CN111896362A - Photosensitive resin model rotating and freezing method - Google Patents
Photosensitive resin model rotating and freezing method Download PDFInfo
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- 239000011347 resin Substances 0.000 title claims abstract description 87
- 229920005989 resin Polymers 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 54
- 238000007710 freezing Methods 0.000 title claims abstract description 34
- 230000008014 freezing Effects 0.000 title claims abstract description 34
- 238000004321 preservation Methods 0.000 claims abstract description 59
- 238000001816 cooling Methods 0.000 claims abstract description 36
- 230000000630 rising effect Effects 0.000 claims abstract description 5
- 230000002596 correlated effect Effects 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000004458 analytical method Methods 0.000 abstract description 7
- 238000010792 warming Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0001—Type of application of the stress
- G01N2203/0005—Repeated or cyclic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
- G01N2203/0017—Tensile
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
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- G01N2203/0019—Compressive
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0021—Torsional
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0023—Bending
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0069—Fatigue, creep, strain-stress relations or elastic constants
- G01N2203/0075—Strain-stress relations or elastic constants
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0222—Temperature
- G01N2203/0226—High temperature; Heating means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0222—Temperature
- G01N2203/0228—Low temperature; Cooling means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/067—Parameter measured for estimating the property
- G01N2203/0676—Force, weight, load, energy, speed or acceleration
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Abstract
The present disclosure provides a photosensitive resin model spin freezing method, including: in the temperature rising stage, the photosensitive resin model is heated to 48-52 ℃ from room temperature, and then the temperature is raised to 58-62 ℃ at the speed of 2-5 ℃/h; in the heat preservation stage, the photosensitive resin model is preserved for 0.5 to 1 hour at the temperature of between 58 and 62 ℃; in the cooling stage, the photosensitive resin model is cooled to 48-52 ℃ at the speed of 1-2 ℃/h; and in the heat preservation stage and the temperature reduction stage, applying a rotating load with the rotating speed of 1000-2500r/min to the photosensitive resin model. According to the method, the photosensitive resin model in the heat preservation stage and the temperature reduction stage is placed in the rotating state, the working state of a prototype is fully simulated, so that the stress of the photosensitive resin model in the rotating state is frozen, and a stress analysis result which is closer to the actual stress is obtained. In addition, the stress stripes obtained by the method are clear, and the stress stripe level value is large and suitable for interpretation.
Description
Technical Field
The disclosure relates to the technical field of model freezing, in particular to a rotary freezing method for a photosensitive resin model.
Background
The photoelastic test object is a photoelastic model, and the laser rapid forming technology has the characteristics of rapid forming, low manufacturing cost, short period, environmental protection and the like, and is widely applied. The photoelastic stress freezing method is a method for performing photoelastic tests, and is characterized in that when a photoelastic model is heated to a freezing temperature, a load is applied, and the photoelastic model is unloaded after being slowly cooled to room temperature.
At present, the photoelastic test mainly focuses on the application of loads such as pulling, pressing, bending, twisting and the like. However, the original model of the whole turbine disc of the aircraft engine is in a high-speed rotation working state, and the freezing process of the whole turbine disc of the existing aircraft engine is easy to cause faults such as the flying of the tenon of the turbine disc from the mortise, the rupture of the turbine disc and the like. Therefore, it is necessary to perform the photoelastic test in a rotating state.
The above information disclosed in the background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute prior art that is known to a person of ordinary skill in the art.
Disclosure of Invention
The purpose of the present disclosure is to provide a method for freezing a photosensitive resin model by rotation, so as to fully simulate the working state of a prototype, so that the stress of the photosensitive resin model in the rotation state is frozen, and a stress analysis result closer to the actual stress is obtained.
In order to achieve the purpose, the technical scheme adopted by the disclosure is as follows:
according to a first aspect of the present disclosure, there is provided a photosensitive resin mold spin freezing method, including:
in the temperature rising stage, the photosensitive resin model is heated to 48-52 ℃ from room temperature, and then is heated to 58-62 ℃ at the speed of 2-5 ℃/h;
a heat preservation stage, namely preserving the heat of the photosensitive resin model at 58-62 ℃ for 0.5-1 h;
in the cooling stage, the photosensitive resin model is cooled to 48-52 ℃ at the speed of 1-2 ℃/h;
and in the heat preservation stage and the temperature reduction stage, applying a rotating load with the rotating speed of 1000-2500r/min to the photosensitive resin model.
In an exemplary embodiment of the disclosure, the holding temperature of the holding phase is inversely related to the rotational speed of the rotational load.
In an exemplary embodiment of the disclosure, the cooling rate of the cooling phase is positively correlated to the rotational speed of the rotating load.
In the exemplary embodiment of the disclosure, when the rotating speed of the rotating load is 1000r/min, the heat preservation temperature of the heat preservation stage is 62 ℃; when the rotating speed of the rotating load is 2500r/min, the heat preservation temperature of the heat preservation stage is 58 ℃.
In an exemplary embodiment of the present disclosure, the method further includes:
and a pretreatment stage, wherein the photosensitive resin model is installed to a model loading device.
In an exemplary embodiment of the present disclosure, the method further includes:
and in the post-treatment stage, after the temperature reduction stage is finished, naturally cooling to room temperature, then taking out the photosensitive resin model from the model loading device, and carrying out cutting and stress fringe interpretation on the photosensitive resin model.
In an exemplary embodiment of the present disclosure, the mold loading device includes a rotational loading module for providing a rotational load to the photosensitive resin mold, which is mounted to the rotational loading module of the mold loading device.
In an exemplary embodiment of the present disclosure, the model loading device further includes a temperature control module, a temperature control program is disposed in the temperature control module, and the temperature control program includes the temperature rising stage, the temperature maintaining stage, and the temperature lowering stage.
In an exemplary embodiment of the present disclosure, the photosensitive resin mold is a turbine disk.
In an exemplary embodiment of the disclosure, the length of the heat preservation time in the heat preservation stage is selected according to the volume of the photosensitive resin model, and the length of the heat preservation time in the heat preservation stage is positively correlated with the volume of the photosensitive resin model;
and selecting the size of the cooling rate in the cooling stage according to the volume size of the photosensitive resin model, wherein the size of the cooling rate in the cooling stage is in negative correlation with the volume size of the photosensitive resin model.
According to the rotary freezing method, the photosensitive resin models in the heat preservation stage and the temperature reduction stage are placed in the rotary state, the working state of a prototype is fully simulated, the stress of the photosensitive resin models in the rotary state is frozen, and a stress analysis result which is closer to the actual stress is obtained. According to the rotary freezing method, the duration of the heating-up stage, the heat-preservation stage and the cooling-down stage is short, the temperature of the heat-preservation stage is low, the method is low in test difficulty and short in test period, test efficiency can be improved to a certain extent, and economic cost is reduced. In addition, the stress stripes obtained by the method are clear, and the stress stripe level value is large and suitable for interpretation.
Drawings
The above and other features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
FIG. 1 is a graph of temperature control curves in an embodiment of the present disclosure.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the embodiments of the disclosure can be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the primary technical ideas of the disclosure.
The terms "a", "an", "the" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc. The terms "first" and "second", etc. are used merely as labels, and are not limiting on the number of their objects.
In the related technology, in the freezing process of the photosensitive resin model, the load applied to the photosensitive resin model is pulling, pressing, bending and twisting, and the influence of rotation on the photosensitive resin model is not fully considered when the load is applied, so that the stress distribution analysis result of the photoelastic test is not accurate enough, and the working state of a prototype cannot be fully simulated.
The present disclosure provides a photosensitive resin mold spin freezing method, including: in the temperature rising stage, the photosensitive resin model is heated to 50 ℃ from room temperature, and then the temperature is raised to 58-62 ℃ at the speed of 2-5 ℃/h; in the heat preservation stage, the photosensitive resin model is preserved for 0.5-1h at the temperature of 58-62 ℃; in the cooling stage, the photosensitive resin model is cooled to 50 ℃ at the speed of 1-2 ℃/h; in the heat preservation stage and the temperature reduction stage, a rotating load with the rotating speed of 1000-.
According to the rotary freezing method, the photosensitive resin models in the heat preservation stage and the temperature reduction stage are placed in the rotary state, the working state of a prototype is fully simulated, the stress of the photosensitive resin models in the rotary state is frozen, and a stress analysis result which is closer to the actual stress is obtained. According to the rotary freezing method, the duration of the heating-up stage, the heat-preservation stage and the cooling-down stage is short, the temperature of the heat-preservation stage is low, the method is low in test difficulty and short in test period, test efficiency can be improved to a certain extent, and economic cost is reduced. In addition, the stress stripes obtained by the method are clear, and the stress stripe level value is large and suitable for interpretation.
The photoelastic test is a test stress analysis method for measuring the stress state of each point on a stress model by an optical method. The present disclosure provides a method for rotating and freezing a photosensitive resin mold, which can more accurately analyze stress distribution of a member in a rotating state, such as a turbine disk. It should be noted that the method provided by the present disclosure is not only applicable to the turbine disk, but also applicable to other components in a rotating state during normal operation.
In exemplary embodiments of the present disclosure, the warming phase includes a first warming phase and a second warming phase, wherein the first warming phase is warming from room temperature to 48-52 ℃ and the second warming phase is warming to 58-62 ℃ at a rate of 2-5 ℃/h. In the first temperature raising stage, the temperature is raised from room temperature to 48-52 ℃, and the final temperature raising temperature may be 48 ℃, 49 ℃, 50 ℃, 51 ℃ or 52 ℃, but is not limited thereto. In the second temperature raising stage, the temperature is raised to 58-62 ℃ at a rate of 2-5 ℃/h, the temperature raising rate can be 2 ℃/h, 2.5 ℃/h, 3 ℃/h, 3.5 ℃/h, 4 ℃/h, 4.5 ℃/h or 5 ℃/h, and the final temperature raising temperature can be 58 ℃, 59 ℃, 60 ℃, 61 ℃ or 62 ℃, but is not limited thereto.
In the disclosed exemplary embodiment, the heat preservation stage is that the heat preservation is carried out for 0.5-1h at the temperature of 58-62 ℃. The temperature maintained in the heat-preserving stage may be 58 ℃, 59 ℃, 60 ℃, 61 ℃ or 62 ℃, but is not limited thereto, and the heat-preserving duration may be 0.5h, 0.6h, 0.7h, 0.8h, 0.9h, 0.95h or 1h, but is not limited thereto. In the step, a proper heat preservation time can be selected according to the size of the photosensitive resin model, specifically, the heat preservation time is selected according to the volume size of the photosensitive resin model, the heat preservation time in the heat preservation stage is positively correlated with the volume size of the photosensitive resin model, and the heat preservation time is longer for the photosensitive resin model with a larger volume.
In an exemplary embodiment of the disclosure, the temperature reduction stage reduces the temperature to 48-52 ℃ at a rate of 1-2 ℃/h. Wherein, the cooling rate of the cooling stage can be 1 ℃/h, 1.1 ℃/h, 1.2 ℃/h, 1.3 ℃/h, 1.4 ℃/h, 1.5 ℃/h, 1.6 ℃/h, 1.7 ℃/h, 1.8 ℃/h, 1.9 ℃/h and 2 ℃/h, but is not limited thereto, and the final temperature after cooling can be 48 ℃, 49 ℃, 50 ℃, 51 ℃, 51.5 ℃ or 52 ℃, but is not limited thereto. In the step, a proper cooling rate is selected according to the size of the photosensitive resin model, specifically, the size of the cooling rate in the cooling stage is in negative correlation with the size of the photosensitive resin model, and the larger the size of the photosensitive resin model is, the smaller the cooling rate is, so as to ensure that the stress distribution state can be really frozen in the model.
In the exemplary embodiment of the disclosure, in the heat preservation stage and the temperature reduction stage, a rotational load with a rotational speed of 1000-. Wherein, the rotating speed can be 1000r/min, 1100r/min, 1200r/min, 1300r/min, 1400r/min, 1500r/min, 1600r/min, 1700r/min, 1800r/min, 1900r/min, 2000r/min, 2100r/min, 2200r/min, 2300r/min, 2400r/min or 2500r/min, but is not limited to the above. In this step, different rotation speeds are selected according to the size of the radius of the photosensitive resin mold and the experimental specifications.
In a preferred embodiment of the present disclosure, the present disclosure provides a photosensitive resin mold spin freezing method, including: in the temperature rise stage, the temperature is raised from room temperature to 50 ℃ within 1h, and then is raised to 58-60 ℃ at the speed of 2-5 ℃/h; in the heat preservation stage, preserving heat for 0.5-1h at the temperature of 58-60 ℃; a temperature reduction stage, wherein the temperature is reduced to 50 ℃ at the speed of 1-2 ℃/h; in the heat preservation stage and the temperature reduction stage, a rotating load with the rotating speed of 1200-.
In a specific embodiment of the present disclosure, the present disclosure provides a photosensitive resin mold spin freezing method, including: a temperature rise stage, namely firstly raising the temperature from room temperature to 50 ℃ within 1h, and then raising the temperature to 60 ℃ at the speed of 5 ℃/h; a heat preservation stage, wherein the temperature is preserved for 1h at 60 ℃; a temperature reduction stage, wherein the temperature is reduced to 50 ℃ at the speed of 2 ℃/h; and in the heat preservation stage and the cooling stage, applying a rotating load with the rotating speed of 1500r/min to the photosensitive resin model.
In an exemplary embodiment of the disclosure, the holding temperature in the holding phase is inversely related to the rotation speed of the rotating load, i.e. the higher the rotation speed of the rotating load, the lower the holding temperature in the holding phase. For example, when the rotating speed of the rotating load is 1000r/min, the heat preservation temperature in the heat preservation stage is 62 ℃; when the rotating speed of the rotating load is 2500r/min, the heat preservation temperature in the heat preservation stage is 58 ℃.
In the method, when the rotating speed is high, the rotating load is large, the optical sensitivity of the material corresponding to the low heat preservation temperature is low, and the stress stripes in the photosensitive resin model are not too dense due to the low optical sensitivity of the material, so that the subsequent interpretation is facilitated. Meanwhile, as the heat preservation temperature is low, the deformation of the model under the same load is reduced, and the vibration caused by overlarge deformation is avoided. And when the rotating speed is low, the rotating load is small, the optical sensitivity of the material corresponding to the high heat preservation temperature is high, and stress stripes in the photosensitive resin model are not too sparse because of the high optical sensitivity of the material, so that the subsequent interpretation is facilitated.
In an exemplary embodiment of the present disclosure, the cooling rate of the cooling phase is positively correlated to the rotational speed of the rotating load. That is, the higher the rotational speed of the rotational load, the greater the cooling rate in the cooling phase.
In the method, when the rotating speed is high, the rotating load is large, the number of the stripes generated by the photosensitive resin model is relatively large, and the additional stress generated by fast cooling can be accepted, so that the test process is accelerated by properly increasing the cooling rate. At low rotation speed, the rotating load is small, the photosensitive resin model generates relatively few stripes, and the additional stress generated by fast cooling cannot be accepted, so that a lower cooling rate is preferably adopted.
In an exemplary embodiment of the present disclosure, the photosensitive resin mold spin freezing method further includes: and in the pretreatment stage, mounting the photosensitive resin model to a model loading device. Then, the subsequent temperature rise operation is performed. The model loading device comprises a rotary loading module and a temperature control module, wherein the rotary loading module is used for providing rotary load for the photosensitive resin model, and the photosensitive resin model is installed on the rotary loading module of the model loading device. The temperature control module is internally provided with a temperature control program, and the temperature control program comprises the temperature rise stage, the heat preservation stage and the temperature reduction stage.
In an exemplary embodiment of the present disclosure, the photosensitive resin mold spin freezing method further includes: and in the post-treatment stage, after the temperature reduction stage is finished, naturally cooling to room temperature, then taking the photosensitive resin model out of the model loading device, and cutting and interpreting the stress stripes of the photosensitive resin model. In this step, in order to reduce the influence of the edge effect on the test accuracy, it is desirable to immediately take out the model and start cutting and streak interpretation, and the generation of processing stress when cutting the model should be avoided.
The technical effects of the present disclosure will be further illustrated by examples and comparative examples.
Examples
As shown in fig. 1, in this embodiment, taking the photoelastic rotation test of the integral turbine disk as an example, the photosensitive resin mold rotation freezing method includes:
(1) according to the prototype: machining the integral turbine disc in a mode of 1: 1;
(2) in the pretreatment stage, the integral turbine disk is arranged on a rotary loading module of the model loading device;
(3) closing the door of the model loading device, and starting a temperature control program set in the temperature control module, wherein the temperature control program is as follows:
a temperature rise stage, namely firstly raising the temperature from room temperature to 50 ℃ within 1h, and then raising the temperature to 60 ℃ at the speed of 5 ℃/h;
in the heat preservation stage, the whole turbine disc model is subjected to heat preservation for 1h at the temperature of 60 ℃;
a temperature reduction stage, wherein the temperature is reduced to 50 ℃ at the speed of 2 ℃/h;
when the temperature rises to 60 ℃ and enters a heat preservation stage, the motor is started, the rotating speed is slowly and steplessly regulated to 1500r/min from zero, and the motor is closed after continuously running for 6 hours.
The temperature control module automatically stops, and the temperature control curve is shown in fig. 1.
(4) And in the post-treatment stage, naturally cooling to room temperature, opening the model loading device, taking out the integral turbine disc from the loading device, and immediately cutting and interpreting the photosensitive resin model.
Comparative example
In this comparative example, the procedure was the same as in example except for the temperature control procedure.
The temperature control procedure is as follows:
a temperature rise stage, namely firstly raising the temperature from room temperature to 30 ℃ within 1h, and then raising the temperature to 65 ℃ at a speed of 10 ℃/h;
in the heat preservation stage, the temperature of the integral turbine disc model is preserved for 1h at 65 ℃;
a temperature reduction stage, wherein the temperature is reduced to 56 ℃ at the rate of 3 ℃/h;
when the temperature rises to 65 ℃ and enters a heat preservation stage, the motor is started, the rotating speed is slowly and steplessly regulated to 1500r/min from zero, and when the temperature is reduced to 56 ℃, the motor is closed.
The results show that the overall turbine disk structure is complete, and the stress striations obtained after the test are clear and have large stress striation level values when performed in the manner of the example. And in the comparative example, the faults that the turbine disc tenon flies out of the mortise and the turbine disc is broken occur in the freezing process, and the test cannot be normally finished.
According to the rotary freezing method, the photosensitive resin models in the heat preservation stage and the temperature reduction stage are placed in the rotary state, the working state of a prototype is fully simulated, the stress of the photosensitive resin models in the rotary state is frozen, and a stress analysis result which is closer to the actual stress is obtained. According to the rotary freezing method, the duration of the heating-up stage, the heat-preservation stage and the cooling-down stage is short, the temperature of the heat-preservation stage is low, the method is low in test difficulty and short in test period, test efficiency can be improved to a certain extent, and economic cost is reduced. In addition, in the method, the data ranges of the temperature rise stage, the heat preservation stage and the temperature reduction stage are proper, the turbine disc structure obtained after the test is finished, the stress stripes are clear, and the numerical value of the stress stripe level is large and suitable for interpretation.
It should be noted that although the various steps of the methods of the present disclosure are depicted in the drawings in a particular order, this does not require or imply that these steps must be performed in this particular order, or that all of the depicted steps must be performed, to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions, etc., are all considered part of this disclosure.
It is to be understood that the disclosure is not limited in its application to the details of construction and the arrangements of the components set forth in the specification. The present disclosure is capable of other embodiments and of being practiced and carried out in various ways. The foregoing variations and modifications are within the scope of the present disclosure. It should be understood that the disclosure disclosed and defined in this specification extends to all alternative combinations of two or more of the individual features mentioned or evident from the text and/or drawings. All of these different combinations constitute various alternative aspects of the present disclosure. The embodiments of this specification illustrate the best mode known for carrying out the disclosure and will enable those skilled in the art to utilize the disclosure.
Claims (10)
1. A photosensitive resin mold spin freezing method, comprising:
in the temperature rising stage, the photosensitive resin model is heated to 48-52 ℃ from room temperature, and then is heated to 58-62 ℃ at the speed of 2-5 ℃/h;
a heat preservation stage, namely preserving the heat of the photosensitive resin model at 58-62 ℃ for 0.5-1 h;
in the cooling stage, the photosensitive resin model is cooled to 48-52 ℃ at the speed of 1-2 ℃/h;
and in the heat preservation stage and the temperature reduction stage, applying a rotating load with the rotating speed of 1000-2500r/min to the photosensitive resin model.
2. The photosensitive resin mold rotary freezing method according to claim 1, wherein the holding temperature in the holding stage is inversely related to the rotation speed of the rotary load.
3. The photosensitive resin mold rotary freezing method according to claim 2, wherein the temperature of the heat-preservation stage is 62 ℃ when the rotation speed of the rotary load is 1000 r/min; when the rotating speed of the rotating load is 2500r/min, the heat preservation temperature of the heat preservation stage is 58 ℃.
4. The photosensitive resin mold rotary freezing method according to claim 1, wherein the cooling rate in the cooling stage is positively correlated with the rotation speed of the rotary load.
5. The photosensitive resin mold spin freezing method according to claim 1, further comprising:
and a pretreatment stage, wherein the photosensitive resin model is installed to a model loading device.
6. The photosensitive resin mold spin freezing method according to claim 5, further comprising:
and in the post-treatment stage, after the temperature reduction stage is finished, naturally cooling to room temperature, then taking out the photosensitive resin model from the model loading device, and carrying out cutting and stress fringe interpretation on the photosensitive resin model.
7. The photosensitive resin pattern rotational freezing method according to claim 5, wherein the pattern loading apparatus includes a rotational loading module for providing a rotational load to the photosensitive resin pattern, the photosensitive resin pattern being mounted to the rotational loading module of the pattern loading apparatus.
8. The method according to claim 5, wherein the mold loading device further comprises a temperature control module, and a temperature control program is disposed in the temperature control module, and the temperature control program comprises the temperature raising stage, the temperature keeping stage, and the temperature lowering stage.
9. The photosensitive resin mold rotary freezing method according to claim 1, wherein the photosensitive resin mold is a turbine disk.
10. The photosensitive resin mold spin freezing method according to claim 1,
selecting the length of the heat preservation time in the heat preservation stage according to the volume of the photosensitive resin model, wherein the length of the heat preservation time in the heat preservation stage is positively correlated with the volume of the photosensitive resin model;
and selecting the size of the cooling rate in the cooling stage according to the volume size of the photosensitive resin model, wherein the size of the cooling rate in the cooling stage is in negative correlation with the volume size of the photosensitive resin model.
Priority Applications (1)
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| CN202010761129.XA CN111896362A (en) | 2020-07-31 | 2020-07-31 | Photosensitive resin model rotating and freezing method |
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