CN111641025B

CN111641025B - Antenna module and electronic equipment

Info

Publication number: CN111641025B
Application number: CN201910154765.3A
Authority: CN
Inventors: 贾玉虎
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-03-01
Filing date: 2019-03-01
Publication date: 2022-08-09
Anticipated expiration: 2039-03-01
Also published as: CN111641025A

Abstract

The application relates to an antenna module and electronic equipment, this antenna module includes: the antenna assembly comprises an antenna substrate, an active device and an antenna array, wherein the active device and the antenna array are arranged on the antenna substrate; the heat conducting component comprises a first heat conducting part and a second heat conducting part which are connected with each other, wherein the first heat conducting part is attached to the active device, and the second heat conducting part is attached to one side of the antenna substrate where the active device is located; the heat conducting component is used for transferring heat generated by the active device; the heat dissipation part is arranged on one side, deviating from the antenna substrate, of the heat conduction part and used for dissipating heat, heat dissipation of the antenna module can be balanced, heat dissipation efficiency is improved, and performance of the antenna is improved.

Description

Antenna module and electronic equipment

Technical Field

The application relates to the technical field of antennas, in particular to an antenna module and electronic equipment.

Background

With the development of wireless communication technology, 5G network technology has emerged. The 5G network, as a fifth generation mobile communication network, has a peak theoretical transmission speed of several tens of Gb per second, which is hundreds of times faster than the transmission speed of the 4G network. Therefore, the millimeter wave band having sufficient spectrum resources becomes one of the operating bands of the 5G communication system.

Because millimeter waves need to achieve Beam forming (Beam forming) through an antenna array in the millimeter wave antenna module, energy is concentrated in the communication direction to combat space loss during high frequency operation. However, since the antenna module usually includes active devices, such as a power amplifier and a low noise amplifier, the active devices have high power consumption, so that a large amount of heat is generated during operation, and if the heat dissipation effect is not good, the temperature of the antenna array is too high locally, which causes deformation of the antenna array, thereby affecting the performance of the antenna.

Disclosure of Invention

The embodiment of the application provides an antenna module and electronic equipment, can equalize the heat dissipation of antenna module, improves the radiating efficiency, improves the performance of antenna then.

An antenna module is applied to electronic equipment, the antenna module includes:

the antenna assembly comprises an antenna substrate, an active device and an antenna array, wherein the active device and the antenna array are arranged on the antenna substrate, the antenna array is used for transceiving millimeter wave signals, and the active device is connected with the antenna array and used for receiving and processing the millimeter wave signals;

a heat conductive member including a first heat conductive portion and a second heat conductive portion connected to each other, wherein the first heat conductive portion is attached to the active device, and the second heat conductive portion is attached to a side of the antenna substrate where the active device is located; the heat conducting component is used for transferring heat generated by the active device;

and the heat dissipation part is arranged on one side of the heat conduction part, which is deviated from the antenna substrate, and is used for dissipating the heat.

In addition, still provide an electronic equipment, including the above-mentioned antenna module of casing, the antenna module with casing fixed connection.

Above-mentioned antenna module and electronic equipment, through reasonable setting heat-conducting component and radiating part on the antenna module, its first heat-conducting portion can be with heat transfer to the second heat-conducting portion that active device produced, make the heat can evenly distributed at heat-conducting component, it has increased heat conduction area, heat-conduction efficiency has been improved, and through setting up the radiating part on leading-in part, the quick heat with on the heat-conducting component spreads out, can avoid the heat dissipation untimely, the high temperature makes the antenna array inflation and the plane degree problem that arouses, make the heat even diffusion that the active device produced, the radiating efficiency is improved, thereby reduce the influence of temperature to the antenna array performance.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of an electronic device in one embodiment;

FIG. 2 is an exploded view of an antenna module according to one embodiment;

FIG. 3 is a cross-sectional view of the antenna module of the embodiment of FIG. 2;

fig. 4 is an exploded view of an antenna module according to another embodiment;

FIG. 5 is a schematic cross-sectional view of the antenna module of the embodiment shown in FIG. 2;

fig. 6 is a schematic cross-sectional view of an antenna module according to another embodiment;

FIG. 7 is a schematic cross-sectional view of an antenna module according to yet another embodiment;

fig. 8 is a block diagram of a partial structure of a mobile phone related to an electronic device provided in an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element, and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, in an embodiment of the present application, an electronic device may include an antenna assembly 10 and a housing assembly 20. The antenna assembly 10 is mounted on the housing assembly 20. The housing assembly 20 may include a center frame and a rear cover, among other things. The middle frame can be a frame structure with a through hole. The middle frame can be accommodated in an accommodating space formed by the display screen and the rear cover. The back cover is used to form the outer contour of the electronic device. The rear cover may be integrally formed. In the forming process of the rear cover, structures such as a rear camera hole, a fingerprint identification module, an antenna assembly 10 mounting hole and the like can be formed on the rear cover. Wherein, the back lid can be behind the nonmetal for the lid, for example, the back lid can be behind the plastic, still for example the back lid can be behind the pottery lid. For another example, the rear cover may include a plastic portion and a metal portion, and the rear cover may be a rear cover structure in which the metal and the plastic cooperate with each other. Specifically, the metal part may be formed first, for example, a magnesium alloy substrate is formed by injection molding, and then plastic is injected on the magnesium alloy substrate to form a plastic substrate, so as to form a complete rear cover structure.

In one embodiment, the electronic Device may be a communication module including a Mobile phone, a tablet computer, a notebook computer, a palm top computer, a Mobile Internet Device (MID), a wearable Device (e.g., a smart watch, a smart bracelet, a pedometer, etc.), or other configurable antenna.

The antenna assembly of an embodiment of the present application is applied to an electronic Device, and in an embodiment, the electronic Device may be a communication module including a Mobile phone, a tablet computer, a notebook computer, a palm computer, a Mobile Internet Device (MID), a wearable Device (e.g., a smart watch, a smart bracelet, a pedometer, etc.), or other antenna assemblies.

As shown in fig. 2 and 3, in one embodiment, an antenna module includes an antenna assembly 10, a heat-conducting member 20, and a heat-dissipating member 30. Wherein:

the antenna assembly 10 includes an antenna substrate 110, and an active device 120 and an antenna array 130 disposed on the antenna substrate 110.

The antenna substrate 110 may be a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit). An antenna array 130 for transceiving millimeter-wave signals may be integrated on the antenna substrate 110, and an active device 120 for receiving and processing the millimeter-wave signals may also be integrated.

In an embodiment, the antenna substrate 110 may be a multi-layer board, and the antenna array 130 and the active device 120 are disposed on different planes of the antenna substrate 110. For example, the active device 120 may be integrated on the upper surface of the antenna substrate 110, and the antenna array 130 may be disposed on the lower surface of the antenna substrate 110 or disposed on an intermediate layer of the antenna substrate 110. Wherein, the upper surface and the lower surface are the surfaces of two opposite sides of the antenna substrate 110.

In this embodiment, the antenna substrate 110 is a small plate.

The antenna array 130 is used for transceiving millimeter wave signals. Millimeter waves refer to electromagnetic waves having a wavelength on the order of millimeters, and having a frequency of about 20GHz to about 300 GHz. The 3GPP has specified a list of frequency bands supported by 5G NR, the 5G NR spectrum range can reach 100GHz, and two frequency ranges are specified: frequency range 1(FR1), i.e. the sub-6 GHz band, and Frequency range 2(FR2), i.e. the millimeter wave band. Frequency range of FR 1: 450MHz-6.0GHz, with a maximum channel bandwidth of 100 MHz. The frequency range of FR2 is 24.25GHz-52.6GHz, and the maximum channel bandwidth is 400 MHz. The near 11GHz spectrum for 5G mobile broadband comprises: 3.85GHz licensed spectrum, for example: 28GHz (24.25-29.5GHz), 37GHz (37.0-38.6GHz), 39GHz (38.6-40GHz) and 14GHz unlicensed spectrum (57-71 GHz). The working frequency bands of the 5G communication system comprise three frequency bands of 28GHz, 39GHz and 60 GHz.

In an embodiment, antenna array 130 may be an antenna for processing millimeter wave signals may be implemented as a phased antenna array. The antenna array 130 for supporting millimeter wave communications may be an antenna array of patch antennas, dipole antennas, yagi antennas, beam antennas, or other suitable antenna elements.

The active device 120 is connected to the antenna array 130 for receiving and processing the millimeter wave signals. The active device 120 includes a power amplifier, a low noise amplifier, and the like, which have high power consumption. A certain amount of heat is generated when each active device is operated. In the embodiment of the present application, the active device 120 may be regarded as a heat source of the antenna module.

The heat conductive member 20 serves to transfer heat generated from the active device 120. The heat conduction member 20 includes a first heat conduction portion 210 and a second heat conduction portion 220 connected to each other, wherein the first heat conduction portion 210 and the second heat conduction portion 220 may be integrated or separated. When the first heat conduction portion 210 and the second heat conduction portion 220 are of a separate structure type, they can be fixedly connected by bonding, welding, or the like, and when they are fixedly connected, they can be fixedly connected by using a heat conduction material. For example, a heat conductive adhesive may be used for bonding, or a heat conductive flux may be used for welding. In the embodiment of the present application, the connection manner of the first heat conduction portion 210 and the second heat conduction portion 220 is not further limited.

In one embodiment, the active device 120 is disposed on the upper surface of the antenna substrate 110, a surface of the antenna substrate 110 on which the active device 120 is integrated may be referred to as a heat dissipation surface 120-1, and the heat dissipation surface 120-1 may be divided into a first region 120-1a and a second region 120-1 b. Here, the first region 120-1a may be understood as a region where the active device 120 is integrated, and the second region 120-1b may be understood as a region where the active device 120 is not integrated.

The first thermal conduction portion 210 is disposed in direct contact with the active device 120, and the first thermal conduction portion 210 is disposed on the active device 120, that is, the first thermal conduction portion 210 is attached to the active device 120. The first heat conducting portion 210 may be arranged at a side of the active device 120 facing away from the antenna substrate 110. That is, the first heat conduction portion 210 is correspondingly disposed above the first region 120-1a and spaced apart from the first region 120-1 a. The second heat conduction portion 220 is attached to one side of the antenna substrate 110 where the active device 120 is located, that is, the second heat conduction portion 220 is directly disposed in the second region 120-1b of the antenna substrate 110.

A heat dissipating member 30 disposed on a side of the heat conductive member 20 facing away from the antenna substrate 10, for dissipating the heat. In an embodiment, the heat dissipation component 30 may be a heat dissipation material such as a heat dissipation silicone or a stone grinding patch. The heat dissipating member 30 has a high planar thermal conductivity, and can uniformly diffuse heat absorbed from the heat conductive member 20 to the middle frame or the rear cover of the electronic device.

Above-mentioned antenna module, through reasonable setting heat-conducting component 20 and heat dissipation part 30 on antenna module 10, its first heat-conducting portion 210 can be with heat transfer to second heat-conducting portion 220 that active device 120 produced, make the heat can evenly distributed at heat-conducting component 20, it has increased the heat conduction area, heat-conduction efficiency has been improved, and through setting up heat dissipation part 30 on leading-in part, the quick heat diffusion away on the heat-conducting component 20, can avoid the heat dissipation untimely, the high temperature makes antenna array 130 inflation and the plane degree problem that arouses, make the heat even diffusion that active device 120 produced, improve the radiating efficiency, thereby reduce the influence of temperature to antenna array 130 performance.

In an embodiment, the first thermal conductive portion 210 is attached to at least one side of the active device 120 away from the antenna substrate 110, and an area of the first thermal conductive portion 210 projected on the antenna substrate 110 is smaller than or equal to an area of the active device 120 projected on the antenna substrate 110.

In an embodiment, the active devices 120 include individual active devices that may be packaged as an IC such that the active devices 120 are three-dimensional volumetric structures that include a plurality of package sides. For example, the first thermal conduction portion 210 may be attached to each package side of the active device 120, or to at least one package side of the active device 120.

Specifically, when the active device 120 is a rectangular parallelepiped, it includes six package side surfaces, including a first package side surface and a second package side surface that are opposite to each other, a third package side surface and a fourth package side surface that are opposite to each other, and a fifth package side surface and a sixth package side surface that are opposite to each other, where the sixth package side surface of the active device is attached to the antenna substrate 110.

In an embodiment, the first heat conducting portion 210 is U-shaped, and includes a first side surface and a second side surface opposite to each other, and a third side surface fixedly connected to the first side surface and the second side surface respectively. The first side, the second side, and the third side are respectively attached to three sides of the active device 120 that are not in contact with the antenna substrate 110, and the third side is disposed on a side of the active device 120 away from the antenna substrate 110. That is, the first side surface of the first heat conduction part 210 is attached to the first package side surface of the active device 120, the second side surface of the first heat conduction part 210 is attached to the second package side surface of the active device 120, the third side surface of the first heat conduction part 210 is attached to the fifth package side surface of the active device 120, and the area of the third side surface is smaller than that of the fifth package side surface.

Optionally, the first thermal conduction part 210 may further include a fourth side surface and/or a fifth side surface, wherein the fourth side surface of the first thermal conduction part 210 is attached to the third package side surface of the active device 120, and the fifth side surface of the first thermal conduction part 210 is attached to the fourth package side surface of the active device 120.

The shape of the first heat conduction portion 210 and the attachment method with the active device 120 may be set according to actual requirements, and the U-shaped first heat conduction portion 210 is merely an example, which is not intended to limit the present application.

In one embodiment, the heat conductive member 20 is made of a heat conductive material, and the heat conductive material includes any one of heat conductive plastic, heat conductive metal, heat conductive ceramic, and heat conductive graphite.

Specifically, the heat conducting member 20 is made of a heat conducting material, so that heat generated by the active device 120 can be better transferred from the first heat conducting portion 210 to the second heat conducting portion 220, and further diffused out through the heat dissipating member 30, thereby increasing the heat dissipating area 120-1, and improving heat transfer efficiency. It should be noted that the heat conducting member 20 can also be made of other heat conducting materials, such as heat conducting plastic, heat conducting metal, heat conducting ceramic and heat conducting graphite, which are only used for illustration and should not be taken as a limitation in the present application.

Optionally, the heat conducting material further has a certain dielectric constant, and on the basis of conducting heat, the electrical interference of the active device 120 can be effectively avoided.

In one embodiment, the heat conducting member 20 is bonded to the active device 120 and the antenna substrate 110 by a heat conducting adhesive, which forms a heat conducting adhesive layer. The thermal conductive adhesive layer can improve the thermal conduction between the thermal conductive member 20 and the active device 120, and also improve the thermal conduction between the thermal conductive member 20 and the antenna substrate 110, thereby improving the heat transfer efficiency.

Alternatively, the heat-conducting member 20 may be attached to the first region 120-1a of the antenna substrate 110 by soldering. The welding flux used in the welding mode is heat-conducting welding flux.

Alternatively, the heat conduction member 20 may be attached to the first region 120-1a of the antenna substrate 110 by a screw riveting method. Wherein, the screw that this screw riveting mode used is the heat conduction screw.

As shown in fig. 4 and 5, in an embodiment, the antenna module further includes a shielding member 40, where the shielding member 40 is disposed on the antenna substrate 110 and covers the active device 120, and is used for shielding signal interference acting on the active device 120. The shielding member 40 is a metal shielding cover. The metal shielding cover covers the active device 120, and a projected area of the metal shielding cover on the antenna substrate 110 is larger than an area of the active device 120 on the antenna substrate 110, so that the active device 120 can be completely covered. By providing a metal shielding cover on the antenna substrate 110, which can cover the active devices 120, interference of each of the active devices 120 with the antenna array 130 can be isolated, that is, the metal shielding cover is used to shield and protect electrical characteristics of the active devices in the active devices 120.

In one embodiment, the shielding member 40 may also be made of a metal heat conductive material, which can effectively transfer heat generated by the active device 120.

In an embodiment, when the antenna module is provided with the shielding member 40, the first thermal conduction portion 210 is disposed between the shielding member 40 and the active device 120 and attached to a side of the active device 120 facing the heat dissipation member 30, the second thermal conduction portion 220 is attached to the antenna substrate 110 on the side of the active device 120, and specifically, the second thermal conduction portion 220 is attached to the second region 120-1b of the heat dissipation surface 120-1 of the antenna substrate 110.

In an embodiment, the antenna module further includes a filling layer (not shown) disposed between the shielding member 40 and the first heat conduction portion 210. The filling layer is made of a heat conductive material, so that heat generated by the active device 120 can be better transferred to the first heat conduction portion 210 through the filling layer and the shielding member 40, and then diffused out through the heat dissipation member 30. Wherein, the heat conduction material can be heat conduction plastic, heat conduction metal, heat conduction ceramic, heat conduction graphite and the like.

It should be noted that the filling layer may be disposed entirely or partially between the shielding member 40 and the first heat conducting portion 210, that is, the filling layer may be formed by completely filling a heat conducting material in a gap between the shielding member 40 and the first heat conducting portion 210 to improve the heat conducting effect, or may be formed by partially filling a heat conducting material in a gap between the shielding member 40 and the first heat conducting portion 210 to form the filling layer.

In an embodiment, the shielding member 40 is provided with at least one slit (not shown), and the filling layer is connected to the first heat conducting portion through the slit. Specifically, the gap ensures good communication between the filler layer inside the shielding member 40 and the first heat conduction portion 210 outside the shielding member 40.

Specifically, the length of the gap may be equal to the height of the first heat conduction portion, or slightly higher than the height of the first heat conduction portion. When the length of the gap is higher than the height of the first heat conducting part, the heat dissipation gap is preset.

It should be noted that the number of the slits, the positions of the openings on the shielding member 40, and the sizes of the slits are not further limited in the embodiment of the present application, and can be set according to actual requirements.

As shown in fig. 6, optionally, the second heat conduction part 220 may also be disposed in the antenna substrate 110, that is, the second heat conduction part 220 may also be embedded in the antenna substrate 110. When the second heat conduction portion 220 is embedded in the antenna substrate 110, the second heat conduction portion 220 may extend to the entire antenna substrate 110, that is, the area of the second heat conduction portion 220 may be equal to the area of the antenna substrate 110. Of course, the area of the second heat conduction portion 220 may be smaller than the area of the antenna substrate 110. The heat conduction area can be increased by providing the second heat conduction portion 220, so as to improve the heat dissipation efficiency.

It should be noted that, no matter the second heat conduction portion 220 is attached to the second region 120-1b of the heat dissipation surface 120-1 of the antenna substrate 110 or embedded in the antenna substrate 110, the second heat conduction portion 220 is fixedly connected to the first heat conduction portion 210. When the second heat-conducting portion 220 is embedded in the antenna substrate 110, the first heat-conducting portion 210 can extend into the antenna substrate 110 and be fixedly connected to the second heat-conducting portion 220.

In an embodiment, the heat dissipation member 30 includes a first heat dissipation member 310 and a second heat dissipation member 320, the first heat dissipation member 310 is attached to the shielding member 40, and the second heat dissipation member 320 is attached to the heat conduction member 20 on the antenna substrate 110.

Specifically, the first heat sink member 310 is disposed on the shielding member 40, and is attached to the shielding member 40 on a side away from the antenna substrate 110. The area of the first heat sink member 310 projected onto the antenna substrate 110 is larger than the area of the shielding member 40 projected onto the antenna substrate 110. The second heat sink member 320 is disposed on the heat conductive member 20 on the antenna substrate 110, and is attached to the heat conductive member 20 on a side away from the antenna substrate 110. Meanwhile, the second heat sink member 320 may be attached to a sidewall of the shielding member 40. Further, the sum of the heights of the first heat sink member 310 and the shielding member 40 is equal to the height of the second heat sink member 320.

In the embodiment of the present application, both the heat conducting member 20 and the shielding member 40 have a function of heat transfer, and the heat dissipating member 30 is directly attached to the heat conducting member 20 and the shielding member 40, so that thermal relations between the heat conducting member 20 and the shielding member 40 and the heat dissipating member 30 are established, and heat generated by the active device 120 can be transferred to the heat dissipating member 30 through the heat conducting member 20 and the shielding member 40, so as to dissipate heat in the active device 120 region.

As shown in fig. 7, in an embodiment, the antenna module further includes an auxiliary heat dissipation layer 50, one side of the auxiliary heat dissipation layer 50 is attached to the heat dissipation member 30 far away from the antenna substrate 110, and the other side of the auxiliary heat dissipation layer 50 is disposed on a rear cover of the electronic device. The auxiliary heat dissipation layer 50 may be laminated on one side of the heat dissipation member 30 to enhance the heat dissipation performance of the heat dissipation member 30.

Among them, the auxiliary heat dissipation layer 50 may be provided to have higher thermal conductivity than the heat dissipation member 30, thereby improving heat dissipation performance. For example, the auxiliary heat dissipation layer 50 may be any one of graphite, copper, or aluminum, or may have a form of a combination thereof with each other. In addition, the auxiliary heat dissipation layer 50 may be a plate-shaped member, or may be formed as a mesh in which metal materials including at least one of aluminum and copper are stacked, or may be provided on one surface of the heat dissipation member 30 in whole or in part.

In this embodiment, when the auxiliary heat dissipation layer 50 is laminated on one surface of the heat dissipation member 30, the overall heat dissipation performance can be improved.

As shown in fig. 1, an embodiment of the present application further provides an electronic device, which includes a housing and the antenna module in any of the above embodiments, where the antenna module is fixedly connected to the housing. The antenna module is mounted on the housing assembly.

Wherein the housing may include a middle frame and a rear cover. The middle frame can be a frame structure with a through hole. The middle frame can be accommodated in an accommodating space formed by the display screen and the rear cover. The back cover is used to form the outer contour of the electronic device. The rear cover may be integrally formed. In the forming process of the rear cover, structures such as a rear camera hole, a fingerprint identification module, an antenna assembly mounting hole and the like can be formed on the rear cover. Wherein, the back lid can be behind the nonmetal for the lid, for example, the back lid can be behind the plastic, still for example the back lid can be behind the pottery lid. For another example, the rear cover may include a plastic portion and a metal portion, and the rear cover may be a metal and plastic cooperating rear cover structure. Specifically, the metal part may be formed first, for example, a magnesium alloy substrate is formed by injection molding, and then plastic is injected on the magnesium alloy substrate to form a plastic substrate, so as to form a complete rear cover structure.

The antenna module is arranged in the electronic equipment, so that heat generated by the active device can be transmitted to the middle frame or the rear cover area of the shell through the heat conducting part and the heat radiating part, and the heat is radiated through the middle frame or the rear cover, so that the local high temperature of the electronic equipment is avoided, the balanced heat radiation of the electronic equipment is realized, and the user experience is improved.

In one embodiment, the antenna module may be embedded in a frame of an electronic device, and the transmission and reception of the millimeter waves may be completed by opening an antenna window in the frame or by using a non-metallic battery cover.

The electronic equipment with the antenna assembly of any one of the embodiments can be suitable for receiving and transmitting millimeter wave signals of 5G communication, so that the heat transmission efficiency is improved, and the antenna performance is improved.

The electronic Device may be a communication module including a Mobile phone, a tablet computer, a notebook computer, a palm computer, a Mobile Internet Device (MID), a wearable Device (e.g., a smart watch, a smart bracelet, a pedometer, etc.), or other settable antenna.

Fig. 8 is a block diagram of a partial structure of a mobile phone related to an electronic device provided in an embodiment of the present invention. Referring to fig. 8, a cellular phone 800 includes: antenna assembly 810, memory 820, input unit 830, display unit 840, sensor 850, audio circuitry 860, wireless fidelity (WIFI) module 870, processor 880, and power supply 890. Those skilled in the art will appreciate that the handset configuration shown in fig. 8 is not intended to be limiting and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.

The antenna element 810 may be configured to receive and transmit information or receive and transmit signals during a call, and may receive downlink information of a base station and then process the downlink information to the processor 880; the uplink data may also be transmitted to the base station. The memory 820 may be used to store software programs and modules, and the processor 880 executes various functional applications and data processing of the cellular phone by operating the software programs and modules stored in the memory 820. The memory 820 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required for at least one function (such as an application program for a sound playing function, an application program for an image playing function, and the like), and the like; the data storage area may store data (such as audio data, an address book, etc.) created according to the use of the mobile phone, and the like. Further, the memory 820 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.

The input unit 830 may be used to receive input numeric or character information and generate key signal inputs related to user settings and function control of the cellular phone 800. In one embodiment, the input unit 830 may include a touch panel 831 and other input devices 832. The touch panel 831, which may also be referred to as a touch screen, may collect touch operations performed by a user on or near the touch panel 831 (e.g., operations performed by a user on or near the touch panel 831 using any suitable object or accessory such as a finger, a stylus, etc.) and drive the corresponding connection device according to a preset program. In one embodiment, the touch panel 831 can include two portions, a touch measurement device and a touch controller. The touch measuring device measures the touch direction of a user, measures signals brought by touch operation and transmits the signals to the touch controller; the touch controller receives touch information from the touch measurement device, converts it to touch point coordinates, and sends the touch point coordinates to the processor 880, and can receive and execute commands from the processor 880. In addition, the touch panel 831 may be implemented by various types such as a resistive type, a capacitive type, an infrared ray, and a surface acoustic wave. The input unit 830 may include other input devices 832 in addition to the touch panel 831. In one embodiment, other input devices 832 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), and the like.

The display unit 840 may be used to display information input by the user or information provided to the user and various menus of the cellular phone. The display unit 840 may include a display panel 841. In one embodiment, the Display panel 841 may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like. In one embodiment, touch panel 831 can overlay display panel 841, such that when touch panel 831 measures a touch event at or near touch panel 831, it can communicate to processor 880 to determine the type of touch event, and processor 880 can then provide a corresponding visual output on display panel 841 based on the type of touch event. Although in fig. 8, the touch panel 831 and the display panel 841 are two separate components to implement the input and output functions of the mobile phone, in some embodiments, the touch panel 831 and the display panel 841 may be integrated to implement the input and output functions of the mobile phone.

The cell phone 800 may also include at least one sensor 850, such as light sensors, motion sensors, and other sensors. In one embodiment, the light sensor may include an ambient light sensor that adjusts the brightness of the display panel 841 based on the ambient light level, and a proximity sensor that turns off the display panel 841 and/or the backlight when the phone is moved to the ear. The motion sensor can comprise an acceleration sensor, the acceleration sensor can measure the magnitude of acceleration in each direction, the magnitude and the direction of gravity can be measured when the mobile phone is static, and the motion sensor can be used for identifying the application of the gesture of the mobile phone (such as horizontal and vertical screen switching), vibration identification related functions (such as pedometer and knocking) and the like. The mobile phone may be provided with other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor.

The audio circuitry 860, speaker 861 and microphone 862 may provide an audio interface between the user and the handset. The audio circuit 860 can transmit the electrical signal converted from the received audio data to the speaker 861, and the electrical signal is converted into a sound signal by the speaker 861 and output; on the other hand, the microphone 862 converts the collected sound signal into an electrical signal, which is received by the audio circuit 860 and converted into audio data, and then the audio data is processed by the audio data output processor 880, and then the audio data may be transmitted to another mobile phone through the antenna assembly 810, or the audio data may be output to the memory 820 for subsequent processing.

The processor 880 is a control center of the mobile phone, connects various parts of the entire mobile phone using various interfaces and lines, and performs various functions of the mobile phone and processes data by operating or executing software programs and/or modules stored in the memory 820 and calling data stored in the memory 820, thereby integrally monitoring the mobile phone. In one embodiment, processor 880 may include one or more processing units. In one embodiment, the processor 880 may integrate an application processor and a modem processor, wherein the application processor primarily handles operating systems, user interfaces, applications, and the like; the modem processor handles primarily wireless communications. It will be appreciated that the modem processor described above may not be integrated into processor 880.

The cell phone 800 also includes a power supply 890 (e.g., a battery) for powering the various components, which may be logically coupled to the processor 880 via a power management system that may be used to manage charging, discharging, and power consumption.

In one embodiment, the cell phone 800 may also include a camera, a bluetooth module, and the like.

Any reference to memory, storage, database, or other medium used herein may include non-volatile and/or volatile memory. Suitable non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM), which acts as external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), Enhanced SDRAM (ESDRAM), synchronous Link (Synchlink) DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and bus dynamic RAM (RDRAM).

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides an antenna module, is applied to electronic equipment, its characterized in that, antenna module includes:

the antenna assembly comprises an antenna substrate, an active device and an antenna array, wherein the active device and the antenna array are arranged on the antenna substrate, the antenna array is used for receiving and transmitting millimeter wave signals, and the active device is connected with the antenna array and used for processing the millimeter wave signals; the active device is arranged on the upper surface of the antenna substrate, one surface of the antenna substrate, on which the active device is integrated, is a heat dissipation surface, and the heat dissipation surface is divided into a first area and a second area;

the heat conducting component comprises a first heat conducting part and a second heat conducting part which are connected with each other, the first heat conducting part is attached to the upper surface of the active device, the first heat conducting part is correspondingly arranged above the first area, and the area of the projection of the first heat conducting part on the antenna substrate is smaller than or equal to the area of the projection of the active device on the antenna substrate;

the second heat conduction part is attached to one side of the antenna substrate where the active device is located, and the second heat conduction part is arranged in a second area of the antenna substrate; the heat conducting component is used for transferring heat generated by the active device;

2. The antenna module of claim 1, wherein the first thermal conductive portion is attached to at least a side of the active device away from the antenna substrate.

3. The antenna module of claim 2, wherein the first conductive trace comprises a first side surface, a second side surface, and a third side surface, wherein the first side surface and the second side surface are opposite to each other, and the third side surface is fixedly connected to the first side surface and the second side surface respectively; the first side face, the second side face and the third side face are respectively attached to three side faces of the active device, which are not in contact with the antenna substrate, and the third side face is arranged on one side, far away from the antenna substrate, of the active device.

4. The antenna module of claim 1, further comprising a shielding member disposed on the antenna substrate and covering the active device for shielding signal interference acting on the active device.

5. The antenna module of claim 4, wherein the first thermal conduction portion is disposed between the shielding member and the active device and attached to a side of the active device facing the heat dissipation member, and wherein the second thermal conduction portion is attached to the antenna substrate on the side where the active device is disposed, or wherein the second thermal conduction portion is embedded in the antenna substrate.

6. The antenna module of claim 5, further comprising a filler layer disposed between the shield member and the first thermal conduction portion.

7. The antenna module of claim 6, wherein the shielding member defines at least one slot, and the filling layer is connected to the first heat-conducting portion through the slot.

8. The antenna module of claim 4, wherein the heat sink member comprises a first heat sink member and a second heat sink member, the first heat sink member is attached to the shielding member, and the second heat sink member is attached to the heat conductive member on the antenna substrate.

9. The antenna module of claim 8, further comprising an auxiliary heat dissipation layer attached to the heat dissipation member away from the antenna substrate.

10. The antenna module of claim 1, wherein the thermal conductive member is bonded to the active device and the antenna substrate by a thermal conductive adhesive, respectively, the thermal conductive adhesive forming a thermal conductive adhesive layer.

11. The antenna module of claim 1, wherein the thermally conductive member is made of a thermally conductive material, and the thermally conductive material comprises any one of a thermally conductive plastic, a thermally conductive metal, a thermally conductive ceramic, and a thermally conductive graphite.

12. An electronic device, comprising a housing and the antenna module of any one of claims 1 to 11, wherein the antenna module is fixedly connected to the housing.