CN111629518B - Cutting equipment for flexible circuit board production and use method thereof - Google Patents
Cutting equipment for flexible circuit board production and use method thereof Download PDFInfo
- Publication number
- CN111629518B CN111629518B CN202010399857.0A CN202010399857A CN111629518B CN 111629518 B CN111629518 B CN 111629518B CN 202010399857 A CN202010399857 A CN 202010399857A CN 111629518 B CN111629518 B CN 111629518B
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- Prior art keywords
- placing
- circuit board
- flexible circuit
- plate
- mounting cover
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
A cutting device for producing a flexible circuit board and a using method thereof comprise a placing plate, a conveying mechanism, a pressing mechanism, a laser, an installation cover and a rack; two placing plates are arranged side by side along the transverse direction; the pressing mechanism comprises a pressing plate, a first guide rod, a first limiting table, a first elastic part and a movable plate, the pressing plate, the first guide rod and the first limiting table are sequentially connected from bottom to top, the first guide rod penetrates through the movable plate and is in sliding connection with the movable plate, two ends of the first elastic part are respectively connected with the pressing plate and the movable plate, and a moving driving mechanism used for driving the movable plate to move along the vertical direction so that the pressing plate is pressed on the placing plate or separated from the placing plate is arranged on the mounting cover. The laser device can compress the flexible circuit board, ensures the cutting quality of the laser device on the flexible circuit board, has two placing plates for placing and taking out the circuit board, is switched to use, has high production efficiency, and has high safety when an operator takes and places the circuit board outside the laser device.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to cutting equipment for flexible circuit board production and a using method thereof.
Background
The Flexible Printed Circuit board (FPC for short) is a Flexible Printed Circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property.
In the production process of the flexible circuit board, the flexible circuit board is required to be cut into a specific shape according to use requirements, at present, when the flexible circuit board is cut by using the existing cutting equipment, the flexible circuit board is not clamped or fixed, wrinkles are easy to appear at the cutting edge in the process of cutting the flexible circuit board by using a laser, so that the flexible circuit board cannot maintain a flat state in the cutting process, when the flexible circuit board is continuously cut by using the laser, the cutting of the edge of the flexible circuit board is not flat, burrs are easy to appear, the cutting quality is reduced, and the production requirements cannot be met; moreover, the existing cutting equipment only has one cutting station, and a circuit board to be cut or a cut circuit board can be placed at one position, so that the cutting efficiency is low, and the risk of personal injury to operators caused by a laser exists.
Disclosure of Invention
Objects of the invention
In order to solve the technical problems in the background art, the invention provides cutting equipment for producing a flexible circuit board and a using method thereof, the flexible circuit board can be compressed, the cutting quality of a laser for the flexible circuit board is ensured, two placing plates for placing and taking out the circuit board are provided, the two placing plates are switched to be used, the production efficiency is high, an operator can take and place the circuit board outside the laser, and the safety is high.
(II) technical scheme
The invention provides cutting equipment for producing a flexible circuit board, which comprises a placing plate, a conveying mechanism, a pressing mechanism, a laser, a mounting cover and a rack, wherein the placing plate is arranged on the rack;
the placing plates are arranged on the conveying mechanism, and two placing plates are arranged side by side along the transverse direction; the conveying mechanism penetrates through the mounting cover; the pressing mechanisms are symmetrically arranged in two groups along the transverse direction relative to the mounting cover, each pressing mechanism comprises a pressing plate, a first guide rod, a first limiting table, a first elastic part and a moving plate, the pressing plates, the first guide rods and the first limiting tables are sequentially connected from bottom to top, the first guide rods penetrate through the moving plates and are in sliding connection with the moving plates, two ends of each first elastic part are respectively connected with the pressing plates and the moving plates, and the mounting cover is provided with a movement driving mechanism for driving the moving plates to move along the vertical direction so that the pressing plates press on the placing plates or are separated from the placing plates; a driving device for driving the laser to move along the transverse direction and the longitudinal direction is arranged in the mounting cover; conveying mechanism and installation cover all set up in the frame.
Preferably, a second elastic element is connected between the first limiting table and the moving plate.
Preferably, the first elastic member and the second elastic member are both compression springs, and the first elastic member and the second elastic member are both located on the outer peripheral side of the first guide rod.
Preferably, the moving plate is vertically provided with a second guide rod; the second guide rod runs through the top of the mounting cover and is in sliding connection with the mounting cover, and a second limiting table is arranged at the top end of the second guide rod.
Preferably, the top of the placing plate is provided with a blocking platform; a plurality of baffle tables are arranged along the edge of the placing plate; the pressing plate is provided with a jack for penetrating through the baffle table.
Preferably, the mobile driving mechanism is an electric push rod, a telescopic cylinder or a hydraulic oil cylinder.
Preferably, the driving device comprises a first sliding table, a first driving mechanism, a first screw rod, a first support, a first mounting plate, a second sliding table, a second driving mechanism, a second screw rod, a second support, a second mounting plate and a mounting frame; the laser is arranged at the bottom of the first sliding table; the first sliding table is arranged on the first mounting plate in a sliding manner; the first driving mechanism and the first support are arranged at the top of the first mounting plate; the output end of the first driving mechanism is connected with the first screw rod; the first screw rod is rotatably connected with the first support, the first screw rod is longitudinally arranged, and the first screw rod is in threaded connection with the first sliding table; the first mounting plate is arranged on the second sliding table; the second sliding table is arranged on the second mounting plate in a sliding manner; the second driving mechanism and the second support are arranged at the top of the second mounting plate; the output end of the second driving mechanism is connected with the second screw rod; the second screw rod is rotatably connected with the second bracket, the second screw rod is transversely arranged, and the second screw rod is in threaded connection with the second sliding table; the second mounting plate is arranged on the mounting frame; the mounting bracket is arranged on the inner surface of the mounting cover.
Preferably, the installation cover is provided with a smoke removing box; the smoke removing box is provided with an air inlet and an air outlet, the smoke removing box is provided with an air inlet hopper, and the inside of the smoke removing box is provided with a fan and a filter screen in parallel along the direction far away from the air inlet; the air exhaust end of the fan faces the air inlet; the air inlet hopper is positioned in the mounting cover and is communicated with the smoke removal box through an air inlet.
Preferably, the bottom of the frame is provided with a foot cup.
The second aspect of the invention provides a use method of the cutting equipment for producing the flexible circuit board, which comprises the following steps:
s1, placing the flexible circuit board to be cut on the first placing board, and conveying the first placing board to the inner side of the mounting cover through the conveying mechanism; placing the flexible circuit board to be cut on the second placing plate;
s2, driving the laser to move transversely and longitudinally by using the driving device, and cutting the flexible circuit board on the first placing board by using the laser;
s3, conveying the two placing plates through a conveying mechanism, wherein the first placing plate is moved out of the mounting cover, the second placing plate is moved into the mounting cover, the flexible circuit board which is cut on the first placing plate is taken down, and a new flexible circuit board to be cut is placed on the first placing plate;
s4, driving the laser to move transversely and longitudinally by using the driving device, and cutting the flexible circuit board on the second placing board by using the laser;
s5, conveying the two placing plates through a conveying mechanism, wherein the second placing plate is moved out of the mounting cover, the first placing plate is moved into the mounting cover, the flexible circuit board which is cut on the second placing plate is taken down, and a new flexible circuit board to be cut is placed on the second placing plate;
and S6, circulating S2-S5 to circularly carry out cutting operation on the flexible circuit boards on the two placing boards.
Compared with the prior art, the technical scheme of the invention has the following beneficial technical effects:
the flexible circuit board can be tightly pressed on the placing plate through the two groups of pressing mechanisms, the cutting quality of the flexible circuit board by the laser is guaranteed, the output end of the moving driving mechanism drives the moving plate to move downwards, the moving plate is provided with the pressing plate, the first guide rod, the first limiting table and the first elastic piece to move downwards, so that the pressing plate can tightly press the circuit board on the placing plate, the first elastic piece is compressed between the pressing plate and the moving plate, the first elastic piece can prevent the pressing plate from crushing the circuit board on the premise that the pressing plate tightly presses the circuit board, the safety is higher, and the first guide rod can guide the moving direction of the pressing plate; the device is provided with two placing plates for placing and taking out the circuit board, the two placing plates are switched to be used, when one placing plate is positioned on the inner side of the mounting cover, the circuit board on the placing plate can be cut by the laser, the other placing plate is positioned on the outer side of the mounting cover, an operator can conveniently take and place the circuit board on the other placing plate outside the mounting cover, the production efficiency is high, and the safety is high.
Drawings
Fig. 1 is a schematic structural diagram of a cutting apparatus for producing a flexible printed circuit board according to the present invention.
Fig. 2 is a partial structural sectional view of a cutting apparatus for producing a flexible circuit board according to the present invention.
Fig. 3 is a schematic partial structural diagram of a cutting apparatus for producing a flexible printed circuit board according to the present invention.
Fig. 4 is an enlarged view of a structure at a in fig. 3.
Fig. 5 is a schematic structural diagram of a moving principle of a laser in the cutting device for producing the flexible printed circuit board according to the present invention.
Fig. 6 is a schematic structural diagram of a smoke removal box and an air intake funnel in the cutting equipment for producing the flexible printed circuit board and the using method thereof provided by the invention.
Reference numerals: 1. placing the plate; 101. blocking the platform; 2. a conveying mechanism; 3. pressing a plate; 301. a jack; 4. a first guide bar; 5. a first limit table; 6. a first elastic member; 7. a second elastic member; 8. moving the plate; 9. a movement drive mechanism; 10. a second guide bar; 11. a second limit table; 12. a laser; 13. a first sliding table; 14. a first drive mechanism; 15. a first lead screw; 16. a first bracket; 17. a first mounting plate; 18. a second sliding table; 19. a second drive mechanism; 20. a second lead screw; 21. a second bracket; 22. a second mounting plate; 23. a mounting frame; 24. mounting a cover; 25. a smoke removal box; 26. an air inlet hopper; 27. a frame; 28. a foot cup.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1 to 6, a cutting apparatus for flexible circuit board production and a method for using the same according to a first aspect of the present invention includes a placing plate 1, a conveying mechanism 2, a pressing mechanism, a laser 12, a mounting cover 24, and a frame 27;
the placing plates 1 are arranged on the conveying mechanism 2, and two placing plates 1 are arranged side by side along the transverse direction; the conveying mechanism 2 penetrates through the mounting cover 24; the pressing mechanisms are symmetrically arranged in two groups along the transverse direction relative to the mounting cover 24, each pressing mechanism comprises a pressing plate 3, a first guide rod 4, a first limiting table 5, a first elastic part 6 and a moving plate 8, the pressing plates 3, the first guide rods 4 and the first limiting tables 5 are sequentially connected from bottom to top, the first guide rods 4 penetrate through the moving plates 8 and are in sliding connection with the moving plates 8, two ends of each first elastic part 6 are respectively connected with the pressing plates 3 and the moving plates 8, and the mounting cover 24 is provided with a movement driving mechanism 9 for driving the moving plates 8 to move along the vertical direction so that the pressing plates 3 are pressed on the placing plates 1 or separated from the placing plates 1; the mounting cover 24 is internally provided with a driving device for driving the laser 12 to move along the transverse direction and the longitudinal direction; the conveying mechanism 2 and the mounting cover 24 are both provided on the frame 27.
In an alternative embodiment, a second elastic member 7 is connected between the first stopping block 5 and the moving plate 8.
It should be noted that, when the pressing plate 3 is separated from the circuit board, the first elastic element 6 is gradually restored to the expanded state, so that elastic oscillation is easily generated, and by providing the second elastic element 7, the elastic oscillation of the first elastic element 6 can be reduced, so that the first elastic element 6 is restored to the stable state as soon as possible.
In an alternative embodiment, the first elastic member 6 and the second elastic member 7 are both compression springs, and the first elastic member 6 and the second elastic member 7 are both located on the outer periphery side of the first guide rod 4, so that the production cost is low, the service life is long, the first elastic member cannot fall off from the first guide rod 4, and the stability is better.
In an alternative embodiment, the moving plate 8 is vertically provided with a second guide bar 10; the second guide rod 10 penetrates through the top of the mounting cover 24 and is in sliding connection with the mounting cover 24, and the second limiting table 11 is arranged at the top end of the second guide rod 10 and can guide the moving direction of the moving plate 8, so that the moving plate 8 can move more stably and accurately.
In an alternative embodiment, the top of the placing plate 1 is provided with a blocking platform 101; a plurality of baffle tables 101 are arranged along the edge of the placing plate 1; the pressing plate 3 is provided with an insertion hole 301 for passing through the baffle table 101.
It should be noted that, by providing the blocking table 101, the placing position of the circuit board can be limited, the circuit board is prevented from falling off from the placing plate 1, and by providing the insertion hole 301, the pressing plate 3 can be ensured to press the circuit board onto the placing plate 1 through the blocking table 101.
In an alternative embodiment, the movement driving mechanism 9 is an electric push rod, a telescopic cylinder or a hydraulic cylinder.
In an alternative embodiment, the driving device includes a first slide table 13, a first driving mechanism 14, a first lead screw 15, a first bracket 16, a first mounting plate 17, a second slide table 18, a second driving mechanism 19, a second lead screw 20, a second bracket 21, a second mounting plate 22, and a mounting bracket 23; the laser 12 is arranged at the bottom of the first sliding table 13; the first sliding table 13 is arranged on the first mounting plate 17 in a sliding manner; the first driving mechanism 14 and the first bracket 16 are both arranged on the top of the first mounting plate 17; the output end of the first driving mechanism 14 is connected with a first screw rod 15; the first screw rod 15 is rotatably connected with the first support 16, the first screw rod 15 is longitudinally arranged, and the first screw rod 15 is in threaded connection with the first sliding table 13; the first mounting plate 17 is arranged on the second slide table 18; the second sliding table 18 is arranged on the second mounting plate 22 in a sliding manner; the second driving mechanism 19 and the second bracket 21 are both arranged on the top of the second mounting plate 22; the output end of the second driving mechanism 19 is connected with a second screw rod 20; the second screw rod 20 is rotatably connected with the second bracket 21, the second screw rod 20 is transversely arranged, and the second screw rod 20 is in threaded connection with the second sliding table 18; the second mounting plate 22 is arranged on the mounting frame 23; the mounting bracket 23 is provided on the inner surface of the mounting cover 24.
It should be noted that the output end of the first driving mechanism 14 drives the first screw rod 15 to rotate, the first screw rod 15 drives the first sliding table 13 to move longitudinally, the first sliding table 13 moves on the first mounting plate 17, and the laser 12 moves longitudinally along with the first sliding table 13; the output end of the second driving mechanism 19 drives the second screw rod 20 to rotate, the second screw rod 20 drives the second sliding table 18 to move along the transverse direction, the second sliding table 18 moves on the second mounting plate 22, and the second sliding table 18 drives the first mounting plate 17 to move along the transverse direction, so that the laser 12 can move along the transverse direction; by the cooperation of the above mechanisms, the laser 12 can be moved in a plane to perform a laser cutting process on the circuit board on the placing board 1.
In an alternative embodiment, the mounting cover 24 is provided with a smoke abatement tank 25; the smoke removing box 25 is provided with an air inlet and an air outlet, the smoke removing box 25 is provided with an air inlet hopper 26, and the inside of the smoke removing box 25 is provided with a fan and a filter screen side by side along the direction far away from the air inlet; the air exhaust end of the fan faces the air inlet; an air intake funnel 26 is located in the mounting cover 24 and communicates with the smoke abatement box 25 through an air intake.
It should be noted that, laser 12 is at the cutting circuit board in-process, and the circuit board can produce the flue gas in installation cover 24, and the fan is through air intake fill 26 and air intake suction flue gas, carries out filtration processing through the filter screen, and the air after the filtration is discharged to smoke abatement case 25 outside through the air outlet, environmental protection health more.
In an alternative embodiment, the bottom of the frame 27 is provided with a foot cup 28 to facilitate flexible movement of the device as required by use.
The invention provides a use method of the cutting equipment for producing the flexible circuit board, which comprises the following steps:
s1, placing the flexible circuit board to be cut on the first placing board 1, and conveying the first placing board 1 to the inner side of the mounting cover 24 through the conveying mechanism 2; placing the flexible circuit board to be cut on the second placing plate 1;
s2, driving the laser 12 to move in the transverse direction and the longitudinal direction by using the driving device, and cutting the flexible circuit board on the first placing board 1 by using the laser 12;
s3, conveying the two placing boards 1 through the conveying mechanism 2, wherein the first placing board 1 is moved out of the mounting cover 24, the second placing board 1 is moved into the mounting cover 24, the cut flexible circuit board on the first placing board 1 is taken down, and a new flexible circuit board to be cut is placed on the first placing board 1;
s4, driving the laser 12 to move transversely and longitudinally by using a driving device, and cutting the flexible circuit board on the second placing board 1 by using the laser 12;
s5, conveying the two placing boards 1 through the conveying mechanism 2, wherein the second placing board 1 is moved out of the mounting cover 24, the first placing board 1 is moved into the mounting cover 24, the cut flexible circuit board on the second placing board 1 is taken down, and a new flexible circuit board to be cut is placed on the second placing board 1;
and S6, and S2-S5 are repeated to circularly perform cutting operation on the flexible circuit boards on the two placing boards 1.
According to the invention, the flexible circuit board can be tightly pressed on the placing plate 1 through two groups of pressing mechanisms, the cutting quality of the laser 12 on the flexible circuit board is ensured, the output end of the movement driving mechanism 9 drives the moving plate 8 to move downwards, the moving plate 8 drives the pressing plate 3, the first guide rod 4, the first limiting table 5 and the first elastic part 6 to move downwards, so that the pressing plate 3 can tightly press the circuit board on the placing plate 1, the first elastic part 6 is compressed between the pressing plate 3 and the moving plate 8, the first elastic part 6 can prevent the pressing plate 3 from crushing the circuit board on the premise that the pressing plate 3 tightly presses the circuit board, the safety is higher, and the first guide rod 4 can guide the moving direction of the pressing plate 3; the device is provided with two placing plates 1 for placing and taking out the circuit boards, the two placing plates 1 are switched to be used, when one placing plate 1 is positioned on the inner side of the mounting cover 24, the circuit board on the placing plate 1 can be cut by the laser 12, the other placing plate 1 is positioned on the outer side of the mounting cover 24, an operator can conveniently take and place the circuit board on the other placing plate 1 outside the mounting cover 24, the production efficiency is high, and the safety is high.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (9)
1. The cutting equipment for producing the flexible circuit board is characterized by comprising a placing plate (1), a conveying mechanism (2), a pressing mechanism, a laser (12), a mounting cover (24) and a rack (27);
the placing plates (1) are arranged on the conveying mechanism (2), and two placing plates (1) are arranged side by side along the transverse direction; the conveying mechanism (2) penetrates through the mounting cover (24); the pressing mechanisms are symmetrically arranged in two groups along the transverse direction relative to the mounting cover (24), each pressing mechanism comprises a pressing plate (3), a first guide rod (4), a first limiting table (5), a first elastic piece (6) and a moving plate (8), the pressing plates (3), the first guide rods (4) and the first limiting tables (5) are sequentially connected from bottom to top, the first guide rods (4) penetrate through the moving plates (8) and are in sliding connection with the moving plates (8), two ends of the first elastic pieces (6) are respectively connected with the pressing plates (3) and the moving plates (8), and the mounting cover (24) is provided with a moving driving mechanism (9) for driving the moving plates (8) to move along the vertical direction so that the pressing plates (3) are pressed on the placing plates (1) or separated from the placing plates (1); a driving device for driving the laser (12) to move along the transverse direction and the longitudinal direction is arranged in the mounting cover (24); the conveying mechanism (2) and the mounting cover (24) are both arranged on the rack (27);
the using method comprises the following steps:
s1, placing the flexible circuit board to be cut on the first placing board (1), and conveying the first placing board (1) to the inner side of the mounting cover (24) through the conveying mechanism (2); placing the flexible circuit board to be cut on the second placing plate (1);
s2, driving the laser (12) to move in the transverse direction and the longitudinal direction by using the driving device, and cutting the flexible circuit board on the first placing board (1) by using the laser (12);
s3, conveying the two placing boards (1) through the conveying mechanism (2), wherein the first placing board (1) is moved out of the mounting cover (24), the second placing board (1) is moved into the inner side of the mounting cover (24), the cut flexible circuit board on the first placing board (1) is taken down, and a new flexible circuit board to be cut is placed on the first placing board (1);
s4, driving the laser (12) to move transversely and longitudinally by using a driving device, and cutting the flexible circuit board on the second placing board (1) by using the laser (12);
s5, conveying the two placing boards (1) through the conveying mechanism (2), wherein the second placing board (1) is moved out of the mounting cover (24), the first placing board (1) is moved into the inner side of the mounting cover (24), the cut flexible circuit board on the second placing board (1) is taken down, and a new flexible circuit board to be cut is placed on the second placing board (1);
s6 and S2-S5 are repeated to circularly carry out cutting operation on the flexible circuit boards on the two placing boards (1).
2. The cutting apparatus for flexible circuit board production according to claim 1, wherein a second elastic member (7) is connected between the first limit table (5) and the moving plate (8).
3. The cutting apparatus for flexible circuit board production according to claim 2, wherein the first elastic member (6) and the second elastic member (7) are both compression springs, and the first elastic member (6) and the second elastic member (7) are both located on the outer peripheral side of the first guide bar (4).
4. The cutting apparatus for flexible circuit board production according to claim 3, wherein the moving plate (8) is vertically provided with a second guide bar (10); the second guide rod (10) penetrates through the top of the mounting cover (24) and is in sliding connection with the mounting cover (24), and a second limiting table (11) is arranged at the top end of the second guide rod (10).
5. The cutting equipment for producing the flexible circuit board according to claim 4, wherein a blocking platform (101) is arranged on the top of the placing plate (1); a plurality of baffle tables (101) are arranged along the edge of the placing plate (1); the pressing plate (3) is provided with an insertion hole (301) for penetrating through the baffle table (101).
6. The cutting equipment for flexible circuit board production according to claim 1, wherein the moving driving mechanism (9) is an electric push rod, a telescopic cylinder or a hydraulic oil cylinder.
7. The cutting equipment for producing the flexible circuit board according to claim 1, wherein the driving device comprises a first sliding table (13), a first driving mechanism (14), a first screw rod (15), a first bracket (16), a first mounting plate (17), a second sliding table (18), a second driving mechanism (19), a second screw rod (20), a second bracket (21), a second mounting plate (22) and a mounting frame (23); the laser (12) is arranged at the bottom of the first sliding table (13); the first sliding table (13) is arranged on the first mounting plate (17) in a sliding manner; the first driving mechanism (14) and the first bracket (16) are arranged on the top of the first mounting plate (17); the output end of the first driving mechanism (14) is connected with a first screw rod (15); the first screw rod (15) is rotatably connected with the first support (16), the first screw rod (15) is longitudinally arranged, and the first screw rod (15) is in threaded connection with the first sliding table (13); the first mounting plate (17) is arranged on the second sliding table (18); the second sliding table (18) is arranged on the second mounting plate (22) in a sliding manner; the second driving mechanism (19) and the second bracket (21) are arranged on the top of the second mounting plate (22); the output end of the second driving mechanism (19) is connected with a second screw rod (20); the second screw rod (20) is rotatably connected with the second bracket (21), the second screw rod (20) is transversely arranged, and the second screw rod (20) is in threaded connection with the second sliding table (18); the second mounting plate (22) is arranged on the mounting frame (23); the mounting bracket (23) is provided on the inner surface of the mounting cover (24).
8. The cutting apparatus for flexible circuit board production according to claim 1, wherein a smoke removing box (25) is provided on the mounting cover (24); an air inlet and an air outlet are arranged on the smoke removing box (25), an air inlet pipe (26) is arranged on the smoke removing box (25), and a fan and a filter screen are arranged in the smoke removing box (25) side by side along the direction far away from the air inlet; the air exhaust end of the fan faces the air inlet; the air inlet pipe (26) is positioned in the mounting cover (24) and is communicated with the smoke removing box (25) through an air inlet.
9. The cutting equipment for producing the flexible circuit board as claimed in claim 1, wherein a foot cup (28) is provided at the bottom of the frame (27).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010399857.0A CN111629518B (en) | 2020-05-13 | 2020-05-13 | Cutting equipment for flexible circuit board production and use method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010399857.0A CN111629518B (en) | 2020-05-13 | 2020-05-13 | Cutting equipment for flexible circuit board production and use method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN111629518A CN111629518A (en) | 2020-09-04 |
| CN111629518B true CN111629518B (en) | 2021-03-16 |
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| CN202010399857.0A Expired - Fee Related CN111629518B (en) | 2020-05-13 | 2020-05-13 | Cutting equipment for flexible circuit board production and use method thereof |
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| CN (1) | CN111629518B (en) |
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|---|---|---|---|---|
| CN113134685A (en) * | 2021-04-28 | 2021-07-20 | 深圳市三德冠精密电路科技有限公司 | Flexible circuit board cutting device |
| CN115257192B (en) * | 2021-06-25 | 2023-11-17 | 深圳达捷科技有限公司 | Spray printing platform for flexible circuit board |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013071150A (en) * | 2011-09-27 | 2013-04-22 | Hitachi Via Mechanics Ltd | Laser beam machine |
| CN103213155A (en) * | 2013-04-16 | 2013-07-24 | 新乡医学院 | Dual-purpose cutting device for cutting and separating circuit board |
| CN205961590U (en) * | 2016-08-05 | 2017-02-15 | 深圳市国人光速科技有限公司 | Ultraviolet laser cutting FPC device |
| CN107322664A (en) * | 2017-08-07 | 2017-11-07 | 嘉兴邦博电子科技有限公司 | A kind of wiring board cutter device of automatic charging |
| CN109015840A (en) * | 2018-09-06 | 2018-12-18 | 浙江欧易新能源有限公司 | A kind of light guide plate cutting equipment |
| CN208451687U (en) * | 2018-05-17 | 2019-02-01 | 盐城合众联通信息技术有限公司 | A kind of flexible circuit board cutter device |
| CN208451681U (en) * | 2018-06-25 | 2019-02-01 | 深圳市森宇通精密电路有限公司 | A kind of flexible circuit board cutter device |
| CN209919116U (en) * | 2019-01-24 | 2020-01-10 | 大族激光科技产业集团股份有限公司 | Utmost point ear cutting device |
| CN110744625A (en) * | 2019-09-17 | 2020-02-04 | 黄丽兰 | Multi-cutter die cutting equipment for flexible circuit board |
| CN210172818U (en) * | 2019-06-02 | 2020-03-24 | 深圳市东迪电路有限公司 | Flexible circuit board cutting device |
| CN210405807U (en) * | 2019-07-15 | 2020-04-24 | 常州博安和达电器有限公司 | Battery flexible circuit board shaping device |
-
2020
- 2020-05-13 CN CN202010399857.0A patent/CN111629518B/en not_active Expired - Fee Related
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013071150A (en) * | 2011-09-27 | 2013-04-22 | Hitachi Via Mechanics Ltd | Laser beam machine |
| CN103213155A (en) * | 2013-04-16 | 2013-07-24 | 新乡医学院 | Dual-purpose cutting device for cutting and separating circuit board |
| CN205961590U (en) * | 2016-08-05 | 2017-02-15 | 深圳市国人光速科技有限公司 | Ultraviolet laser cutting FPC device |
| CN107322664A (en) * | 2017-08-07 | 2017-11-07 | 嘉兴邦博电子科技有限公司 | A kind of wiring board cutter device of automatic charging |
| CN208451687U (en) * | 2018-05-17 | 2019-02-01 | 盐城合众联通信息技术有限公司 | A kind of flexible circuit board cutter device |
| CN208451681U (en) * | 2018-06-25 | 2019-02-01 | 深圳市森宇通精密电路有限公司 | A kind of flexible circuit board cutter device |
| CN109015840A (en) * | 2018-09-06 | 2018-12-18 | 浙江欧易新能源有限公司 | A kind of light guide plate cutting equipment |
| CN209919116U (en) * | 2019-01-24 | 2020-01-10 | 大族激光科技产业集团股份有限公司 | Utmost point ear cutting device |
| CN210172818U (en) * | 2019-06-02 | 2020-03-24 | 深圳市东迪电路有限公司 | Flexible circuit board cutting device |
| CN210405807U (en) * | 2019-07-15 | 2020-04-24 | 常州博安和达电器有限公司 | Battery flexible circuit board shaping device |
| CN110744625A (en) * | 2019-09-17 | 2020-02-04 | 黄丽兰 | Multi-cutter die cutting equipment for flexible circuit board |
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| CN111629518A (en) | 2020-09-04 |
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