CN112086493A - Display device and method for manufacturing the same - Google Patents
Display device and method for manufacturing the same Download PDFInfo
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- CN112086493A CN112086493A CN202010946693.9A CN202010946693A CN112086493A CN 112086493 A CN112086493 A CN 112086493A CN 202010946693 A CN202010946693 A CN 202010946693A CN 112086493 A CN112086493 A CN 112086493A
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- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000000034 method Methods 0.000 title claims description 7
- 239000011241 protective layer Substances 0.000 claims abstract description 77
- 238000005452 bending Methods 0.000 claims description 36
- 238000005507 spraying Methods 0.000 claims description 28
- 239000010410 layer Substances 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 238000002161 passivation Methods 0.000 claims description 8
- 238000000016 photochemical curing Methods 0.000 claims description 8
- 238000005286 illumination Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 abstract description 2
- 239000007921 spray Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
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- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The application provides a display device, it includes display module assembly and drive module assembly, display module assembly includes a display panel, display panel's demonstration side is provided with one and binds the district, drive module assembly's first end electricity connect in bind the district, the second end buckle extremely display panel's non-display side, drive module assembly is still including being located first end with the regional of buckling between the second end, it has the protective layer to buckle regional coats and is stamped, be provided with the stress release structure on the protective layer.
Description
Technical Field
The present disclosure relates to display devices, and particularly to a display device and a method for manufacturing the same.
Background
In a conventional Organic Light-Emitting Diode (OLED) display device, an external circuit electrically connected to a Pad (Pad) at an edge of the display device may be bent to a rear surface of the display device, thereby narrowing a frame of the display device. Because the thickness of the OLED display device is about 20 μm, when an external circuit is bent, internal resistance exists during bending deformation, so that the flexible OLED display device is damaged by stress.
Disclosure of Invention
In view of the above, the present disclosure provides a display device capable of reducing stress damage to an OLED display device caused by bending of an external circuit.
The application provides a display device, it includes display module assembly and drive module assembly, display module assembly includes a display panel, display panel's demonstration side is provided with one and binds the district, drive module assembly's first end electricity connect in bind the district, the second end buckle extremely display panel's non-display side, drive module assembly is still including being located first end with the regional of buckling between the second end, it has the protective layer to buckle regional coats and is stamped, be provided with the stress release structure on the protective layer.
In one embodiment, the stress relief structure is a groove formed in the protective layer or a protrusion formed on the surface of the protective layer.
In one embodiment, the length of the groove in the bending direction of the driving module ranges from 20 micrometers to 40 micrometers.
In one embodiment, the distance between the grooves in the bending direction is one third of the length of the grooves in the bending direction.
In one embodiment, a density of stress relief structures corresponding to the first end and to the second end is greater than a density of stress relief structures corresponding to the inflection region.
In one embodiment, the protective layer includes the first protective layer and the second protective layer, which are stacked, the first protective layer is provided with a first stress releasing structure, the second protective layer is provided with a second stress releasing structure, the first stress releasing structure and the second stress releasing structure are both grooves, and an orthographic projection of the first stress releasing structure on the second protective layer is staggered from the second stress releasing structure.
In one embodiment, the driving module includes a chip on film or a flexible circuit board.
The present application provides a method of manufacturing a display device, comprising the steps of,
providing a display module and a driving module, wherein the display module comprises a display panel, the display side of the display panel is provided with a binding area,
forming a protective layer at a preset position of the drive module, electrically connecting a first end of the drive module covered with the protective layer to the binding region, and bending a second end of the drive module to the non-display side of the display panel to bend the region covered with the protective layer to form a bending region; wherein the step of forming a protective layer at a predetermined position of the driving module comprises:
and spraying photocuring resin on the preset position of the driving module through a spraying template, and carrying out illumination hardening on the photocuring resin to form a protective layer, wherein a plurality of through holes are formed in the spraying template, and a stress release structure is formed on the protective layer by utilizing the through holes.
In one embodiment, the stress relief structure is a groove formed in the protective layer or a protrusion formed on the surface of the protective layer.
In one embodiment, the step of forming a protective layer on a predetermined position of the driving module includes:
spraying photocuring resin on a preset position of the driving module through a first spraying template, performing light hardening on the photocuring resin to form a first protective layer, wherein a plurality of first through holes are formed in the first spraying template, and a first stress release structure is formed on the first protective layer by utilizing the first through holes;
spraying light-cured resin on a preset position of the driving module through a second spraying template, and carrying out light hardening on the light-cured resin to form a second protective layer, wherein a plurality of second through holes are formed in the second spraying template, and a second stress release structure is formed on the second protective layer by utilizing the second through holes;
and then, the second protective layer is attached to the first protective layer, so that the orthographic projection of the first stress release structure on the second protective layer is staggered with the second stress release structure.
Compare in prior art, the display device of this application plays the regional effect of reinforceing the buckling through forming the protective layer in the drive module outside, through set up stress release structure on the protective layer, when drive module buckles to the non-demonstration side, makes the regional inherent resistance of deformation release better, reduces to buckle and hinders the risk, improves product stability. In addition, the application also provides a manufacturing method of the display device, and the stress release mechanism can be formed on the protective layer by utilizing the spraying template provided with the through hole, so that the stability of the product is improved.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present application.
Fig. 2 is a schematic perspective view of a display device according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a display device according to another embodiment of the present application.
Fig. 4 is an enlarged schematic view of a region a of the display device of fig. 2.
Fig. 5 is a schematic cross-sectional view of a region a of the display device of fig. 2.
Fig. 6 is a schematic plan view of a display device according to an embodiment of the present invention, in which a protective layer is developed.
Fig. 7 is a schematic cross-sectional view of a region a of a display device according to another embodiment of the present application.
Fig. 8 is a schematic cross-sectional view of a region a of a display device according to still another embodiment of the present application.
Fig. 9 is a schematic diagram illustrating a step of forming a protective layer in a method of manufacturing a display device according to an embodiment of the present application.
Fig. 10 is a sectional view of a spray template for forming a protective layer in a method of manufacturing a display device according to still another embodiment of the present application.
Detailed Description
The technical solution in the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application, are within the scope of protection of the present application.
The display device 100 provided in the present application may include, for example, at least one of a smart phone (smartphone), a tablet personal computer (tablet personal computer), a mobile phone (mobile phone), a video phone, an electronic book reader (e-book reader), a desktop computer (desktop PC), a laptop computer (laptop PC), a netbook (netbook computer), a workstation (workstation), a server, a personal digital assistant (personal digital assistant), a portable media player (portable multimedia player), an MP3 player, a mobile medical machine, a camera, or a wearable device (e.g., smart glasses, head-mounted devices (head-mounted-devices (hmd)), electronic clothing, an electronic bracelet, an electronic necklace, an electronic smart accessory (app), an electronic tattoo, a smart bracelet, or a smart watch (smart watch).
Referring to fig. 1 and fig. 2, a display device 100 provided in the present application includes a display module 10 and a driving module 20. The display module 10 includes a display panel 11. The display side of the display panel 11 is provided with a binding region 11 a. The first end 21 of the driving module 20 is electrically connected to the bonding area 11 a. The second end 22 is bent to the non-display side of the display panel 11. The drive module 20 further comprises a bending region 23 between the first end 21 and the second end 22. The bending region 23 is covered with a protective layer 30. The display module 10 further includes a back plate 12(back plate) disposed on the non-display side of the display panel 11. The back plate 12 is used to support the display panel 11. The second end 22 of the driving module 20 is bent to a side of the back plate 12 away from the display panel 11.
The display module 10 of the present application can be an Active Light Emitting display module, such as an Organic Light-Emitting Diode (OLED) display module, an Active-matrix Organic Light-Emitting Diode (AMOLED) display module, a Passive-matrix OLED (Passive-OLED) display module, a Quantum Dot OLED (Quantum Dot Light Emitting Diodes, QLED) display module, a Micro-LED (Micro Light-Emitting Diode, Micro-LED) display module, and a sub-millimeter LED (Mini Light-Emitting Diode, Mini-LED) display module; the display module may be a passive light emitting type display module, such as a Liquid Crystal Display (LCD) module. The bonding area 11a is located at an edge position of the display panel 11. The bonding area 11a is provided with a plurality of connection pads.
The driving module 20 may include a flexible circuit board and a driving chip (IC)24 electrically connected to the flexible circuit board. A first end 21, a second end 22 and a bending area 23 of the driving module 20. Referring to fig. 3, in another embodiment of the present application, the driving module 20 includes a Chip On Film (COF).
The protective layer 30 serves to increase the stiffness of the bending region 23. In the present embodiment, the protective layer 30 covers only the bent region 23. In other embodiments of the present disclosure, the protection layer 30 may also cover the first end 21 and/or the second end 22 of the driving module 20.
The material of the protective layer 30 includes a photo-curable resin. The photocurable resin may be, for example, an epoxy resin, an acrylic resin, a polyimide resin, or the like. The protection layer 30 is uniformly coated on the bending region 23 of the driving module 20. The uniform coating means that the surface smoothness of the colloid is high, the stress is more uniform in the bending process, and the stress damage can be reduced. The thickness of the protective layer 30 is 40 to 100 micrometers.
When the bending region 23 of the driving module 20 is deformed, especially when the bending deformation radius, i.e. the R angle, is very small, the internal stress in the deformation position cannot be effectively released, which easily causes damage to the driving module 20, and further, when the stress is transmitted to the display module 10, damage to the display module 10 may also be caused. In order to relieve stress, a stress relieving structure 31 is provided on the protective layer 30.
Referring to fig. 4 and 5, a region a in fig. 4 shows a portion of the protective layer 30 in fig. 2. In one embodiment, the stress relieving feature 31 is a groove opened in the protective layer 30.
The groove can be a through hole or a blind hole. The shape of the groove is not limited in the application, and the groove can be circular, oval, polygonal or annular. Referring to fig. 6, the length d1 of the groove in the bending direction Y of the driving module 20 ranges from 20 micrometers to 40 micrometers. If the length d1 of the groove in the bending direction Y is too small, the stress applied to the bending region 23 is too large and cannot be released, and if the length d1 of the groove in the bending direction Y is too large, the protective layer area of the bending region 23 is too small and cannot play an external protection role. Furthermore, in one embodiment, the spacing d2 of the grooves in the bending direction Y may be about one third of the length d1 of the grooves in the bending direction Y, thereby ensuring stress relief.
The release structures 31 in the protective layer 30 may be uniformly distributed or may be non-uniformly distributed. In one embodiment, the density of stress relief structures 31 corresponding to the first end 21 and corresponding to the second end 22 may be greater than the density of stress relief structures 31 corresponding to the inflection region 23. Since the bend deformation radius of the bend region 23, i.e., the R-angle, is smaller than the bend deformation radius of the bend region 23 near the first end 21 and near the second end 22, the stress to which the driving module 20 is subjected is larger near the first end 21 and near the second end 22. More specifically, the density of the stress relieving structures 31 is tapered in a direction toward the bending region 23 at the first end 21, and is tapered in a direction toward the bending region 23 at the second end 22.
Referring to fig. 7, in another embodiment, the stress relief structure 31 is a protrusion formed on the surface of the protection layer 30. The stress experienced by the bending region 23 is transmitted through the protrusion.
Referring to fig. 8, in another embodiment, the protection layer 30 includes a first protection layer 30a and a second protection layer 30b stacked together. The first passivation layer 30a has a first stress relief structure 31 a. The second passivation layer 30b is provided with a second stress relief structure 31 b. The first stress relief structure 31a and the second stress relief structure 31b are both grooves. The first stress relief structure 31a and the second stress relief structure 31b are arranged in a staggered manner, that is, an orthographic projection of the first stress relief structure 31a on the second protection layer 30b is staggered from the second stress relief structure 31 b. This can further relieve stress.
The application also provides a manufacturing method of the display device, which is used for manufacturing the display device.
The manufacturing method comprises the following steps:
a display module 10 and a driving module 20 are provided. The display module 10 includes a display panel 11. The display side of the display panel 11 is provided with a binding region 11 a.
Forming a protection layer 30 on a predetermined position of the driving module 20, electrically connecting the first end 21 of the driving module 20 covered with the protection layer 30 to the bonding region 11a, and bending the second end 22 to the non-display side of the display panel 11, so that the region covered with the protection layer 30 is bent to form a bending region 23.
The step of forming the protection layer 30 on the predetermined position of the driving module 20 includes:
referring to fig. 9, a photo-curable resin is sprayed on a predetermined position of the driving module 20 through a spraying template 202, and the photo-curable resin is cured by light to form the protection layer 30. The spray device 200 for spraying a photocurable resin used for spraying a photocurable resin includes a head mechanism 201 and a spray pattern 202. A plurality of through holes 200a are opened in the spray template 202. The through-hole 200a may be cylindrical. The stress relieving structure 31 is formed on the protective layer 30 using the through hole 200 a. During spraying, the nozzle mechanism 201 and the spraying template 202 may be spaced apart from each other or may be in close contact with each other. In one embodiment, the stress relieving feature 31 is a groove. The length of the through-hole 200a in one predetermined direction is 20 to 40 micrometers. The pitch of the through holes 200a in the predetermined direction may be about one third of the length of the through holes 200a in the predetermined direction. The predetermined direction is a bending direction of the driving module 20.
In another embodiment, referring to fig. 10, the projection of fig. 7 can be formed as the stress relieving feature 31 by using the spray template 202. The through-hole 200a of the spray pattern plate 202 is circular truncated cone-shaped, and the cross section thereof is trapezoidal. In other embodiments, in this embodiment, the projections in the figure may be formed by placing the spray head mechanism 201 against the spray template 202.
In another embodiment, the method for manufacturing a display device further includes forming another protective layer by using the nozzle mechanism 201 and the spray template 202, and attaching the protective layer to the previously formed protective layer.
In other words, in the method for manufacturing the display device, the step of forming the protection layer 30 at the predetermined position of the driving module 20 includes:
a photo-curable resin is sprayed to a predetermined position of the driving module 20 through the first spray pattern 202, and the photo-curable resin is photo-cured to form the first protective layer 31. The spray device 200 for spraying a photocurable resin used for spraying a photocurable resin includes a nozzle mechanism 201 and a first spray pattern plate. A plurality of first through holes are formed in the spray template 202. A first stress relief structure 31a is formed on the first protective layer 31 using the first via hole.
The photo-curable resin is sprayed to a predetermined position of the driving module 20 through the second spraying template, and the photo-curable resin is cured by light irradiation to form the second protective layer 30 b. Wherein. A plurality of second through holes are formed in the spray template 202. The second stress relief structure 31b is formed on the second protective layer 32 using the second via hole. The second protection layer 30b is attached to the first protection layer 31, so that the orthographic projection of the first stress releasing structure 31a on the second protection layer 30b is staggered from the second stress releasing structure 31 b. The first mask for forming the first protective layer 30a and the second mask for forming the second protective layer 30b may be the same or different.
Compare in prior art, the display device of this application plays the regional effect of reinforceing the buckling through forming the protective layer in the drive module outside, through set up stress release structure on the protective layer, when drive module buckles to the non-demonstration side, makes the regional inherent resistance of deformation release better, reduces to buckle and hinders the risk, improves product stability. In addition, the application also provides a manufacturing method of the display device, and the stress release mechanism can be formed on the protective layer by utilizing the spraying template provided with the through hole, so that the stability of the product is improved.
The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. The display device is characterized by comprising a display module and a driving module, wherein the display module comprises a display panel, a binding area is arranged on the display side of the display panel, the first end of the driving module is electrically connected to the binding area, the second end of the driving module is bent to the non-display side of the display panel, the driving module further comprises a bending area which is located between the first end and the second end, a protective layer covers the bending area, and a stress release structure is arranged on the protective layer.
2. The display device according to claim 1, wherein the stress relief structure is a groove formed in the protective layer or a protrusion formed on a surface of the protective layer.
3. The display device according to claim 2, wherein the length of the groove in the bending direction of the driving module is in a range of 20 to 40 micrometers.
4. A display device as claimed in claim 3, characterized in that the distance of the grooves in the bending direction is one third of the length of the grooves in the bending direction.
5. The display device according to claim 1, wherein a density of the stress relieving structures corresponding to the first end and the second end is greater than a density of the stress relieving structures corresponding to the bending region.
6. The display device according to claim 1, wherein the passivation layer includes a first passivation layer and a second passivation layer stacked on each other, the first passivation layer has a first stress relief structure formed thereon, the second passivation layer has a second stress relief structure formed thereon, the first stress relief structure and the second stress relief structure are both recesses, and an orthographic projection of the first stress relief structure on the second passivation layer is staggered from the second stress relief structure.
7. The display device as claimed in claim 1, wherein the driving module comprises a flip-chip film or a flexible circuit board.
8. A method of manufacturing a display device includes the steps of,
providing a display module and a driving module, wherein the display module comprises a display panel, the display side of the display panel is provided with a binding area,
forming a protective layer at a preset position of the drive module, electrically connecting a first end of the drive module covered with the protective layer to the binding region, and bending a second end of the drive module to the non-display side of the display panel to bend the region covered with the protective layer to form a bending region; wherein the step of forming a protective layer at a predetermined position of the driving module comprises:
and spraying photocuring resin on the preset position of the driving module through a spraying template, and carrying out illumination hardening on the photocuring resin to form a protective layer, wherein a plurality of through holes are formed in the spraying template, and a stress release structure is formed on the protective layer by utilizing the through holes.
9. The method according to claim 8, wherein the stress relief structure is a groove formed in the protective layer or a protrusion formed on a surface of the protective layer.
10. The method of manufacturing a display device according to claim 8, wherein the step of forming a protective layer on a predetermined position of the driving module comprises:
spraying photocuring resin on a preset position of the driving module through a first spraying template, performing light hardening on the photocuring resin to form a first protective layer, wherein a plurality of first through holes are formed in the first spraying template, and a first stress release structure is formed on the first protective layer by utilizing the first through holes;
spraying light-cured resin on a preset position of the driving module through a second spraying template, and carrying out light hardening on the light-cured resin to form a second protective layer, wherein a plurality of second through holes are formed in the second spraying template, and a second stress release structure is formed on the second protective layer by utilizing the second through holes;
and then, the second protective layer is attached to the first protective layer, so that the orthographic projection of the first stress release structure on the second protective layer is staggered with the second stress release structure.
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US20190318689A1 (en) * | 2018-04-11 | 2019-10-17 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
CN109062439A (en) * | 2018-08-09 | 2018-12-21 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
CN109448554A (en) * | 2018-12-03 | 2019-03-08 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels and preparation method thereof |
CN110148620A (en) * | 2019-06-26 | 2019-08-20 | 昆山国显光电有限公司 | A kind of display panel and display device |
CN111045264A (en) * | 2019-12-13 | 2020-04-21 | 武汉华星光电技术有限公司 | Display panel |
CN111430432A (en) * | 2020-04-14 | 2020-07-17 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel |
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