CN112281207A - 一种用于减少拉晶炉的热量散失的保温盖及拉晶炉 - Google Patents
一种用于减少拉晶炉的热量散失的保温盖及拉晶炉 Download PDFInfo
- Publication number
- CN112281207A CN112281207A CN202011074656.XA CN202011074656A CN112281207A CN 112281207 A CN112281207 A CN 112281207A CN 202011074656 A CN202011074656 A CN 202011074656A CN 112281207 A CN112281207 A CN 112281207A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- heat
- crucible
- furnace body
- crystal pulling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 57
- 238000004321 preservation Methods 0.000 title abstract description 9
- 239000012774 insulation material Substances 0.000 claims abstract description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 21
- 239000011810 insulating material Substances 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000002210 silicon-based material Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 229920005591 polysilicon Polymers 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011074656.XA CN112281207A (zh) | 2020-10-09 | 2020-10-09 | 一种用于减少拉晶炉的热量散失的保温盖及拉晶炉 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011074656.XA CN112281207A (zh) | 2020-10-09 | 2020-10-09 | 一种用于减少拉晶炉的热量散失的保温盖及拉晶炉 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112281207A true CN112281207A (zh) | 2021-01-29 |
Family
ID=74423070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011074656.XA Pending CN112281207A (zh) | 2020-10-09 | 2020-10-09 | 一种用于减少拉晶炉的热量散失的保温盖及拉晶炉 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112281207A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114804083A (zh) * | 2022-04-11 | 2022-07-29 | 常州二维碳素科技股份有限公司 | 一种石墨坩埚盖与cvd法制石墨烯粉体系统 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002097097A (ja) * | 2000-09-19 | 2002-04-02 | Komatsu Electronic Metals Co Ltd | Cz法単結晶引上げ装置 |
CN101575731A (zh) * | 2009-06-22 | 2009-11-11 | 上虞晶盛机电工程有限公司 | 带水冷夹套的直拉式硅单晶生长炉 |
CN102181925A (zh) * | 2011-04-13 | 2011-09-14 | 任丙彦 | 直拉法生长IC级低Fe含量硅单晶的生长工艺与装置 |
CN203923449U (zh) * | 2014-06-20 | 2014-11-05 | 河北宁通电子材料有限公司 | 一种低能耗单晶炉 |
CN105568368A (zh) * | 2015-06-16 | 2016-05-11 | 杭州海纳半导体有限公司 | 保护热场部件减小损耗的热场及方法 |
-
2020
- 2020-10-09 CN CN202011074656.XA patent/CN112281207A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002097097A (ja) * | 2000-09-19 | 2002-04-02 | Komatsu Electronic Metals Co Ltd | Cz法単結晶引上げ装置 |
CN101575731A (zh) * | 2009-06-22 | 2009-11-11 | 上虞晶盛机电工程有限公司 | 带水冷夹套的直拉式硅单晶生长炉 |
CN102181925A (zh) * | 2011-04-13 | 2011-09-14 | 任丙彦 | 直拉法生长IC级低Fe含量硅单晶的生长工艺与装置 |
CN203923449U (zh) * | 2014-06-20 | 2014-11-05 | 河北宁通电子材料有限公司 | 一种低能耗单晶炉 |
CN105568368A (zh) * | 2015-06-16 | 2016-05-11 | 杭州海纳半导体有限公司 | 保护热场部件减小损耗的热场及方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114804083A (zh) * | 2022-04-11 | 2022-07-29 | 常州二维碳素科技股份有限公司 | 一种石墨坩埚盖与cvd法制石墨烯粉体系统 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6136091A (en) | Process and apparatus for producing polycrystalline semiconductor ingot | |
CN110983429A (zh) | 单晶炉及单晶硅制备方法 | |
KR101767268B1 (ko) | 사파이어 단결정의 제조 장치 | |
US11326272B2 (en) | Mono-crystalline silicon growth apparatus | |
JPWO2014013698A1 (ja) | SiC単結晶の製造装置及びSiC単結晶の製造方法 | |
CN109868503A (zh) | 一种坩埚组件及长晶炉 | |
CN105887186A (zh) | 硅单晶提拉设备与生长方法 | |
CN112281207A (zh) | 一种用于减少拉晶炉的热量散失的保温盖及拉晶炉 | |
JPS63315589A (ja) | 単結晶製造装置 | |
KR20220124698A (ko) | 단결정 제조장치 | |
WO2012070528A1 (ja) | 単結晶引き上げ装置、及び単結晶引き上げ装置に用いられる低熱伝導性部材 | |
JP4265269B2 (ja) | SiC単結晶製造炉 | |
JPH05294783A (ja) | シリコン単結晶の製造装置 | |
JPH0315550Y2 (zh) | ||
KR20140037034A (ko) | 단결정 제조장치 및 단결정 제조방법 | |
KR102532226B1 (ko) | 단결정 성장로의 열차폐 장치 | |
JP2007254162A (ja) | 単結晶製造装置およびリチャージ方法 | |
CN114775042B (zh) | 一种晶体生长用坩埚及晶体生长方法 | |
JPH02172885A (ja) | シリコン単結晶の製造方法 | |
US11377752B2 (en) | Mono-crystalline silicon growth method | |
JPH04198084A (ja) | 半導体単結晶引上用底着き防止治具 | |
JPH1095688A (ja) | 単結晶体の製造方法 | |
JP2000247780A (ja) | 単結晶引き上げ装置 | |
CN117822089A (zh) | 一种含有异形隔板的晶体生长装置和异形隔板 | |
KR20230111038A (ko) | 실리콘 융액을 수용하는 외부 도가니 및 이를 포함하는 실리콘 단결정 잉곳의 성장 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220805 Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant after: Xi'an Yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |