CN111719065A - Cu-Ni-Sn-Si-Ag-P multi-element alloy foil and preparation method thereof - Google Patents
Cu-Ni-Sn-Si-Ag-P multi-element alloy foil and preparation method thereof Download PDFInfo
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- 229910001325 element alloy Inorganic materials 0.000 title claims abstract description 56
- 239000011888 foil Substances 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 37
- 239000000956 alloy Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 21
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 11
- 238000007711 solidification Methods 0.000 claims abstract description 11
- 230000008023 solidification Effects 0.000 claims abstract description 11
- 229910052718 tin Inorganic materials 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 37
- 239000002994 raw material Substances 0.000 claims description 22
- 239000000155 melt Substances 0.000 claims description 18
- 238000005096 rolling process Methods 0.000 claims description 17
- 238000000354 decomposition reaction Methods 0.000 claims description 11
- 238000005266 casting Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 229910000906 Bronze Inorganic materials 0.000 abstract description 9
- 229910052790 beryllium Inorganic materials 0.000 abstract description 9
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 abstract description 9
- 239000010974 bronze Substances 0.000 abstract description 9
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 9
- 239000012071 phase Substances 0.000 abstract description 8
- 239000007791 liquid phase Substances 0.000 abstract description 6
- 238000005728 strengthening Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 4
- 229910005487 Ni2Si Inorganic materials 0.000 abstract description 3
- 230000009466 transformation Effects 0.000 abstract description 3
- 229910003217 Ni3Si Inorganic materials 0.000 abstract 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 18
- 239000010949 copper Substances 0.000 description 17
- 229910018100 Ni-Sn Inorganic materials 0.000 description 11
- 229910018532 Ni—Sn Inorganic materials 0.000 description 11
- 239000007789 gas Substances 0.000 description 10
- 229910052786 argon Inorganic materials 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 9
- 230000003647 oxidation Effects 0.000 description 9
- 238000007254 oxidation reaction Methods 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 230000000087 stabilizing effect Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000001330 spinodal decomposition reaction Methods 0.000 description 6
- 238000009718 spray deposition Methods 0.000 description 6
- 238000004804 winding Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 239000013081 microcrystal Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000005204 segregation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 101000859014 Gallus gallus Cathelicidin-1 Proteins 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000009828 non-uniform distribution Methods 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- VRUVRQYVUDCDMT-UHFFFAOYSA-N [Sn].[Ni].[Cu] Chemical compound [Sn].[Ni].[Cu] VRUVRQYVUDCDMT-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/06—Continuous casting of metals, i.e. casting in indefinite lengths into moulds with travelling walls, e.g. with rolls, plates, belts, caterpillars
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
Abstract
The application discloses a Cu-Ni-Sn-Si-Ag-P multi-element alloy foil and a preparation method thereof, wherein the Cu-Ni-Sn-Si-Ag-P multi-element alloy foil comprises the following components in percentage by mass: 14-16% of Ni, 7-9% of Sn, 0.5-1.5% of Si, 0.1-0.2% of Ag, 0.005-0.015% of P and the balance of Cu. The application improves the quality by adding 0.1 to 0.2 percent of AgThe electrical conductivity of the multi-component alloy is close to that of beryllium bronze, the problem of insufficient performance existing when the multi-component alloy replaces the beryllium bronze is solved, and meanwhile, the high-temperature performance of the multi-component alloy is further improved. In addition, by adding 0.5-1.2% of Si and 0.005-0.015% of P, the problem of large solidification temperature range of the multi-element alloy is solved, the liquid phase fluidity of the multi-element alloy foil in the solid-liquid phase transformation process is increased, the porosity of the multi-element alloy is reduced, the thickness uniformity of the multi-element alloy is improved, the forming performance of the multi-element alloy is improved, and meanwhile, Ni formed by Si and Ni forms Ni3Si\Ni2Si strengthening phase, and Cu formed with Ni and Sn (Cu)xNix‑1)3The Sn strengthening phase further improves the mechanical property of the multi-element alloy.
Description
Technical Field
The application relates to the field of metal materials, in particular to a Cu-Ni-Sn-Si-Ag-P multi-element alloy foil and a preparation method thereof.
Background
The Cu-Ni-Sn multi-element alloy in the related technology is an ideal substitute material of beryllium bronze due to the advantages of high strength, excellent stress relaxation property, corrosion resistance, heat conductivity, electric conductivity and the like, has excellent mechanical properties equivalent to those of the beryllium bronze, has the advantages of good heat stress relaxation resistance and no toxicity, environmental protection and the like which are not possessed by the beryllium bronze, and has very wide application prospect.
The Cu-Ni-Sn multi-element alloy foil in the related art is generally prepared by adopting semi-continuous casting and multi-pass rolling deformation, and the method has the following problems:
(1) segregation was severe
Because of the higher Ni and Sn contents, segregation is easily generated in the casting process, thereby influencing the subsequent plastic deformation
(2) Large deformation resistance
The alloy has high strength, so the work hardening phenomenon is serious, which brings challenges to plastic deformation, and the processing of the Cu-Ni-Sn multi-element alloy foil mostly needs the cooperation of multi-pass rolling and annealing, and is easy to crack.
(3) The preparation cost is high
Due to the problems of segregation, deformation resistance and the like, the Cu-Ni-Sn multi-element alloy foil has longer preparation process and higher production cost.
In fact, the process method is not successful in multiple trial production of domestic enterprises and Japanese and European copper processing enterprises except for the batch production of the American Material Brush company in the world at present, so that the current American Material Brush company monopolies on the product.
Based on this, the present application is specifically proposed.
Content of application
In order to solve the problems, the application provides a Cu-Ni-Sn-Si-Ag-P multi-element alloy foil and a preparation method thereof.
In a first aspect, embodiments of the present application provide a Cu-Ni-Sn-Si-Ag-P multi-component alloy foil, which includes the following components by mass: 14-16% of Ni, 7-8% of Sn, 0.5-1.5% of Si, 0.1-0.2% of Ag, 0.005-0.015% of P and the balance of Cu.
In some of these embodiments, the Cu-Ni-Sn-Si-Ag-P multi-component alloy foil has a width of 90-110mm, a thickness of 0.03-0.1mm, an electrical conductivity of greater than or equal to 15% IACS, a tensile strength of greater than or equal to 1160MPa, a porosity of less than or equal to 0.5%, and an elastic modulus of greater than or equal to 140 GPa.
In a second aspect, an embodiment of the present application provides a method for preparing a Cu-Ni-Sn-Si-Ag-P multi-component alloy foil in any one of the above embodiments, the method comprising the following steps: providing raw materials, wherein the raw materials comprise Ni, Sn, Si, Ag, P and Cu; preparing the raw materials into a melt; spraying the melt to the surface of a rotating roller for solidification to obtain a blank; and carrying out microcrystalline heat treatment, amplitude-modulated decomposition heat treatment and at least one-time rolling on the blank to obtain the Cu-Ni-Sn-Si-Ag-P multi-element alloy foil.
In some of these embodiments, "forming the raw materials into a melt" includes: casting the raw materials to obtain an ingot blank; and remelting the ingot blank to obtain a melt.
In some of these embodiments, the temperature of the microcrystalline heat treatment is 920 ℃ to 930 ℃.
In some embodiments, the time for the heat treatment of the microcrystal is 2-6 h.
In some of these embodiments, the temperature of the spinodal decomposition heat treatment is 420 to 520 ℃.
In some of these embodiments, the spinodal decomposition heat treatment is carried out for a period of 2 to 6 hours.
In some of these embodiments, the rotating roller has a rotational speed of 17 to 25 m/s.
In some of these embodiments, the temperature of the remelting is 1280 ℃ to 1330 ℃.
The application provides a Cu-Ni-Sn-Si-Ag-P multi-element alloy foil and a preparation method thereof, which have the following beneficial effects:
(1) based on the embodiment, the electric conductivity of the multi-element alloy is improved by adding 0.1-0.2% of Ag, compared with 8% of IACS of Cu-Ni-Sn alloy in the related technology, the Cu-Ni-Sn-Si-Ag-P multi-element alloy reaches 15% of IACS and above, and is close to beryllium bronze, the problem of insufficient performance existing when the multi-element alloy replaces the beryllium bronze is solved, and meanwhile, the high-temperature performance of the multi-element alloy is further improved. In addition, by adding 0.5-1.2% of Si and 0.005-0.015% of P, the problem of large solidification temperature range of the multi-element alloy is solved, and the liquid phase fluidity of the multi-element alloy foil in the solid-liquid phase transformation process is increased, so that the spray forming technology can be adopted, the porosity of the multi-element alloy is reduced, the thickness uniformity of the multi-element alloy is improved, and the forming performance of the multi-element alloy is improved3Si\Ni2Si strengthening phase, and Cu formed with Ni and Sn (Cu)xNix-1)3The Sn strengthening phase further improves the mechanical property of the multi-element alloy.
(2) By adopting the spray forming technology, the problem of macrosegregation in the preparation process of the multi-element alloy is solved. Meanwhile, the microcrystal heat treatment is carried out, so that the amorphous in the blank is converted into the microcrystal, the problem of nonuniform performance of the multi-element alloy caused by nonuniform distribution of the amorphous and the microcrystal in the blank after spray forming is solved, the main element and Cu form an alpha phase, and the preparation on the organization structure is made for the subsequent amplitude modulation decomposition heat treatment.
(3) By carrying out amplitude modulation decomposition heat treatment, 3/4 hardening state is obtained, and the foil is subjected to stretch bending straightening and finishing by combining a high-precision rolling technology, so that the size specification, the mechanical property and the plate shape precision of the foil are effectively controlled, the mechanical property and the plate shape precision of the foil are improved, and the high-strength and high-conductivity multi-element alloy foil is obtained.
(4) The Cu-Ni-Sn-Si-Ag-P multi-element alloy foil is high in strength and high in conductivity, is an important raw material for strategic tactical weapons such as satellites and aircrafts, and has important application value in the fields of electronic communication such as 5G and smart phones.
(5) The preparation method greatly shortens the preparation flow and the production cost of the multi-element alloy foil, breaks through the technical barrier faced by the processing deformation of the multi-element alloy foil, simultaneously improves the conductivity and the strength of the multi-element alloy foil, and has performance superior to the Cu-Ni-Sn alloy foil monopolized by the American Material Brush company.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic flow diagram of a preparation method in an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The embodiment of the application provides a Cu-Ni-Sn-Si-Ag-P multi-component alloy foil, which comprises the following components in percentage by mass: 14-16% of Ni, 7-8% of Sn, 0.5-1.5% of Si, 0.1-0.2% of Ag, 0.005-0.015% of P and the balance of Cu.
The electric conductivity of the multi-component alloy is improved by adding 0.1-0.2% of Ag, compared with 8% of IACS of Cu-Ni-Sn alloy in the related technology, the Cu-Ni-Sn-Si-Ag-P multi-component alloy reaches 15% of IACS and above, and is close to beryllium bronze, the problem of insufficient performance existing when the multi-component alloy replaces beryllium bronze is solved, and meanwhile, the high-temperature performance of the multi-component alloy is further improved. In addition, by adding 0.5-1.2% of Si and 0.005-0.015% of P, the problem of large solidification temperature range of the multi-element alloy is solved, and the liquid phase fluidity of the multi-element alloy foil in the solid-liquid phase transformation process is increased, so that the spray forming technology can be adopted, the porosity of the multi-element alloy is reduced, the thickness uniformity of the multi-element alloy is improved, and the forming performance of the multi-element alloy is improved3Si\Ni2Si strengthening phase, and Cu formed with Ni and Sn (Cu)xNix-1)3The Sn strengthening phase further improves the mechanical property of the multi-element alloy.
In one embodiment of the application, the Cu-Ni-Sn-Si-Ag-P multi-element alloy foil has the width of 90-110mm, the thickness of 0.03-0.1mm, the electric conductivity of more than or equal to 15% IACS, the tensile strength of more than or equal to 1160MPa, the porosity of less than or equal to 0.5% and the elastic modulus of more than or equal to 140 GPa. The Cu-Ni-Sn-Si-Ag-P multi-element alloy foil is high in strength and high in conductivity, is an important raw material for strategic tactical weapons such as satellites and aircrafts, and has important application value in the fields of electronic communication such as 5G and smart phones.
Referring to fig. 1, an embodiment of the present application provides a method for preparing a Cu-Ni-Sn-Si-Ag-P multi-component alloy foil in any one of the above embodiments, the method comprising the following steps: providing raw materials, wherein the raw materials comprise Ni, Sn, Si, Ag, P and Cu; preparing the raw materials into a melt; spraying the melt to the surface of a rotating roller for solidification to obtain a blank; and carrying out microcrystalline heat treatment, amplitude-modulated decomposition heat treatment and at least one-time rolling on the blank to obtain the Cu-Ni-Sn-Si-Ag-P multi-element alloy foil.
The method solves the problem of macrosegregation in the preparation process of the multi-element alloy by adopting a spray forming technology. Meanwhile, the amorphous in the blank is converted into fine crystals through microcrystalline heat treatment, the problem of nonuniform performance of the multi-element alloy caused by nonuniform distribution of the amorphous and fine crystals in the blank after spray forming is solved, and the main element and Cu form an alpha phase to prepare the organization structure for subsequent amplitude modulation decomposition heat treatment. 3/4 hardening state is obtained through amplitude modulation decomposition heat treatment, and the foil is straightened and finished by combining a high-precision rolling technology and stretch bending, so that the size specification, the mechanical property and the plate shape precision of the foil are effectively controlled, the mechanical property and the plate shape precision of the foil are improved, and the high-strength and high-conductivity copper-nickel-tin foil is obtained.
The raw materials including Ni, Sn, Si, Ag, P, and Cu are limited only to include Ni, Sn, Si, Ag, P, and Cu, and the existence form of Ni, Sn, Si, Ag, P, and Cu is not limited, and taking P as an example, the existence form of P may be pure P, or P in the CuP alloy, and the mass percentage of P in the CuP alloy may be 14%.
The "making the raw materials into a melt" may specifically be: casting the raw materials to obtain an ingot blank; and remelting the ingot blank to obtain a melt. Wherein the melt-casting may include melting and casting.
In order to avoid the oxidation of the multi-component alloy, the melting and casting, the remelting, the microcrystal heat treatment and the spinodal decomposition heat treatment are respectively carried out in an anaerobic state. To obtain the oxygen-free state, the container can be evacuated and then protective gas is introduced. The vacuum pressure can be stabilized at 10-4Pa or so. The shielding gas may be high purity argon, which may be 99.99% pure.
After "obtaining an ingot", the ingot may be cut into a predetermined size, and then the ingot cut into the predetermined size may be remelted. For example, an ingot blank with the specification of phi 70X 1400mm can be cut into the specification of phi 70X 100 mm.
The temperature of the microcrystalline heat treatment can be 920-930 ℃, such as 920 ℃, 935 ℃ and 930 ℃.
The time of the microcrystalline heat treatment can be 2-6 h, such as 2h, 2.5h, 2.8h, 3h and 6 h. Preferably, the time for the heat treatment of the crystallites may be 2.5-3 h.
The temperature of the AM decomposition heat treatment may be 420-520 deg.C, such as 420 deg.C, 480 deg.C, 520 deg.C. Preferably, the temperature of the spinodal decomposition heat treatment may be 480 ℃.
The time of the AM decomposition heat treatment can be 2-6 hours, such as 2 hours, 3 hours and 6 hours. The time for the spinodal decomposition heat treatment may be 3 hours.
The rotating speed of the rotating roller can be 17-25 m/s, such as 17m/s, 20m/s, 22m/s, 25 m/s. Preferably, the rotating roller may have a rotating speed of 17 to 22 m/s.
The remelting temperature may be 1280 ℃ to 1330 ℃, such as 1280 ℃, 1320 ℃, 1322 ℃, 1325 ℃ and 1330 ℃. Preferably, the temperature of the remelting can be from 1320 ℃ to 1325 ℃.
The step of spraying the melt onto the surface of a rotating roller for solidification to obtain a blank can be specifically as follows: and spraying the melt to the surface of a rotating roller to solidify into a belt, and synchronously winding the belt into a coil by a winding machine to obtain a coiled blank. The rotating rollers may be copper.
After the "microcrystallization heat treatment" of the blank, it may be rolled at least once (noted as primary rolling), trimmed to strips, then submitted to spinodal decomposition heat treatment and rolled again at least once (noted as secondary rolling). The high-precision rolling technique can be adopted in both primary rolling and secondary rolling.
After the secondary rolling, stretch bending straightening, detection and packaging can be carried out.
In summary, the preparation method greatly shortens the preparation process and the production cost of the multi-component alloy foil, breaks through the technical barrier faced by the processing deformation of the multi-component alloy foil, simultaneously improves the conductivity and the strength of the multi-component alloy foil, and has performance superior to that of Cu-Ni-Sn alloy foil monopolized by American Material Brush company.
The following are some examples and experimental examples of the present application.
Example one
(1) 76.5kg of Cu (CATH-1), 15kg of Ni (NO2200), 8.1kg of 1# Sn8, 0.1kg of 1# Ag0.1kg of Si (99.5%), and 0.65kg of P (CuP 14% master alloy) were used as raw materials.
(2) Smelting the raw materials at 1320 deg.C under oxygen-free condition to avoid oxidation of multi-element alloy, vacuumizing the furnace cover to obtain oxygen-free condition, and stabilizing vacuum pressure at 10 deg.C-4Pa, 99.99 percent of high-purity argon as protective gas, casting in vacuum to obtain an ingot blank with the specification of phi 70 × 1400mm, taking out the ingot blank and cutting the ingot blank into the specification of phi 70 × 100 mm.
Remelting ingot blank at 1320 deg.C under oxygen-free state to avoid oxidation of multicomponent alloy, vacuumizing furnace cover to obtain oxygen-free state, and stabilizing vacuum pressure at 10 deg.C-4Pa or so, and 99.99 percent of high-purity argon as protective gas to obtain a melt.
(3) And spraying the melt to the surface of a rotating roller for solidification to solidify into a belt and synchronously winding the belt into a coil by a winding machine, wherein the rotating speed of the rotating roller for solidification is 22m/s, so that a blank with the width of 115mm, the thickness of 0.045-0.05 mm and the coil weight of 10kg is obtained.
(4) Placing the blank at 920 deg.C for heat treatment for 3 hr, wherein the heat treatment is carried out under anaerobic condition to avoid oxidation of multicomponent alloy, and the heat treatment is carried out under anaerobic condition to obtain anaerobic condition, vacuumizing the furnace cover, and stabilizing vacuum pressure at 10%-4Pa or so, and 99.99 percent of high-purity argon as protective gas to obtain a metallographic uniform structure with the average grain size of 0.008, then rolling to the thickness of 0.035mm, cutting edges and splitting to obtain two strip coils with the width of 50mm and two strip cutting edge wastes with the width of 7.5 mm.
Heat treating the strip coil at 480 deg.C for 3 hr under anaerobic condition to avoid oxidation of multi-element alloy, vacuumizing the furnace cover, and stabilizing the vacuum pressure at 10%-4Pa, 99.99 percent of high-purity argon as protective gas, and then carrying out shape control and property control high-precision rolling, stretch bending straightening, detection and packaging to obtain the Cu-Ni-Sn-Si-Ag-P multi-element alloy foil with the width of 50mm, the thickness of 0.03 +/-0.002 mm and the coil weight of 3.51 kg. Wherein the tensile strength of the Cu-Ni-Sn-Si-Ag-P multi-element alloy foil is 1279MPa, and the electric conductivity is 15% IACS.
Example two
(1) Providing 75.5kg of Cu (CATH-1), 15kg of Ni (NO2200) and 1# Sn8kg as raw materials; 1# Ag0.15kg, Si (99.5%) 1kg, P (CuP 14% master alloy) 0.5 kg.
(2) Smelting the raw materials at 1325 deg.C under oxygen-free condition to avoid oxidation of multicomponent alloy, vacuumizing the furnace cover to obtain oxygen-free condition, and stabilizing vacuum pressure at 10%-4Pa, 99.99 percent of high-purity argon as protective gas, casting in vacuum to obtain an ingot blank with the specification of phi 70 × 1400mm, taking out the ingot blank and cutting the ingot blank into the specification of phi 70 × 100 mm.
Remelting ingot blank at 1320 deg.C under oxygen-free state to avoid oxidation of multicomponent alloy, vacuumizing furnace cover to obtain oxygen-free state, and stabilizing vacuum pressure at 10 deg.C-4Pa or so, and 99.99 percent of high-purity argon as protective gas to obtain a melt.
(3) And spraying the melt to the surface of a rotating roller for solidification to solidify the belt and synchronously winding the belt into a coil by a winding machine, wherein the rotating speed of the rotating roller for solidification is 17 m/s. The blank with the width of 115mm, the thickness of 0.122-0.13 mm and the coil weight of 10kg is obtained.
(4) Placing the blank at 930 deg.C for heat treatment for 2.5h, wherein the heat treatment is carried out under anaerobic condition to avoid oxidation of multicomponent alloy, and the heat treatment is carried out under anaerobic condition to obtain anaerobic condition, vacuumizing the furnace cover, and stabilizing vacuum pressure at 10-4Pa or so, and 99.99 percent of high-purity argon as protective gas to obtain a metallographic uniform structure with the average grain size of 0.01, then rolling the metallographic uniform structure until the thickness is 0.115mm, and cutting edges and splitting the metallographic uniform structure to obtain two strip-shaped coil materials with the width of 100mm and two strip-shaped cut edge waste materials with the width of 7.5 mm.
Heat treating the strip coil at 480 deg.C for 3 hr under anaerobic condition to avoid oxidation of multi-element alloy, vacuumizing the furnace cover, and stabilizing the vacuum pressure at 10%-4Pa, about 99.99 percent of high-purity argon as protective gas, and then carrying out shape control and property control high-precision rolling, stretch bending straightening, detection and packaging to obtain the Cu-Ni-Sn-Si-Ag-P multi-element alloy foil with the width of 100mm, the thickness of 0.1 +/-0.005 mm and the coil weight of 8.5 kg. Wherein the tensile strength of the Cu-Ni-Sn-Si-Ag-P multi-component alloy foil is 1297MPa, and the electric conductivity is 16% IACS.
Test example 1
The present test example examined the technical maturity of the method for producing a Cu-Ni-Sn-Si-Ag-P multi-component alloy foil of the present application and the method for producing a Cu-Ni-Sn alloy foil of the related art (including the methods for producing Cu-Ni-Sn alloy foils of companies such as american material Brush, japan NGK), and also compared the performance of the Cu-Ni-Sn-Si-Ag-P multi-component alloy foil of the present application with the Cu-Ni-Sn alloy foil monopolized by american material Brush, and the results are shown in the following table.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. The Cu-Ni-Sn-Si-Ag-P multi-element alloy foil is characterized by comprising the following components in percentage by mass:
14-16% of Ni, 7-9% of Sn, 0.5-1.5% of Si, 0.1-0.2% of Ag, 0.005-0.015% of P and the balance of Cu.
2. The Cu-Ni-Sn-Si-Ag-P multi-element alloy foil according to claim 1,
the Cu-Ni-Sn-Si-Ag-P multi-element alloy foil is 90-120mm in width, 0.03-0.15mm in thickness, more than or equal to 15% IACS in electric conductivity, more than or equal to 1160MPa in tensile strength, less than or equal to 0.5% in porosity and more than or equal to 140GPa in elastic modulus.
3. A method for preparing the Cu-Ni-Sn-Si-Ag-P multi-component alloy foil according to claim 1, comprising the steps of:
providing raw materials, wherein the raw materials comprise Ni, Sn, Si, Ag, P and Cu;
preparing the raw materials into a melt;
spraying the melt to the surface of a rotating roller for solidification to obtain a blank;
and carrying out microcrystalline heat treatment, amplitude-modulated decomposition heat treatment and at least one-time rolling on the blank to obtain the Cu-Ni-Sn-Si-Ag-P multi-element alloy foil.
4. The method according to claim 3,
"forming the raw materials into a melt" includes: casting the raw materials to obtain an ingot blank; and remelting the ingot blank to obtain a melt.
5. The method according to claim 3,
the temperature of the microcrystalline heat treatment is 920-930 ℃.
6. The method according to claim 3,
the time for the microcrystalline heat treatment is 2-6 h.
7. The method according to claim 3,
the temperature of the amplitude-modulated decomposition heat treatment is 420-520 ℃.
8. The method according to claim 3,
the time of the amplitude-modulated decomposition heat treatment is 2-6 hours.
9. The method according to claim 3,
the rotating speed of the rotating roller is 17-25 m/s.
10. The method according to claim 4,
the remelting temperature is 1280-1330 ℃.
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