CN112117228B - Material tray conveying and positioning device of IGBT bonding machine - Google Patents

Material tray conveying and positioning device of IGBT bonding machine

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Publication number
CN112117228B
CN112117228B CN202011086768.7A CN202011086768A CN112117228B CN 112117228 B CN112117228 B CN 112117228B CN 202011086768 A CN202011086768 A CN 202011086768A CN 112117228 B CN112117228 B CN 112117228B
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CN
China
Prior art keywords
mounting frame
dbc
tray
screw
bonding machine
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011086768.7A
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Chinese (zh)
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CN112117228A (en
Inventor
邱道权
袁磊
王凯锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Zhongheng Micro Semiconductor Co ltd
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Hefei Zhongheng Micro Semiconductor Co ltd
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Priority to CN202011086768.7A priority Critical patent/CN112117228B/en
Publication of CN112117228A publication Critical patent/CN112117228A/en
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

Landscapes

  • Control Of Conveyors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明公开了一种IGBT键合机料盘传送定位装置,包括安装架以及通过传送带沿着安装架活动的DBC料盘,所述安装架的底部滑动安装有定位机构,所述定位机构是由固定设置与安装架底板上的丝杆机构、固定安装于丝杆机构活动部上的伸缩机构、固定安装于伸缩机构上的限位组件,所述DBC料盘的侧面设置有与限位组件相匹配的缺口。该装置,通过传动带将DBC料盘在安装架内侧平移,输送到键合操作点时,通过滑动设置的定位机构,间隔性的对DBC料盘进行定位,从而保证DBC料盘上的DBC基板通过上方的键合机依次进行键合,省去和操作人员进行手动辅助定位的工作,放置精度更高,并且加快了生产加工效率,实用性强。

The present invention discloses an IGBT bonding machine tray conveying and positioning device, comprising a mounting frame and a DBC tray that moves along the mounting frame through a conveyor belt, a positioning mechanism that is slidably installed at the bottom of the mounting frame, and the positioning mechanism is composed of a screw mechanism fixedly arranged on the bottom plate of the mounting frame, a telescopic mechanism fixedly installed on the movable part of the screw mechanism, and a limit assembly fixedly installed on the telescopic mechanism, and a notch that matches the limit assembly is arranged on the side of the DBC tray. The device translates the DBC tray on the inner side of the mounting frame through a transmission belt, and when it is conveyed to a bonding operation point, the DBC tray is intermittently positioned through a sliding positioning mechanism, thereby ensuring that the DBC substrates on the DBC tray are bonded in sequence through the bonding machine above, eliminating the need for manual auxiliary positioning with operators, and having higher placement accuracy, and accelerating production and processing efficiency, and having strong practicality.

Description

Material tray conveying and positioning device of IGBT bonding machine
Technical Field
The invention belongs to the technical field of electronic element processing equipment, and particularly relates to a material tray conveying and positioning device of an IGBT bonding machine.
Background
IGBT (Insulated Gate Bipolar Transistor), namely an insulated gate bipolar transistor, is a core device for energy conversion and transmission, and is extremely widely applied to the fields of rail transit, smart grids, aerospace, electric automobiles, new energy equipment and the like. In order to improve the heat dissipation performance of the power device, the service life and the reliability are prolonged, and the modularized packaging form with smaller volume, higher efficiency and higher reliability has become the main packaging form of the high-power IGBT.
In the bonding process in the production process of the IGBT module, the chips on the DBC substrate and the chips and the DBC substrate are connected through bonding wire bonding, so that a complete circuit structure is formed. At present, in order to improve the utilization rate of equipment, a plurality of DBC substrates are loaded and unloaded in batches by a material tray. In view of the high requirement of the bonding process on the positioning precision of the DBC substrate, the manual loading and unloading of the material tray is time-consuming and labor-consuming, the placement precision cannot be guaranteed, and meanwhile, the processing production efficiency is limited, so that the material tray conveying and positioning device of the IGBT bonding machine needs to be designed and put into use.
Disclosure of Invention
The invention aims to provide a tray conveying and positioning device of an IGBT bonding machine, which is put into use to solve the problems in the background technology.
The technical scheme is that the tray conveying and positioning device of the IGBT bonding machine comprises a mounting frame and a DBC tray which moves along the mounting frame through a conveyor belt, wherein a positioning mechanism is slidably arranged at the bottom of the mounting frame and consists of a screw rod mechanism fixedly arranged on a bottom plate of the mounting frame, a telescopic mechanism fixedly arranged on a movable part of the screw rod mechanism and a limiting assembly fixedly arranged on the telescopic mechanism, and a notch matched with the limiting assembly is formed in the side surface of the DBC tray;
The limiting assembly is formed by symmetrically and fixedly arranging two limiting vertical rods at the upper end of a transverse plate, and the transverse plate is fixedly arranged on a movable part of the screw rod mechanism;
The screw rod mechanism is composed of a screw rod rotatably arranged in the middle of a bottom plate of the mounting frame, a movable nut in threaded connection with the screw rod and sliding along the screw rod, and a driving motor fixedly arranged on the mounting frame and used for driving the screw rod to rotate, and the screw rod is arranged in parallel with the mounting frame;
the transverse plate is fixedly provided with a photoelectric sensor;
a group of correlation sensors are arranged on the vertical plates of the mounting frame.
Preferably, the movable nut is fixedly arranged in the middle of the movable base, the lower end of the movable base is in sliding connection with the mounting frame through the guide rail, and the telescopic mechanism is fixedly arranged at the upper end of the movable base.
Preferably, the telescopic mechanism is an electric push rod or an electric cylinder.
Preferably, the conveyor belt is disposed on the side wall of the mounting bracket riser by rotating a pulley mounted on the mounting bracket riser.
Preferably, a supporting bar is arranged below the conveyor belt, and supports the conveyor belt and the DBC tray when the DBC tray is pressed on the conveyor belt.
The invention has the technical effects and advantages that the material tray conveying and positioning device of the IGBT bonding machine,
1. Through setting up the positioning mechanism of drive translation, spaced-type carries out a lot of location to DBC charging tray to make DBC base plate on the DBC charging tray reach the bonding point in proper order and carry out bonding operation, finally realize that a plurality of DBC base plates accomplish bonding processing on the DBC charging tray, save and operating personnel carry out manual assistance-localization real-time's work, place the precision higher, and accelerated production machining efficiency, the practicality is strong.
2. Adopt belt conveying cooperation installing support's mode to carry DBC charging tray, can be continuous with the charging tray conveying to bonding position, go up the charging tray inefficiency, can conveniently integrate with automatic feed and discharge device, realize automatic unloading of going up, further accelerated machining efficiency.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
fig. 2 is a schematic view of the internal structure of the mounting frame.
In the figure, 1, a mounting frame, 2, a conveyor belt, 3, a DBC material tray, 4, a positioning mechanism, 41, a screw rod mechanism, 42, a telescopic mechanism, 43 and a limiting component;
411. a screw rod, 412, a movable nut, 413, a driving motor;
431. 432, limit vertical rods;
5. a notch; 6, a photoelectric sensor, 7, a correlation sensor, 8, a movable base, 9, a guide rail, 10, a belt wheel, 11 and a support bar.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides a tray conveying and positioning device of an IGBT bonding machine, which is shown in figures 1-2, and comprises a mounting frame 1 and a DBC tray 3 which moves along the mounting frame 1 through a conveyor belt 2, wherein a positioning mechanism 4 is slidably arranged at the bottom of the mounting frame 1, the positioning mechanism 4 is composed of a screw rod mechanism 41 fixedly arranged on a bottom plate of the mounting frame 1, a telescopic mechanism 42 fixedly arranged on a movable part of the screw rod mechanism 41 and a limiting assembly 43 fixedly arranged on the telescopic mechanism 42, and a notch 5 matched with the limiting assembly 43 is arranged on the side surface of the DBC tray 3.
At first, the telescopic mechanism 42 is in an extending state, a plurality of DBC trays 3 carrying DBC substrates (the DBC substrates are arranged in preset grooves on the DBC trays 3) are driven by a conveying belt to be conveyed forwards, and a limiting component 43 at the end part of the telescopic mechanism 42 just clamps into a notch 5 at the end part of the DBC trays 3, so that the front, back, left and right directions of the trays are limited, the positions of the trays are accurately determined, and after the photoelectric sensors 6 and the correlation sensors sense that the DBC trays 3 are in place and the DBC substrates in the trays exist, the bonding machine performs next bonding action on the DBC substrates below;
after the bonding operation is completed, the screw rod mechanism 41 works to drive the telescopic mechanism 42 and the limiting assembly 43 to move to the next positioning position, the material tray is driven by the conveying belt to move forwards, and the material tray stops after being blocked by the limiting assembly 43, so that the DBC substrate to be bonded in the DBC material tray 3 is positioned below the bonding machine accurately, and at the moment, the next bonding operation can be performed again. The above actions are repeatedly executed until all DBC substrates in the tray are bonded. Then the telescopic mechanism 42 drives the limiting component 43 to retract, and the DBC tray 3 is driven by the conveyor belt 2 to be conveyed to the discharging position.
The limiting assembly 43 is formed by symmetrically and fixedly arranging two limiting vertical rods 432 at the upper end of a transverse plate 431, and the transverse plate 431 is fixedly arranged on the movable part of the screw rod mechanism 41. The limiting vertical rods 432 symmetrically arranged are respectively clamped into the notches 5 formed in the end parts of the DBC material trays 3, limiting to the front, back, left and right directions of the DBC material trays 3 is achieved, and positioning is more stable and rapid.
The transverse plate 431 is fixedly provided with a photoelectric sensor 6, and the vertical plate of the mounting frame 1 is provided with a group of correlation sensors 7. The existence of the DBC tray 3 can be detected after the DBC tray 3 is positioned by the limiting component 43 through the photoelectric sensor 6 on the transverse plate 431 of the limiting component 43, and meanwhile, the existence of the DBC substrate placed on the DBC tray 3 is detected through the correlation sensor 7, and then the next bonding operation is carried out.
The screw rod mechanism 41 is composed of a screw rod 411 rotatably installed in the middle of a bottom plate of the installation frame 1, a movable nut 412 in threaded connection with the screw rod 411 and sliding along the screw rod 411, and a driving motor 413 fixedly installed on the installation frame 1 and used for driving the screw rod 411 to rotate, the screw rod 411 and the installation frame 1 are arranged in parallel, the movable nut 412 is fixedly installed in the middle of the movable base 8, the lower end of the movable base 8 is in sliding connection with the installation frame 1 through a guide rail 9, and the telescopic mechanism 42 is fixedly installed at the upper end of the movable base 8. The driving motor 413 drives the screw rod 411 to rotate, so that the movable nut 412 translates along the screw rod 411, thereby driving the movable base 8 to translate, dragging the telescopic mechanism 42 and the limiting mechanism to move to a bonding point of the next position simultaneously, and performing bonding processing operation on a group of DBC substrates on the DBC tray 3.
The telescopic mechanism 42 is an electric push rod or an electric cylinder.
The conveyor belt 2 is arranged on the side wall of the riser of the installation frame 1 by rotating a belt pulley 10 arranged on the riser of the installation frame 1.
A supporting bar 11 is arranged below the conveyor belt 2, and the supporting bar 11 supports the conveyor belt 2 and the DBC tray 3 when the DBC tray 3 is pressed and held on the conveyor belt 2. When the DBC substrate on the DBC tray 3 is bonded, the two sides of the DBC tray 3 are supported by the supporting bars 11, so that the situation that the conveyor belt 2 is damaged due to excessive pressure is avoided.
It should be noted that the foregoing description is only a preferred embodiment of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood that modifications, equivalents, improvements and modifications to the technical solution described in the foregoing embodiments may occur to those skilled in the art, and all modifications, equivalents, and improvements are intended to be included within the spirit and principle of the present invention.

Claims (5)

1.一种IGBT键合机料盘传送定位装置,包括安装架(1)以及通过传送带(2)沿着安装架(1)活动的DBC料盘(3),其特征在于:所述安装架(1)的底部滑动安装有定位机构(4),所述定位机构(4)是由固定设置与安装架(1)底板上的丝杆机构(41)、固定安装于丝杆机构(41)活动部上的伸缩机构(42)、固定安装于伸缩机构(42)上的限位组件(43),所述DBC料盘(3)的侧面设置有与限位组件(43)相匹配的缺口(5);1. An IGBT bonding machine tray conveying and positioning device, comprising a mounting frame (1) and a DBC tray (3) movable along the mounting frame (1) through a conveyor belt (2), characterized in that: a positioning mechanism (4) is slidably mounted on the bottom of the mounting frame (1), the positioning mechanism (4) is composed of a screw mechanism (41) fixedly arranged on the bottom plate of the mounting frame (1), a telescopic mechanism (42) fixedly mounted on the movable part of the screw mechanism (41), and a limit assembly (43) fixedly mounted on the telescopic mechanism (42), and a notch (5) matching the limit assembly (43) is arranged on the side of the DBC tray (3); 所述限位组件(43)是由横板(431)上端对称固定设置两根限位竖杆(432)构成,所述横板(431)固定安装于丝杆机构(41)的活动部上;The limiting assembly (43) is composed of two limiting vertical rods (432) symmetrically fixedly arranged on the upper end of a horizontal plate (431), and the horizontal plate (431) is fixedly mounted on the movable part of the screw mechanism (41); 所述丝杆机构(41)是由转动安装于安装架(1)底板中部的丝杆(411)、与丝杆(411)螺纹连接且沿着丝杆(411)滑动的活动螺母(412)以及固定安装于安装架(1)上用于驱动丝杆(411)转动的驱动电机(413)构成,所述丝杆(411)与安装架(1)平行设置;The screw mechanism (41) is composed of a screw (411) rotatably mounted on the middle part of the bottom plate of the mounting frame (1), a movable nut (412) threadedly connected to the screw (411) and sliding along the screw (411), and a driving motor (413) fixedly mounted on the mounting frame (1) and used to drive the screw (411) to rotate, and the screw (411) is arranged parallel to the mounting frame (1); 所述横板(431)上固定设置有光电感应器(6);A photoelectric sensor (6) is fixedly arranged on the horizontal plate (431); 所述安装架(1)的竖板上设置有一组对射式传感器(7)。A group of opposing beam sensors (7) are arranged on the vertical plate of the mounting frame (1). 2.根据权利要求1所述的一种IGBT键合机料盘传送定位装置,其特征在于:活动螺母(412)固定安装于活动基座(8)的中部,所述活动基座(8)的下端通过导轨(9)与安装架(1)滑动连接,且伸缩机构(42)固定安装于活动基座(8)上端。2. An IGBT bonding machine tray conveying and positioning device according to claim 1, characterized in that: a movable nut (412) is fixedly installed in the middle of a movable base (8), the lower end of the movable base (8) is slidably connected to the mounting frame (1) through a guide rail (9), and a telescopic mechanism (42) is fixedly installed on the upper end of the movable base (8). 3.根据权利要求1所述的一种IGBT键合机料盘传送定位装置,其特征在于:所述伸缩机构(42)为电动推杆或电动缸。3. An IGBT bonding machine tray conveying and positioning device according to claim 1, characterized in that: the telescopic mechanism (42) is an electric push rod or an electric cylinder. 4.根据权利要求1所述的一种IGBT键合机料盘传送定位装置,其特征在于:所述传送带(2)通过转动安装于安装架(1)竖板上的带轮(10)安置于安装架(1)竖板的侧壁上。4. An IGBT bonding machine tray conveying and positioning device according to claim 1, characterized in that: the conveyor belt (2) is arranged on the side wall of the vertical plate of the mounting frame (1) by rotating a pulley (10) installed on the vertical plate of the mounting frame (1). 5.根据权利要求1-4任意一项所述的一种IGBT键合机料盘传送定位装置,其特征在于:所述传送带(2)的下方设置有支撑条(11),当DBC料盘(3)压持到传送带(2)上时,支撑条(11)对传送带(2)和DBC料盘(3)进行支撑。5. An IGBT bonding machine tray conveying and positioning device according to any one of claims 1 to 4, characterized in that a support bar (11) is arranged under the conveyor belt (2), and when the DBC tray (3) is pressed onto the conveyor belt (2), the support bar (11) supports the conveyor belt (2) and the DBC tray (3).
CN202011086768.7A 2020-10-12 2020-10-12 Material tray conveying and positioning device of IGBT bonding machine Active CN112117228B (en)

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CN202011086768.7A CN112117228B (en) 2020-10-12 2020-10-12 Material tray conveying and positioning device of IGBT bonding machine

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Application Number Priority Date Filing Date Title
CN202011086768.7A CN112117228B (en) 2020-10-12 2020-10-12 Material tray conveying and positioning device of IGBT bonding machine

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CN112117228A CN112117228A (en) 2020-12-22
CN112117228B true CN112117228B (en) 2025-07-22

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CN114671247A (en) * 2022-05-07 2022-06-28 深圳市合智创通讯有限公司 A belt type FPC automatic feeding machine

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CN206953804U (en) * 2017-05-26 2018-02-02 大族激光科技产业集团股份有限公司 Laser marking machine and its positioner
CN213304090U (en) * 2020-10-12 2021-05-28 合肥中恒微半导体有限公司 An IGBT bonding machine material tray transmission positioning device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019127033A1 (en) * 2017-12-26 2019-07-04 深圳市柔宇科技有限公司 Film affixing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206953804U (en) * 2017-05-26 2018-02-02 大族激光科技产业集团股份有限公司 Laser marking machine and its positioner
CN213304090U (en) * 2020-10-12 2021-05-28 合肥中恒微半导体有限公司 An IGBT bonding machine material tray transmission positioning device

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