CN111688322A - Durable phenolic foam with low heat conductivity coefficient - Google Patents

Durable phenolic foam with low heat conductivity coefficient Download PDF

Info

Publication number
CN111688322A
CN111688322A CN202010576874.7A CN202010576874A CN111688322A CN 111688322 A CN111688322 A CN 111688322A CN 202010576874 A CN202010576874 A CN 202010576874A CN 111688322 A CN111688322 A CN 111688322A
Authority
CN
China
Prior art keywords
phenolic foam
durable
layer
clamping
plate body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010576874.7A
Other languages
Chinese (zh)
Inventor
房中华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Zhongchuang Technology Co ltd
Original Assignee
Zhejiang Zhongchuang Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Zhongchuang Technology Co ltd filed Critical Zhejiang Zhongchuang Technology Co ltd
Priority to CN202010576874.7A priority Critical patent/CN111688322A/en
Publication of CN111688322A publication Critical patent/CN111688322A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B32B2266/0285—Condensation resins of aldehydes, e.g. with phenols, ureas, melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/73—Hydrophobic

Landscapes

  • Laminated Bodies (AREA)

Abstract

The invention discloses durable phenolic foam with low thermal conductivity, which belongs to the technical field of phenolic foam. According to the invention, the clamping parts of different plate bodies are clamped in a sliding manner along the track of the clamping groove, the T-shaped structure ensures that the clamping structure is firm, the plate cannot be loosened up and down, the assembly is convenient, and the practical performance of the phenolic foam in the aspect of plate installation is improved.

Description

Durable phenolic foam with low heat conductivity coefficient
Technical Field
The invention relates to the technical field of phenolic foam, in particular to durable phenolic foam with low thermal conductivity.
Background
Phenolic foam insulation is often referred to as phenolic foam for short. The phenolic foam is a closed-cell rigid foam plastic prepared by scientifically mixing phenolic resin, a flame retardant, a smoke suppressant, a curing agent, a foaming agent, other auxiliaries and the like.
Patent No. CN109385040A discloses a phenolic foam board, which belongs to the technical field of building materials. Weighing the following components in parts by weight: 50-60 parts of phenolic resin, 10-25 parts of mixed foaming agent, 5-12 parts of mixed curing agent, 3-8 parts of surfactant and 5-10 parts of epoxidized soybean oil, mixing the phenolic resin and the mixed foaming agent in a stirrer, adding the mixed curing agent, the surfactant and the epoxidized soybean oil into the stirrer, stirring and mixing for 30-40 min at the temperature of 40-50 ℃ and the rotating speed of 300-400 r/min to obtain a mixed blank, injecting the mixed blank into a mold, curing for 2-3 h at the temperature of 180-185 ℃, and demolding to obtain the phenolic foam plate. The phenolic foam board obtained by the invention has excellent fracture resistance.
At present, the phenolic foam has certain defects in application technology: 1. the board made of the phenolic foam has poor practicability and is not easy to assemble; 2. the phenolic foam is easily affected by external factors such as external high temperature, external force abrasion and dampness, so that the service life of the phenolic foam is shortened and the phenolic foam is not durable.
Disclosure of Invention
The invention provides durable phenolic foam with low heat conductivity coefficient, which is characterized in that clamping parts of different plate bodies are clamped in a sliding manner along the track of a clamping groove, a T-shaped structure ensures that a clamping structure is firm and cannot be loosened up and down, the assembly is convenient, the practical performance of the phenolic foam in the aspect of plate installation is improved, a heat insulation plate A and a heat insulation plate B are additionally arranged at the upper end and the lower end of a phenolic foam layer, the heat insulation plate A and the heat insulation plate B are made of common plates, but a high-temperature resistant coating is coated outside the plates to insulate heat of equipment, the performances of wear resistance, water resistance, insulation and the like of the phenolic foam are improved, the service life of the phenolic foam is prolonged, the phenolic foam is more durable, and the problems in the.
The specific technical scheme provided by the invention is as follows:
the invention provides durable phenolic foam with low heat conductivity coefficient, which comprises a plate body, wherein the plate body comprises a phenolic foam layer, the upper surface of the phenolic foam layer is coated with an adhesive layer A, the upper end of the adhesive layer A is bonded with a heat insulation plate A, the lower surface of the phenolic foam layer is coated with an adhesive layer B, the lower end of the adhesive layer B is bonded with a heat insulation plate B, the outer surfaces of the heat insulation plate A and the heat insulation plate B are both coated with high temperature resistant coatings, the left side wall of the plate body is provided with a clamping groove, and the right side wall of the plate body is provided with a clamping part.
Optionally, cylindrical grooves are formed in the phenolic foam layer, and the cylindrical grooves are distributed in a rectangular array.
Optionally, the adhesive layer a and the adhesive layer B are both made of an organic silicon adhesive.
Optionally, the clamping groove is of a T-shaped structure, and the clamping portion is of a T-shaped structure.
Optionally, the high-temperature-resistant coating is made of HX-012 high-temperature-resistant paint.
The invention has the following beneficial effects:
1. the clamping structure is practical, convenient to operate and good in using effect, the clamping groove is formed in the plate body, the clamping portion is arranged on the right side of the plate body, the clamping groove and the clamping portion are both T-shaped structures, the clamping portion is matched with the clamping groove, the clamping portions of different plate bodies are clamped in a sliding mode along the track of the clamping groove, the T-shaped structures enable the clamping structure to be firm, the upper portion and the lower portion of the clamping structure cannot be loosened, assembly is convenient, and the practicability of phenolic foam in the aspect of plate installation is improved.
2. In the invention, the upper end and the lower end of the phenolic foam layer are added with the heat insulation board A and the heat insulation board B, the heat insulation board A and the heat insulation board B are made of common boards, but a layer of high temperature resistant coating is coated outside the boards, particularly HX-012 high temperature resistant coating is adopted, HX-012 high temperature resistant coating is a new material derived from space technology for heat insulation of spacecraft, and the product has the advantages of water resistance, fire resistance, corrosion resistance, wear resistance, insulation and the like, the coating is applied to the latest nano ceramic technology, the heat insulation efficiency can reach more than 90 percent, the product consists of high temperature adhesive, nano high temperature ceramic micro-beads, various high temperature fillers and special additives, can work in the high temperature environment of 1100 ℃ for heat insulation of equipment for long time, simultaneously improves the performances of wear resistance, water resistance, insulation and the like of the phenolic foam, and prolongs the service, making the phenolic foam more durable.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of the overall structure of a durable, low thermal conductivity phenolic foam of an embodiment of the present invention;
FIG. 2 is a schematic illustration of a phenolic foam layer structure of a durable, low thermal conductivity phenolic foam of an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a durable phenolic foam with low thermal conductivity according to an embodiment of the present invention;
in the figure: 1. a plate body; 101. a phenolic foam layer; 102. an adhesive layer A; 103. an adhesive layer B; 104. a heat insulation plate A; 105. a heat insulation board B; 2. a card slot; 3. a clamping part; 4. a cylindrical groove; 5. and (3) high-temperature resistant coating.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A durable, low thermal conductivity phenolic foam of an embodiment of the present invention will be described in detail with reference to fig. 1 to 3.
As shown in fig. 1-3, a durable phenolic foam with a low thermal conductivity coefficient, comprises a plate body 1, the plate body 1 comprises a phenolic foam layer 101, the upper surface of the phenolic foam layer 101 is coated with an adhesive layer a102, the upper end of the adhesive layer a102 is bonded with a thermal insulation board a104, the lower surface of the phenolic foam layer 101 is coated with an adhesive layer B103, the lower end of the adhesive layer B103 is bonded with a thermal insulation board B105, the outer surfaces of the thermal insulation board a104 and the thermal insulation board B105 are both coated with a high temperature resistant coating 5, the left side wall of the plate body 1 is provided with a clamping groove 2, and the right side wall of the plate body 1 is provided with a.
In the embodiment, as shown in fig. 1-3, the clamping groove 2 is arranged on the plate body 1, the clamping portion 3 is arranged on the right side of the plate body 1, the clamping groove 2 and the clamping portion 3 are both in a T-shaped structure, and the clamping portion 3 is matched with the clamping groove 2, so that the clamping portions 3 of different plate bodies 1 are slidably clamped along the track of the clamping groove 2, the T-shaped structure enables the clamping structure to be firm, the upper and lower looseness is avoided, the assembly is convenient, and the practicability of the phenolic foam in the aspect of plate installation is improved; the upper end and the lower end of the phenolic foam layer 101 are additionally provided with a heat insulation board A104 and a heat insulation board B105, the heat insulation board A104 and the heat insulation board B105 are made of common boards, but the exterior of the plate is coated with a high-temperature resistant coating 5, which is made of HX-012 high-temperature resistant coating, HX-012 high-temperature resistant coating is a new material derived from space technology for heat preservation and insulation of spacecraft, and has the advantages of water resistance, fire resistance, corrosion resistance, wear resistance, insulation and the like, the coating applies the latest nano ceramic technology, the heat insulation efficiency can reach more than 90 percent, the product consists of high-temperature binder, nano high-temperature ceramic microspheres, various high-temperature fillers and special additives, can work in a high-temperature environment of 1100 ℃ for a long time, insulates heat of equipment, meanwhile, the performances of wear resistance, water resistance, insulation and the like of the phenolic foam are improved, the service life of the phenolic foam is prolonged, and the phenolic foam is more durable.
The phenolic foam layer 101 is provided with cylindrical grooves 4, and the cylindrical grooves 4 are distributed in a rectangular array.
In this embodiment, as shown in fig. 2, the cylindrical groove 4 reduces the material usage of the phenolic foam layer 101, and saves resources.
The adhesive layer A102 and the adhesive layer B103 are both made of organic silicon adhesive.
In this embodiment, as shown in fig. 3, the silicone adhesive for forming the adhesive layer a102 and the adhesive layer B103 is a single-component, translucent paste-like room temperature curing adhesive, and is a high-performance elastomer obtained by natural curing. Has excellent cold and hot resistance, aging resistance and electric insulation performance, and has good adhesion to most of metal and non-metal materials.
The clamping groove 2 is of a T-shaped structure, and the clamping portion 3 is of a T-shaped structure.
In this embodiment, as shown in fig. 1, the clamping portion 3 is engaged with the clamping groove 2, and the T-shaped structure makes the clamping structure firm and not loose up and down.
Wherein, the high temperature resistant coating 5 is made of HX-012 high temperature resistant coating.
In the embodiment, as shown in fig. 3, the HX-012 type high-temperature resistant coating is a new material derived from a space technology for heat preservation and insulation of a spacecraft, and has various advantages of water resistance, fire resistance, corrosion resistance, wear resistance, insulation and the like.
The invention is to be noted that the durable phenolic foam with low heat conductivity coefficient is characterized in that when the phenolic foam is in use, the clamping groove 2 is arranged on the plate body 1, the clamping part 3 is arranged on the right side of the plate body 1, the clamping groove 2 and the clamping part 3 are both in T-shaped structures, and the clamping part 3 is matched with the clamping groove 2, so that the clamping parts 3 of different plate bodies 1 are clamped in a sliding manner along the track of the clamping groove 2, the T-shaped structures enable the clamping structures to be firm and not to be loosened up and down, the assembly is convenient, and the practicability of the phenolic foam in the aspect of plate installation is improved; the upper end and the lower end of the phenolic foam layer 101 are additionally provided with a heat insulation board A104 and a heat insulation board B105, the heat insulation board A104 and the heat insulation board B105 are made of common boards, but the exterior of the plate is coated with a high-temperature resistant coating 5, which is made of HX-012 high-temperature resistant coating, HX-012 high-temperature resistant coating is a new material derived from space technology for heat preservation and insulation of spacecraft, and has the advantages of water resistance, fire resistance, corrosion resistance, wear resistance, insulation and the like, the coating applies the latest nano ceramic technology, the heat insulation efficiency can reach more than 90 percent, the product consists of high-temperature binder, nano high-temperature ceramic microspheres, various high-temperature fillers and special additives, can work in a high-temperature environment of 1100 ℃ for a long time, insulates heat of equipment, meanwhile, the performances of wear resistance, water resistance, insulation and the like of the phenolic foam are improved, the service life of the phenolic foam is prolonged, and the phenolic foam is more durable.
The plate body 1 of the present invention; a phenolic foam layer 101; adhesive layer a 102; an adhesive layer B103; a heat insulation board A104; a heat insulation board B105; a card slot 2; a clip portion 3; a cylindrical groove 4; the parts of the refractory coating 5 are all standard parts or parts known to the person skilled in the art, the structure and the principle of which are known to the person skilled in the art by means of technical manuals or by means of routine experimentation.
It will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention without departing from the spirit or scope of the embodiments of the invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to encompass such modifications and variations.

Claims (5)

1. The utility model provides a low coefficient of thermal conductivity's of durable type phenolic foam, includes plate body (1), its characterized in that, plate body (1) is including phenolic foam layer (101), phenolic foam layer (101) upper surface is scribbled viscose layer A (102), viscose layer A (102) upper end bonds there is heat insulating board A (104), phenolic foam layer (101) lower surface is scribbled viscose layer B (103), viscose layer B (103) lower extreme bonds there is heat insulating board B (105), heat insulating board A (104) and heat insulating board B (105) surface all are scribbled high temperature resistant coating (5), draw-in groove (2) have been seted up to plate body (1) left side wall, and joint portion (3) have been seted up to plate body (1) right side wall.
2. The durable phenolic foam with low thermal conductivity according to claim 1, wherein the phenolic foam layer (101) is provided with cylindrical grooves (4), and the cylindrical grooves (4) are distributed in a rectangular array.
3. The durable low thermal conductivity phenolic foam of claim 1, wherein the adhesive layer a (102) and the adhesive layer B (103) are both made of silicone adhesive.
4. The durable phenolic foam with low thermal conductivity according to claim 1, wherein the clamping grooves (2) are of a T-shaped structure, and the clamping portions (3) are of a T-shaped structure.
5. A durable phenolic foam with low thermal conductivity according to claim 1, wherein the high temperature resistant coating (5) is made of HX-012 high temperature resistant paint.
CN202010576874.7A 2020-06-23 2020-06-23 Durable phenolic foam with low heat conductivity coefficient Pending CN111688322A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010576874.7A CN111688322A (en) 2020-06-23 2020-06-23 Durable phenolic foam with low heat conductivity coefficient

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010576874.7A CN111688322A (en) 2020-06-23 2020-06-23 Durable phenolic foam with low heat conductivity coefficient

Publications (1)

Publication Number Publication Date
CN111688322A true CN111688322A (en) 2020-09-22

Family

ID=72483030

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010576874.7A Pending CN111688322A (en) 2020-06-23 2020-06-23 Durable phenolic foam with low heat conductivity coefficient

Country Status (1)

Country Link
CN (1) CN111688322A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118024703A (en) * 2024-03-14 2024-05-14 江苏科强新材料股份有限公司 A high temperature resistant phenolic resin base plate and its preparation process

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0596674A (en) * 1991-10-09 1993-04-20 Ig Tech Res Inc Composite board
CN101343915A (en) * 2007-07-09 2009-01-14 四川威尔达化工有限公司 Foaming ceramic micro-ball heat preservation heat insulation fire-proof slab and producing method thereof
CN202466863U (en) * 2012-02-24 2012-10-03 陈伟 High-temperature-resistant phenolic foam composite thermal-insulating body
CN104563317A (en) * 2014-08-29 2015-04-29 霍山捷成科技发展有限公司 Phenolic foam board
CN205344017U (en) * 2015-12-25 2016-06-29 广西丰林木业集团股份有限公司 Phenolic foam presss from both sides core flame -retardant composite board
CN210342659U (en) * 2019-06-03 2020-04-17 金鑫 Building heat preservation template

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0596674A (en) * 1991-10-09 1993-04-20 Ig Tech Res Inc Composite board
CN101343915A (en) * 2007-07-09 2009-01-14 四川威尔达化工有限公司 Foaming ceramic micro-ball heat preservation heat insulation fire-proof slab and producing method thereof
CN202466863U (en) * 2012-02-24 2012-10-03 陈伟 High-temperature-resistant phenolic foam composite thermal-insulating body
CN104563317A (en) * 2014-08-29 2015-04-29 霍山捷成科技发展有限公司 Phenolic foam board
CN205344017U (en) * 2015-12-25 2016-06-29 广西丰林木业集团股份有限公司 Phenolic foam presss from both sides core flame -retardant composite board
CN210342659U (en) * 2019-06-03 2020-04-17 金鑫 Building heat preservation template

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118024703A (en) * 2024-03-14 2024-05-14 江苏科强新材料股份有限公司 A high temperature resistant phenolic resin base plate and its preparation process

Similar Documents

Publication Publication Date Title
CN215211643U (en) Carbon fiber cloth composite board
CN210507870U (en) Heat-insulating board based on new material
JP7425435B2 (en) laminate
CN206616716U (en) External wall insulation
CN207846958U (en) A kind of insulation and decoration board mounting structure
CN110117992A (en) A kind of environmentally friendly fireproof thermal insulation plate of finishing
CN216639356U (en) Aerogel composite heat insulation film
CN108979055B (en) Novel heating floor and preparation process thereof
WO2019080978A1 (en) Insulating composite for insulation of buildings
CN214941211U (en) Heat-resistant creep ceramic polystyrene board
CN205116449U (en) High -strength composite building board
KR200347621Y1 (en) Composite sandwich panel with built-in steel plate support and insulation and insulation board
CN209128353U (en) A kind of thermally conductive uniform double faced adhesive tape
CN219158014U (en) A heated board for indoor quick assembly
CN219690947U (en) Assembled building wallboard
CN213897972U (en) Outer heat conduction prefabricated groove floor heating PC template
CN221346128U (en) Corner structure suitable for grid plate installation
CN209244136U (en) A kind of mortar coating suitable for oil resistance, moisture resistance and water resistance
CN217711200U (en) Composite heat-insulation wallboard structure
CN216195769U (en) Thermal-insulated connecting device is used to curtain
CN213227853U (en) Built-in kinking insulation board of automatic equipment in colliery
CN216007360U (en) Green environment-friendly insulation board
CN216373615U (en) Marble composite board with anti-seepage and blocking structure
CN220336330U (en) Heating decorative plate
CN214574905U (en) Rural assembled house heat preservation wall

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20200922

RJ01 Rejection of invention patent application after publication