CN112054698A - Multifunctional supporting structure for photovoltaic inverter - Google Patents
Multifunctional supporting structure for photovoltaic inverter Download PDFInfo
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- CN112054698A CN112054698A CN202011085474.2A CN202011085474A CN112054698A CN 112054698 A CN112054698 A CN 112054698A CN 202011085474 A CN202011085474 A CN 202011085474A CN 112054698 A CN112054698 A CN 112054698A
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- Prior art keywords
- circuit board
- support column
- photovoltaic inverter
- support structure
- multifunctional
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/56—Power conversion systems, e.g. maximum power point trackers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
Abstract
本发明公开一种光伏逆变器用的多功能支撑结构,包括第一电路板、第二电路板和支撑在第一电路板和第二电路板之间的支撑柱,第一电路板通过支撑柱电性连接第二电路板。支撑柱表面设有流线型凹槽或凸起,同时具有定向导风和散热性能。与现有技术相比,本发明的优点在于:本发明中的支撑柱即具有支撑功能又具有导电功能,安装和固定方式固定,有助于降低成本,且支撑柱表面设有流线型凹槽或凸起,可以起到辅助散热作用,降低设备的温度的功能。
The invention discloses a multifunctional support structure for a photovoltaic inverter, comprising a first circuit board, a second circuit board and a support column supported between the first circuit board and the second circuit board, the first circuit board passing through the support column is electrically connected to the second circuit board. The surface of the support column is provided with streamlined grooves or protrusions, and has both directional air guide and heat dissipation properties. Compared with the prior art, the advantages of the present invention are: the support column in the present invention has both a support function and a conductive function, the installation and fixing methods are fixed, which helps to reduce costs, and the surface of the support column is provided with streamlined grooves or The protrusions can play a role in assisting heat dissipation and reducing the temperature of the device.
Description
技术领域technical field
本发明叠层电路板结构领域,具体涉及一种光伏逆变器用的多功能支撑结构。The present invention relates to the field of laminated circuit board structures, in particular to a multifunctional support structure for photovoltaic inverters.
背景技术Background technique
光伏逆变器中,经常需要电路板采用叠层的结构设计,这样在安装时,多采用金属支撑柱做支撑作用,而电气连接多采用线束连接。这种方式组装步骤多,安装复杂,容易造成设备内部线束多,占用空间,也容易阻塞散热的通道,同时也不够美观,因此获得一种结构简单、即可以起到支撑作用又可以当导电功能柱用的光伏逆变器用的多功能支撑结构十分重要。In photovoltaic inverters, the circuit board is often required to be designed with a laminated structure, so that during installation, metal support columns are often used for support, and electrical connections are mostly connected by wire harnesses. This method has many assembly steps and complicated installation, which is easy to cause many wiring harnesses inside the equipment, takes up space, and easily blocks the heat dissipation channel, and is also not beautiful. Multifunctional support structures for PV inverters for columns are very important.
发明内容SUMMARY OF THE INVENTION
为解决上述至少一种技术问题,本发明提供一种光伏逆变器用的多功能支撑结构,包括第一电路板、第二电路板和支撑在第一电路板和第二电路板之间的支撑柱,第一电路板通过支撑柱电性连接第二电路板。In order to solve at least one of the above technical problems, the present invention provides a multifunctional support structure for a photovoltaic inverter, comprising a first circuit board, a second circuit board, and a support supported between the first circuit board and the second circuit board A column, the first circuit board is electrically connected to the second circuit board through the support column.
第一电路板上设置有焊接端子,支撑柱通过焊接端子固定。焊接端子为导电金属材料,且开设有用于连接支撑柱的第一内螺纹。焊接端子为T型。Soldering terminals are arranged on the first circuit board, and the support column is fixed by the soldering terminals. The welding terminal is made of conductive metal material, and is provided with a first inner thread for connecting the support column. Solder terminals are T-shaped.
第一电路板上设置有第一安装孔为焊接孔,第二电路板上设置有与第一安装孔配合的第二安装孔为锁附孔。焊接端子固定在焊接孔上。The first mounting hole provided on the first circuit board is a welding hole, and the second mounting hole provided on the second circuit board and matched with the first mounting hole is a locking hole. Solder terminals are fixed on the solder holes.
支撑柱为导电金属材料,其第一端开设有与第一内螺纹配合的第一外螺纹,第二端开设有与锁附孔配合的第二内螺纹。支撑柱一端固定在第一安装孔内,即锁附在焊接端子上,另一端固定在第二安装孔上,用以作为支撑结构支撑第二电路板。The support column is made of conductive metal material, the first end of the support column is provided with a first external thread matched with the first internal thread, and the second end is provided with a second internal thread matched with the locking hole. One end of the support column is fixed in the first installation hole, that is, locked on the welding terminal, and the other end is fixed in the second installation hole, and is used as a support structure to support the second circuit board.
支撑柱表面设有流线型凹槽或凸起,同时具有定向导风和散热性能。The surface of the support column is provided with streamlined grooves or protrusions, and has both directional air guide and heat dissipation properties.
与现有技术相比,本发明的优点在于:本发明中的支撑柱即具有支撑功能又具有导电功能,安装和固定方式固定,有助于降低成本,且支撑柱表面设有流线型凹槽或凸起,可以起到辅助散热作用,降低设备的温度的功能。Compared with the prior art, the advantages of the present invention are: the support column in the present invention has both a support function and a conductive function, the installation and fixing methods are fixed, which helps to reduce costs, and the surface of the support column is provided with streamlined grooves or The protrusions can play a role in assisting heat dissipation and reducing the temperature of the device.
附图说明Description of drawings
图1为本发明立体图;1 is a perspective view of the present invention;
图2为支撑柱立体结构示意图;Figure 2 is a schematic diagram of a three-dimensional structure of a support column;
图3为焊接端子立体结构示意图;3 is a schematic diagram of a three-dimensional structure of a welding terminal;
附图标记:1-第一电路板;2-第二电路板;3-支撑柱;4-焊接端子;5-第一内螺纹;6-第一安装孔;7-第二安装孔;8-第一外螺纹;9-第二内螺纹;10-有流线型凹槽。Reference numerals: 1-first circuit board; 2-second circuit board; 3-support column; 4-soldering terminal; 5-first internal thread; 6-first mounting hole; 7-second mounting hole; 8 -First external thread; 9-Second internal thread; 10-There is a streamlined groove.
具体实施方式Detailed ways
为了使本领域技术人员更好地理解本发明,从而对本发明要求保护的范围作出更清楚地限定,下面就本发明的某些具体实施例对本发明进行详细描述。需要说明的是,以下仅是本发明构思的某些具体实施方式仅是本发明的一部分实施例,其中对于相关结构的具体的直接的描述仅是为方便理解本发明,各具体特征并不当然、直接地限定本发明的实施范围。In order for those skilled in the art to better understand the present invention and thus to more clearly define the scope of protection of the present invention, the present invention will be described in detail below with respect to some specific embodiments of the present invention. It should be noted that the following are only some specific embodiments of the present invention, which are only a part of the embodiments of the present invention, and the specific and direct description of the relevant structures is only for the convenience of understanding the present invention, and each specific feature is not of course , directly limit the scope of implementation of the present invention.
参阅附图所示,本发明采用以下技术方案,一种光伏逆变器用的多功能支撑结构,包括第一电路板、第二电路板和支撑在第一电路板和第二电路板之间的支撑柱,第一电路板通过支撑柱电性连接第二电路板。Referring to the drawings, the present invention adopts the following technical solutions: a multifunctional support structure for photovoltaic inverters, comprising a first circuit board, a second circuit board, and a support structure supported between the first circuit board and the second circuit board A support column, the first circuit board is electrically connected to the second circuit board through the support column.
第一电路板上设置有焊接端子,支撑柱通过焊接端子固定。焊接端子为导电金属材料,且开设有用于连接支撑柱的第一内螺纹。焊接端子为T型。Soldering terminals are arranged on the first circuit board, and the support column is fixed by the soldering terminals. The welding terminal is made of conductive metal material, and is provided with a first inner thread for connecting the support column. Solder terminals are T-shaped.
第一电路板上设置有第一安装孔为焊接孔,第二电路板上设置有与第一安装孔配合的第二安装孔为锁附孔。焊接端子固定在焊接孔上。The first mounting hole provided on the first circuit board is a welding hole, and the second mounting hole provided on the second circuit board and matched with the first mounting hole is a locking hole. Solder terminals are fixed on the solder holes.
其中值得一提的是,焊接端子可以固定在第二电路板上,锁附孔可以开设在第一电路板上。It is worth mentioning that the soldering terminal can be fixed on the second circuit board, and the locking hole can be opened on the first circuit board.
支撑柱为导电金属材料,其第一端开设有与第一内螺纹配合的第一外螺纹,第二端开设有与锁附孔配合的第二内螺纹。支撑柱一端固定在第一安装孔内,即锁附在焊接端子上,另一端固定在第二安装孔上,用以作为支撑结构支撑第二电路板。The support column is made of conductive metal material, the first end of the support column is provided with a first external thread matched with the first internal thread, and the second end is provided with a second internal thread matched with the locking hole. One end of the support column is fixed in the first installation hole, that is, locked on the solder terminal, and the other end is fixed in the second installation hole, and is used as a support structure to support the second circuit board.
支撑柱表面设有流线型凹槽或凸起,同时具有定向导风和散热性能。The surface of the support column is provided with streamlined grooves or protrusions, and has both directional air guide and heat dissipation properties.
与现有技术相比,本发明的优点在于:本发明中的支撑柱即具有支撑功能又具有导电功能,安装和固定方式固定,有助于降低成本,且支撑柱表面设有流线型凹槽或凸起,可以起到辅助散热作用,降低设备的温度的功能。Compared with the prior art, the advantages of the present invention are: the support column in the present invention has both a support function and a conductive function, the installation and fixing methods are fixed, which helps to reduce costs, and the surface of the support column is provided with streamlined grooves or The protrusions can play a role in assisting heat dissipation and reducing the temperature of the device.
上述说明并非是对本发明的限制,本发明也并不仅限于上述举例,本技术领域的技术人员在本发明的实质范围内所做出的变化、改型、添加或替换,也应属于本发明的保护范围。The above description is not intended to limit the present invention, and the present invention is not limited to the above examples. Changes, modifications, additions or substitutions made by those skilled in the art within the scope of the present invention should also belong to the present invention. protected range.
Claims (9)
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011085474.2A CN112054698A (en) | 2020-10-12 | 2020-10-12 | Multifunctional supporting structure for photovoltaic inverter |
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| CN202011085474.2A CN112054698A (en) | 2020-10-12 | 2020-10-12 | Multifunctional supporting structure for photovoltaic inverter |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115066094A (en) * | 2022-06-14 | 2022-09-16 | 维沃移动通信有限公司 | Circuit board structure and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201973481U (en) * | 2010-12-02 | 2011-09-14 | 西安比特利光电应用有限公司 | Anti-explosion LED (light-emitting diode) flood light |
| CN205754195U (en) * | 2016-05-16 | 2016-11-30 | 苏州欧姆尼克新能源科技有限公司 | Inductive component attachment structure for photovoltaic DC-to-AC converter |
| CN212627715U (en) * | 2020-10-12 | 2021-02-26 | 锦浪科技股份有限公司 | Multifunctional supporting structure for photovoltaic inverter |
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2020
- 2020-10-12 CN CN202011085474.2A patent/CN112054698A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201973481U (en) * | 2010-12-02 | 2011-09-14 | 西安比特利光电应用有限公司 | Anti-explosion LED (light-emitting diode) flood light |
| CN205754195U (en) * | 2016-05-16 | 2016-11-30 | 苏州欧姆尼克新能源科技有限公司 | Inductive component attachment structure for photovoltaic DC-to-AC converter |
| CN212627715U (en) * | 2020-10-12 | 2021-02-26 | 锦浪科技股份有限公司 | Multifunctional supporting structure for photovoltaic inverter |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115066094A (en) * | 2022-06-14 | 2022-09-16 | 维沃移动通信有限公司 | Circuit board structure and electronic equipment |
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Application publication date: 20201208 |
