallel inside the outer shell 431; two pushing blocks 434 are adopted, and through holes are formed in two ends of each pushing block 434 and sleeved on the guide columns 433 to be in sliding connection; a fixture block 435 is fixed on the outer side of the pushing block 434; a return spring 436 is arranged between the pushing block 434 and the inner wall of the outer shell 431, and the return spring 436 is sleeved on the guide post 433.
Specifically, when the sealing assembly is disassembled, the stud 437 is rotated counterclockwise, the trapezoidal sliding block 438 loses the jacking force of the stud 437, the return spring 436 pushes the pushing block 434 to move inwards, the clamping block 435 is separated from the groove on the inner side of the groove-shaped block 41, and the sealing assembly 43 can be taken down.
In this embodiment, the upper ends of the adjacent sides of the two pushing blocks 434 are provided with inclined planes with an angle of 45 degrees; a trapezoidal sliding block 438 used for driving the pushing block 434 is further arranged above the two pushing blocks 434, and the trapezoidal sliding block 438 is located right below the stud 437.
In this embodiment, the two sides inside the groove-shaped block 41 are provided with clamping grooves for clamping the clamping blocks 435.
In this embodiment, the bottom of the outer housing 431 is designed to be flat, so that the wire clip 425 can press down the wire to prevent the wire from being loosened.
Specifically, the rubber bottom pad 424 is bonded to the bottom side of the wire clamping shell 421, and the arc-shaped groove at the bottom of the wire clamping piece 425 is matched, so that the wire clamping device can play a role in clamping and can prevent the wire from being damaged by clamping.
The working principle of the invention is as follows: when the lead fixing device is used, a lead penetrates through the rubber sealing ring 54, the sealing nut 53 and the rubber guide pipe 52 and then enters the lead fixing component 42, the lead firstly enters from the wire inlet hole 422 and then penetrates out from the wire outlet hole 423, after wiring is finished, the lead clamping piece 425 is pressed downwards to clamp the lead, then the lead fixing component 42 is sealed through the required sealing component 43, when the lead fixing device is used, firstly, the outer shell 431 is clamped at the upper end of the lead fixing component 42, then the stud 437 is rotated clockwise, the stud 437 continuously moves downwards, the trapezoidal sliding block 438 forces the two pushing blocks 434 to drive the clamping blocks 435 to move towards two sides on the guide column 433, and then the clamping blocks 435 penetrate through the through grooves 439 and are clamped with the grooves in the inner sides of the groove-shaped blocks 41, so that the sealing component 43 is;
when the integrated circuit board 8 is disassembled, the stud 437 is rotated anticlockwise, the trapezoidal sliding block 438 loses the jacking force of the stud 437, the return spring 436 pushes the pushing block 434 to move inwards, the clamping block 435 is separated from the groove on the inner side of the groove-shaped block 41, and the sealing component 43 can be disassembled;
mounting panel 7's setting, mounting panel 7 fixed mounting is at the inside intermediate position of radiator 2, two solitary working chambers about cutting apart into radiator 2, mounting panel 7's top is provided with power 6 that is used for integrated circuit board 8 power supply, integrated circuit board 8 is installed to mounting panel 7's bottom, power 6 and integrated circuit board 8 accomplish independent work in respective cavity, mutual noninterference, and the radiating effect is good, and operational environment is stable, set up terminal 10 in radiator 2, one can prevent binding post and wet or the piling up of dust, two also can play radiating effect.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims (10)

1.一种集成电路板散热装置,其特征在于:包括1. An integrated circuit board heat sink, characterized in that: comprising: 上盖板(1),用于对散热器(2)顶部进行密封的上盖板(1)四周开设有多个螺纹孔,该上盖板(1)通过螺钉安装在散热器(2)的顶部;The upper cover plate (1), which is used for sealing the top of the radiator (2), is provided with a plurality of threaded holes around the upper cover plate (1), and the upper cover plate (1) is mounted on the radiator (2) by screws. top; 散热器(2),用于对集成电路板(8)进行散热的散热器(2)内部具有安装空间,可用于对集成电路板(8)的安装;The radiator (2), the radiator (2) used for dissipating heat on the integrated circuit board (8) has an installation space inside, which can be used for the installation of the integrated circuit board (8); 底板(3),用于对散热器(2)底部进行密封的底板(3)四周开设有多个螺纹孔,该底板(3)通过螺钉(9)安装在散热器(2)的底部;The bottom plate (3), which is used for sealing the bottom of the radiator (2), is provided with a plurality of threaded holes around the bottom plate (3), and the bottom plate (3) is mounted on the bottom of the radiator (2) through screws (9); 导线防拽拉机构(4),安装在散热器(2)一侧的导线防拽拉机构(4)可以用于对集成电路板(8)外部连接的导线的固定,防止外部力拽拉造成导线脱落的情况;The wire anti-pulling mechanism (4), the wire anti-pulling mechanism (4) installed on the side of the radiator (2) can be used to fix the wires externally connected to the integrated circuit board (8) to prevent external forces from being pulled The case of the wire falling off; 密封连接组件(5),设置在导线防拽拉机构(4)一侧的密封连接组件(5)可对导线起到密封效果,防止外部灰尘跟随导线进入散热器(2)内部,也具有较好的防水效果;The sealing connection assembly (5), the sealing connection assembly (5) arranged on the side of the wire anti-pulling mechanism (4) can seal the wire, prevent external dust from following the wire into the inside of the radiator (2), and also has a relatively high performance. good waterproof effect; 电源(6),用于集成电路板(8)供电的电源(6)设置在散热器(2)内部,并固定安装在安装板(7)上;所述安装板(7)固定在散热器(2)内部的中间位置,该安装板(7)将散热器(2)分割成两个单独的工作空间;A power supply (6), the power supply (6) for supplying power to the integrated circuit board (8) is arranged inside the radiator (2) and is fixedly mounted on the mounting plate (7); the mounting plate (7) is fixed on the radiator (2) In the middle of the interior, the mounting plate (7) divides the radiator (2) into two separate working spaces; 集成电路板(8),固定安装在安装板(7)的底部,并通过导线与电源(6)连接;所述散热器(2)内部还设置有用于电源(6)与外界导线连接的接线柱(10)。The integrated circuit board (8) is fixedly mounted on the bottom of the mounting plate (7), and is connected to the power supply (6) through wires; the radiator (2) is also provided with wiring for connecting the power supply (6) to external wires Column (10). 2.根据权利要求1所述的集成电路板散热装置,其特征在于:所述散热器(2)包括散热器本体(21),侧固定板(22),凸起块(23),接线柱安装板(24)和穿线孔(25),所述散热器本体(21)的内壁上均布有多个用于固定安装板(7)的侧凸起块(23);所述侧凸起块(23)上开设有螺纹孔;所述散热器本体(21)一端的外部固定连接有用于安装导线防拽拉机构(4)的侧固定板(22);所述散热器本体(21)设置有侧固定板(22)同侧端,横向开设有便于外部导线穿入的穿线孔(25);所述穿线孔(25)的下方设置有便于接线柱(10)固定的接线柱安装板(24)。2 . The integrated circuit board heat dissipation device according to claim 1 , wherein the heat sink ( 2 ) comprises a heat sink body ( 21 ), a side fixing plate ( 22 ), a raised block ( 23 ), and a terminal. 3 . The mounting plate (24) and the threading hole (25), the inner wall of the radiator body (21) is evenly distributed with a plurality of side projection blocks (23) for fixing the mounting plate (7); the side projections A threaded hole is formed on the block (23); an external fixing plate (22) for installing the wire anti-pulling mechanism (4) is fixedly connected to one end of the radiator body (21); the radiator body (21) The side fixing plate (22) is provided with the same side end, and a threading hole (25) is arranged laterally to facilitate the penetration of external conductors; the lower part of the threading hole (25) is provided with a terminal installation plate that is convenient for the fixing of the terminal (10). (twenty four). 3.根据权利要求2所述的集成电路板散热装置,其特征在于:所述导线防拽拉机构(4)包括槽型块(41),导线固定组件(42)和密封组件(43),所述槽型块(41)固定安装在侧固定板(22)上,该槽型块(41)的内部设置有用于导线进行固定的导线固定组件(42);所述的密封组件(43)设置在导线固定组件(42)的上方,并与槽型块(41)可拆卸连接。3. The integrated circuit board heat dissipation device according to claim 2, characterized in that: the wire anti-pulling mechanism (4) comprises a grooved block (41), a wire fixing assembly (42) and a sealing assembly (43), The grooved block (41) is fixedly mounted on the side fixing plate (22), and a wire fixing assembly (42) for wire fixing is provided inside the grooved block (41); the sealing assembly (43) It is arranged above the wire fixing assembly (42) and is detachably connected to the slot block (41). 4.根据权利要求3所述的集成电路板散热装置,其特征在于:所述密封连接组件(5)包括穿线口(51),橡胶导管(52),密封螺柱套(53)和橡胶密封圈(54),所述穿线口(51)设置在槽型块(41)远离散热器本体(21)的一侧,该穿线口(51)内部套接有用来防水和防尘的橡胶导管(52);所述密封螺柱套(53)与穿线口(51)螺纹连接。4. The integrated circuit board heat dissipation device according to claim 3, characterized in that: the sealing connection assembly (5) comprises a threading port (51), a rubber conduit (52), a sealing stud sleeve (53) and a rubber seal ring (54), the threading opening (51) is arranged on the side of the groove block (41) away from the radiator body (21), and a rubber conduit ( 52); the sealing stud sleeve (53) is threadedly connected with the threading port (51). 5.根据权利要求4所述的集成电路板散热装置,其特征在于:所述密封螺柱套(53)设置为中空式,在安装导线的时候,并配合橡胶密封圈(54)使用。5 . The integrated circuit board heat sink according to claim 4 , wherein the sealing stud sleeve ( 53 ) is hollow, and is used in conjunction with a rubber sealing ring ( 54 ) when installing wires. 6 . 6.根据权利要求3所述的集成电路板散热装置,其特征在于:所述导线固定组件(42)由多个卡线外壳(421)并列组成;每个所述卡线外壳(421)的两端分别开设有进线孔(422)和出线孔(423);所述卡线外壳(421)内通过转轴活动连接有用于对导线进行卡紧的导线卡件(425);所述卡线外壳(421)内部的底侧粘结有橡胶底垫(424)。6. The integrated circuit board heat dissipation device according to claim 3, characterized in that: the wire fixing assembly (42) is composed of a plurality of wire card casings (421) in parallel; The two ends are respectively provided with a wire inlet hole (422) and a wire outlet hole (423); a wire clamp (425) for clamping the wire is movably connected in the wire clamping housing (421) through a rotating shaft; the wire clamping The bottom side inside the casing (421) is bonded with a rubber bottom pad (424). 7.根据权利要求6所述的集成电路板散热装置,其特征在于:所述密封组件(43)包括外壳体(431),螺纹孔(432),导向柱(433),推动块(434),卡块(435),复位弹簧(436),螺柱(437),梯形滑块(438)和通槽(439),所述外壳体(431)的顶部开设有用于螺柱(437)配合连接的螺纹孔(432),该外壳体(431)的两侧还开设有通槽(439);7. The integrated circuit board heat dissipation device according to claim 6, characterized in that: the sealing assembly (43) comprises an outer casing (431), a threaded hole (432), a guide post (433), and a push block (434) , clamping block (435), return spring (436), stud (437), trapezoidal slider (438) and through groove (439), the top of the outer shell (431) is provided with a stud (437) for matching Connecting threaded holes (432), through grooves (439) are also provided on both sides of the outer casing (431); 所述导向柱(433)采用两个,平行设置在外壳体(431)的内部;所述推动块(434)采用两个,且推动块(434)两端开设有通孔,套在导向柱(433)上滑动连接;所述推动块(434)的外侧还固定有卡块(435);所述推动块(434)与外壳体(431)内壁之间设置有复位弹簧(436),且复位弹簧(436)套接在导向柱(433)上。Two guide posts (433) are used and are arranged in parallel inside the outer casing (431); two push blocks (434) are used, and two ends of the push blocks (434) are provided with through holes, which are sleeved on the guide posts (433) is slidably connected; the outer side of the push block (434) is also fixed with a clamping block (435); a return spring (436) is arranged between the push block (434) and the inner wall of the outer casing (431), and The return spring (436) is sleeved on the guide post (433). 8.根据权利要求7所述的集成电路板散热装置,其特征在于:两个所述推动块(434)相邻一侧的上端开设有45度角的倾斜面;两个所述推动块(434)的上方还设置有用于推动块(434)驱动的梯形滑块(438),且梯形滑块(438)位于螺柱(437)的正下方。8. The integrated circuit board heat sink according to claim 7, characterized in that: the upper ends of the adjacent sides of the two push blocks (434) are provided with inclined surfaces with an angle of 45 degrees; the two push blocks (434) 434) is also provided with a trapezoidal sliding block (438) for driving the push block (434), and the trapezoidal sliding block (438) is located just below the stud (437). 9.根据权利要求7所述的集成电路板散热装置,其特征在于:所述槽型块(41)内部的两侧开设有与卡块(435)相卡接的卡槽。9 . The integrated circuit board heat dissipation device according to claim 7 , characterized in that: two sides of the inside of the groove block ( 41 ) are provided with card slots that are engaged with the card blocks ( 435 ). 10 . 10.根据权利要求7所述的集成电路板散热装置,其特征在于:所述外壳体(431)的底部采用平底设计,用于导线卡件(425)对导线的下压,防止导线松脱。10. The integrated circuit board heat sink according to claim 7, characterized in that: the bottom of the outer casing (431) adopts a flat-bottom design, which is used for pressing down the wires by the wire clips (425) to prevent the wires from loosening. .
CN202011201896.1A 2020-11-02 2020-11-02 Heat dissipation device of integrated circuit board Active CN112289758B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011201896.1A CN112289758B (en) 2020-11-02 2020-11-02 Heat dissipation device of integrated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011201896.1A CN112289758B (en) 2020-11-02 2020-11-02 Heat dissipation device of integrated circuit board

Publications (2)

Publication Number Publication Date
CN112289758A CN112289758A (en) 2021-01-29
CN112289758B true CN112289758B (en) 2021-05-04

Family

ID=74353948

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011201896.1A Active CN112289758B (en) 2020-11-02 2020-11-02 Heat dissipation device of integrated circuit board

Country Status (1)

Country Link
CN (1) CN112289758B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206293639U (en) * 2016-12-16 2017-06-30 厦门宏发电声股份有限公司 A kind of binding post for preventing wire from releasing
CN207298421U (en) * 2017-09-01 2018-05-01 施志广 A kind of LED lamp
CN208569469U (en) * 2018-04-10 2019-03-01 南通天华和睿科技创业有限公司 A kind of high-efficient heat-dissipating computer rear cover
CN209561701U (en) * 2019-03-02 2019-10-29 王颖 A kind of electrical junction box damp-proof installation
CN110867672A (en) * 2019-11-19 2020-03-06 扬州千裕电气有限公司 Wiring terminal for compressor wiring terminal

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108899667A (en) * 2018-08-09 2018-11-27 江苏林诚电仪设备有限公司 A kind of tag with external telescopic rod

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206293639U (en) * 2016-12-16 2017-06-30 厦门宏发电声股份有限公司 A kind of binding post for preventing wire from releasing
CN207298421U (en) * 2017-09-01 2018-05-01 施志广 A kind of LED lamp
CN208569469U (en) * 2018-04-10 2019-03-01 南通天华和睿科技创业有限公司 A kind of high-efficient heat-dissipating computer rear cover
CN209561701U (en) * 2019-03-02 2019-10-29 王颖 A kind of electrical junction box damp-proof installation
CN110867672A (en) * 2019-11-19 2020-03-06 扬州千裕电气有限公司 Wiring terminal for compressor wiring terminal

Also Published As

Publication number Publication date
CN112289758A (en) 2021-01-29

Similar Documents

Publication Publication Date Title
TWI437187B (en) Lamp
WO2012155816A1 (en) Dustproof and waterproof multipurpose led-light power source assembly and dustproof and waterproof led light
WO2009146599A1 (en) Divided led lamp
WO2016090834A1 (en) Led spotlight
CN112289758B (en) Heat dissipation device of integrated circuit board
CN101713905B (en) Light path engine and projector using same
CN207716217U (en) A kind of LED light
CN210181516U (en) Computer with internal circuit board having waterproof structure design
CN215174839U (en) LED lamp pearl and subassembly with highlight effect
CN215298153U (en) A dust-proof case
CN213452926U (en) LED lamp with prolonged service life
CN213334022U (en) LED lamp with dampproofing dry function
CN213272554U (en) Heat dissipation device for LED lamp
CN211019524U (en) Intelligent air machine control panel
CN218153842U (en) LED lamp with good sealing performance
CN217406908U (en) Double-fan radiating power supply
CN209358911U (en) Electronic component heat radiation structure and electrical equipment
CN210630155U (en) Aluminum heat dissipation shell convenient to install
CN218033061U (en) A high heat conduction and heat dissipation LED lamp aluminum profile
CN207569779U (en) A kind of LED automobile headlamp component
CN211146825U (en) Air conditioner and controller installation structure
CN219389653U (en) Dustproof LED lamp
CN219775647U (en) Lamp shell structure
CN214895622U (en) Underground power cable insulation monitoring device
CN223310104U (en) A high heat dissipation and waterproof power adapter

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20210412

Address after: Room b2906, block a and B, West Xintian Century Business Center, Shixia community, Fubao street, Futian District, Shenzhen, Guangdong 518000

Applicant after: Ruisheng Electronic Technology ( Shenzhen ) Ltd.

Address before: 521 Mintai building, Minkang Road, Minkang Road, Longhua New District, Shenzhen, Guangdong Province

Applicant before: Shenzhen mingshitang Trading Co.,Ltd.

GR01 Patent grant
GR01 Patent grant