CN112272499A - Calculate rack cooling device and calculate rack - Google Patents

Calculate rack cooling device and calculate rack Download PDF

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Publication number
CN112272499A
CN112272499A CN202011183777.8A CN202011183777A CN112272499A CN 112272499 A CN112272499 A CN 112272499A CN 202011183777 A CN202011183777 A CN 202011183777A CN 112272499 A CN112272499 A CN 112272499A
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CN
China
Prior art keywords
cooling
water inlet
water
cooling element
cabinet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011183777.8A
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Chinese (zh)
Inventor
王晓阳
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Guangzhou Xinxiwang Technology Co ltd
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Individual
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Application filed by Individual filed Critical Individual
Priority to CN202011183777.8A priority Critical patent/CN112272499A/en
Publication of CN112272499A publication Critical patent/CN112272499A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a cooling device for a computer cabinet and the computer cabinet, wherein the cooling device for the computer cabinet comprises: the cooling piece is attached to the circuit board; and the water inlet and outlet mechanism comprises a water inlet pipeline communicated with the water inlet end of the cooling piece and a water outlet pipeline communicated with the water outlet end of the cooling piece. According to the technical scheme, the cooling piece is attached to the circuit board, and the water inlet and outlet mechanism is communicated with the cooling piece, so that the water inlet end of the cooling piece is correspondingly communicated with the water inlet pipeline in the water inlet and outlet mechanism, the water outlet end of the cooling piece is correspondingly communicated with the water outlet pipeline, heat generated in the computer cabinet is taken out of the computer cabinet through water flow, a good heat dissipation effect is achieved, the utilization of energy consumption is reduced by adopting a water cooling mode, energy can be saved better, and the forced control target provided by the state for energy consumption indexes is favorably achieved.

Description

Calculate rack cooling device and calculate rack
Technical Field
The invention relates to the technical field of computer cabinets, in particular to a cooling device of a computer cabinet and the computer cabinet.
Background
The computer cabinets are widely used for storing computers and related control equipment, protecting the storage equipment, shielding electromagnetic interference, and orderly arranging the equipment.
Because the elements of the computer cabinet can generate more heat in the using process, if the heat is not dissipated timely, the internal elements can be damaged, in the related technology, the computer cabinet dissipates the heat in an air cooling mode, but the heat generated by the computer is still in the center, a large amount of energy consumption is needed for cooling, and the state puts forward a mandatory control target for the energy consumption index PUE of the data center, so that the air cooling mode is not favorable for energy conservation.
Disclosure of Invention
The invention aims to provide a cooling device of a computer cabinet, which adopts a water cooling mode to dissipate heat, has a good heat dissipation effect and has better applicability.
In order to achieve the purpose, the invention adopts the following technical scheme:
a computing cabinet cooling arrangement, comprising: the cooling piece is attached to the circuit board; and the water inlet and outlet mechanism comprises a water inlet pipeline communicated with the water inlet end of the cooling piece and a water outlet pipeline communicated with the water outlet end of the cooling piece.
Preferably, the cooling device for the computer cabinet further includes a cooling member group, the cooling member group includes a plurality of cooling members arranged at intervals, the circuit boards are arranged in a plurality, and each of the circuit boards is attached to each of the cooling members in a one-to-one correspondence manner.
Preferably, the cooling element groups are arranged into a plurality of groups, the water inlet end of each cooling element group is communicated with the water inlet pipeline, and the water outlet end of each cooling element group is communicated with the water outlet pipeline.
Preferably, the cooling device for the computer cabinet further includes a plurality of fixing brackets, each cooling element group is disposed in each fixing bracket in a one-to-one correspondence manner, the plurality of cooling elements are stacked layer by layer along a thickness direction thereof, two adjacent cooling elements are disposed in a mutually communicated manner, and each circuit board is sandwiched between two adjacent cooling elements in a one-to-one correspondence manner.
Preferably, the cooling element on the top side of each cooling element group is communicated with the water inlet pipeline, and the cooling element on the bottom side is communicated with the water outlet pipeline; or the cooling piece at the bottom side is communicated with the water inlet pipeline, and the cooling piece at the top side is communicated with the water outlet pipeline.
Preferably, one of the cooling elements in each cooling element group is communicated with the water inlet pipeline, and the upper and lower cooling elements adjacent to the cooling element are communicated with the water outlet pipeline.
Preferably, three cooling elements are provided in each cooling element group.
Preferably, the cooling device for the computer cabinet further comprises an interface, one end of the interface is communicated with the cooling part, and the other end of the interface is communicated with the water inlet pipeline or the water outlet pipeline.
The invention also provides a computer cabinet, a cooling device of the computer cabinet and a circuit board, wherein the circuit board is attached to a cooling piece in the cooling device of the computer cabinet.
Preferably, the computer cabinet further comprises a cabinet body, electronic components and a partition plate fixedly connected to the inner surface of the cabinet body, wherein a first cavity for installing the cooling device of the computer cabinet and a second cavity for installing the electronic components are arranged around the cabinet body and the partition plate.
Compared with the prior art, the invention has the beneficial effects that:
the cooling device for the computer cabinet, provided in the technical scheme, is a cooling piece which is attached to a circuit board, and a water inlet and outlet mechanism which is communicated with the cooling piece, so that the water inlet end of the cooling piece is communicated with a water inlet pipeline in the water inlet and outlet mechanism correspondingly, the water outlet end of the cooling piece is communicated with a water outlet pipeline correspondingly, heat generated in the computer cabinet is calculated and is taken out of the computer cabinet through water flow, the cooling device has a good heat dissipation effect, a water cooling mode is adopted, the utilization of energy consumption is reduced, energy can be better saved, the compulsory control target which can be provided by the country for energy consumption indexes is favorably achieved, and the cooling device has good applicability.
Drawings
FIG. 1 is a schematic diagram of a cooling apparatus for a computing cabinet according to an embodiment of the invention.
FIG. 2 is a rear view of a cooling apparatus for a computing cabinet, according to an embodiment of the invention.
FIG. 3 is a schematic diagram of a portion of a cooling device assembly of a computing cabinet according to an embodiment of the invention.
FIG. 4 is a schematic diagram of a cooling device portion of a computing cabinet according to an embodiment of the invention.
Fig. 5 is a schematic sectional view of the left side of fig. 1.
Fig. 6 is a schematic view of the separator shown in fig. 5.
Description of the symbols of the drawings:
1. a cooling member; 2. a water inlet and outlet mechanism; 21. a water inlet pipe; 22. a water outlet pipeline; 3. a cooling element group; 31. a water inlet end; 32. a water outlet end; 4. fixing a bracket; 5. an interface; 6. a circuit board; 7. a cabinet body; 71. a first cavity; 72. a second cavity; 73. a heat dissipation port; 8. a partition plate; 81. and (4) opening.
Detailed Description
The present invention will now be described in more detail with reference to the accompanying drawings, in which the description of the invention is given by way of illustration and not of limitation. The various embodiments may be combined with each other to form other embodiments not shown in the following description.
Referring to fig. 1-5, in an embodiment of the present invention, a cooling apparatus for a computer cabinet includes: cooling member 1, water inlet and outlet mechanism 2, cooling member group 3, fixing support 4 and interface 5.
The cooling piece 1 is attached to the circuit board 6; the water inlet and outlet mechanism 2 comprises a water inlet pipeline 21 communicated with the water inlet end of the cooling part 1 and a water outlet pipeline 22 communicated with the water outlet end of the cooling part 1.
It can be understood that cooling member 1 is made by current aluminium alloy die-casting, also can use other materials that have better heat conductivity, cooling member 1 is including cooling water course, be formed with the cavity in cooling member 1, the cooling water course sets up in the cavity, the cooling water course is made through aluminium alloy or the better metal die-casting of other heat conductivities.
The water inlet pipeline 21 leads water flow in a water source into the cooling part 1 through the water inlet end of the cooling part 1, the water flow is discharged into the water outlet pipeline 22 from the water outlet end of the cooling part 1 after flowing through the cooling water channel in the cooling part 1, finally the water flow is discharged out of the computing cabinet through the water outlet pipeline 22, heat generated by the circuit board 6 is dissipated through the water flow flowing through the cooling part 1, and then the heat is taken out of the computing cabinet through the water flow, so that the computing cabinet has a good heat dissipation effect, the utilization of energy consumption is reduced by adopting a water cooling mode, better energy saving can be realized, and the mandatory control target provided by the state for energy consumption indexes is favorably achieved.
Wherein, in order to reach better radiating effect, cooling piece group 3 is including being a plurality of that the interval set up cooling piece 1, circuit board 6 sets up to a plurality ofly, each circuit board 6 one-to-one laminating in each on cooling piece 1, can understand, work as circuit board 6 is equipped with when a plurality ofly, sets up cooling piece group 3 for a plurality of cooling piece 1 dispels the heat the operation simultaneously, accelerate to the heat dissipation of circuit board 6 satisfies a plurality of circuit board 6 to radiating demand.
The cooling element groups 3 are arranged into a plurality of groups, the water inlet end 31 of each cooling element group 3 is communicated with the water inlet pipe 21, the water outlet end 32 of each cooling element group 3 is communicated with the water outlet pipe 22, it can be understood that, as shown in fig. 2, only one water inlet and outlet mechanism 2 is arranged, the plurality of cooling element groups 3 are communicated with the water inlet and outlet mechanisms 2, as shown in the figure, when only two cooling element groups 3 are arranged, the water inlet pipe 21 is arranged in a U shape, the water outlet pipe 22 is in an inverted U shape, and the water inlet pipe 21 and the water outlet pipe 22 are arranged in a cross manner, so that not only the water flow in and out of each cooling element group 3 is ensured, but also the arrangement number of the water inlet and outlet mechanisms 2 is reduced, the installation workload of the water inlet and outlet mechanisms 2 is reduced, and the assembly operation efficiency is improved.
In addition, in order to install the cooling element group 3 in the computing cabinet and generate a better heat dissipation effect, the cooling device for the computing cabinet further includes a plurality of fixing brackets 4, each cooling element group 3 is correspondingly arranged in each fixing bracket 4 one by one, the plurality of cooling elements 1 are stacked layer by layer along the thickness direction thereof, two adjacent cooling elements 1 are mutually communicated and arranged, and each circuit board 6 is correspondingly clamped between two adjacent cooling elements 1 one by one.
It can be understood that the fixing bracket 4 is arranged to stably arrange the cooling element groups 3 in the computer cabinet, the cooling elements 1 in each cooling element group 3 are arranged at intervals, the cooling elements 1 are cooling plates, the heat generating body on the circuit board 6 is a chip, when the circuit board 6 needs to be installed, the part of the circuit board 6 provided with the chip is inserted between the upper and lower adjacent cooling plates and is attached to the cooling plates to clamp and fix the circuit board 6, the heat generated by the chip is conducted into the cooling water channel through the contact with the water cooling plates and then is discharged out of the computer cabinet through the water outlet pipe 22, so as to achieve the purpose of heat dissipation, the chip is arranged between the cooling plates to prevent the chip from being exposed, so as to protect the chip, because the circuit board 6 is provided with other non-heat generating bodies of other components, may be exposed outside the water-cooled panel.
Because the cooling member 1 is a stacked cooling plate, and as a preferred embodiment, the circuit board 6 is made of an aluminum substrate, both the upper and lower surfaces of the circuit board 6 can be cooled, and meanwhile, the cooling member 1 is in surface contact with the circuit board 6, so that the mutual contact area is increased, and a better cooling effect is achieved.
In one embodiment, the cooling element 1 on the top side of each cooling element group 3 is communicated with the water inlet pipe 21, and the cooling element 1 on the bottom side is communicated with the water outlet pipe 22; or the cooling element 1 on the bottom side communicates with the water inlet pipe 21 and the cooling element 1 on the top side communicates with the water outlet pipe 22.
It can be understood that, as shown in fig. 3, two cooling elements 1 adjacent to each other up and down are disposed in communication with each other, and one water inlet end 31 and one water outlet end 32 are disposed in each cooling element group 3, that is, after water flows in each cooling element group 3 from one water inlet end 31 and flows through a plurality of cooling elements 1, the water flows are discharged from one water outlet end 32 into the water outlet pipe 22, so as to provide heat dissipation for the circuit board 6, and since one water inlet end 31 and one water outlet end 32 are disposed in each cooling element group 3, the installation workload of the interface 5 is reduced.
As a preferred embodiment, three cooling elements 1 are arranged in each cooling element group 3, the three cooling elements 1 are stacked in a thickness direction thereof, the cooling element 1 on the top side is communicated with the water inlet pipe 21, because the two cooling elements 1 adjacent to each other are arranged in a mutually communicated manner, water flows through the cooling element 1 on the top side, then flows into the cooling element 1 in the middle, and finally flows into the cooling element 1 on the bottom side, and the water flows through the cooling element 1 on the bottom side and is discharged into the water outlet pipe 22; or the cooling element 1 at the bottom side is communicated with the water inlet pipeline 21, water flows through the cooling element 1 at the middle side and then is introduced into the cooling element 1 at the top side, and the water flows through the cooling element 1 at the top side and then is discharged into the water outlet pipeline 22.
The cooling element group 3 is provided with only one water inlet end 31 and one water outlet end 32, so that the heat dissipation of the circuit board 6 is provided, and the installation workload of the interface 5 can be reduced.
In one embodiment, compared with the previous embodiment, the present embodiment is different in that one of the cooling elements 1 in each cooling element group 3 is communicated with the water inlet pipe 21, and the upper and lower cooling elements 1 adjacent to the cooling element 1 are communicated with the water outlet pipe 22.
It can be understood that, as shown in fig. 4, the water inlet end 31 provided in each of the cooling element groups 3 is a multiple of two, the water outlet end 32 provided in each of the cooling element groups 3 is a multiple of two, the number of the cooling elements 1 provided in the cooling element group 3 is a multiple of three, in every three adjacent cooling elements 1, two water inlet ends 31 are provided on the water cooling element 1 located in the middle, water flows from the two water inlet ends 31 into the water cooling element 1 located in the middle, flows through the water cooling element 1 located in the middle, flows into the water cooling element 1 located on the upper side adjacent to the water cooling element 1, and simultaneously flows into the water cooling element 1 located on the lower side adjacent to the water cooling element 1, and after flowing through the water cooling element on the upper side, is discharged into the water outlet pipe 22 through the water outlet end 32 of the water cooling element 1 on the upper side, and simultaneously, after flowing through the water cooling element located on the lower side, is discharged into the water outlet pipe 22 through the water outlet end 32 of the water cooling element 1 on the, the plurality of water inlet ends 31 and the plurality of water outlet ends 32 are arranged in the cooling element groups 3, so that the flowing path of water flow in each cooling element group 3 is shortened, namely, the water change is accelerated, and the heat of the circuit board 6 can be quickly dissipated.
In a preferred embodiment, three cooling elements 1 are arranged in each cooling element group 3, the three cooling elements 1 are stacked in the thickness direction thereof, the cooling element 1 located in the middle is provided with two water inlet ends 31, water flows enter the middle water cooling element 1 from the two water inlet ends 31, because the two cooling elements 1 adjacent to each other are arranged in a mutually communicated manner, the water flows through the middle cooling element 1 and then flows into the cooling element 1 on the top side, and simultaneously flows into the cooling element 1 on the bottom side, the water flows through the cooling element 1 on the top side and then is discharged into the water outlet pipe 22 through the water outlet end 32 of the water cooling element 1 on the top side, and the water flows through the cooling element 1 on the bottom side and then is discharged into the water outlet pipe 22 through the water outlet end 32 of the water cooling element 1 on the bottom side; the cooling element group 3 is provided with two water inlet ends 31 and two water outlet ends 32, so that the water changing frequency is improved, and the heat of the circuit board 6 can be quickly dissipated.
In addition, one end of the interface 5 is communicated with the cooling member 1, and the other end is communicated with the water inlet pipe 21 or the water outlet pipe 22, it can be understood that the interface 5 is provided for communicating the water inlet and outlet mechanism 2 with the cooling member group 3.
Referring to fig. 1, fig. 3, and fig. 5 to fig. 6, the present invention further provides a computer cabinet, which includes a cooling device, a circuit board 6, a cabinet body 7, electronic components, and a partition 8.
The circuit board 6 is attached to the cooling part 1 in the cooling device of the computer cabinet, heat generated by the circuit board 6 is dissipated through the cooling device of the computer cabinet, a good heat dissipation effect is achieved on the computer cabinet, the cooling device of the computer cabinet and the circuit board 6 are integrated together, space in the computer cabinet is saved, and the overall structure is compact.
In addition, 8 rigid couplings of baffle in on 7 internal surfaces of rack, rack body 7 with baffle 8 encloses and is equipped with the installation calculate rack cooling device's first cavity 71, rack body 7 with baffle 8 still encloses and is equipped with second cavity 72, electronic components installs in second cavity 72, can understand, because install in the first cavity 71 water-cooling board and inlet and outlet water pipe way 22, what set up in the second cavity 72 is naked electronic components, sets up baffle 8 realizes the separation of water and electricity, avoids water and electric mutual interference, improves the security in the calculation rack.
The partition plate 8 penetrates through the first cavity 71 to the second cavity 72 to form a plurality of openings 81, and the top surface of the cabinet body 7 is provided with the heat dissipation port 73, so that it can be understood that heat generated by the electronic component is dissipated into the first cavity 71 through the openings 81, dissipated through the cooling part 1, and dissipated outside the computer cabinet through the heat dissipation port 73.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims (10)

1. A computing cabinet cooling apparatus, comprising:
the cooling piece (1) is attached to the circuit board (6);
and the water inlet and outlet mechanism (2) comprises a water inlet pipeline (21) communicated with the water inlet end of the cooling piece (1) and a water outlet pipeline (22) communicated with the water outlet end of the cooling piece (1).
2. The computing cabinet cooling arrangement of claim 1, further comprising a cooling element group (3), wherein the cooling element group (3) comprises a plurality of cooling elements (1) arranged at intervals, wherein the circuit boards (6) are arranged in a plurality, and wherein each circuit board (6) is attached to each cooling element (1) in a one-to-one correspondence.
3. The computing cabinet cooling arrangement according to claim 2, wherein the cooling element groups (3) are arranged in a plurality of groups, wherein the water inlet end (31) of each cooling element group (3) is arranged in communication with the water inlet conduit (21), and wherein the water outlet end (32) of each cooling element group (3) is arranged in communication with the water outlet conduit (22).
4. The cooling apparatus for a computer cabinet according to claim 3, wherein the cooling apparatus for a computer cabinet further comprises a plurality of fixing brackets (4), each cooling group (3) is correspondingly arranged in each fixing bracket (4), a plurality of cooling members (1) are stacked layer by layer along the thickness direction of the cooling members, two adjacent cooling members (1) are mutually communicated and arranged, and each circuit board (6) is correspondingly clamped between two adjacent cooling members (1).
5. The computing cabinet cooling arrangement according to claim 4, wherein the cooling elements (1) of the top side of each cooling element group (3) communicate with the water inlet duct (21) and the cooling elements (1) of the bottom side communicate with the water outlet duct (22); or the cooling element (1) on the bottom side is communicated with the water inlet pipeline (21), and the cooling element (1) on the top side is communicated with the water outlet pipeline (22).
6. Computing cabinet cooling arrangement according to claim 4, characterized in that one of the cooling elements (1) of each cooling element group (3) is in communication with the water inlet duct (21), and that both the upper and lower cooling elements (1) adjacent to the cooling element (1) are in communication with the water outlet duct (22).
7. Computing cabinet cooling arrangement according to claim 5 or 6, wherein three cooling elements (1) are provided in each cooling element group (3).
8. The computing cabinet cooling arrangement of claim 1, further comprising an interface (5), wherein the interface (5) is arranged in communication with the cooling element (1) at one end and with the water inlet conduit (21) or the water outlet conduit (22) at the other end.
9. A computing cabinet comprising the computing cabinet cooling device of any one of claims 1-8 and a circuit board (6), wherein the circuit board (6) is attached to the cooling element (1) of the computing cabinet cooling device.
10. The computing cabinet of claim 9, further comprising a cabinet body (7), electronic components, and a partition (8) fixedly attached to an inner surface of the cabinet body (7), wherein the cabinet body (7) and the partition (8) enclose a first cavity (71) in which the computing cabinet cooling device is mounted, and a second cavity (72) in which the electronic components are mounted.
CN202011183777.8A 2020-10-29 2020-10-29 Calculate rack cooling device and calculate rack Pending CN112272499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011183777.8A CN112272499A (en) 2020-10-29 2020-10-29 Calculate rack cooling device and calculate rack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011183777.8A CN112272499A (en) 2020-10-29 2020-10-29 Calculate rack cooling device and calculate rack

Publications (1)

Publication Number Publication Date
CN112272499A true CN112272499A (en) 2021-01-26

Family

ID=74346125

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011183777.8A Pending CN112272499A (en) 2020-10-29 2020-10-29 Calculate rack cooling device and calculate rack

Country Status (1)

Country Link
CN (1) CN112272499A (en)

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Effective date of registration: 20221205

Address after: 510000 No. B702, Guangzhou Jufeng auto parts market, No. 382, Guangcong 3rd road, community 6, Shating village, Taihe Town, Baiyun District, Guangzhou, Guangdong Province

Applicant after: Guangzhou Xinxiwang Technology Co.,Ltd.

Address before: 312000 No. 915, Xinwei village, Ma'an Town, Keqiao District, Shaoxing City, Zhejiang Province

Applicant before: Wang Xiaoyang

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