CN111698891A - Power adapter with radiating fins - Google Patents
Power adapter with radiating fins Download PDFInfo
- Publication number
- CN111698891A CN111698891A CN202010680723.6A CN202010680723A CN111698891A CN 111698891 A CN111698891 A CN 111698891A CN 202010680723 A CN202010680723 A CN 202010680723A CN 111698891 A CN111698891 A CN 111698891A
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- Prior art keywords
- heat sink
- heat
- pcb board
- power adapter
- elastic arm
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/02—Conversion of AC power input into DC power output without possibility of reversal
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明涉及电源适配器技术领域,具体涉及一种带有散热片的电源适配器,包括壳体以及设于壳体内的PCB板;所述PCB板的顶部设有第一散热片;所述PCB板的底部设有第二散热片;所述第一散热片的底部以及第二散热片的顶部均设有锁紧件;所述PCB板贯穿设有锁紧槽;所述锁紧件与锁紧槽连接;所述第一散热片设有容置腔;所述第一散热片设有散热孔;所述第二散热片包括散热本体以及覆盖散热本体顶部的绝缘片;所述绝缘片的顶部设有导热片;所述导热片与PCB板的底部抵靠。本发明通过在PCB板的顶部以及底部分别设置第一散热片以及第二散热片,从而能够有效地将PCB板上发热源的热量散发出去,防止电源适配器因高温而损坏。
The invention relates to the technical field of power adapters, in particular to a power adapter with heat sinks, comprising a casing and a PCB board arranged in the casing; the top of the PCB board is provided with a first heat sink; The bottom is provided with a second heat sink; the bottom of the first heat sink and the top of the second heat sink are provided with locking pieces; the PCB board is provided with a locking groove; the locking piece and the locking groove connection; the first heat sink is provided with a accommodating cavity; the first heat sink is provided with a heat dissipation hole; the second heat sink includes a heat dissipation body and an insulating sheet covering the top of the heat dissipation body; the top of the insulating sheet is provided with There is a heat-conducting sheet; the heat-conducting sheet abuts against the bottom of the PCB board. In the present invention, the first heat sink and the second heat sink are respectively arranged on the top and bottom of the PCB board, thereby effectively dissipating the heat of the heat source on the PCB board and preventing the power adapter from being damaged due to high temperature.
Description
技术领域technical field
本发明涉及电源适配器技术领域,具体涉及一种带有散热片的电源适配器。The invention relates to the technical field of power adapters, in particular to a power adapter with heat sinks.
背景技术Background technique
目前电源适配器在工作的时侯部分电子元件都会或多或少的产生多余的热能,表现的现象即产品居部的电子元件温度升高,当温度上升到一定的高度后超过电子元件的极限温度此元件就会因温度过高而损坏以致整个产品也报废了。因此就需要散热装置把发热的电子元件中的热能导走,其中散热片就广泛的应用于电源及适配器中;而目前的电源适配器存在散热效果不足的问题。At present, some electronic components of the power adapter will generate excess heat energy more or less when the power adapter is working. This component will be damaged due to excessive temperature and the entire product will be scrapped. Therefore, a heat sink is required to dissipate the heat energy in the heat-generating electronic components, and heat sinks are widely used in power supplies and adapters; however, the current power adapters have the problem of insufficient heat dissipation.
发明内容SUMMARY OF THE INVENTION
本发明的目的是针对现有技术中的上述不足,提供了一种带有散热片的电源适配器。The purpose of the present invention is to provide a power adapter with a heat sink in view of the above deficiencies in the prior art.
本发明的目的通过以下技术方案实现:一种带有散热片的电源适配器,包括壳体以及设于壳体内的PCB板;所述PCB板的顶部设有第一散热片;所述PCB板的底部设有第二散热片;所述第一散热片的底部以及第二散热片的顶部均设有锁紧件;所述PCB板贯穿设有锁紧槽;所述锁紧件与锁紧槽连接;The object of the present invention is achieved through the following technical solutions: a power adapter with a heat sink, comprising a housing and a PCB board arranged in the housing; a first heat sink is provided on the top of the PCB board; The bottom is provided with a second heat sink; the bottom of the first heat sink and the top of the second heat sink are provided with locking pieces; the PCB board is provided with a locking groove; the locking piece and the locking groove connect;
所述第一散热片设有容置腔;所述第一散热片设有与容置腔连通的散热孔;所述第二散热片包括散热本体以及覆盖散热本体顶部的绝缘片;所述绝缘片的顶部设有导热片;所述导热片与PCB板的底部抵靠。The first heat sink is provided with an accommodating cavity; the first heat sink is provided with a heat dissipation hole communicating with the accommodating cavity; the second heat sink includes a heat dissipation body and an insulating sheet covering the top of the heat dissipation body; the insulation The top of the sheet is provided with a heat-conducting sheet; the heat-conducting sheet abuts against the bottom of the PCB board.
本发明进一步设置为,所述壳体包括下盖以及与下盖可拆卸连接的上盖;所述上盖设有密封圈。The present invention further provides that the housing includes a lower cover and an upper cover that is detachably connected to the lower cover; the upper cover is provided with a sealing ring.
本发明进一步设置为,所述散热孔设于第一散热片的顶部;所述第一散热片的侧部设有螺孔。In the present invention, the heat dissipation hole is further provided on the top of the first heat dissipation fin; the side part of the first heat dissipation fin is provided with screw holes.
本发明进一步设置为,所述第一散热片的数量为两个;两个第一散热片分别设于PCB板的两侧。According to the present invention, the number of the first heat sinks is two; the two first heat sinks are respectively arranged on both sides of the PCB board.
本发明进一步设置为,所述第一散热片的材料为金属铝板材。The present invention further provides that the material of the first heat sink is a metal aluminum plate.
本发明进一步设置为,所述绝缘片的材料为塑胶;所述导热片的材料为硅胶。The present invention further provides that the material of the insulating sheet is plastic; the material of the thermally conductive sheet is silica gel.
本发明进一步设置为,所述锁紧件包括插脚本体;所述插脚本体的一端延伸有相对设置的第一弹性臂以及第二弹性臂;所述第一弹性臂远离第二弹性臂的一侧设有第一卡块;所述第二弹性臂远离第一弹性臂的一侧设有第二卡块。According to the present invention, the locking member includes a plug-in body; one end of the plug-in body is extended with a first elastic arm and a second elastic arm oppositely arranged; the first elastic arm is away from the side of the second elastic arm A first clamping block is provided; a side of the second elastic arm away from the first elastic arm is provided with a second clamping block.
本发明进一步设置为,所述插脚本体设有铆接孔;所述插脚本体通过铆接孔与第一散热片以及第二散热片铆接。The present invention further provides that the plug-in body is provided with riveting holes; the plug-in body is riveted to the first heat sink and the second heat sink through the riveting holes.
本发明的有益效果:本发明通过在PCB板的顶部以及底部分别设置第一散热片以及第二散热片,从而能够有效地将PCB板上发热源的热量散发出去,防止电源适配器因高温而损坏。Beneficial effects of the present invention: the present invention can effectively dissipate the heat of the heat source on the PCB board by setting the first heat sink and the second heat sink on the top and bottom of the PCB board, preventing the power adapter from being damaged due to high temperature .
附图说明Description of drawings
利用附图对发明作进一步说明,但附图中的实施例不构成对本发明的任何限制,对于本领域的普通技术人员,在不付出创造性劳动的前提下,还可以根据以下附图获得其它的附图。The invention will be further described by using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. For those of ordinary skill in the art, under the premise of no creative work, other Attached.
图1是本发明的结构示意图;Fig. 1 is the structural representation of the present invention;
图2是本发明的结构分解图;Fig. 2 is the structure exploded view of the present invention;
图3是本发明第一散热片的结构示意图;3 is a schematic structural diagram of a first heat sink of the present invention;
图4是本发明第二散热片的结构示意图;4 is a schematic structural diagram of a second heat sink of the present invention;
图5是本发明第二散热片另一视角的结构示意图;5 is a schematic structural diagram of the second heat sink of the present invention from another perspective;
图6是本发明锁紧件的结构示意图;Fig. 6 is the structural representation of the locking member of the present invention;
其中:11、上盖;12、下盖;2、PCB板;3、第一散热片;31、容置腔; 32、散热孔;33、螺孔;4、第二散热片;41、散热本体;42、绝缘片;43、导热片;5、锁紧件;6、插脚本体;61、第一弹性臂;62、第二弹性臂;71、第一卡块;72、第二卡块;8、密封圈;9、铆接孔。Among them: 11, upper cover; 12, lower cover; 2, PCB board; 3, first heat sink; 31, accommodating cavity; 32, heat dissipation hole; 33, screw hole; 4, second heat sink; 41, heat dissipation body; 42, insulating sheet; 43, thermally conductive sheet; 5, locking piece; 6, plug-in body; 61, first elastic arm; 62, second elastic arm; 71, first block; 72, second block ; 8, sealing ring; 9, riveting hole.
具体实施方式Detailed ways
结合以下实施例对本发明作进一步描述。The present invention will be further described with reference to the following examples.
由图1至图6可知,本实施例所述的一种带有散热片的电源适配器,包括壳体以及设于壳体内的PCB板2;所述PCB板2的顶部设有第一散热片3;所述PCB板2的底部设有第二散热片4;所述第一散热片3的底部以及第二散热片4的顶部均设有锁紧件5;所述PCB板2贯穿设有锁紧槽;所述锁紧件5 与锁紧槽连接;其中图中并未画出锁紧槽;It can be seen from FIGS. 1 to 6 that a power adapter with a heat sink described in this embodiment includes a housing and a PCB board 2 arranged in the housing; the top of the PCB board 2 is provided with a
所述第一散热片3设有容置腔31;所述第一散热片3设有与容置腔31连通的散热孔32;所述第二散热片4包括散热本体41以及覆盖散热本体41顶部的绝缘片42;所述绝缘片42的顶部设有导热片43;所述导热片43与PCB 板2的底部抵靠。The
具体地,本实施例所述的带有散热片的电源适配器,PCB板2、第一散热片3以及第二散热片4均设于壳体内,第一散热片3通过锁紧件5锁紧在锁紧槽中,从而使得第一散热片3固定在PCB板2的顶部,使得PCB板2上的发热源放置在容置腔31内,并且使得PCB板2上的发热源与第一散热片3的内侧贴紧,从而起到散热的效果,另外通过第一散热片3设置散热孔32能够增加第一散热片3的散热效果;Specifically, in the power adapter with heat sink described in this embodiment, the PCB board 2 , the
其次,第二散热片4通过锁紧件5锁紧在锁紧槽中,从而使得第二散热片4固定在PCB板2的底部,导热片43与PCB板2上的发热源贴紧从而将热量传输至散热本体41起到散热的效果,另外,由于PCB板2的底部焊接有电子元件的引脚,故为了防止第二散热片4与电子元件发生短路的情况,故在散热本体41的顶部覆盖有绝缘片42。Secondly, the
本实施例所述的一种带有散热片的电源适配器,所述壳体包括下盖12以及与下盖12可拆卸连接的上盖11;所述上盖11设有密封圈8。上述设置便于壳体的拆装以及维修;密封圈8起到防水的作用。In the power adapter with cooling fins described in this embodiment, the housing includes a
本实施例所述的一种带有散热片的电源适配器,所述散热孔32设于第一散热片3的顶部;上述设置能够提高第一散热片3的散热效果;所述第一散热片3的侧部设有螺孔33。通过设置螺孔33便于第一散热片3与PCB板2上的发热源进行固定贴紧。In the power adapter with heat sinks described in this embodiment, the
本实施例所述的一种带有散热片的电源适配器,所述第一散热片3的数量为两个;两个第一散热片3分别设于PCB板2的两侧。上述设置能够进一步提高电源适配器的散热效果。In the power adapter with heat sinks described in this embodiment, the number of the
本实施例所述的一种带有散热片的电源适配器,所述第一散热片3的材料为金属铝板材。上述设置能够进一步提高电源适配器的散热效果。In the power adapter with heat sinks described in this embodiment, the material of the
本实施例所述的一种带有散热片的电源适配器,所述绝缘片42的材料为塑胶;所述导热片43的材料为硅胶。上述设置能够提高导热片43的导热效果。In the power adapter with a heat sink described in this embodiment, the material of the
本实施例所述的一种带有散热片的电源适配器,所述锁紧件5包括插脚本体6;所述插脚本体6的一端延伸有相对设置的第一弹性臂61以及第二弹性臂62;所述第一弹性臂61远离第二弹性臂62的一侧设有第一卡块71;所述第二弹性臂62远离第一弹性臂61的一侧设有第二卡块72。In the power adapter with cooling fins described in this embodiment, the
具体地,通过设置第一弹性臂61以及第二弹性臂62,使得锁紧件5在插入PCB板2的锁紧槽的过程中很顺利的插入,插入后通过第一弹性臂61的第一卡块71以及第二弹性臂62的第二卡块72进行回弹,从而第一卡块71以及第二卡块72能够牢牢扣住PCB板2的锁紧槽,而使整个产品在生产的过程中第一散热片3以及第二散热片4不会脱落移位。Specifically, by arranging the first
本实施例所述的一种带有散热片的电源适配器,所述插脚本体6设有铆接孔9;所述插脚本体6通过铆接孔9与第一散热片3以及第二散热片4铆接。上述设置便于生产制造。In the power adapter with heat sinks described in this embodiment, the socket body 6 is provided with riveting holes 9 ; the socket body 6 is riveted to the
最后应当说明的是,以上实施例仅用以说明本发明的技术方案,而非对本发明保护范围的限制,尽管参照较佳实施例对本发明作了详细地说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的实质和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that , the technical solutions of the present invention may be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.
Claims (8)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI784741B (en) * | 2021-10-06 | 2022-11-21 | 全漢企業股份有限公司 | Power adapter |
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| CN210641227U (en) * | 2019-07-26 | 2020-05-29 | 厦门台和电子有限公司 | Circuit board heat radiation structure of power adapter |
| CN212393136U (en) * | 2020-07-15 | 2021-01-22 | 东莞市大忠电子有限公司 | Power adapter with radiating fins |
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2020
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3061118U (en) * | 1999-01-29 | 1999-09-17 | 建準電機工業股▲分▼有限公司 | Heat radiator and its fixing member |
| JP2003124660A (en) * | 2001-10-12 | 2003-04-25 | Pfu Ltd | Electronic equipment cooling device |
| CN209776187U (en) * | 2019-01-14 | 2019-12-13 | 上海西埃新能源科技有限公司 | New energy automobile CDU trinity equipment |
| CN210641227U (en) * | 2019-07-26 | 2020-05-29 | 厦门台和电子有限公司 | Circuit board heat radiation structure of power adapter |
| CN212393136U (en) * | 2020-07-15 | 2021-01-22 | 东莞市大忠电子有限公司 | Power adapter with radiating fins |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI784741B (en) * | 2021-10-06 | 2022-11-21 | 全漢企業股份有限公司 | Power adapter |
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Application publication date: 20200922 |
