CN111664733B - Heat abstractor of microchannel heat exchanger combined with heat pipe - Google Patents

Heat abstractor of microchannel heat exchanger combined with heat pipe

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Publication number
CN111664733B
CN111664733B CN202010420564.6A CN202010420564A CN111664733B CN 111664733 B CN111664733 B CN 111664733B CN 202010420564 A CN202010420564 A CN 202010420564A CN 111664733 B CN111664733 B CN 111664733B
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China
Prior art keywords
heat
heat exchanger
heat pipe
microchannel
substrate
Prior art date
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Application number
CN202010420564.6A
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Chinese (zh)
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CN111664733A (en
Inventor
叶嘉荣
莫松平
林潇晖
程东波
王智彬
陈颖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan New Power Electronics Co ltd
Original Assignee
Dongguan New Power Electronics Co ltd
Guangdong University of Technology
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Application filed by Dongguan New Power Electronics Co ltd, Guangdong University of Technology filed Critical Dongguan New Power Electronics Co ltd
Priority to CN202010420564.6A priority Critical patent/CN111664733B/en
Publication of CN111664733A publication Critical patent/CN111664733A/en
Application granted granted Critical
Publication of CN111664733B publication Critical patent/CN111664733B/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225—Microheat pipes

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses a heat dissipation device combining a micro-channel heat exchanger with a heat pipe, which mainly comprises the micro-channel heat exchanger, the heat pipe and a substrate. The micro-channel heat exchanger is composed of an upper part, a middle part and a lower part, the upper part and the lower part are heat pipe condensation section parts, the middle part is a micro-channel, and the two ends of the heat exchanger are respectively provided with an inlet and an outlet of a coolant. The device is applying gravity and heat pipe theory of operation and the outstanding radiating effect of microchannel, and the heat source passes through heat pipe transfer heat and carries out cooling to microchannel heat exchanger. The heat-exchange device combines the outstanding heat exchange performance of the heat pipe and the effective cooling effect of the micro-channel to form a heat-exchange device, fully absorbs heat of a heat source and is remarkably beneficial to the heat management technology so as to improve the comprehensive application of the cooled object.

Description

Heat abstractor of microchannel heat exchanger combined with heat pipe
Technical Field
The invention relates to the field of heat dissipation devices, in particular to a heat dissipation device combining a micro-channel heat exchanger with a heat pipe.
Background
With the rapid development of modern science and technology, many modern electronic devices generate a large amount of heat during operation, resulting in device damage, reduced reliability, and shortened lifetime. However, for many electronic devices, the problem of thermal management is very important, for example, LED lamps, and since the luminous efficiency of LED lamps is generally lower than 35%, the rest of LED lamps are emitted in the form of heat, and if a reasonable heat dissipation treatment cannot be obtained, the sustainability and reliability of LED lamps are greatly reduced.
The limitation of the traditional cooling method is that the electronic equipment in practical application cannot be well thermally managed in either an air cooling or liquid cooling mode. With the large number of micro-channels, research has shown that a cooling system using a micro-channel heat sink (MEMS) in combination with a coolant is the most efficient way to cool modern electronic devices. In recent years, MEMS technology has been developed and matured, and as it can make up for some of the drawbacks of the conventional heat sink, people pay more attention to the use of micro channels.
The heat pipe is a heat transfer element with high heat conducting performance, and transfers heat through evaporation and condensation of working medium in the fully-enclosed vacuum tube shell. The heat pipe technology is a new heat dissipation technology, fully utilizes the heat conduction principle and the rapid heat transfer property of the phase change medium, and has strong heat conduction capacity exceeding that of any known metal. In addition, the design and installation of the heat pipe are flexible, the heat pipe can be put into use in different occasions, and the heat pipe is a high-efficiency and environment-friendly heat conducting element.
Heat sinks have been developed to a great extent, and different devices have been used in many areas, but have not been perfected to date in terms of thermal management of high power electronics. Accordingly, there is a need in the art for further improvements and perfection.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a heat dissipation device combining a micro-channel heat exchanger with a heat pipe.
The aim of the invention is achieved by the following technical scheme:
A heat dissipating device combining a micro-channel heat exchanger with a heat pipe mainly comprises a substrate, a heat pipe group and a heat exchanger. The substrate is arranged on the heat source and contacts with the heat source to absorb heat. The heat exchanger is arranged above the base plate and is arranged in parallel with the base plate. The heat pipe group is arranged on the substrate, one end of the heat pipe group is connected and contacted with one side of the heat exchanger, and the other end of the heat pipe group is connected and contacted with the other side of the heat exchanger.
Specifically, the heat pipe group is formed by arranging a plurality of connecting substrates and heat pipes of a heat exchanger side by side, wherein the heat pipes comprise an evaporation section, a first transition section, a second transition section, a first condensation section and a second condensation section. The evaporation section is arranged on the substrate and fixedly connected with the substrate. The first condensation section is arranged on the side surface, close to the substrate, of the heat exchanger and is fixedly connected with the heat exchanger. The second condensation section is arranged on the other side surface of the heat exchanger far away from the substrate and is fixedly connected with the heat exchanger. One end of the first transition section is connected with one end of the evaporation section, the other end of the first transition section is connected with one end of the first condensation section, and the other end of the first condensation section is closed. One end of the second transition section is connected with the other end of the evaporator, the other end of the second transition section is connected with one end of the second condensation section, and the other end of the second condensation section is closed.
Specifically, the heat exchanger adopts a micro-channel heat exchanger, and comprises a heat exchanger body, a cooling liquid inlet, a cooling liquid outlet and a micro-channel. The cooling liquid inlet is arranged at one end of the heat exchanger body and is fixedly connected with the heat exchanger body, one end of the cooling liquid inlet is communicated with the outside, and the other end of the cooling liquid inlet is communicated with the inside of the heat exchanger body. The cooling liquid outlet is arranged at the other end of the heat exchanger body and fixedly connected with the heat exchanger body, one end of the cooling liquid outlet is communicated with the outside, and the other end of the cooling liquid outlet is communicated with the inside of the heat exchanger body. The micro-channel is curled in the heat exchanger body, one end of the micro-channel is connected with the cooling liquid inlet, and the other end of the micro-channel is connected with the cooling liquid outlet.
As a preferable scheme of the invention, the first transition section and the second transition section on one side of the adjacent heat pipes in the heat pipe group are arranged alternately.
As a preferable scheme of the invention, the first transition section and the second transition section are designed to be arc-shaped or semicircular structures.
As a preferable scheme of the invention, the curled shape of the micro-channel adopts a serpentine, back-shaped, spiral and zigzag structural design.
As a preferable scheme of the invention, the micro-channel is filled with water or nano-fluid as cooling liquid.
As a preferable scheme of the invention, the heat pipe is internally filled with a phase change material as a cooling working medium, and the phase change material is a mixture of water, paraffin, graphite powder and metal powder.
As a preferable scheme of the invention, the heat pipe adopts square pipe or round pipe structural design.
As a preferable scheme of the invention, the evaporation section is partially embedded or completely embedded in the substrate, so that the contact area with the substrate is increased.
As a preferable scheme of the invention, the condensing section is partially embedded or completely embedded in the heat exchanger, so that the contact area with the heat exchanger is increased.
The invention is installed on small heat exchanging occasion, and the heat source radiates heat under the device. The heat source and the heat conducting layer thereof can be adhered together through the heat conducting silicone grease, when the heat source starts to work, the heat dissipating capacity is increased so that the temperature rises along with the heat dissipating capacity, the heat pipe contacted with the heat source absorbs heat, the phase change working medium in the evaporation section of the heat pipe is evaporated from liquid to gas and is transferred to the condensation section of the heat pipe, the condensation section of the heat pipe is tightly contacted with the micro-channel heat exchanger, the micro-channel heat exchanger takes away the heat of the condensation section of the heat pipe through the flowing in and out of the cooling agent, the gas in the condensation section of the heat pipe is condensed into liquid, and the liquid is refluxed to the evaporation section of the heat pipe under the action of gravity, so that a closed circulation loop is formed, and the circulation is continued. The device has two use conditions, when the heat quantity of the heat source is small, the gas of the evaporation section of the heat pipe can only be transferred to the condensation section of the heat pipe which is close to the substrate, and when the heat quantity of the heat source is large, enough gas is generated, so that the gas of the evaporation section of the heat pipe can be transferred to the condensation sections of the heat pipes at two sides of the micro-channel heat exchanger to dissipate heat, the effect of double condensation sections is achieved, and more heat is effectively absorbed. The invention skillfully combines the micro-channel heat exchanger and the heat pipe, has the characteristics of compact structure, outstanding performance, high efficiency, environmental protection and the like, and can be put into use in occasions with small space and high power.
Compared with the prior art, the invention has the following advantages:
(1) The heat dissipation device of the micro-channel heat exchanger combined with the heat pipe adopts the direct contact of the heat source and the evaporation section of the heat pipe, thereby greatly improving the heat transfer effect and fully absorbing the heat of the heat source.
(2) When the heat quantity is large, the heat pipe and the micro-channel heat exchanger realize the effect of double condensation sections, which is also the effect obtained by the heat pipe combined with the long and short pipes, so that the cooling liquid of the micro-channel heat exchanger does not influence the heat exchange effect and the liquid is heated uniformly.
(3) The micro-channel heat exchanger of the heat dissipation device combining the micro-channel heat exchanger with the heat pipe has the advantages of extremely outstanding cooling effect on electronic equipment, extremely low thermal resistance and remarkable promotion of solving the problem of heat management, and the device is simple and practical, efficient and environment-friendly by combining the micro-channel heat exchanger with the heat pipe.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipating device of a microchannel heat exchanger combined with a heat pipe according to the present invention.
Fig. 2 is a perspective view of a heat dissipating device of a microchannel heat exchanger combined with a heat pipe according to the present invention.
Fig. 3 is a schematic structural diagram of a substrate and an evaporation section of a heat pipe provided by the present invention.
Fig. 4 is a side view of a heat dissipating device of a microchannel heat exchanger combined with a heat pipe according to the present invention.
Fig. 5 is a schematic diagram of the overall structure of the heat pipe according to the present invention.
Fig. 6 is a schematic view of the internal structure of the heat exchanger provided by the invention.
The reference numerals in the above figures illustrate:
1-heat exchanger, 2-coolant inlet, 3-coolant outlet, 4-base plate, 5/A-evaporation section, 6/(B 1 and B 2) -transition section, 7/(C 1 and C 2) -condensation section.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clear and clear, the present invention will be further described below with reference to the accompanying drawings and examples.
Example 1:
as shown in fig. 1 to 6, the present embodiment discloses a heat dissipating device combining a microchannel heat exchanger with a heat pipe, which has a simple and compact structure, low power consumption, and excellent heat exchange and heat dissipation effects, and provides an effective way for dissipating heat of high-power electronic devices.
The heat dissipation device for combining the micro-channel heat exchanger with the heat pipe comprises a substrate 4, an evaporation section 5 of the heat pipe is arranged at the top of the substrate 4, a heat source is arranged at the top of the substrate 4, condensation sections 7 of the heat pipe are arranged on the surfaces of the upper part and the lower part of the micro-channel heat exchanger 1, the transition sections 6 of the heat pipe are connected with the evaporation section 5 and the condensation sections 7 in a bending way, the heat pipes are uniformly distributed on the surfaces of the substrate 4 and the micro-channel heat exchanger 1, and a snake-shaped pipeline is arranged in the middle of the micro-channel heat exchanger 1 and provided with a coolant inlet and outlet pipeline.
The bottom surface of the heat source is provided with a heat conducting layer, and the effect of direct contact between the heat pipe evaporation section 5 and the heat conducting layer can be realized by the fact that the bottom surface of the heat conducting layer is attached to the top of the substrate 4 when the heat conducting glue is used;
The substrate 4 is balanced with the micro-channel heat exchanger 1, and the center point of the micro-channel heat exchanger 1 is symmetrical, and the micro-channel heat exchanger 1 is provided with a coolant inlet and a coolant outlet (a coolant inlet 2 and a coolant outlet 3), so that the length of the micro-channel heat exchanger 1 is slightly longer than that of the substrate 4;
The heat pipe is internally provided with a phase change working medium, so that the heat pipe has the effects of heating, evaporating, cooling and condensing, and when in use, the top of the base plate 4 can be directed downwards, and the working medium can form reflux after condensing under the action of gravity so as to realize circulation;
The transition section 6 of the heat pipe is 180 degrees in a bending form, and after a U-shaped structure is formed, the transition section 6 is fixedly connected with the evaporation section 5 and the condensation section 7 of the heat pipe on the substrate 4 through heat conducting glue respectively;
Optionally, the phase change material in the heat pipe is a mixture of water, paraffin, graphite powder and metal powder;
Optionally, the specifications and sizes of the substrate 4 and the micro-channel heat exchanger 1 are selected, and reasonable design and processing can be performed according to the requirements of a heat source;
optionally, the size and the number of the heat pipes are set according to actual requirements, and design processing is carried out under the principle of keeping uniform distribution and compact structure;
Optionally, the heat pipe may be made of different materials, such as copper, aluminum, stainless steel, etc., and the substrate 4 and the microchannel heat exchanger 1 may be made of materials with good heat conductivity, such as copper or aluminum, etc.;
Optionally, the liquid flowing into the microchannel heat exchanger 1 may be water or other coolants such as nanofluid;
Optionally, the micro-channel heat exchanger 1 has a serpentine internal micro-channel structure.
The integral heat dissipation device provided by the invention mainly comprises a substrate 4, a heat pipe and a micro-channel heat exchanger 1, wherein the substrate 4 and the micro-channel heat exchanger 1 are connected through the heat pipe. As shown in fig. 2, the upper and lower surfaces of the microchannel heat exchanger 1 are provided with condensing sections 7 of heat pipes and are regularly and uniformly distributed; the heat pipe evaporator section 5 is arranged on the top of the base plate 4 in fig. 3, and a heat source is arranged on the top of the base plate 4 in use, the heat radiator is shown in fig. 4 as a side view, which can show the compact structure and the uniform distribution of the heat pipes, the transition sections (B 1 and B 2) of the heat pipes are connected with the evaporator section A and the condenser section (C 1 and C 2) in a bending manner in fig. 5, the heat pipes are uniformly distributed on the surfaces of the base plate 4 and the micro-channel heat exchanger 1, and the micro-channel heat exchanger 1 is designed with a snake-shaped pipeline and a liquid inlet and outlet pipeline in the center part of the micro-channel heat exchanger 1 in fig. 6.
The specifications of the micro-channel heat exchanger 1, the substrate 4, the heat pipe and the like can be determined by corresponding calculation according to the actually required heat source.
When in use, the invention is arranged on a small heat exchange occasion, and the heat source dissipates heat under the device. The heat source and the heat conducting layer thereof can be adhered to the base plate 4 through the heat conducting silicone grease, when the heat source starts to work, the heat dissipating capacity is increased, so that the temperature rises along with the heat dissipating capacity, the heat pipe contacted with the heat source absorbs heat, the phase change working medium in the heat pipe evaporation section 5 is evaporated from liquid into gas and is transferred to the heat pipe condensation section 7, the heat pipe condensation section 7 is tightly contacted with the micro-channel heat exchanger 1, the micro-channel heat exchanger 1 takes away the heat of the heat pipe condensation section 7 through the flowing in and out of the cooling agent, the gas in the heat pipe condensation section 7 is condensed into liquid, and the liquid is returned to the heat pipe evaporation section 5 under the action of gravity, so that a closed circulation loop is formed, and the circulation is continued. The device has two use conditions, when the heat of a heat source is less, the gas of the heat pipe evaporation section 5 can only be transferred to the heat pipe condensation section 7 which is closer to the substrate 4, and when the heat of the heat source is greater, enough gas is generated, so that the gas of the heat pipe evaporation section 5 can be transferred to the heat pipe condensation sections 7 at two sides of the micro-channel heat exchanger 1 for heat dissipation, the effect of double condensation sections is achieved, and more heat is effectively absorbed. The invention skillfully combines the micro-channel heat exchanger 1 and the heat pipe, has the characteristics of compact structure, outstanding performance, high efficiency, environmental protection and the like, and can be put into use in occasions with small space and high power.
The above examples are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above examples, and any other changes, modifications, substitutions, combinations, and simplifications that do not depart from the spirit and principle of the present invention should be made in the equivalent manner, and the embodiments are included in the protection scope of the present invention.

Claims (8)

1.一种微通道换热器结合热管的散热装置，其特征在于，包括基板、热管组、以及换热器；所述基板设置在热源上，并与热源接触吸收热量；所述换热器设置在基板上方，并与基板平行设置；所述热管组设置在基板上，其一端与换热器的一侧连接接触，另一端与换热器的另一侧连接接触；1. A heat dissipation device combining a microchannel heat exchanger and a heat pipe, comprising a substrate, a heat pipe assembly, and a heat exchanger; the substrate being disposed on a heat source and in contact with the heat source to absorb heat; the heat exchanger being disposed above and parallel to the substrate; and the heat pipe assembly being disposed on the substrate, with one end of the heat pipe assembly connected to one side of the heat exchanger and the other end of the heat pipe assembly connected to the other side of the heat exchanger. 所述热管组由若干连接基板与换热器的热管并排设置而成，所述热管包括蒸发段、第一过渡段、第二过渡段、第一冷凝段、以及第二冷凝段；所述蒸发段设置在基板上，与基板固定连接；所述第一冷凝段设置在换热器靠近基板的侧面上，与换热器固定连接；所述第二冷凝段设置在换热器远离基板的另一侧面上，与换热器固定连接；所述第一过渡段的一端与蒸发段的一端连接，另一端与第一冷凝段的一端连接，第一冷凝段的另一端封闭；所述第二过渡段的一端与蒸发器的另一端连接，另一端与第二冷凝段的一端连接，第二冷凝段的另一端封闭；所述热管组内的相邻热管一侧的第一过渡段与第二过渡段相间设置；The heat pipe group is composed of a plurality of heat pipes connected to a substrate and a heat exchanger, and the heat pipes include an evaporation section, a first transition section, a second transition section, a first condensation section, and a second condensation section; the evaporation section is arranged on the substrate and fixedly connected to the substrate; the first condensation section is arranged on the side of the heat exchanger close to the substrate and fixedly connected to the heat exchanger; the second condensation section is arranged on the other side of the heat exchanger away from the substrate and fixedly connected to the heat exchanger; one end of the first transition section is connected to one end of the evaporation section, and the other end is connected to one end of the first condensation section, and the other end of the first condensation section is closed; one end of the second transition section is connected to the other end of the evaporator, and the other end is connected to one end of the second condensation section, and the other end of the second condensation section is closed; the first transition section and the second transition section on one side of adjacent heat pipes in the heat pipe group are alternately arranged; 所述第一过渡段与第二过渡段均采用弧形或半圆形结构设计。The first transition section and the second transition section are both designed with an arc or semicircular structure. 2.根据权利要求1所述的微通道换热器结合热管的散热装置，其特征在于，所述换热器采用微通道式换热器，包括换热器本体、冷却液入口、冷却液出口、以及微通道；所述冷却液入口设置在换热器本体的一端，并与换热器本体固定连接，冷却液入口的一端与外界连通，另一端与换热器本体内部连通；所述冷却液出口设置在换热器本体的另一端，并与换热器本体固定连接，冷却液出口的一端与外界连通，另一端与换热器本体内部连通；所述微通道卷曲设置在换热器本体内，其一端与冷却液入口连接，另一端与冷却液出口连接。2. The heat dissipation device of the microchannel heat exchanger combined with the heat pipe according to claim 1 is characterized in that the heat exchanger adopts a microchannel heat exchanger, including a heat exchanger body, a coolant inlet, a coolant outlet, and a microchannel; the coolant inlet is arranged at one end of the heat exchanger body and is fixedly connected to the heat exchanger body, one end of the coolant inlet is communicated with the outside world, and the other end is communicated with the inside of the heat exchanger body; the coolant outlet is arranged at the other end of the heat exchanger body and is fixedly connected to the heat exchanger body, one end of the coolant outlet is communicated with the outside world, and the other end is communicated with the inside of the heat exchanger body; the microchannel is curled and arranged in the heat exchanger body, one end of which is connected to the coolant inlet, and the other end is connected to the coolant outlet. 3.根据权利要求2所述的微通道换热器结合热管的散热装置，其特征在于，所述微通道的卷曲形状采用蛇形、回形、螺旋形、之字形的结构设计。3. The heat dissipation device of the microchannel heat exchanger combined with a heat pipe according to claim 2, wherein the curled shape of the microchannel adopts a serpentine, meandering, spiral, or zigzag structural design. 4.根据权利要求2所述的微通道换热器结合热管的散热装置，其特征在于，所述微通道内填充水或纳米流体作为冷却液。4. The heat dissipation device of the microchannel heat exchanger combined with a heat pipe according to claim 2, wherein the microchannel is filled with water or nanofluid as a coolant. 5.根据权利要求1所述的微通道换热器结合热管的散热装置，其特征在于，所述热管内填充相变材料作为冷却工质，该相变材料为水、石蜡与石墨粉、金属粉末组成的混合物。5. The heat dissipation device of the microchannel heat exchanger combined with a heat pipe according to claim 1, wherein the heat pipe is filled with a phase change material as a cooling medium, and the phase change material is a mixture of water, paraffin wax, graphite powder, and metal powder. 6.根据权利要求1所述的微通道换热器结合热管的散热装置，其特征在于，所述热管采用方管或圆管结构设计。6. The heat dissipation device of a microchannel heat exchanger combined with a heat pipe according to claim 1, wherein the heat pipe is designed with a square tube or a round tube structure. 7.根据权利要求1所述的微通道换热器结合热管的散热装置，其特征在于，所述蒸发段部分嵌入或完全嵌入基板内，增大与基板的接触面积。7. The heat dissipation device of a microchannel heat exchanger combined with a heat pipe according to claim 1, wherein the evaporation section is partially or completely embedded in the substrate to increase the contact area with the substrate. 8.根据权利要求1所述的微通道换热器结合热管的散热装置，其特征在于，所述第一冷凝段和第二冷凝段部分嵌入或完全嵌入换热器内，增大与换热器的接触面积。8. The heat dissipation device of a microchannel heat exchanger combined with a heat pipe according to claim 1, characterized in that the first condensation section and the second condensation section are partially or completely embedded in the heat exchanger to increase the contact area with the heat exchanger.
CN202010420564.6A 2020-05-18 2020-05-18 Heat abstractor of microchannel heat exchanger combined with heat pipe Active CN111664733B (en)

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CN111664733A CN111664733A (en) 2020-09-15
CN111664733B true CN111664733B (en) 2025-08-01

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CN112105231B (en) * 2020-09-18 2024-08-27 广东工业大学 A pulsating heat pipe blade server thermal management system
CN112762744B (en) * 2021-01-29 2024-07-23 西南交通大学 Electronic component pulsation and integral heat pipe coupling type air-cooled radiator and method
CN112797837B (en) * 2021-03-01 2025-01-28 衢州市鼎盛化工科技有限公司 A microchannel reboiler
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