CN111698847B - 一种用于高频电路板层间精确定位的方法 - Google Patents
一种用于高频电路板层间精确定位的方法 Download PDFInfo
- Publication number
- CN111698847B CN111698847B CN202010602872.0A CN202010602872A CN111698847B CN 111698847 B CN111698847 B CN 111698847B CN 202010602872 A CN202010602872 A CN 202010602872A CN 111698847 B CN111698847 B CN 111698847B
- Authority
- CN
- China
- Prior art keywords
- substrate
- circuit board
- rivet
- hole
- circuit layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 11
- 238000005553 drilling Methods 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 38
- 239000011229 interlayer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010602872.0A CN111698847B (zh) | 2020-06-29 | 2020-06-29 | 一种用于高频电路板层间精确定位的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010602872.0A CN111698847B (zh) | 2020-06-29 | 2020-06-29 | 一种用于高频电路板层间精确定位的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111698847A CN111698847A (zh) | 2020-09-22 |
CN111698847B true CN111698847B (zh) | 2022-07-29 |
Family
ID=72484281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010602872.0A Active CN111698847B (zh) | 2020-06-29 | 2020-06-29 | 一种用于高频电路板层间精确定位的方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111698847B (zh) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4554831B2 (ja) * | 2001-02-13 | 2010-09-29 | ローム株式会社 | 個片基板の製造方法および個片基板並びに集合基板 |
JP4222394B2 (ja) * | 2006-08-22 | 2009-02-12 | 船井電機株式会社 | 表示画面旋回装置 |
CN201648553U (zh) * | 2010-04-13 | 2010-11-24 | 竞陆电子(昆山)有限公司 | 印刷电路板电镀用二次挂具的固定结构 |
CN102378492B (zh) * | 2010-08-19 | 2013-07-10 | 竞陆电子(昆山)有限公司 | 多层线路板的各层铆钉孔定位结构 |
CN103379750B (zh) * | 2012-04-27 | 2016-06-01 | 富葵精密组件(深圳)有限公司 | 多层电路板及其制作方法 |
CN202617563U (zh) * | 2012-05-22 | 2012-12-19 | 中国科学院西安光学精密机械研究所 | 一种线路板夹紧定位装置 |
CN205817368U (zh) * | 2016-07-22 | 2016-12-21 | 襄阳楚安科技实业有限公司 | 可调式定位工装 |
CN206440473U (zh) * | 2016-08-29 | 2017-08-25 | 湖北三江航天万山特种车辆有限公司 | 一种转向臂固定销座 |
JP2018120940A (ja) * | 2017-01-25 | 2018-08-02 | シャープ株式会社 | プリント配線基板 |
CN106879174B (zh) * | 2017-04-25 | 2019-05-10 | 安徽宏鑫电子科技有限公司 | 一种pcb |
CN107984552B (zh) * | 2017-12-23 | 2023-07-25 | 魏章河 | 门锁安装打孔定位器 |
CN210075841U (zh) * | 2019-03-11 | 2020-02-14 | 深圳市华力勤技术有限公司 | 一种用于pcb板的固定结构 |
CN210491299U (zh) * | 2019-05-06 | 2020-05-08 | 中山高木电子科技有限公司 | 一种便于连接的电路板 |
-
2020
- 2020-06-29 CN CN202010602872.0A patent/CN111698847B/zh active Active
Also Published As
Publication number | Publication date |
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CN111698847A (zh) | 2020-09-22 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Method for Accurate Interlayer Location of High Frequency Circuit Boards Effective date of registration: 20230105 Granted publication date: 20220729 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220729 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method for precise interlayer positioning of high-frequency circuit boards Granted publication date: 20220729 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980001767 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |