CN111856247A - A device for simulating memory current testing - Google Patents

Abstract

The invention discloses a device for simulating memory current testing, comprising the following components: a plurality of simulated memory pull-in boards, the plurality of simulated memory pull-in boards are arranged side by side on a memory slot, and each simulated memory pull-in board is provided with There are a plurality of groups of connecting bars; a connecting plate, a plurality of groups of connecting holes are arranged side by side on the connecting plate, and each group of connecting holes is shaped to fit with each group of connecting bars to detachably fix the connecting plate on the analog memory pull carrier board; and a guillotine knife The knife is arranged on the connecting plate, and the knife is provided with a plurality of protruding parts, and the protruding parts are correspondingly arranged with the connecting holes to form a short circuit between the plurality of analog memory pull-in boards by inserting the protruding parts into the connecting holes. The solution proposed by the present invention simulates the most severe load conditions of the operation of the mainboard memory strip by using the simulated memory pull carrier board, and verifies the design index of the memory voltage specification. Test accuracy.

Description

A device for simulating memory current testing

technical field

The present invention relates to the field of testing, and more particularly, to a device for simulating memory current testing.

Background technique

With the deepening of artificial intelligence, the power and performance requirements of servers are also getting higher and higher, and more and more servers have higher and higher requirements for memory power supply. The server motherboard has transitioned from the previous 2-way to 4-way and 8-way. The requirements for memory are also getting higher and higher, and the full-load working current of the analog memory is also increasing, basically reaching more than 100A.

Server motherboards and other boards need power supply testing for memory VR (Voltage Regulation, voltage specification) in the development stage. In the test process, the electronic load is required to pull a large current to the load end of the memory VR to verify whether the various design indicators of the memory VR meet the industry design standards, and to judge whether the output voltage, current and other parameters of the memory VR meet the specified SPEC. Require. At the same time, various protection verification tests for memory VR are required. Under normal circumstances, when the server motherboard is fully equipped with the largest memory module, during the stress test, the power supply current of the memory VR cannot pass the stress test to reach the maximum load current and the most severe working conditions.

In the prior art, when the load current is large, it is necessary to weld multiple load wires at the VR output end, connect them to the electronic load, and use the electronic load and other equipment to perform relevant verification, and the verification work is becoming more and more cumbersome. At the same time, since the mainboard-side memory VR is connected to the electronic load by soldering the load cable, when the load cable is long, when the short circuit protection test is performed, the risk of board burning is likely to occur due to the long circuit.

SUMMARY OF THE INVENTION

In view of this, the purpose of the embodiments of the present invention is to provide a device for simulating memory current testing, by using a simulated memory pull carrier board to simulate the most severe load conditions of the operation of the mainboard memory module, and to carry out the design index of the memory voltage specification. Verification, low cost and easy operation, reduce man-hours, improve work efficiency and test accuracy.

Based on the above purpose, an aspect of the embodiments of the present invention provides a device for simulating memory current testing, including the following components: a plurality of simulated memory pull-up boards, the plurality of simulated memory pull-up boards are arranged side by side in a memory module slot On each analog memory pull carrier board, there are multiple groups of connecting strips; the connecting board is provided with multiple sets of connecting holes side by side, and each set of the connecting holes is shaped to fit with each set of the connecting strips to connect the the connecting board is detachably fixed on the analog memory pull carrier board; and a knife, the knife is arranged on the connecting plate, a plurality of protruding parts are provided on the knife, and the protruding parts Corresponding to the connection holes, the plurality of analog memory pull carriers are short-circuited by inserting the protrusions into the connection holes.

In some embodiments, it further includes: a pull-carrying wire, and a detachable pull-carrying wire is disposed between each two groups of connection holes of the connecting plate.

In some embodiments, each group of connection bars of the analog memory pull carrier board includes a power connection bar and a ground connection bar, and the distances between the power connection bars and the ground connection bars of each group are the same.

In some implementations, the power connection bars in different groups of connection bars on the same analog memory pull carrier board correspond to different power types.

In some implementations, the power connection strips of the same power type in the plurality of analog memory pull-up boards are arranged in the same position.

In some embodiments, the connecting plate includes a first metal plate and a second metal plate, the first metal plate and the second metal plate are arranged side by side, the first metal plate and the second metal plate Use insulating material to connect in the middle.

In some embodiments, each group of connection holes on the connection plate includes a first sub-connection hole and a second sub-connection hole, and the first sub-connection hole and the second sub-connection hole are respectively provided in the first sub-connection hole. A metal plate and the second metal plate, the first sub-connection hole and the second sub-connection hole are symmetrical with respect to the insulating material.

In some embodiments, the distance between the first sub-connection hole and the second sub-connection hole is the same as the distance between two sub-connection bars in a corresponding group of the connection bars.

In some embodiments, a plurality of sub-connecting portions are provided on the guillotine blade corresponding to the plurality of groups of connecting holes, and the plurality of sub-connecting portions are arranged in parallel.

In some embodiments, each of the sub-connecting parts is provided with a first protruding part and a second protruding part, the first protruding part is provided corresponding to the first sub-connecting hole, and the second protruding part is corresponding to the first sub-connecting hole. The second sub-connection holes are correspondingly arranged.

The invention has the following beneficial technical effects: by adopting the simulated memory pull carrier board to simulate the most severe load condition of the operation of the mainboard memory stick, the design index of the memory voltage specification is verified, the cost is low, the operation is simple, the man-hours are reduced, and the Work efficiency and test accuracy.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other embodiments can also be obtained according to these drawings without creative efforts.

1 is a schematic diagram of an embodiment of a device for simulating memory current testing provided by the present invention;

Fig. 2 is the schematic diagram of the connecting plate provided by the present invention;

3 is a schematic diagram of an analog memory pull carrier board provided by the present invention;

FIG. 4 is a schematic diagram of a guillotine knife provided by the present invention.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention will be further described in detail below with reference to the specific embodiments and the accompanying drawings.

It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are for the purpose of distinguishing two entities with the same name but not the same or non-identical parameters. It can be seen that "first" and "second" It is only for the convenience of expression and should not be construed as a limitation to the embodiments of the present invention, and subsequent embodiments will not describe them one by one.

Based on the above purpose, in a first aspect of the embodiments of the present invention, an embodiment of a protection circuit for preventing reverse connection is provided. FIG. 1 shows a schematic diagram of an embodiment of an apparatus for simulating a memory current test provided by the present invention. As shown in FIG. 1, the embodiment of the present invention includes the following components:

A plurality of simulated memory pull-in boards 1, the plurality of simulated memory pull-in boards 1 are arranged side by side on the memory slot of the mainboard 0, and each simulated memory pull-in board 1 is provided with a plurality of groups of connection bars 11;

A connecting plate 2, a plurality of groups of connecting holes 21 are arranged side by side on the connecting plate 2, and each group of the connecting holes 21 is shaped to fit with each group of the connecting bars 11 to detachably fix the connecting plate 2 on the connecting plate 2. The analog memory is pulled on the carrier board 1; and

The knife 3 is provided on the connecting plate 2, and a plurality of protrusions 31 are provided on the knife 3, and the protrusions 31 are correspondingly provided with the connecting holes 21 to pass the The protrusions 31 are inserted into the connection holes 21 to form a short circuit among the plurality of analog memory pull-up boards 1 .

FIG. 2 shows a schematic diagram of the connection board provided by the present invention. As shown in FIG. 2 , the connection plate 2 includes a plurality of groups of connection holes 21 . In some embodiments, the connecting plate includes a first metal plate and a second metal plate, the first metal plate and the second metal plate are arranged side by side, the first metal plate and the second metal plate Use insulating material to connect in the middle. As shown in FIG. 2, the connecting plate 2 includes a first metal plate 22a and a second metal plate 22b, the first metal plate 22a and the second metal plate 22b are arranged side by side, and an insulation is used between the first metal plate 22a and the second metal plate 22b Material connection.

In some embodiments, it further includes: a pull-carrying wire, and a detachable pull-carrying wire is disposed between each two groups of connection holes of the connecting plate. Continuing to refer to FIG. 2 , a detachable load-carrying wire 22 is disposed between each two groups of connecting holes 21 of the connecting plate 2 .

In some embodiments, each group of connection holes on the connection plate includes a first sub-connection hole and a second sub-connection hole, and the first sub-connection hole and the second sub-connection hole are respectively provided in the first sub-connection hole. A metal plate and the second metal plate, the first sub-connection hole and the second sub-connection hole are symmetrical with respect to the insulating material. Continuing to refer to FIG. 2, each group of connection holes 21 on the connection plate 2 includes a first sub-connection hole 21a and a second sub-connection hole 21b, and the first sub-connection hole 21a and the second sub-connection hole 21b are respectively provided on the first metal plate 22a and the second metal plate 22b, the first sub-connection hole 21a and the second sub-connection hole 21b are symmetrical with respect to the insulating material.

FIG. 3 shows a schematic diagram of an analog memory pull carrier board provided by the present invention. As shown in FIG. 3 , one end of the analog memory pull carrier board 1 includes multiple groups of connecting strips 11 , and the other end is connected to the memory module slot, so the PIN pin can be defined in the same way as the PIN pin of the memory module slot of the motherboard. Gold finger design is available. In some embodiments, each group of connection bars of the analog memory pull carrier board includes a power connection bar and a ground connection bar, and the distances between the power connection bars and the ground connection bars of each group are the same. As shown in FIG. 3 , the analog memory pull carrier board 1 includes three groups of connection bars, but this is only an example, other numbers of connection bars may be used in other embodiments, and each group of connection bars includes a power connection bar and a ground connection strip. In some implementations, the power connection bars in different groups of connection bars on the same analog memory pull carrier board correspond to different power types. The power connection bars in this embodiment are respectively VDD, VTT and VPP, which are denoted by 13a, 13b and 13c respectively in the figure, and the ground connection bar is denoted by 14.

In some implementations, the power connection strips of the same power type in the plurality of analog memory pull-up boards are arranged in the same position. In order to facilitate testing, multiple analog memory pull carriers can be designed to be identical, and of course, the positions of the power connection strips of different power types on each analog memory pull carrier are fixed. For example, in the analog memory pull carrier board a1, the arrangement of the VDD, VTT and VPP power supply connection bars is 13a, 13b and 13c, then in the analog memory pull carrier board a2, the arrangement of the VDD, VTT and VPP power supply connection bars 13a, 13b and 13c are also possible.

In some embodiments, the distance between the first sub-connection hole and the second sub-connection hole is the same as the distance between two sub-connection bars in a corresponding group of the connection bars. Sub-connecting strips are different types of power connection strips and ground connection strips. The connection holes and connection strips are used together. Therefore, the distance between the two sub-connecting holes in each group of connection holes is the same as the distance between the two sub-connection holes in the corresponding group of connection strips. The distances between the sub-links are the same.

In some embodiments, a plurality of sub-connecting portions are provided on the guillotine blade corresponding to the plurality of groups of connecting holes, and the plurality of sub-connecting portions are arranged in parallel. FIG. 4 shows a schematic diagram of the guillotine knife provided by the present invention. As shown in FIG. 4 , a plurality of sub-connecting portions 32 are provided on the knife 3 corresponding to the plurality of groups of connecting holes 21 . The plurality of sub-connecting portions 32 are arranged in parallel and converge on the connecting portion 33 . The connecting portion 33 is connected with the handle 34 , so that the The movement of the plurality of sub-connecting parts 32 can be controlled simultaneously by the handle 34 .

In some embodiments, each of the sub-connecting parts is provided with a first protruding part and a second protruding part, the first protruding part is provided corresponding to the first sub-connecting hole, and the second protruding part is corresponding to the first sub-connecting hole. The second sub-connection holes are correspondingly arranged. Continuing to refer to FIG. 4 , the sub-connecting portion 32 is provided with a first protruding portion 31 a and a second protruding portion 31 b , the first protruding portion 31 a is provided corresponding to the first sub-connecting hole 21 a , and the second protruding portion 31 b is corresponding to the second sub-connecting hole 31 b 21b corresponds to the setting. When the blade is lifted (VDD\VTT\VPP) and GND are disconnected, when the output short circuit test is required, close the blade and connect (VDD\VTT\VPP) to GND quickly. Due to the short circuit, protection testing can be achieved quickly.

When testing items that need to use electronic load pull load test items, connect the pull load cable to the electronic load and set the electronic load; power on the main board to be tested, and perform the corresponding pull load test; When testing the memory voltage short-circuit protection test item, first disconnect the knife, and after the main board is powered on, quickly close the knife to complete the short-circuit protection.

The above are exemplary embodiments of the present disclosure, but it should be noted that various changes and modifications may be made without departing from the scope of the disclosure of the embodiments of the present invention as defined in the claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements disclosed in the embodiments of the present invention may be described or claimed in the singular, unless explicitly limited to the singular, the plural may also be construed.

It should be understood that, as used herein, the singular form "a" is intended to include the plural form as well, unless the context clearly supports an exception. It will also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.

The above-mentioned embodiments of the present invention disclose the serial numbers of the embodiments only for description, and do not represent the advantages and disadvantages of the embodiments.

Those of ordinary skill in the art can understand that all or part of the steps of implementing the above embodiments can be completed by hardware, or can be completed by instructing relevant hardware through a program, and the program can be stored in a computer-readable storage medium. The storage medium can be a read-only memory, a magnetic disk or an optical disk, and the like.

Those of ordinary skill in the art should understand that the discussion of any of the above embodiments is only exemplary, and is not intended to imply that the scope (including the claims) disclosed by the embodiments of the present invention is limited to these examples; under the idea of the embodiments of the present invention , the technical features in the above embodiments or different embodiments can also be combined, and there are many other changes in different aspects of the above embodiments of the present invention, which are not provided in detail for the sake of brevity. Therefore, any omission, modification, equivalent replacement, improvement, etc. made within the spirit and principle of the embodiments of the present invention should be included within the protection scope of the embodiments of the present invention.

Claims (10)

1. An apparatus for simulating memory current testing, comprising:

the analog memory pull-in support plates are arranged on the memory strip slots side by side, and each analog memory pull-in support plate is provided with a plurality of groups of connecting strips;

the connecting plate is provided with a plurality of groups of connecting holes side by side, and each group of connecting holes is matched with each group of connecting strip shapes so as to detachably fix the connecting plate on the analog memory pull carrier plate; and

the switch blade is arranged on the connecting plate, a plurality of protruding parts are arranged on the switch blade, and the protruding parts and the connecting holes are correspondingly arranged so that the protruding parts are inserted into the connecting holes to enable the plurality of analog memory pull-up carrier plates to form short circuits.

2. The apparatus of claim 1, further comprising:

the connecting plate is provided with a detachable pulling load line between every two groups of connecting holes.

3. The device of claim 1, wherein each group of the connection bars of the analog dram carrier board comprises a power connection bar and a ground connection bar, and the distances between the power connection bar and the ground connection bar of each group are the same.

4. The apparatus of claim 3, wherein the power types corresponding to the power connection bars in different groups of connection bars on the same analog DRAM carrier are different.

5. The apparatus of claim 4, wherein the power connection bars of the same power type in the plurality of analog memory pull-up boards are disposed at the same position.

6. The apparatus of claim 1, wherein the connecting plate comprises a first metal plate and a second metal plate, the first metal plate and the second metal plate are arranged side by side, and the first metal plate and the second metal plate are connected with an insulating material therebetween.

7. The apparatus of claim 6, wherein each set of connection holes on the connection plate comprises a first sub-connection hole and a second sub-connection hole, the first sub-connection hole and the second sub-connection hole being disposed on the first metal plate and the second metal plate, respectively, the first sub-connection hole and the second sub-connection hole being symmetrical with respect to the insulating material.

8. The apparatus of claim 7, wherein the first sub-connection hole and the second sub-connection hole have the same distance as two sub-connection bars in a corresponding group of the connection bars.

9. The device according to claim 8, wherein a plurality of sub-connecting portions are provided on the blade corresponding to the plurality of sets of connecting holes, and the plurality of sub-connecting portions are arranged in parallel.

10. The apparatus of claim 9, wherein each of the sub-connecting portions has a first protrusion and a second protrusion, the first protrusion corresponding to the first sub-connecting hole, and the second protrusion corresponding to the second sub-connecting hole.

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