CN111698891A - Power adapter with radiating fins - Google Patents

Power adapter with radiating fins Download PDF

Info

Publication number
CN111698891A
CN111698891A CN202010680723.6A CN202010680723A CN111698891A CN 111698891 A CN111698891 A CN 111698891A CN 202010680723 A CN202010680723 A CN 202010680723A CN 111698891 A CN111698891 A CN 111698891A
Authority
CN
China
Prior art keywords
heat sink
heat
pcb board
power adapter
elastic arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010680723.6A
Other languages
Chinese (zh)
Inventor
邱福祥
李正中
李经伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Dazhong Electronics Co Ltd
Original Assignee
Dongguan Dazhong Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Dazhong Electronics Co Ltd filed Critical Dongguan Dazhong Electronics Co Ltd
Priority to CN202010680723.6A priority Critical patent/CN111698891A/en
Publication of CN111698891A publication Critical patent/CN111698891A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/02Conversion of AC power input into DC power output without possibility of reversal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明涉及电源适配器技术领域,具体涉及一种带有散热片的电源适配器,包括壳体以及设于壳体内的PCB板;所述PCB板的顶部设有第一散热片;所述PCB板的底部设有第二散热片;所述第一散热片的底部以及第二散热片的顶部均设有锁紧件;所述PCB板贯穿设有锁紧槽;所述锁紧件与锁紧槽连接;所述第一散热片设有容置腔;所述第一散热片设有散热孔;所述第二散热片包括散热本体以及覆盖散热本体顶部的绝缘片;所述绝缘片的顶部设有导热片;所述导热片与PCB板的底部抵靠。本发明通过在PCB板的顶部以及底部分别设置第一散热片以及第二散热片,从而能够有效地将PCB板上发热源的热量散发出去,防止电源适配器因高温而损坏。

Figure 202010680723

The invention relates to the technical field of power adapters, in particular to a power adapter with heat sinks, comprising a casing and a PCB board arranged in the casing; the top of the PCB board is provided with a first heat sink; The bottom is provided with a second heat sink; the bottom of the first heat sink and the top of the second heat sink are provided with locking pieces; the PCB board is provided with a locking groove; the locking piece and the locking groove connection; the first heat sink is provided with a accommodating cavity; the first heat sink is provided with a heat dissipation hole; the second heat sink includes a heat dissipation body and an insulating sheet covering the top of the heat dissipation body; the top of the insulating sheet is provided with There is a heat-conducting sheet; the heat-conducting sheet abuts against the bottom of the PCB board. In the present invention, the first heat sink and the second heat sink are respectively arranged on the top and bottom of the PCB board, thereby effectively dissipating the heat of the heat source on the PCB board and preventing the power adapter from being damaged due to high temperature.

Figure 202010680723

Description

一种带有散热片的电源适配器A power adapter with heat sink

技术领域technical field

本发明涉及电源适配器技术领域,具体涉及一种带有散热片的电源适配器。The invention relates to the technical field of power adapters, in particular to a power adapter with heat sinks.

背景技术Background technique

目前电源适配器在工作的时侯部分电子元件都会或多或少的产生多余的热能,表现的现象即产品居部的电子元件温度升高,当温度上升到一定的高度后超过电子元件的极限温度此元件就会因温度过高而损坏以致整个产品也报废了。因此就需要散热装置把发热的电子元件中的热能导走,其中散热片就广泛的应用于电源及适配器中;而目前的电源适配器存在散热效果不足的问题。At present, some electronic components of the power adapter will generate excess heat energy more or less when the power adapter is working. This component will be damaged due to excessive temperature and the entire product will be scrapped. Therefore, a heat sink is required to dissipate the heat energy in the heat-generating electronic components, and heat sinks are widely used in power supplies and adapters; however, the current power adapters have the problem of insufficient heat dissipation.

发明内容SUMMARY OF THE INVENTION

本发明的目的是针对现有技术中的上述不足,提供了一种带有散热片的电源适配器。The purpose of the present invention is to provide a power adapter with a heat sink in view of the above deficiencies in the prior art.

本发明的目的通过以下技术方案实现:一种带有散热片的电源适配器,包括壳体以及设于壳体内的PCB板;所述PCB板的顶部设有第一散热片;所述PCB板的底部设有第二散热片;所述第一散热片的底部以及第二散热片的顶部均设有锁紧件;所述PCB板贯穿设有锁紧槽;所述锁紧件与锁紧槽连接;The object of the present invention is achieved through the following technical solutions: a power adapter with a heat sink, comprising a housing and a PCB board arranged in the housing; a first heat sink is provided on the top of the PCB board; The bottom is provided with a second heat sink; the bottom of the first heat sink and the top of the second heat sink are provided with locking pieces; the PCB board is provided with a locking groove; the locking piece and the locking groove connect;

所述第一散热片设有容置腔;所述第一散热片设有与容置腔连通的散热孔;所述第二散热片包括散热本体以及覆盖散热本体顶部的绝缘片;所述绝缘片的顶部设有导热片;所述导热片与PCB板的底部抵靠。The first heat sink is provided with an accommodating cavity; the first heat sink is provided with a heat dissipation hole communicating with the accommodating cavity; the second heat sink includes a heat dissipation body and an insulating sheet covering the top of the heat dissipation body; the insulation The top of the sheet is provided with a heat-conducting sheet; the heat-conducting sheet abuts against the bottom of the PCB board.

本发明进一步设置为,所述壳体包括下盖以及与下盖可拆卸连接的上盖;所述上盖设有密封圈。The present invention further provides that the housing includes a lower cover and an upper cover that is detachably connected to the lower cover; the upper cover is provided with a sealing ring.

本发明进一步设置为,所述散热孔设于第一散热片的顶部;所述第一散热片的侧部设有螺孔。In the present invention, the heat dissipation hole is further provided on the top of the first heat dissipation fin; the side part of the first heat dissipation fin is provided with screw holes.

本发明进一步设置为,所述第一散热片的数量为两个;两个第一散热片分别设于PCB板的两侧。According to the present invention, the number of the first heat sinks is two; the two first heat sinks are respectively arranged on both sides of the PCB board.

本发明进一步设置为,所述第一散热片的材料为金属铝板材。The present invention further provides that the material of the first heat sink is a metal aluminum plate.

本发明进一步设置为,所述绝缘片的材料为塑胶;所述导热片的材料为硅胶。The present invention further provides that the material of the insulating sheet is plastic; the material of the thermally conductive sheet is silica gel.

本发明进一步设置为,所述锁紧件包括插脚本体;所述插脚本体的一端延伸有相对设置的第一弹性臂以及第二弹性臂;所述第一弹性臂远离第二弹性臂的一侧设有第一卡块;所述第二弹性臂远离第一弹性臂的一侧设有第二卡块。According to the present invention, the locking member includes a plug-in body; one end of the plug-in body is extended with a first elastic arm and a second elastic arm oppositely arranged; the first elastic arm is away from the side of the second elastic arm A first clamping block is provided; a side of the second elastic arm away from the first elastic arm is provided with a second clamping block.

本发明进一步设置为,所述插脚本体设有铆接孔;所述插脚本体通过铆接孔与第一散热片以及第二散热片铆接。The present invention further provides that the plug-in body is provided with riveting holes; the plug-in body is riveted to the first heat sink and the second heat sink through the riveting holes.

本发明的有益效果:本发明通过在PCB板的顶部以及底部分别设置第一散热片以及第二散热片,从而能够有效地将PCB板上发热源的热量散发出去,防止电源适配器因高温而损坏。Beneficial effects of the present invention: the present invention can effectively dissipate the heat of the heat source on the PCB board by setting the first heat sink and the second heat sink on the top and bottom of the PCB board, preventing the power adapter from being damaged due to high temperature .

附图说明Description of drawings

利用附图对发明作进一步说明,但附图中的实施例不构成对本发明的任何限制,对于本领域的普通技术人员,在不付出创造性劳动的前提下,还可以根据以下附图获得其它的附图。The invention will be further described by using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. For those of ordinary skill in the art, under the premise of no creative work, other Attached.

图1是本发明的结构示意图;Fig. 1 is the structural representation of the present invention;

图2是本发明的结构分解图;Fig. 2 is the structure exploded view of the present invention;

图3是本发明第一散热片的结构示意图;3 is a schematic structural diagram of a first heat sink of the present invention;

图4是本发明第二散热片的结构示意图;4 is a schematic structural diagram of a second heat sink of the present invention;

图5是本发明第二散热片另一视角的结构示意图;5 is a schematic structural diagram of the second heat sink of the present invention from another perspective;

图6是本发明锁紧件的结构示意图;Fig. 6 is the structural representation of the locking member of the present invention;

其中:11、上盖;12、下盖;2、PCB板;3、第一散热片;31、容置腔; 32、散热孔;33、螺孔;4、第二散热片;41、散热本体;42、绝缘片;43、导热片;5、锁紧件;6、插脚本体;61、第一弹性臂;62、第二弹性臂;71、第一卡块;72、第二卡块;8、密封圈;9、铆接孔。Among them: 11, upper cover; 12, lower cover; 2, PCB board; 3, first heat sink; 31, accommodating cavity; 32, heat dissipation hole; 33, screw hole; 4, second heat sink; 41, heat dissipation body; 42, insulating sheet; 43, thermally conductive sheet; 5, locking piece; 6, plug-in body; 61, first elastic arm; 62, second elastic arm; 71, first block; 72, second block ; 8, sealing ring; 9, riveting hole.

具体实施方式Detailed ways

结合以下实施例对本发明作进一步描述。The present invention will be further described with reference to the following examples.

由图1至图6可知,本实施例所述的一种带有散热片的电源适配器,包括壳体以及设于壳体内的PCB板2;所述PCB板2的顶部设有第一散热片3;所述PCB板2的底部设有第二散热片4;所述第一散热片3的底部以及第二散热片4的顶部均设有锁紧件5;所述PCB板2贯穿设有锁紧槽;所述锁紧件5 与锁紧槽连接;其中图中并未画出锁紧槽;It can be seen from FIGS. 1 to 6 that a power adapter with a heat sink described in this embodiment includes a housing and a PCB board 2 arranged in the housing; the top of the PCB board 2 is provided with a first heat sink 3; the bottom of the PCB board 2 is provided with a second heat sink 4; the bottom of the first heat sink 3 and the top of the second heat sink 4 are provided with locking members 5; Locking groove; the locking piece 5 is connected with the locking groove; the locking groove is not shown in the figure;

所述第一散热片3设有容置腔31;所述第一散热片3设有与容置腔31连通的散热孔32;所述第二散热片4包括散热本体41以及覆盖散热本体41顶部的绝缘片42;所述绝缘片42的顶部设有导热片43;所述导热片43与PCB 板2的底部抵靠。The first heat sink 3 is provided with an accommodating cavity 31 ; the first heat sink 3 is provided with a heat dissipation hole 32 communicating with the accommodating cavity 31 ; the second heat sink 4 includes a heat dissipation body 41 and a cover heat dissipation body 41 The insulating sheet 42 on the top; the top of the insulating sheet 42 is provided with a thermally conductive sheet 43 ; the thermally conductive sheet 43 abuts against the bottom of the PCB board 2 .

具体地,本实施例所述的带有散热片的电源适配器,PCB板2、第一散热片3以及第二散热片4均设于壳体内,第一散热片3通过锁紧件5锁紧在锁紧槽中,从而使得第一散热片3固定在PCB板2的顶部,使得PCB板2上的发热源放置在容置腔31内,并且使得PCB板2上的发热源与第一散热片3的内侧贴紧,从而起到散热的效果,另外通过第一散热片3设置散热孔32能够增加第一散热片3的散热效果;Specifically, in the power adapter with heat sink described in this embodiment, the PCB board 2 , the first heat sink 3 and the second heat sink 4 are all arranged in the housing, and the first heat sink 3 is locked by the locking member 5 . In the locking groove, the first heat sink 3 is fixed on the top of the PCB board 2, so that the heat source on the PCB board 2 is placed in the accommodating cavity 31, and the heat source on the PCB board 2 and the first heat sink are The inner side of the fins 3 is closely attached, thereby achieving the effect of heat dissipation, and the heat dissipation effect of the first fins 3 can be increased by setting the cooling holes 32 through the first fins 3;

其次,第二散热片4通过锁紧件5锁紧在锁紧槽中,从而使得第二散热片4固定在PCB板2的底部,导热片43与PCB板2上的发热源贴紧从而将热量传输至散热本体41起到散热的效果,另外,由于PCB板2的底部焊接有电子元件的引脚,故为了防止第二散热片4与电子元件发生短路的情况,故在散热本体41的顶部覆盖有绝缘片42。Secondly, the second heat sink 4 is locked in the locking groove by the locking member 5, so that the second heat sink 4 is fixed on the bottom of the PCB board 2, and the heat conduction sheet 43 is in close contact with the heat source on the PCB board 2 so that the The heat is transmitted to the heat dissipation body 41 to dissipate heat. In addition, since the bottom of the PCB board 2 is welded with the pins of the electronic components, in order to prevent the short circuit between the second heat sink 4 and the electronic components, the heat dissipation body 41 is placed on the bottom of the heat dissipation body 41. The top is covered with insulating sheet 42 .

本实施例所述的一种带有散热片的电源适配器,所述壳体包括下盖12以及与下盖12可拆卸连接的上盖11;所述上盖11设有密封圈8。上述设置便于壳体的拆装以及维修;密封圈8起到防水的作用。In the power adapter with cooling fins described in this embodiment, the housing includes a lower cover 12 and an upper cover 11 detachably connected to the lower cover 12 ; the upper cover 11 is provided with a sealing ring 8 . The above arrangement is convenient for disassembly, assembly and maintenance of the casing; the sealing ring 8 plays a waterproof role.

本实施例所述的一种带有散热片的电源适配器,所述散热孔32设于第一散热片3的顶部;上述设置能够提高第一散热片3的散热效果;所述第一散热片3的侧部设有螺孔33。通过设置螺孔33便于第一散热片3与PCB板2上的发热源进行固定贴紧。In the power adapter with heat sinks described in this embodiment, the heat dissipation holes 32 are arranged on the top of the first heat sink 3; the above arrangement can improve the heat dissipation effect of the first heat sink 3; the first heat sink 3 The side of 3 is provided with screw holes 33 . By providing the screw holes 33 , it is convenient for the first heat sink 3 to be fixed and tightly attached to the heat source on the PCB board 2 .

本实施例所述的一种带有散热片的电源适配器,所述第一散热片3的数量为两个;两个第一散热片3分别设于PCB板2的两侧。上述设置能够进一步提高电源适配器的散热效果。In the power adapter with heat sinks described in this embodiment, the number of the first heat sinks 3 is two; the two first heat sinks 3 are respectively disposed on both sides of the PCB board 2 . The above arrangement can further improve the heat dissipation effect of the power adapter.

本实施例所述的一种带有散热片的电源适配器,所述第一散热片3的材料为金属铝板材。上述设置能够进一步提高电源适配器的散热效果。In the power adapter with heat sinks described in this embodiment, the material of the first heat sink 3 is a metal aluminum plate. The above arrangement can further improve the heat dissipation effect of the power adapter.

本实施例所述的一种带有散热片的电源适配器,所述绝缘片42的材料为塑胶;所述导热片43的材料为硅胶。上述设置能够提高导热片43的导热效果。In the power adapter with a heat sink described in this embodiment, the material of the insulating sheet 42 is plastic; the material of the heat conducting sheet 43 is silica gel. The above arrangement can improve the heat conduction effect of the heat conduction sheet 43 .

本实施例所述的一种带有散热片的电源适配器,所述锁紧件5包括插脚本体6;所述插脚本体6的一端延伸有相对设置的第一弹性臂61以及第二弹性臂62;所述第一弹性臂61远离第二弹性臂62的一侧设有第一卡块71;所述第二弹性臂62远离第一弹性臂61的一侧设有第二卡块72。In the power adapter with cooling fins described in this embodiment, the locking member 5 includes a plug-in body 6; one end of the plug-in body 6 is extended with a first elastic arm 61 and a second elastic arm 62 arranged oppositely The side of the first elastic arm 61 away from the second elastic arm 62 is provided with a first block 71 ; the side of the second elastic arm 62 away from the first elastic arm 61 is provided with a second block 72 .

具体地,通过设置第一弹性臂61以及第二弹性臂62,使得锁紧件5在插入PCB板2的锁紧槽的过程中很顺利的插入,插入后通过第一弹性臂61的第一卡块71以及第二弹性臂62的第二卡块72进行回弹,从而第一卡块71以及第二卡块72能够牢牢扣住PCB板2的锁紧槽,而使整个产品在生产的过程中第一散热片3以及第二散热片4不会脱落移位。Specifically, by arranging the first elastic arm 61 and the second elastic arm 62 , the locking member 5 can be inserted smoothly in the process of being inserted into the locking groove of the PCB board 2 . The blocking block 71 and the second blocking block 72 of the second elastic arm 62 are rebounded, so that the first blocking block 71 and the second blocking block 72 can be firmly fastened to the locking groove of the PCB board 2, so that the entire product can be produced during production. During the process, the first heat sink 3 and the second heat sink 4 will not fall off and displace.

本实施例所述的一种带有散热片的电源适配器,所述插脚本体6设有铆接孔9;所述插脚本体6通过铆接孔9与第一散热片3以及第二散热片4铆接。上述设置便于生产制造。In the power adapter with heat sinks described in this embodiment, the socket body 6 is provided with riveting holes 9 ; the socket body 6 is riveted to the first heat sink 3 and the second heat sink 4 through the riveting holes 9 . The above arrangement is convenient for production.

最后应当说明的是,以上实施例仅用以说明本发明的技术方案,而非对本发明保护范围的限制,尽管参照较佳实施例对本发明作了详细地说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的实质和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that , the technical solutions of the present invention may be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims (8)

1.一种带有散热片的电源适配器,其特征在于:包括壳体以及设于壳体内的PCB板(2);所述PCB板(2)的顶部设有第一散热片(3);所述PCB板(2)的底部设有第二散热片(4);所述第一散热片(3)的底部以及第二散热片(4)的顶部均设有锁紧件(5);所述PCB板(2)贯穿设有锁紧槽;所述锁紧件(5)与锁紧槽连接;1. A power adapter with a heat sink, characterized in that: it comprises a housing and a PCB board (2) arranged in the housing; the top of the PCB board (2) is provided with a first heat sink (3); The bottom of the PCB board (2) is provided with a second heat sink (4); the bottom of the first heat sink (3) and the top of the second heat sink (4) are provided with locking pieces (5); A locking groove is provided through the PCB board (2); the locking member (5) is connected with the locking groove; 所述第一散热片(3)设有容置腔(31);所述第一散热片(3)设有与容置腔(31)连通的散热孔(32);所述第二散热片(4)包括散热本体(41)以及覆盖散热本体(41)顶部的绝缘片(42);所述绝缘片(42)的顶部设有导热片(43);所述导热片(43)与PCB板(2)的底部抵靠。The first radiating fin (3) is provided with an accommodating cavity (31); the first radiating fin (3) is provided with a radiating hole (32) communicating with the accommodating cavity (31); the second radiating fin (4) comprising a heat dissipation body (41) and an insulating sheet (42) covering the top of the heat dissipation body (41); the top of the insulating sheet (42) is provided with a heat conducting sheet (43); the heat conducting sheet (43) is connected to the PCB The bottom of the plate (2) abuts. 2.根据权利要求1所述的一种带有散热片的电源适配器,其特征在于:所述壳体包括下盖(12)以及与下盖(12)可拆卸连接的上盖(11);所述上盖(11)设有密封圈(8)。2. The power adapter with heat sink according to claim 1, wherein the housing comprises a lower cover (12) and an upper cover (11) detachably connected to the lower cover (12); The upper cover (11) is provided with a sealing ring (8). 3.根据权利要求1所述的一种带有散热片的电源适配器,其特征在于:所述散热孔(32)设于第一散热片(3)的顶部;所述第一散热片(3)的侧部设有螺孔(33)。3. A power adapter with a heat sink according to claim 1, characterized in that: the heat dissipation hole (32) is arranged on the top of the first heat sink (3); the first heat sink (3) ) is provided with a screw hole (33) on the side. 4.根据权利要求1所述的一种带有散热片的电源适配器,其特征在于:所述第一散热片(3)的数量为两个;两个第一散热片(3)分别设于PCB板(2)的两侧。4. A power adapter with heat sinks according to claim 1, characterized in that: the number of the first heat sinks (3) is two; the two first heat sinks (3) are respectively arranged in Both sides of the PCB board (2). 5.根据权利要求1所述的一种带有散热片的电源适配器,其特征在于:所述第一散热片(3)的材料为金属铝板材。5 . The power adapter with heat sinks according to claim 1 , wherein the material of the first heat sink ( 3 ) is a metal aluminum plate. 6 . 6.根据权利要求1所述的一种带有散热片的电源适配器,其特征在于:所述绝缘片(42)的材料为塑胶;所述导热片(43)的材料为硅胶。6 . The power adapter with heat sink according to claim 1 , wherein the insulating sheet ( 42 ) is made of plastic; the thermal conductive sheet ( 43 ) is made of silica gel. 7 . 7.根据权利要求1所述的一种带有散热片的电源适配器,其特征在于:所述锁紧件(5)包括插脚本体(6);所述插脚本体(6)的一端延伸有相对设置的第一弹性臂(61)以及第二弹性臂(62);所述第一弹性臂(61)远离第二弹性臂(62)的一侧设有第一卡块(71);所述第二弹性臂(62)远离第一弹性臂(61)的一侧设有第二卡块(72)。7 . The power adapter with heat sink according to claim 1 , wherein the locking member ( 5 ) comprises a plug-in body ( 6 ); one end of the plug-in body ( 6 ) extends with opposite A first elastic arm (61) and a second elastic arm (62) are provided; a first clamping block (71) is provided on the side of the first elastic arm (61) away from the second elastic arm (62); the A second blocking block (72) is provided on the side of the second elastic arm (62) away from the first elastic arm (61). 8.根据权利要求1所述的一种带有散热片的电源适配器,其特征在于:所述插脚本体(6)设有铆接孔(9);所述插脚本体(6)通过铆接孔(9)与第一散热片(3)以及第二散热片(4)铆接。8. The power adapter with heat sink according to claim 1, characterized in that: the plug-in body (6) is provided with a riveting hole (9); the plug-in body (6) passes through the riveting hole (9). ) are riveted to the first heat sink (3) and the second heat sink (4).
CN202010680723.6A 2020-07-15 2020-07-15 Power adapter with radiating fins Pending CN111698891A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010680723.6A CN111698891A (en) 2020-07-15 2020-07-15 Power adapter with radiating fins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010680723.6A CN111698891A (en) 2020-07-15 2020-07-15 Power adapter with radiating fins

Publications (1)

Publication Number Publication Date
CN111698891A true CN111698891A (en) 2020-09-22

Family

ID=72485985

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010680723.6A Pending CN111698891A (en) 2020-07-15 2020-07-15 Power adapter with radiating fins

Country Status (1)

Country Link
CN (1) CN111698891A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI784741B (en) * 2021-10-06 2022-11-21 全漢企業股份有限公司 Power adapter

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3061118U (en) * 1999-01-29 1999-09-17 建準電機工業股▲分▼有限公司 Heat radiator and its fixing member
JP2003124660A (en) * 2001-10-12 2003-04-25 Pfu Ltd Electronic equipment cooling device
CN209776187U (en) * 2019-01-14 2019-12-13 上海西埃新能源科技有限公司 New energy automobile CDU trinity equipment
CN210641227U (en) * 2019-07-26 2020-05-29 厦门台和电子有限公司 Circuit board heat radiation structure of power adapter
CN212393136U (en) * 2020-07-15 2021-01-22 东莞市大忠电子有限公司 Power adapter with radiating fins

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3061118U (en) * 1999-01-29 1999-09-17 建準電機工業股▲分▼有限公司 Heat radiator and its fixing member
JP2003124660A (en) * 2001-10-12 2003-04-25 Pfu Ltd Electronic equipment cooling device
CN209776187U (en) * 2019-01-14 2019-12-13 上海西埃新能源科技有限公司 New energy automobile CDU trinity equipment
CN210641227U (en) * 2019-07-26 2020-05-29 厦门台和电子有限公司 Circuit board heat radiation structure of power adapter
CN212393136U (en) * 2020-07-15 2021-01-22 东莞市大忠电子有限公司 Power adapter with radiating fins

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI784741B (en) * 2021-10-06 2022-11-21 全漢企業股份有限公司 Power adapter

Similar Documents

Publication Publication Date Title
WO2008122220A1 (en) Shielding and heat-dissipating device
TWI607675B (en) Dc/dc power module and dc/dc power system assembly
CN207067638U (en) Heat exchanger and projection equipment
CN212393136U (en) Power adapter with radiating fins
CN206564724U (en) A kind of cooling circuit board, circuit board assemblies and electronic equipment
CN111698891A (en) Power adapter with radiating fins
CN106877629A (en) A kind of power supply adaptor of pin radiating
CN108983537B (en) Heat exchanger and projection equipment
CN111863745B (en) A heat dissipation structure for medium integrated suspension line power amplifier
CN106469693A (en) Assembling structure of high-power semiconductor and radiator
CN209420245U (en) The copper aluminium mixing shielding case that embedded copper billet directly radiates
CN204834602U (en) Assembly structure of high-power semiconductor and heat sink
TW201436701A (en) Heat dissipating module
CN209420219U (en) Radiator and electronic equipment
CN209563078U (en) Cooling fins for servers with interchangeable cooling fins
CN205912405U (en) Heat radiation structure and hand -held device
CN116209146A (en) Heat dissipation device
CN211580514U (en) Heat dissipation device and electronic equipment
CN1972585A (en) Electronic device with double heat dissipation structure
CN210325764U (en) Semiconductor device and radiator combined device
CN211240248U (en) PCB convenient to connect
CN218783028U (en) A semiconductor cooling substrate
CN223613529U (en) Power adapter back chip heat dissipation structure
CN223157294U (en) A circuit board heat dissipation structure
CN223584567U (en) A heat dissipation system

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20200922