CN111645271A - Injection mold for manufacturing basin stand structure of sound production device - Google Patents
Injection mold for manufacturing basin stand structure of sound production device Download PDFInfo
- Publication number
- CN111645271A CN111645271A CN202010534395.9A CN202010534395A CN111645271A CN 111645271 A CN111645271 A CN 111645271A CN 202010534395 A CN202010534395 A CN 202010534395A CN 111645271 A CN111645271 A CN 111645271A
- Authority
- CN
- China
- Prior art keywords
- frame structure
- tin
- top surface
- injection mold
- basin frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
Abstract
The invention relates to the technical field of acoustic element manufacturing, and discloses an injection mold for manufacturing a basin frame structure of a sound production device. The injection mold for manufacturing the basin frame structure of the sound production device comprises a mold body, wherein the top surface of the mold body is matched with the bottom wall of the basin frame structure in shape, and an avoiding groove is formed in the position, corresponding to the position of the bottom wall of the basin frame structure, of the top surface of the mold body, wherein the tin-plated bonding pad is arranged on the top surface of the mold body. According to the injection mold for manufacturing the sounding device basin frame structure, provided by the embodiment of the invention, when high-speed high-temperature injection is carried out, the tin-plated bonding pad and the mold are separated by the avoidance groove, so that the tin-plated layer of the tin-plated bonding pad can be prevented from being remelted due to high temperature during injection, the uniform thickness of the tin-plated layer is ensured, the spot welding state of the voice coil wire is good, and no noise is caused.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of acoustic element manufacturing, in particular to an injection mold for manufacturing a basin frame structure of a sound production device.
[ background of the invention ]
The sound generating device is widely applied to various electronic products in life and industry, and the performance of the sound generating device directly affects the functions of the electronic products with the sound generating device, so that the manufacturing process of the sound generating device is more and more emphasized.
The basin frame structure of the sound generating device in the prior art can be produced through a high-speed high-temperature injection molding process, a tinned pad connected with an electrode is placed on a mold base, and then the basin frame structure is manufactured through processes of mold closing, injection molding, pressure stabilization, cooling, mold stripping and the like. In this in-process, the tinning region and the mould direct contact of the tinning pad set up in the basin frame structure, because the temperature influence when moulding plastics, the remelting probably takes place for the tinning region, and then leads to the lead wire disconnection that tinning region thickness is inhomogeneous or with the voice coil loudspeaker voice coil, and then leads to the unable work of sound generating mechanism.
Therefore, it is necessary to provide an injection mold capable of ensuring that the tin plating layer is not reflowed under the conditions of high-speed and high-temperature injection molding process.
[ summary of the invention ]
The invention aims to provide an injection mold which can ensure that a tin coating of a basin frame structure of a sound production device is not remelted under a high-speed and high-temperature injection molding process.
In order to solve the above problems, an embodiment of the invention provides an injection mold for manufacturing a basin frame structure of a sound production device, which comprises a mold body, wherein the top surface of the mold body is matched with the bottom wall of the basin frame structure in shape, and an avoiding groove is arranged on the top surface of the mold body corresponding to a position of the bottom wall of the basin frame structure, which is provided with a tin-plated pad.
Further, the area of the avoiding groove is larger than the area of the tin plating area on the tin plating pad.
Further, the side wall of the avoiding groove is perpendicular to the top surface of the die body, and the top edge of the avoiding groove is located between the edge of the tin-plated soldering pan and the edge of the tin-plated area.
Further, the top surface of the avoiding groove is of a plane structure, and the vertical distance between the top surface of the avoiding groove and the top surface of the die body is larger than the tinning thickness of the tinning area.
Furthermore, it is 2, 2 to dodge the groove the position of dodging the groove respectively with the tin-plating pad that positive negative pole is connected.
Meanwhile, the invention also provides a basin frame structure, the basin frame structure is manufactured by adopting the injection mold, and the position of the tinned pad arranged on the basin frame structure corresponds to the position of the avoiding groove of the injection mold.
The invention has the beneficial effects that: the tinned pad that will be connected with the electrode is placed on the mould base, at the in-process of compound die, the position of tinned pad is aimed at to the groove of dodging that sets up on the top surface of mould body, form in the top of tinned pad and dodge the space, at this in-process, there is not direct contact in the tinned region of tinned pad and the top surface of mould body, consequently, the heat of mould transmission can not lead to the remelting of tinned region through the separation of dodging the space when moulding plastics, the regional thickness of tinning can not change, consequently, the tinned region can ensure that the lead wire and the tinned pad of voice coil loudspeaker voice coil are in good connected state, and then the production quality when.
[ description of the drawings ]
FIG. 1 is a perspective view of an injection mold provided by the present invention;
FIG. 2 is a schematic plan view of the top surface of the die body of the present invention;
FIG. 3 is a side view of the mold body clamp of the present invention;
FIG. 4 is a cross-sectional view of the mold body of the present invention closed;
FIG. 5 is an enlarged view of a portion of an avoidance slot of the present invention;
FIG. 6 is a top view of the frame structure of the present invention;
fig. 7 is a perspective view of the frame structure of the present invention.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention relates to an injection mold 100 for manufacturing a basin frame structure of a sound production device, which comprises a mold body 1, wherein the top surface 11 of the mold body 1 is matched with the bottom wall 21 of the basin frame structure 2 in shape, as shown in fig. 1 to 7. An avoiding groove 12 is arranged on the top surface 11 of the die body 1, and the position of the avoiding groove 12 corresponds to the position of the tinned bonding pad 3 arranged on the basin frame structure 2. During high-speed high-temperature injection molding, the tin-plated pad 3 connected with the electrode is placed on a mold base, the injection mold 100 provided by the invention is matched with the mold base, and the avoidance groove 12 after matching forms an avoidance space above the tin-plated pad 3.
Compared with the prior art, the tin plating area 31 with a certain thickness is formed on the surface of the tin plating pad 3 after the tin plating pad 3 is connected with the positive or negative lead of the voice coil lead through the tin plating layer, the tin plating thickness of the tin plating area 31 can ensure that the lead of the voice coil wire and the surface of the tin plating pad 3 form a path connection, and meanwhile, the tin plating layer does not waste tin plating materials due to too large thickness and occupy the internal space of the frame structure 2. In high-speed high-temperature injection molding, the injection mold 100 provided by the invention is matched with a mold base. An avoiding groove 12 is provided on the top surface 11 of the die body 1, and the position of the avoiding groove 12 corresponds to the tin plating region 31 on the tin plating pad 3. Therefore, the avoiding groove 12 forms an avoiding space with a certain air space above the tin plating region 31 for blocking heat transfer from the top surface 11 of the mold body 1 to the tin plating region 31 at the time of injection molding. The melting point of the tin plating material is about 270 ℃, the temperature during high-speed high-temperature injection molding is about 300 ℃, most heat during injection molding needs to be dissipated through conduction of the mold, and if the top surface 11 of the mold body 1 directly contacts the tin plating area 31, the tin plating layer of the tin plating area 31 is remelted, and the avoidance groove 12 is arranged on the top surface 11 of the mold body 1, and the avoidance groove 12 forms an avoidance space with a certain air interval above the tin plating area 31 and is used for preventing heat during injection molding from being transferred to the tin plating area 31 from the top surface 11 of the mold body 1. Can reduce the transmission of most heat from the top surface 11 of mould body 1 to tin-plated area 31, and then prevented the remelting of tin-plated layer, tin-plated area 31's thickness does not change and keeps even state, the lead wire of voice coil loudspeaker voice coil forms good route through tin-plated area 31 and tin-plated pad 3 and is connected this moment, the welding quality of tin-plated pad 3 and voice coil lead wire when having ensured moulding plastics, the yields when having increased basin frame structure 2 and having moulded plastics production has also ensured the quality of product when applying to other electronic equipment.
Implementation details of the present embodiment are specifically described below, and the following is provided only for ease of understanding and is not necessary for the present embodiment.
Specifically, the avoiding groove 12 is arranged on the top surface 11 of the die body 1, the covering area of the avoiding groove 12 can meet the requirement only by being larger than the welding area of the lead of the voice coil and the tin-plated pad 3, and when the die is used for injection molding, as long as the tin-plated layer of the partial tin-plated area is not remelted, the connection relation between the lead of the voice coil and the channel of the tin-plated pad 3 cannot be damaged. Preferably, in the present embodiment, the area of the relief groove 12 is larger than the area of all the tin plating regions 31 on the tin plating pad 3, thereby further ensuring the stability of the tin plating layer during injection molding.
Specifically, as shown in fig. 3 to 5, the area of the avoiding groove 12 is larger than the area of all the tin plating regions 31 on the tin plating pad 3, and at this time, the cross section of the avoiding groove 12 may have various selection modes as long as the interval of the avoiding space meets the requirement of heat insulation. The dome structure can be an arc dome structure, a polygonal structure formed by a plurality of line segments in a surrounding mode, or a shape formed by combining the line segments and an arc line. Preferably, in the present embodiment, the side wall 121 of the avoiding groove 12 is perpendicular to the top surface 11 of the mold body 1, the side wall 121 of the avoiding groove 12 intersects with the top surface 11 of the mold body 1 to form a top edge 122, and the top edge 122 is located in the non-tinned area 32 between the edge of the tinned pad 3 and the edge of the tinned area 31. The portion of the top surface 11 of the mold body 1 near the top edge 122 now abuts the un-tinned area 32 on the tinned pad 3, constraining the position of the tinned pad 3 during injection molding. When top edge 122 is closer to the edge of tin plating area 31, it is still possible to transfer heat to the tin plating layer of tin plating area 31, and then influence the thickness of the tin plating layer in tin plating area 31, as further optimization, can set up the position of top edge 122 at the edge position that is close to tin plating pad 3, and top edge 122 not only can retrain tin plating pad 3 this moment, has reduced the interference to the tin plating layer of tin plating area 31 as far as possible again simultaneously.
Specifically, when the side wall 121 of the avoiding groove 12 is perpendicular to the top surface 11 of the mold body 1, the avoiding groove top surface 123 may have various structural options, and may have an arc-shaped dome structure, a polygonal combination structure, or other shapes meeting the requirements. As a preferred option, in this embodiment, the avoiding groove top surface 123 adopts a planar structure, the planar structure is adopted to facilitate the processing of the avoiding groove 12, the control of the distance between the avoiding groove top surface 123 and the tin plating area 31 is facilitated, a suitable distance is set, it is ensured that the heat on the die body 1 does not affect the tin plating area 31, and the influence of uneven heat transfer of the complex structure on the tin plating area 31 is also avoided. It should be noted that the vertical distance between the avoiding groove top surface 123 and the top surface 11 of the die body 1 is greater than the tin plating thickness of the tin plating region 31, so that a clearance is ensured between the avoiding groove top surface 123 and the tin plating region 31.
Specifically, the number of the tin-plated pads 3 arranged on the frame structure 2 is 2, and the tin-plated pads 3 are respectively connected with the positive and negative electrodes of the voice coil leads. Therefore, in the present embodiment, the avoidance grooves 12 are provided at the positions corresponding to the 2 tin-plated pads 3, respectively, so as to ensure that the connections between the positive and negative electrodes of the voice coil lead and the tin-plated pads 3 are stable.
Meanwhile, the embodiment of the invention also provides a basin frame structure 2 manufactured by using the injection mold 100, wherein the basin frame structure 2 is provided with an accommodating groove 22, the tinned pad 3 is arranged in the accommodating groove 22, and the position of the accommodating groove 22 corresponds to the position of the avoiding groove 12 of the injection mold 100, namely the position of the tinned pad 3 arranged on the basin frame structure 2 corresponds to the position of the avoiding groove 12. When the frame structure 2 is manufactured using the injection mold 100, the tin-plated pads 3 are firmly embedded in the frame structure 2, while the tin-plated regions 31 on the tin-plated pads 3 are also well protected.
While the foregoing is directed to embodiments of the present invention, it will be understood by those skilled in the art that various changes may be made without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides an injection mold for making sound generating mechanism basin frame structure, includes the mould body, the top surface of mould body with the diapire shape adaptation of basin frame structure, its characterized in that: the top surface of the die body corresponds to the position of the bottom wall of the basin frame structure, which is provided with the tinning pad, is provided with an avoiding groove.
2. The injection mold for manufacturing the frame structure of the sound generating device according to claim 1, wherein: the area of the avoiding groove is larger than that of the tin plating area on the tin plating pad.
3. The injection mold for manufacturing the frame structure of the sound generating device according to claim 2, wherein: the side wall of the avoiding groove is perpendicular to the top surface of the die body, and the top edge of the avoiding groove is located between the edge of the tin-plated soldering pan and the edge of the tin-plated area.
4. The injection mold for manufacturing the frame structure of the sound generating device according to claim 3, wherein: the top surface of the avoiding groove is of a plane structure, and the vertical distance between the top surface of the avoiding groove and the top surface of the die body is larger than the tin plating thickness of the tin plating area.
5. The injection mold for manufacturing the frame structure of the sound generating device according to any one of claims 1 to 4, wherein: the number of the avoiding grooves is 2, and the positions of the avoiding grooves are respectively corresponding to the tinning bonding pads connected with the positive electrode and the negative electrode.
6. A basin frame structure, characterized in that the basin frame structure is manufactured by the injection mold according to any one of claims 1-5, and the position of the tinned bonding pad on the basin frame structure corresponds to the position of the avoiding groove of the injection mold.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010534395.9A CN111645271B (en) | 2020-06-12 | 2020-06-12 | Injection mold for manufacturing basin stand structure of sound production device |
| PCT/CN2020/096292 WO2021248511A1 (en) | 2020-06-12 | 2020-06-16 | Injection mold for manufacturing sound-producing device basket structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010534395.9A CN111645271B (en) | 2020-06-12 | 2020-06-12 | Injection mold for manufacturing basin stand structure of sound production device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111645271A true CN111645271A (en) | 2020-09-11 |
| CN111645271B CN111645271B (en) | 2022-04-29 |
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ID=72349346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010534395.9A Active CN111645271B (en) | 2020-06-12 | 2020-06-12 | Injection mold for manufacturing basin stand structure of sound production device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111645271B (en) |
| WO (1) | WO2021248511A1 (en) |
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| CN203840534U (en) * | 2014-04-30 | 2014-09-17 | 歌尔声学股份有限公司 | Loudspeaker module group |
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- 2020-06-16 WO PCT/CN2020/096292 patent/WO2021248511A1/en active Application Filing
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| JPS61268416A (en) * | 1985-05-23 | 1986-11-27 | Ryoden Kasei Co Ltd | Manufacture of resin-molded part |
| JPH1086171A (en) * | 1996-09-18 | 1998-04-07 | Mitsubishi Electric Corp | Method and apparatus for transfer mold |
| CN1574313A (en) * | 2003-06-06 | 2005-02-02 | 本田技研工业株式会社 | Resin encapsulated electronic component unit and method of manufacturing the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111645271B (en) | 2022-04-29 |
| WO2021248511A1 (en) | 2021-12-16 |
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