CN111900122A - Lift driving device and semiconductor device - Google Patents
Lift driving device and semiconductor device Download PDFInfo
- Publication number
- CN111900122A CN111900122A CN202010802064.9A CN202010802064A CN111900122A CN 111900122 A CN111900122 A CN 111900122A CN 202010802064 A CN202010802064 A CN 202010802064A CN 111900122 A CN111900122 A CN 111900122A
- Authority
- CN
- China
- Prior art keywords
- air
- cylinder
- pressure
- workbench
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 239000004973 liquid crystal related substance Substances 0.000 claims description 17
- 238000007599 discharging Methods 0.000 claims description 6
- 239000000428 dust Substances 0.000 abstract description 8
- 230000006870 function Effects 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 6
- 230000003749 cleanliness Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the invention provides a lifting driving device and a semiconductor device, wherein the lifting driving device comprises a lifting mechanism and a balance mechanism for keeping the levelness of a workbench within a preset range, the balance mechanism comprises a plurality of cylinders and a pressure control module, the cylinders are dispersedly arranged relative to the workbench, each cylinder is provided with a vertically arranged piston piece, and the upper end of each piston piece is used for supporting the workbench; the pressure control module is connected with each cylinder and used for controlling the gas pressure in each cylinder so as to enable each piston piece to apply the same supporting force to the workbench, and the pressure control module is used for exhausting the gas flowing out of the cylinders into the atmosphere when the gas pressure in any cylinder is larger than a pressure set value corresponding to the supporting force so as to keep the gas pressure in each cylinder at the pressure set value. The lifting driving device and the semiconductor equipment provided by the embodiment of the invention can ensure that the flatness of the workbench meets the requirement, and reduce the dust emission amount and the occupied space in a microenvironment.
Description
Technical Field
The invention relates to the technical field of liquid crystal display manufacturing, in particular to a lifting driving device and semiconductor equipment.
Background
In the production process of the liquid crystal display, ultraviolet curing is one of the more critical processes. In the process of performing the process, the liquid crystal panel is generally transported to the curing device by using a manipulator and placed on a workbench, the liquid crystal panel is generally fixed on the workbench in an adsorption manner, and the workbench is driven by a lifting driving device to move up and down so as to lift the liquid crystal panel, so that the liquid crystal panel can be supported by the workbench to be lifted up and down, and the liquid crystal panel is adjusted to a specified height position. In order to ensure the adsorption effect, the worktable is required to have higher flatness.
However, for a workbench with a large size and a large weight, the currently used lifting driving device easily causes the workbench to generate plastic deformation, so that the flatness of the workbench cannot meet the requirement, the lifting driving device has a large load and is easy to wear, the dust emission in a microenvironment is large, and pollution damage is caused to the clean environment. In addition, the lifting driving device used at present not only occupies a large space, but also causes great difficulty for equipment maintenance.
Disclosure of Invention
The embodiment of the invention aims to at least solve one of the technical problems in the prior art, and provides a lifting driving device and a semiconductor device, which not only can reduce the plastic deformation of a workbench and ensure that the flatness of the workbench meets the requirement, but also can reduce the self abrasion, thereby reducing the dust emission amount in a microenvironment and improving the environmental cleanliness, and in addition, the occupied space can be reduced, and convenience is provided for maintenance.
In order to achieve the above object, an embodiment of the present invention provides a lifting driving device, including a lifting mechanism for driving a worktable to perform lifting movement, and further including a balance mechanism for maintaining a levelness of the worktable within a preset range, the balance mechanism including a plurality of cylinders and a pressure control module, wherein,
the plurality of cylinders are arranged in a dispersed manner relative to the workbench, each cylinder is provided with a vertically arranged piston piece, and the upper end of each piston piece is used for supporting the workbench;
the pressure control module is connected with each cylinder and used for controlling the gas pressure in each cylinder so as to enable each piston member to apply the same supporting force to the workbench, and the pressure control module is used for exhausting the gas flowing out of the cylinders into the atmosphere when the gas pressure in any cylinder is larger than a pressure set value corresponding to the supporting force so as to keep the gas pressure in each cylinder at the pressure set value.
Optionally, the pressure control module includes an air source, a plurality of first air paths, and an overflow pressure reducing valve disposed on each of the air paths, wherein an input end of each of the first air paths is connected to the air source, and an output end of each of the first air paths is connected to each of the air cylinders in a one-to-one correspondence manner;
the overflow pressure reducing valve is used for controlling the gas pressure in the first gas path at the output end of the overflow pressure reducing valve and discharging the gas flowing out of the cylinder into the atmosphere; and the relief valve comprises a pressure fine-tuning unit which is used for adjusting the pressure set value.
Optionally, the relief valve comprises a digital relief valve.
Optionally, the pressure control module further includes a second air path corresponding to the first air path, and two ends of the second air path are respectively connected to two ends of the overflow pressure reducing valve; and each second air path is provided with a one-way valve, and the one-way valves are used for enabling the air in the second air paths to flow in one direction from the air cylinder to the air source.
Optionally, the pressure control module includes an air source, a plurality of first air paths, and a pressure reducing valve and an overflow valve disposed on each of the first air paths, wherein an input end of each of the first air paths is connected to the air source, and output ends of each of the air paths are connected to the cylinders in a one-to-one correspondence manner;
the pressure reducing valve is used for controlling the gas pressure in the first gas circuit at the output end of the pressure reducing valve;
the overflow valve is positioned between the pressure reducing valve and the cylinder and used for discharging gas flowing out of the cylinder into the atmospheric environment.
Optionally, the pressure control module further includes second air paths, the second air paths are arranged in one-to-one correspondence with the first air paths, and two ends of each second air path are respectively connected to two ends of the pressure reducing valve; and each second air path is provided with a one-way valve, and the one-way valves are used for enabling the air in the second air paths to flow in one direction from the air cylinder to the air source.
Optionally, the balance mechanism further includes a plurality of floating connectors, each floating connector is connected to the upper end of each piston member in a floating manner, and the piston member supports the workbench through the floating connector.
Optionally, the number of the lifting mechanisms is the same as that of the cylinders, and the supporting points of the plurality of piston members for supporting the workbench are close to the connecting positions of the lifting mechanisms and the workbench in a one-to-one correspondence manner.
Optionally, the lifting mechanism includes a screw driving assembly and a guiding assembly, wherein the screw driving assembly includes a vertically arranged screw and a motor for driving the screw to rotate, and a moving member matched with the screw is arranged on the screw and connected with the workbench; the guide assembly comprises a guide rail and a sliding block, the guide rail is vertically arranged, the sliding block can slide along the guide rail, and the sliding block is connected with the moving piece.
As another technical solution, an embodiment of the present invention further provides a semiconductor device, including a worktable for supporting a liquid crystal panel, and further including the above-mentioned lifting driving device provided in the embodiment of the present invention, for driving the worktable to perform lifting movement.
The embodiment of the invention has the following beneficial effects:
according to the lifting driving device provided by the embodiment of the invention, the levelness of the workbench is kept within the preset range by virtue of the balance mechanism, and in the balance mechanism, the workbench is dispersedly supported by virtue of the piston pieces of the multiple cylinders, so that the distribution uniformity of the supporting force can be improved, the plastic deformation of the workbench can be reduced, the flatness of the workbench can be ensured to meet the requirements, the abrasion of the lifting mechanism can be reduced, the dust emission amount in a microenvironment is reduced, and the environment cleanliness is improved. Moreover, the piston piece of each cylinder can apply the same supporting force to the workbench by controlling the gas pressure in each cylinder by the aid of the pressure control module, and if the gas pressure in any cylinder is greater than a pressure set value corresponding to the supporting force, the gas flowing out of the cylinder can be discharged into the atmospheric environment by the aid of the pressure control module so as to keep the gas pressure in each cylinder at the pressure set value, so that the pressure consistency of a plurality of cylinders can be ensured, and the gas flowing out of the cylinder can be discharged into the atmospheric environment by the aid of the pressure control module, so that gas storage equipment can be saved, the occupied space can be reduced, and convenience is brought to maintenance.
According to the semiconductor equipment provided by the embodiment of the invention, by adopting the lifting driving device provided by the embodiment of the invention, the plastic deformation of the workbench can be reduced, the flatness of the workbench can be ensured to meet the requirement, and the abrasion of the workbench can be reduced, so that the dust emission amount in a microenvironment is reduced, the environmental cleanliness is improved, the occupied space can be reduced, and the convenience is provided for maintenance.
Drawings
Fig. 1 is a structural view of a lift driving apparatus according to a first embodiment of the present invention;
fig. 2 is a structural view of a balance mechanism employed in the first embodiment of the present invention;
FIG. 3 is a gas circuit diagram of a pressure control module used in the first embodiment of the present invention;
fig. 4 is a gas path diagram of a pressure control module according to a second embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes in detail a lift driving device and a semiconductor apparatus provided in an embodiment of the present invention with reference to the accompanying drawings.
First embodiment
Referring to fig. 1, the lifting driving device provided in this embodiment includes a lifting mechanism 1, the lifting mechanism 1 is used for driving a workbench 2 to perform lifting motion, and the lifting mechanism 1 may have various specific structures, for example, includes a screw driving assembly 11 and a guiding assembly 12, wherein the screw driving assembly 11 includes a vertically arranged screw and a motor for driving the screw to rotate, and a moving member (for example, a nut) matched with the screw is disposed on the screw, the moving member is connected with the workbench 2, and when the motor drives the screw to rotate, the moving member drives the workbench 2 to perform lifting motion along an axial direction of the screw.
In the present embodiment, the lifting mechanisms 1 are four sets and are distributed at four corner positions near the rectangular table 2 to be able to uniformly apply the driving force to the table 2. Of course, in practical applications, the number and distribution of the lifting mechanisms 1 can be freely set according to the actual shape and size of the worktable 2.
Optionally, the lifting mechanism 1 is provided with a self-locking device, and the self-locking device is used for locking the workbench 2 at the current position when the lifting mechanism 1 is powered off or fails, so as to ensure the safety of the equipment.
The specific structure of the guide assembly 12 may be various, for example, the guide assembly includes a guide rail vertically arranged and a slider capable of sliding along the guide rail, and the slider is connected to the moving member of the lifting mechanism 1, so that the moving member can be lifted along the guide rail. In the present embodiment, the number of the guide assemblies 12 is four, and each set of the guide assemblies 12 is disposed on one side of each set of the lifting mechanism 1 in a one-to-one correspondence.
The above-mentioned working table 2 is applied to, for example, carrying and fixing the liquid crystal screen, and the working table 2 usually fixes the liquid crystal screen in an adsorption manner, as shown in fig. 1, a plurality of adsorption holes 21 are uniformly distributed on the table top of the working table 2 for adsorbing the liquid crystal screen. In order to ensure the absorption effect and avoid the relative displacement of the liquid crystal screen, the flatness of the worktable 2 is required to meet the requirements (for example, less than +/-0.1 mm).
However, only relying on the lifting mechanism 1 to synchronously drive the workbench 2 can not ensure that the flatness of the workbench 2 meets the requirements, particularly for the workbench with large size and weight, the workbench is easy to generate plastic deformation, so that the flatness of the workbench is poor, the lifting mechanism 1 has large load, is easy to wear, has large dust emission amount in a microenvironment, and causes pollution damage to a clean environment.
In order to solve the above problem, the lift driving device provided by the present embodiment further includes a balance mechanism 3 for maintaining the levelness of the table 2 within a preset range. The balance mechanism is used for assisting in supporting the workbench 2, increasing supporting points and sharing part of the gravity of the workbench 2 on the basis that the lifting mechanism 1 applies main driving force to the workbench 2, so that the plastic deformation of the workbench 2 can be reduced; simultaneously, can also reduce elevating system 1's load, guarantee above-mentioned elevating system 1 constant torque output to can reduce elevating system 1's wearing and tearing (for example lead screw wearing and tearing), thereby reduce the microenvironment and send the dust volume, improve the environment cleanliness factor.
In the present embodiment, as shown in fig. 2 and 3, the balancing mechanism 3 includes a plurality of cylinders 31 and a pressure control module 4, wherein the plurality of cylinders 31 are arranged separately with respect to the table 2, and each cylinder 31 has a vertically arranged piston member 32, an upper end of which piston member 32 is used to support the table 2. In the present embodiment, as shown in fig. 1, the number of the cylinders 31 is four, and the number of the cylinders is the same as that of the lifting mechanisms 1, and the supporting points of the four piston members 32 for supporting the table 2 are close to the connecting positions of the lifting mechanisms 1 and the table 2, so that the auxiliary supporting function of the four piston members 32 can be applied to the four lifting mechanisms 1 in a one-to-one correspondence. Alternatively, the support point of the piston member 32 for supporting the table 2 is located close to the inner side of the guide assembly 12.
In the present embodiment, as shown in fig. 2, the balance mechanism 3 further includes a plurality of floating connection members 33, each floating connection member 33 being in floating connection with the upper end of each piston member 32 in a one-to-one correspondence, the piston members 32 supporting the table 2 via the floating connection members 33. By means of the floating connection 33, it is possible to allow a certain amount of tilting of the table 2 or a certain amount of eccentricity of the piston member 32, for example 2mm, so that it is ensured that the cylinder 31 and the piston member 32 will still function properly in the presence of the above-mentioned amount of tilting or eccentricity and bending or wear of the piston member 32 is avoided. The floating connector 33 is, for example, a floating connector or any other floating connector.
In the present embodiment, the pressure control module 4 is used for controlling the gas pressure in each cylinder 31 to ensure the pressure consistency of the plurality of cylinders 31, and specifically, the pressure control module 4 is connected to each cylinder 31 and is used for controlling the gas pressure in each cylinder 31 so that each piston member 32 can apply the same supporting force to the table 2, and the pressure control module 4 is used for exhausting the gas flowing out from the cylinder 31 to the atmosphere when the gas pressure in any cylinder 31 is greater than the pressure set value corresponding to the supporting force so as to maintain the gas pressure in each cylinder 31 at the pressure set value. That is, with the pressure control module 4 described above, the gas pressures in the plurality of cylinders 31 can be maintained at the same pressure setting value, thereby enabling the plurality of piston members 32 to apply the same supporting force to the table 2; meanwhile, during the lowering of the table 2, there may be a case where the gas pressure in the cylinder 31 is increased by discharging the gas flowing out from the cylinder 31 into the atmosphere, so that the gas pressure in the cylinder 31 is again equal to the above-mentioned pressure set value. Thereby, the pressure uniformity of the plurality of cylinders 31 can be ensured. Moreover, because pressure control module 4 can be with the gaseous atmospheric environment of emitting of cylinder in, this can save gas storage equipment (be used for the gaseous of buffer memory cylinder outflow) to occupation space can be reduced, it provides convenience to overhaul.
Specifically, as shown in fig. 3, the pressure control module 4 includes a gas source 46, a plurality of first gas paths 41, and a relief valve 42 provided on each first gas path 41, wherein the gas source 46 includes a gas supply device 461, a main path connected to the gas supply device 461, and a main path pressure maintaining valve 462 and a main path on-off valve 463 provided on the main path; the input end of each first air path 41 is connected to the air supply 46 (i.e., the output end of the main path), and the output end of each first air path 41 is connected to each cylinder 31 in a one-to-one correspondence. The gas supplied from the gas source 46 may be input into the cylinder 31 via each of the first gas paths 41, or the gas in the cylinder 31 may be returned via the first gas path 41.
The relief valve 42 is used to control the gas pressure in the first gas passage 41 at the output end of the relief valve 42, corresponding to the gas pressure in the control cylinder 31, so as to be stabilized at the above-mentioned pressure set value; meanwhile, the relief valve 42 has a relief function of discharging the gas flowing out of the cylinder 31 into the atmosphere when the gas pressure in the cylinder 31 is higher than a pressure set value corresponding to the supporting force. That is, when the gas in the first air passage 41 flows from the gas source 46 to the cylinder 31, the relief valve 42 functions to stabilize the pressure; conversely, when the gas in the first gas passage 41 flows in the direction from the cylinder 31 to the gas source 46, the relief valve 42 functions as an overflow. With such a characteristic of the relief valve 42 as described above, it is possible to ensure that the pressure output from the cylinder 31 during the raising and lowering of the table 2 is constant, so that a stable supporting force can be applied to the table 2. Further, the relief valve 42 may further include a pressure trimming unit for adjusting the magnitude of the pressure set value. By fine-adjusting the pressure set value of each relief valve 42 in this way, the pressure uniformity of the plurality of cylinders 31 can be further improved.
When the table 2 is in a rest state, the gas source 46 is turned on to supply gas into the gas cylinder 31 until the gas pressure in the gas cylinder 31 is stabilized at a pressure set value, at which time the piston member 32 applies a vertically upward, constant supporting force to the table 2, which is smaller than the gravity of the table 2.
When the worktable 2 is in the ascending state, the air source 46 continuously supplies air, the air pressure in the air cylinders 31 is still stabilized at the pressure set value, and the piston rods 32 of the air cylinders 31 can synchronously extend along with the ascending of the worktable 2 and always keep applying constant supporting force to the worktable 2 because the supporting force is smaller than the gravity of the worktable 2.
When the work table 2 is in the descending state, the air supply 46 continues to supply air, the piston rods 32 of the plurality of air cylinders 31 retract, the instantaneous air pressure in the air cylinders 31 tends to rise and is greater than the pressure set value, and the air in the air cylinders 31 overflows and overflows to the atmosphere through the bypass inside the overflow relief valve 42 until the air pressure in the air cylinders 31 is equal to the pressure set value again. Compared with the gas buffered by the gas storage device, the overflow pressure reducing valve 42 can stabilize the gas pressure in the cylinder 31 at a pressure set value all the time, has higher reliability, can avoid the generation of heat energy due to the rise of the pressure in the gas storage device, and can avoid the generation of adverse effects on a temperature field in the device, and can reduce the occupied space and provide convenience for maintenance.
The type of relief valve 42 may be varied, including, for example, a digital relief valve. The digital overflow reducing valve has high precision and strong pressure stabilizing capacity. Optionally, the digital relief valve includes a display for displaying a pressure set point of the relief valve 42, and the displayed pressure set point includes three decimal places, for example, 0.489 MPa.
In this embodiment, as shown in fig. 3, the pressure control module 4 further includes a second air path 44 corresponding to the first air path 41, and two ends of the second air path 44 are respectively connected to two ends of the relief valve 42; each of the second gas passages 44 is provided with a check valve 45, and the check valve 45 is configured to allow the gas in the second gas passage 44 to flow in one direction from the cylinder 41 to the gas source 46. Thus, when the relief valve 42 is out of order, the gas overflowed from the cylinder 31 can be returned to the gas source 46 via the second gas path 44, so that the safety of the apparatus can be improved.
In the present embodiment, each first air passage 41 is further provided with an on-off valve 43 for turning on or off the first air passage 41 in which the on-off valve 43 is located. The on-off valve 43 is, for example, a normally open solenoid valve. By means of the on-off valve 43, independent commissioning and servicing of the individual cylinders 31 can be achieved.
Second embodiment
As shown in fig. 4, the present embodiment provides a lifting driving device, which is different from the first embodiment only in that: in the pressure control module 4', the relief valve 421 and the relief valve 422 are used instead of the relief valve 42 in the first embodiment described above.
Specifically, the pressure reducing valve 421 is provided on the first gas passage 41, and is configured to control the gas pressure in the first gas passage 41 at the output end of the pressure reducing valve 421, which corresponds to the gas pressure in the control cylinder 31, so as to be stabilized at the above-mentioned pressure set value; the relief valve 422 is located between the pressure reducing valve 421 and the cylinder 31, and discharges the gas flowing out of the cylinder 31 into the atmosphere. When the gas in the first air passage 41 flows from the gas source 46 to the cylinder 31, the pressure reducing valve 421 plays a role of pressure stabilization; conversely, when the gas in the first gas passage 41 flows in the direction from the cylinder 31 to the gas source 46, the relief valve 422 functions as a relief. This also ensures that the pressure output by the air cylinder 31 is constant during the lifting of the table 2, so that a stable supporting force can be applied to the table 2.
Similar to the first embodiment, in this embodiment, the pressure control module further includes second air paths 44, the second air paths 44 are disposed in one-to-one correspondence with the first air paths 41, and two ends of each second air path 44 are respectively connected to two ends of the pressure reducing valve 421; each of the second gas passages 44 is provided with a check valve 45, and the check valve 45 is configured to allow the gas in the second gas passage 44 to flow in one direction from the cylinder 41 to the gas source 46.
Other structures and functions of the lifting driving device provided in this embodiment are the same as those of the first embodiment, and are not described herein again because they have been described in detail in the first embodiment.
As another technical solution, an embodiment of the present invention further provides a semiconductor apparatus, for example, a liquid crystal panel manufacturing apparatus, which includes a table for supporting a liquid crystal panel, and a lifting driving device provided in each of the above embodiments of the present invention for driving the table to move up and down. The liquid crystal panel manufacturing apparatus may be any apparatus used in the respective processes of manufacturing a liquid crystal panel, such as a curing apparatus.
According to the semiconductor equipment provided by the embodiment of the invention, by adopting the lifting driving device provided by each embodiment of the invention, the plastic deformation of the workbench can be reduced, the flatness of the workbench can be ensured to meet the requirement, the abrasion of the workbench can be reduced, the dust emission amount in a microenvironment is reduced, the environment cleanliness is improved, the occupied space can be reduced, and the convenience is provided for maintenance.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A lifting driving device comprises a lifting mechanism for driving a workbench to do lifting movement, and is characterized by further comprising a balance mechanism for keeping the levelness of the workbench within a preset range, wherein the balance mechanism comprises a plurality of air cylinders and a pressure control module,
the plurality of cylinders are arranged in a dispersed manner relative to the workbench, each cylinder is provided with a vertically arranged piston piece, and the upper end of each piston piece is used for supporting the workbench;
the pressure control module is connected with each cylinder and used for controlling the gas pressure in each cylinder so as to enable each piston member to apply the same supporting force to the workbench, and the pressure control module is used for exhausting the gas flowing out of the cylinders into the atmosphere when the gas pressure in any cylinder is larger than a pressure set value corresponding to the supporting force so as to keep the gas pressure in each cylinder at the pressure set value.
2. The lifting driving device according to claim 1, wherein the pressure control module comprises an air source, a plurality of first air paths, and an overflow pressure reducing valve disposed on each air path, wherein an input end of each first air path is connected to the air source, and an output end of each first air path is connected to each air cylinder in a one-to-one correspondence manner;
the overflow pressure reducing valve is used for controlling the gas pressure in the first gas path at the output end of the overflow pressure reducing valve and discharging the gas flowing out of the cylinder into the atmosphere; and the relief valve comprises a pressure fine-tuning unit which is used for adjusting the pressure set value.
3. The lift drive of claim 2, wherein the relief valve comprises a digital relief valve.
4. The lifting driving device according to claim 2, wherein the pressure control module further comprises a second air path corresponding to the first air path, and two ends of the second air path are respectively connected to two ends of the relief valve; and each second air path is provided with a one-way valve, and the one-way valves are used for enabling the air in the second air paths to flow in one direction from the air cylinder to the air source.
5. The lifting driving device according to claim 1, wherein the pressure control module comprises an air source, a plurality of first air paths, and a pressure reducing valve and an overflow valve which are arranged on each first air path, wherein an input end of each first air path is connected with the air source, and an output end of each air path is connected with each air cylinder in a one-to-one correspondence manner;
the pressure reducing valve is used for controlling the gas pressure in the first gas circuit at the output end of the pressure reducing valve;
the overflow valve is positioned between the pressure reducing valve and the cylinder and used for discharging gas flowing out of the cylinder into the atmospheric environment.
6. The lifting driving device according to claim 5, wherein the pressure control module further comprises second air paths, the second air paths are arranged in one-to-one correspondence with the first air paths, and two ends of each second air path are respectively connected with two ends of the pressure reducing valve; and each second air path is provided with a one-way valve, and the one-way valves are used for enabling the air in the second air paths to flow in one direction from the air cylinder to the air source.
7. The lift drive of any one of claims 1 to 6, wherein said counterbalance mechanism further comprises a plurality of floating connectors, each of said floating connectors being in floating connection with an upper end of each of said piston members in a one-to-one correspondence, said piston members supporting said table via said floating connectors.
8. The lift drive of any one of claims 1 to 6, wherein the number of lift mechanisms is the same as the number of cylinders, and the support points at which the plurality of piston members support the table are located in one-to-one correspondence with the positions at which the respective lift mechanisms are connected to the table.
9. The lifting driving device according to any one of claims 1-6, wherein the lifting mechanism comprises a lead screw driving assembly and a guiding assembly, wherein the lead screw driving assembly comprises a vertically arranged lead screw and a motor for driving the lead screw to rotate, and a moving member matched with the lead screw is arranged on the lead screw and is connected with the workbench; the guide assembly comprises a guide rail and a sliding block, the guide rail is vertically arranged, the sliding block can slide along the guide rail, and the sliding block is connected with the moving piece.
10. A semiconductor device comprising a table for supporting a liquid crystal panel, characterized by further comprising the elevation driving apparatus of any one of claims 1 to 9 for driving the table to perform an elevation movement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010802064.9A CN111900122B (en) | 2020-08-11 | 2020-08-11 | Lifting driving device and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010802064.9A CN111900122B (en) | 2020-08-11 | 2020-08-11 | Lifting driving device and semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111900122A true CN111900122A (en) | 2020-11-06 |
| CN111900122B CN111900122B (en) | 2024-06-28 |
Family
ID=73228812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010802064.9A Active CN111900122B (en) | 2020-08-11 | 2020-08-11 | Lifting driving device and semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111900122B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102050395A (en) * | 2009-10-27 | 2011-05-11 | 堵智斌 | Pneumatic workpiece lifting device |
| CN102262017A (en) * | 2011-04-28 | 2011-11-30 | 江苏正信新能源科技集团有限公司 | Device for pneumatically and rapidly testing compressive property of battery component |
| CN203582398U (en) * | 2013-11-26 | 2014-05-07 | 佛山市科达石材机械有限公司 | Lifting balance system |
| JP2014225282A (en) * | 2014-07-23 | 2014-12-04 | 株式会社ニコン | Pressure valve, compression device, overlapping device, compression method and overlapping method |
| CN104891339A (en) * | 2015-05-07 | 2015-09-09 | 南京工业职业技术学院 | Adaptive pressure balance control system based on microcontroller |
| KR102095931B1 (en) * | 2019-08-29 | 2020-04-01 | (주) 대하 | Multi-position lifting device controlled by synchronize operation control program |
-
2020
- 2020-08-11 CN CN202010802064.9A patent/CN111900122B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102050395A (en) * | 2009-10-27 | 2011-05-11 | 堵智斌 | Pneumatic workpiece lifting device |
| CN102262017A (en) * | 2011-04-28 | 2011-11-30 | 江苏正信新能源科技集团有限公司 | Device for pneumatically and rapidly testing compressive property of battery component |
| CN203582398U (en) * | 2013-11-26 | 2014-05-07 | 佛山市科达石材机械有限公司 | Lifting balance system |
| JP2014225282A (en) * | 2014-07-23 | 2014-12-04 | 株式会社ニコン | Pressure valve, compression device, overlapping device, compression method and overlapping method |
| CN104891339A (en) * | 2015-05-07 | 2015-09-09 | 南京工业职业技术学院 | Adaptive pressure balance control system based on microcontroller |
| KR102095931B1 (en) * | 2019-08-29 | 2020-04-01 | (주) 대하 | Multi-position lifting device controlled by synchronize operation control program |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111900122B (en) | 2024-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6564642B2 (en) | Substrate transfer chamber, substrate processing system, and gas replacement method in substrate transfer chamber | |
| JP4303237B2 (en) | Panel supply device for flat panel display panel inspection equipment | |
| KR100832926B1 (en) | Lifter and transfer | |
| CN107963571A (en) | A kind of scissor lifting device of electromagnetism-screw coordinated drive | |
| CN111900122A (en) | Lift driving device and semiconductor device | |
| US10603843B2 (en) | Curved display bonding apparatus | |
| CN108701635B (en) | Substrate floating and conveying device | |
| KR101613119B1 (en) | Stocker apparatus | |
| CN101528571A (en) | Pallet conveyance device and substrate inspection device | |
| KR101930456B1 (en) | System for processing substrate | |
| CN108750677A (en) | A kind of adsorbent equipment and conveyer system of large size thin slice | |
| KR100358707B1 (en) | Panel Sending Apparatus of Liquid Crystal Display Inspection System | |
| JP2018162139A (en) | Cargo handling device | |
| CN209797357U (en) | Cylinder buffering load lifting mechanism | |
| KR200297464Y1 (en) | Motor lifte Machine | |
| CN111897149B (en) | Ultraviolet curing equipment | |
| KR101362455B1 (en) | Apparatus driving lift pins and device having it for manufacturing FPD | |
| CN214352095U (en) | Tool for disassembling and assembling power module of wind generating set | |
| KR20210034824A (en) | Transfer cart for pallet truck type | |
| CN217780584U (en) | Triaxial gantry with pneumatic balance function | |
| CN109309036A (en) | Base plate transfer device | |
| CN214924216U (en) | Air-float displacement platform | |
| CN105242414A (en) | Plane base platform and substrate defect repairing machine | |
| CN107298404A (en) | A kind of portable vehicle double-layer lifting device | |
| CN215993103U (en) | Telescopic electric lifting table frame with wire hiding function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |