CN112286325B - External radiator for notebook computer - Google Patents
External radiator for notebook computer Download PDFInfo
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- CN112286325B CN112286325B CN202011313581.6A CN202011313581A CN112286325B CN 112286325 B CN112286325 B CN 112286325B CN 202011313581 A CN202011313581 A CN 202011313581A CN 112286325 B CN112286325 B CN 112286325B
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- cold air
- water
- heat
- fins
- water cooling
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明关于一种笔记本电脑外置散热器，包括冷风鳍片，风扇，导热管，制冷组件，均温铜板和水冷组件，水冷组件用于给制冷散热；水冷组件的结构为水冷鳍片、水管和水冷风扇，水冷风扇贴合在水冷鳍片表面，水管连接水冷风扇，制冷组件贴合在散热模块上方。使用时，将笔记本电脑放置在该外置散热器上，水冷鳍片会通过水管吸收制冷组件的热量，再用水冷风扇对水冷鳍片内进行散热，以此来对制冷组件进行循环散热，然后制冷组件的制冷面会吸收热管的热量，热管吸收冷风鳍片的热量，而冷风鳍片下方的风扇会将冷风鳍片内冷风吹送至电脑内部，令电脑降温。通过采用了水冷组件对制冷组件进行散热，大大提升了散热效率。
The present invention relates to an external radiator for a laptop computer, comprising a cooling fin, a fan, a heat pipe, a refrigeration component, a temperature-averaging copper plate and a water-cooling component, wherein the water-cooling component is used for cooling and dissipating heat; the structure of the water-cooling component is a water-cooling fin, a water pipe and a water-cooling fan, wherein the water-cooling fan is attached to the surface of the water-cooling fin, the water pipe is connected to the water-cooling fan, and the refrigeration component is attached to the top of the heat dissipation module. When in use, the laptop computer is placed on the external radiator, the water-cooling fin absorbs the heat of the refrigeration component through the water pipe, and then the water-cooling fan is used to dissipate the heat in the water-cooling fin, thereby circulating the heat dissipation of the refrigeration component, and then the refrigeration surface of the refrigeration component absorbs the heat of the heat pipe, the heat pipe absorbs the heat of the cooling fin, and the fan under the cooling fin blows the cold air in the cooling fin to the inside of the computer, so as to cool the computer. By using the water-cooling component to dissipate the heat of the refrigeration component, the heat dissipation efficiency is greatly improved.
Description
Technical Field
The invention relates to a radiator, in particular to an external radiator of a notebook computer.
Background
Along with the development of technology, notebook computers have become an indispensable important tool in people's work and life. However, due to the small size and thin thickness of the notebook computer, the notebook computer generates a large amount of heat along with longer and longer use time, is difficult to dissipate, and can damage the notebook computer, thereby affecting the performance and the service life.
Most of the existing methods use an air-cooled radiator to radiate heat of a notebook computer, but the radiating effect is not obvious, or use a semiconductor refrigeration structure to radiate heat of the notebook computer, but when the environment is at 25 ℃ or higher, the radiating effect is also poor.
Disclosure of Invention
The invention aims to provide an external radiator of a notebook computer, which aims to solve the problem of low radiating efficiency of the existing notebook computer.
The technical scheme for solving the technical problems is as follows:
The external radiator of the notebook computer is arranged at the bottom of the notebook computer and comprises a shell, the shell comprises a shell and a bottom shell, an air cooling assembly, a refrigerating assembly and a water cooling assembly are arranged in the shell, the air cooling assembly comprises a cold air fan and a heat conducting pipe, the water cooling assembly comprises water cooling fins, a water cooling fan, a radiating module and a water pipe used for connecting the water cooling fins and the radiating module, the radiating module is fixed on the bottom shell, the refrigerating assembly is attached to the upper portion of the radiating module, and the refrigerating assembly is connected with the air cooling assembly through the heat conducting pipe.
Further, the water cooling fins are vertically fixed on one side of the refrigerating assembly, the water cooling fan is located between the refrigerating assembly and the water cooling fins, the water cooling fan is attached to the water cooling fins, and an air outlet of the water cooling fan faces the water cooling fins.
Further, the air cooling assembly further comprises cold air fins, and the cold air fins are attached to the upper surface of the cold air fan.
Further, the refrigeration assembly may be a refrigeration assembly.
Further, the water pipe comprises a water inlet pipe and a water outlet pipe, the first ends of the water inlet pipe and the water outlet pipe are respectively connected with the heat dissipation module, the second ends of the water inlet pipe and the water outlet pipe are respectively connected with the water cooling fins, the water inlet pipe transmits cooling water into the heat dissipation module to dissipate heat of the refrigeration assembly, and the water outlet pipe discharges water which absorbs heat of the refrigeration assembly in the heat dissipation module into the water cooling fins.
Further, the water cooling fan comprises a plurality of fans, and the fans are attached to the surfaces of the water cooling fins side by side.
Further, the external radiator of the notebook computer further comprises a uniform Wen Tongban, the uniform-temperature copper plate is positioned between the refrigerating component and the heat conducting tube, the first end of the heat conducting tube is inserted with the supercooling wind fins, the second end of the heat conducting tube is attached to the upper surface of the uniform-temperature copper plate, and the lower surface of the uniform-temperature copper plate is attached to the upper surface of the refrigerating component.
Further, the first end of the heat conducting pipe is a cylinder, and the second end of the heat conducting pipe is a flat cylinder.
Further, the cold air fan comprises at least two cold air fans, at least two cold air fins are corresponding to the cold air fans one by one, and the at least two cold air fans are arranged between the cold air fins and the heat conducting pipe side by side.
Further, the refrigeration assembly comprises a refrigeration surface and a heating surface opposite to the refrigeration surface, wherein the refrigeration surface is attached to both Wen Tongban, and the heating surface is attached to the heat dissipation module.
The invention also discloses the following technical scheme:
The external radiator of the notebook computer is arranged at the bottom of the notebook computer and is characterized in that the external radiator of the notebook computer comprises a shell, an air cooling assembly, a refrigerating assembly and a water cooling assembly are arranged in the shell, the air cooling assembly comprises a cold air fan and cold air fins matched with the cold air fan, the water cooling assembly comprises the water cooling fins, the water cooling fan matched with the water cooling fins, a radiating module and a water pipe used for connecting the water cooling fins and the radiating module, a circulating waterway is formed between the water cooling fins and the radiating module, the radiating module is matched with the refrigerating assembly to realize heat transfer, the cold air fins are matched with the refrigerating assembly to realize heat transfer, the refrigerating assembly radiates heat to the cold air fins through the circulating waterway, the cold air cooled by the cold air fan blows out of the shell to cool electronic equipment, and the water cooling fan blows heat on the water cooling fins out of the shell.
The invention has the beneficial effects that:
Compared with the prior art, the external radiator for the notebook computer comprises the air cooling component and the water cooling component, the air cooling component directly dissipates heat at the bottom of the notebook computer, and the water cooling component dissipates heat at the high temperature side of the refrigerating component, so that the refrigerating component can continuously and efficiently work, the heat dissipation efficiency of the notebook computer is improved, and the service life of the notebook computer is prolonged.
Drawings
The invention will be further described with reference to the drawings and examples, in which
Fig. 1 is a schematic structural diagram of a notebook computer external radiator in a working state;
FIG. 2 is an exploded view of the external heat sink of the notebook computer of FIG. 1;
FIG. 3 is an enlarged schematic view of a portion of FIG. 2A;
FIG. 4 is a schematic top view of the present invention from the bottom shell portion.
The reference numerals indicate 1-shell, 11-bottom shell, 12-shell, 21-cold air fan, 22-heat conducting pipe, 23-cold air fin, 3-refrigeration component, 41-water cooling fin, 42-water cooling fan, 43-heat dissipation module, 44-water pipe, 5-ventilation hole, 6-air inlet through hole, 7-all Wen Tongban, upper end face-8, side face-9, 20-notebook computer and 30-external radiator
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In order to illustrate the technical scheme of the invention, the following description is made by specific examples.
Referring to fig. 1, in the preferred embodiment of the present invention, the notebook computer 20 and the external radiator 30 are positioned on the upper end surface 8 of the triangular prism-shaped external radiator 30, the external radiator 30 is horizontally placed on a desktop, the bottom is rectangular, and the right-angled triangle sides of the radiator are the left and right sides of the radiator respectively.
Referring to fig. 2, in this embodiment, the external radiator 30 includes a housing 1, the housing 1 includes a shell 12 and a bottom shell 11, an air cooling component, a refrigerating component and a water cooling component are disposed in the housing 1, the air cooling component includes a cold air fan 21 and a heat conducting tube 22, the water cooling component includes a water cooling fin 41, a water cooling fan 42, a heat dissipation module 43 and a water tube 44 for connecting the water cooling fin 41 and the heat dissipation module 43, the heat dissipation module 43 is fixed on the bottom shell 11, the refrigerating component 3 is attached above the heat dissipation module 43, and the refrigerating component 3 is connected with the air cooling component through the heat conducting tube 22.
Specifically, the casing 12 of the casing 1 is in a triangular prism shape, and includes an upper end surface 8 for placing a notebook computer, side surfaces 9 perpendicular to the upper end surface 8 and symmetrically placed on two sides of the upper end surface 8, and a front end surface for connecting the side surfaces 9 on two sides with the upper end surface 8, wherein the upper end surface 8 is preferably rectangular, the side surfaces 9 on two sides are preferably right-angled triangles, and a receiving cavity is formed by the connection parts of the two side surfaces 9 with the front end surface and the upper end surface 8.
In the embodiment, the air cooling component for cooling by air cooling and the water cooling component for cooling by water cooling are combined to cool the notebook computer, and the key point is that the water cooling component is adopted to cool the refrigerating component 3, so that the refrigerating component is ensured to keep a lower temperature all the time, and the cooling efficiency is improved.
In an embodiment, the water cooling fins 41 are disposed in the accommodating cavity of the housing 1, as shown in fig. 3, the water cooling fins 41 are vertically disposed at a position close to the front end face, the air cooling assembly is disposed at one end away from the front end face, the cooling assembly is disposed between the air cooling assembly and the water cooling assembly, the water cooling fan 42 is disposed between the cooling assembly 3 and the water cooling fins 41, the water cooling fan 42 is attached to the water cooling fins 41, and an air outlet of the water cooling fan 42 faces the water cooling fins 41.
The water cooling fins 41 absorb the heat of the refrigeration assembly 3 through the water pipe 44, and the water cooling fan 42 radiates the heat of the air blowing inside the water cooling fins 41, so that the circulation heat radiation is performed.
In an embodiment, the air cooling assembly further includes a cold air fin 23, the cold air fan 21 is attached to the lower surface of the cold air fin 23, the cold air fin 23 is located below the upper end surface 8 of the housing 12, and the first end 221 of the heat conducting tube can absorb heat at the bottom of the notebook computer and transfer the heat to the second end 222 of the heat conducting tube.
The cold air fan 21 radiates heat from the heat conduction pipe 22, and the cold air fins 23 absorb cold air transferred from the heat conduction pipe 22 and radiate heat from the bottom of the notebook computer 20.
In an embodiment, the first end 221 of the heat pipe 22 is a cylinder, the second end 222 is a flat cylinder, the first end 221 can better penetrate through the water cooling fins 41, and the second end 222 is a flat cylinder, so that the heat pipe 22 can be better attached to the lower surface of the cold air fan 21 and the upper surface of the cooling fan Wen Tongban.
In an embodiment, the cold air fan 21 includes at least two cold air fans 21, at least two cold air fins 23 are also at least two, and are in one-to-one correspondence with the cold air fans 21, and the at least two cold air fans 21 are arranged between the cold air fins 23 and the heat conducting tube 22 side by side, so that the at least two cold air fans 21 can radiate heat to the cold air fins 23 at the same time, and the heat radiation effect is enhanced.
In one embodiment, the refrigerating component 3 may be a semiconductor refrigerating chip, which is formed by mutually arranging a plurality of particles of N-type semiconductors and P-type semiconductors, the N-type semiconductors and the P-type semiconductors are usually connected by metal conductors such as copper, aluminum and the like, so as to form a complete circuit, and finally, two ceramic sheets with good heat conduction and insulation properties are used for clamping the circuit.
In one embodiment, the water pipe 44 includes a water inlet pipe and a water outlet pipe, the first ends of the water inlet pipe and the water outlet pipe are respectively connected with the heat dissipation module 43, the second ends of the water inlet pipe and the water outlet pipe are respectively connected with the water cooling fins 41, the water inlet pipe transfers cooling water into the heat dissipation module 43 to dissipate heat of the refrigeration assembly 3, the water outlet pipe discharges water absorbed by the heat dissipation module 43 and subjected to heat of the refrigeration assembly 3 into the water cooling fins 41, and the water cooling assembly 4 dissipates heat of the refrigeration assembly 3.
In an embodiment, the water cooling fan 42 includes a plurality of fans, the fans are attached to the surface of the water cooling fins 41 side by side, the air outlet of the water cooling fan 42 faces the water cooling fins 41, and the fans simultaneously blow and dissipate heat to the water cooling fins 41.
In an embodiment, the external radiator of the notebook computer further includes a heat equalizing plate Wen Tongban, the heat equalizing plate 7 can equalize the heat transferred by the heat conducting tube 22, so that the radiator cannot generate overheat phenomenon, the heat equalizing plate 7 is located between the refrigeration component 3 and the heat conducting tube 22, the lower surface of the heat equalizing plate Wen Tongban is attached to the upper surface of the refrigeration component 3, the first end 221 of the heat conducting tube 22 is inserted through the cold air fins 23, and the second end 222 of the heat conducting tube 22 is attached to the upper surface of the heat conducting tube Wen Tongban 7.
In one embodiment, the refrigeration assembly 3 includes a refrigeration face and a heating face opposite the refrigeration face. Wherein, the refrigeration face of refrigeration subassembly is laminated with the lower surface of sameness Wen Tongban 7 mutually, and the heating face is laminated with the upper surface of heat dissipation module 43 mutually, can make its refrigeration face temperature reduce when refrigeration subassembly 3 refrigerates to sameness Wen Tongban's 7 cooling.
In one embodiment, a plurality of ventilation holes 5 are provided on both side surfaces of the housing 12 so that the air flow blown out from the water cooling fins 41 can be discharged to the outside of the housing 12 through the ventilation holes 5, thereby maintaining the ambient temperature in the housing 12 in a low state.
In an embodiment, the bottom shell 11 of the housing 1 is further provided with a plurality of air inlet holes 6 corresponding to the air inlet of the cold air fan 21, and the air flow in the external space can flow into the air inlet of the cold air fan 21 through the air inlet holes 6.
Compared with the prior art, when the external radiator for the notebook computer is used, the notebook computer is placed on the external radiator, the water cooling fins can absorb heat of the refrigerating assembly through the water pipe, then the water cooling fan is used for radiating the heat in the water cooling fins, so that the refrigerating assembly is circularly radiated, then the refrigerating surface of the refrigerating assembly can absorb the heat of the heat pipe, the heat pipe absorbs the heat of the cold air fins, and the fan below the cold air fins can blow cold air in the cold air fins into the computer, so that the computer is cooled. The water cooling assembly is adopted to dissipate heat of the refrigerating assembly, so that heat dissipation efficiency is greatly improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment contains only one independent technical solution, and that such description is provided for clarity only, and that the technical solutions of the embodiments may be appropriately combined to form other embodiments that will be understood by those skilled in the art.
Claims (4)
1. An external radiator of a notebook computer is arranged at the bottom of the notebook computer and is characterized in that,
The external radiator of the notebook computer comprises a shell, wherein the shell comprises a shell and a bottom shell, an air cooling assembly, a refrigerating assembly and a water cooling assembly are arranged in the shell, and the shell is defined with an inclined upper end face for bearing the notebook computer, two side faces perpendicular to the upper end face and symmetrically arranged on two sides of the upper end face and a front end face for connecting the two side faces and the upper end face;
The air cooling assembly comprises a cold air fan and cold air fins matched with the cold air fan, the cold air fins are positioned below the upper end face of the shell, and an air outlet of the cold air fan is attached to the lower part of the cold air fins;
The air inlet through holes are arranged on the bottom shell and correspond to the lower part of the air inlet of the cold air fan;
The water cooling assembly comprises water cooling fins, a water cooling fan, a heat dissipation module and a water pipe, wherein a circulating water path is formed between the inside of the water cooling fins and the inside of the heat dissipation module by the water pipe;
the water cooling fins are vertically arranged at a position close to the front end face;
The water cooling fan is attached to the water cooling fins and is positioned between the water cooling fins and the air cooling assembly;
the refrigerating assembly comprises a refrigerating surface and a heating surface opposite to the refrigerating surface, and the heating surface is attached to the heat dissipation module to realize heat transfer;
wen Tongban, which are attached to the refrigerating surface of the refrigerating component to realize heat transfer;
The heat conduction pipe is provided with a first end and a second end, the first end is inserted into the supercooling wind fins, the second end is attached to the upper surface of the temperature-uniforming copper plate, and the heat conduction pipe realizes heat transfer between the supercooling wind fins and the temperature-uniforming copper plate;
The cooling surface of the refrigeration assembly cools the cold air fins through the heat conduction pipe, and the cold air fan blows cold air cooled by the cold air fins out of the shell to cool the notebook computer.
2. The external heat sink for a notebook computer of claim 1, wherein,
The water cooling fans comprise a plurality of fans, and the fans are attached to the surfaces of the water cooling fins side by side.
3. The external heat sink for a notebook computer of claim 1, wherein,
The first end of the heat conducting pipe is a cylinder, and the second end of the heat conducting pipe is a flat cylinder.
4. The external heat sink for a notebook computer of claim 1, wherein,
The cold air fans comprise at least two cold air fans, at least two cold air fins are corresponding to the cold air fans one by one, and the at least two cold air fans are arranged between the cold air fins and the heat conducting pipe side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011313581.6A CN112286325B (en) | 2020-11-20 | 2020-11-20 | External radiator for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011313581.6A CN112286325B (en) | 2020-11-20 | 2020-11-20 | External radiator for notebook computer |
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| Publication Number | Publication Date |
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| CN112286325A CN112286325A (en) | 2021-01-29 |
| CN112286325B true CN112286325B (en) | 2025-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011313581.6A Active CN112286325B (en) | 2020-11-20 | 2020-11-20 | External radiator for notebook computer |
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| CN (1) | CN112286325B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI825429B (en) * | 2021-06-11 | 2023-12-11 | 宏碁股份有限公司 | Heat dissipation structure and electronic device |
| CN113985995B (en) * | 2021-11-02 | 2024-05-17 | 北京神州数码云科信息技术有限公司 | External radiator of notebook computer |
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| CN213338634U (en) * | 2020-11-20 | 2021-06-01 | 太仓欣华盈电子有限公司 | External radiator of notebook computer |
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| TW588823U (en) * | 2002-05-13 | 2004-05-21 | Shuttle Inc | CPU heat dissipation apparatus having heat conduction pipe |
| KR200364239Y1 (en) * | 2004-07-16 | 2004-10-11 | 주식회사 펠렉스 | Notebook Cooler with Thermoelectric Semiconductor |
| TWM342531U (en) * | 2008-01-15 | 2008-10-11 | Sonnenschein Industry Co Ltd | Heat-dissipation device for water-cooling notebook |
| CN202310445U (en) * | 2011-11-11 | 2012-07-04 | 惠州智科实业有限公司 | Water-cooled radiator |
| JP2014109387A (en) * | 2012-11-30 | 2014-06-12 | Toshiba Corp | Cooling device and electronic apparatus including the same |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103838334A (en) * | 2014-01-17 | 2014-06-04 | 东华理工大学 | Heat dissipation base of notebook computer |
| CN205003611U (en) * | 2015-09-09 | 2016-01-27 | 深圳市七彩虹科技发展有限公司 | Graphics cooler of forced air cooling water -cooling integration |
| CN111026251A (en) * | 2019-11-01 | 2020-04-17 | 苏州永腾电子制品有限公司 | High-efficiency combined heat dissipation type CPU radiator |
| CN213338634U (en) * | 2020-11-20 | 2021-06-01 | 太仓欣华盈电子有限公司 | External radiator of notebook computer |
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