CN111570661A - Resistor element lead forming device and method - Google Patents
Resistor element lead forming device and method Download PDFInfo
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- CN111570661A CN111570661A CN202010272975.5A CN202010272975A CN111570661A CN 111570661 A CN111570661 A CN 111570661A CN 202010272975 A CN202010272975 A CN 202010272975A CN 111570661 A CN111570661 A CN 111570661A
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- resistance element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention provides a resistor element lead forming device and a resistor element lead forming method, which comprise a base, two pressing blocks, two forming pressing plates and two side plates, wherein the pressing blocks are arranged above the base; be equipped with the resistance element standing groove between clamp plate and the base, the resistance element standing groove level sets up, and the resistance element standing groove is a plurality of and sets up along base length direction, and the bottom plate bilateral symmetry is equipped with the lead wire groove, and the vertical setting of lead wire groove, lead wire groove be the multiunit and set up along base length direction, and a set of lead wire groove corresponds a resistance element standing groove. The pressing cavity of the resistor element lead forming device is formed by the structural shapes and sizes of the base, the forming pressing plate and the pressing block. The body and the lead wire of the resistor element can not be damaged in the pressing process, the resistor element can be fixed in a certain range, and the lead wire of the resistor element can be formed into required size and shape.
Description
Technical Field
The invention belongs to the technical field of electronic assembly and particularly relates to a resistor element lead forming device and method.
Background
In a series of products, the leads of a color ring resistor and a precision resistor element which are used in large quantity in a circuit board of an electronic cabin part are linear before forming. According to the installation requirement of a product circuit board, in order to ensure the heat dissipation of the resistance element, the resistance element is specified not to be installed by attaching the circuit board; meanwhile, in order to meet the requirement of high overload resistance (10000 g) of a product, the element body is arranged at a distance of 2.5 +/-0.5 mm from the plate; when wave soldering is carried out on the circuit board, a certain support needs to be provided for the resistance element by the board surface, and the soldering quality cannot be influenced by the sinking of the resistance element, so that the resistance element is subjected to lead forming.
Because no special tool for molding the leads on the two sides of the resistance element at one time is available, and the leads on one side of the resistance element are molded by using a universal molding clamp, the shape and the structure of the formed leads cannot be accurate and consistent, the size is not stable enough, and the consistency of the leads on the two sides of the resistance element cannot be ensured; meanwhile, when the resistor element with larger lead forming difference is corrected, the element lead is easy to damage or break, so that the whole resistor element is scrapped. Therefore, the molding quality of the component leads and the soldering quality of the circuit board are greatly affected, and the production cost and the production efficiency of the product are also affected.
Disclosure of Invention
The invention aims to provide a resistor element lead forming device, which overcomes the technical problems in the prior art.
The invention also aims to provide a method for forming the lead of the resistor element, which effectively reduces the damage and the loss of the element and ensures the once through rate of selective wave soldering of the product.
Therefore, the technical scheme provided by the invention is as follows:
a resistor element lead forming device comprises a base, two pressing blocks, two forming pressing plates and two side plates, wherein the pressing blocks are arranged above the base and are symmetrically arranged along the two sides of the length direction of the base respectively;
the resistance element placing groove is arranged between the pressing plate and the base, the resistance element placing groove is horizontally arranged, the resistance element placing grooves are arranged in a plurality of groups along the length direction of the base, lead grooves are symmetrically arranged on two sides of the bottom plate and are arranged vertically, the lead grooves are arranged in a plurality of groups along the length direction of the base, and one group of lead grooves corresponds to one resistance element placing groove.
The resistance element placing groove comprises a first resistance element positioning groove and a second resistance element positioning groove, the first resistance element positioning groove is arranged at the bottom end of the pressing block, the second resistance element positioning groove is arranged at the top end of the base, and two sides of the pressing block are respectively connected with the two forming pressing plates.
The top of base is equipped with resistance element constant head tank two, the lead wire groove is including straight groove and type groove, the bottom width of base is less than the width at top.
The forming press plate is provided with a convex block and a step from top to bottom, the convex block is matched with the groove, and the step is connected with the upper end of the smaller width part of the base.
The lower part of the side plate is fixedly connected with the base, and the upper part of the side plate is connected with the pressing block and the forming pressing plate.
The height of the profiled groove is larger than 2.5 mm.
The forming press plate is connected with the press block through a pin, the side plate is connected with the base through a screw, and the side plate is connected with the press block through a bolt.
A resistor element lead forming method uses a resistor element lead forming device to form a resistor element lead forming pressing cavity through a base, a forming pressing plate and a pressing block, after accurate positioning, a resistor element is placed into the resistor element lead forming cavity and pressed into the forming pressing plate, and the resistor element lead forming is completed.
And placing the resistance element into a resistance element placing groove, placing the leads at two ends of the resistance element into a lead groove, and applying pressure to the forming pressing plate to press and mold the leads.
When pinpointing, curb plate and briquetting pass through the bolt connection location, make briquetting and base counterpoint, ensure that the pressfitting location of base and shaping clamp plate is accurate.
The invention has the beneficial effects that:
the resistance element lead forming device provided by the invention forms a pressing cavity of the resistance element lead forming device through the structural shapes and sizes of the base, the forming pressing plate and the pressing block. The size of the cavity formed by the base, the forming pressing plate and the pressing block during pressing is matched with the forming size of the element, so that the body and the lead of the resistance element are not damaged in the pressing process, the resistance element can be fixed in a certain range, and the lead of the resistance element can be formed into the required size and shape.
The resistor element lead forming device is simple in structure, convenient and efficient to operate, low in manufacturing cost and convenient to process; the positioning is accurate, the forming quality consistency of the lead of the resistance element is good, and the forming efficiency is high; the method has the advantages of safe operation and convenient use, effectively reduces the damage and loss of elements, ensures the once through rate of selective wave soldering of products, and solves the problem of selective wave soldering of resistance elements.
In order to make the aforementioned and other objects of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
FIG. 1 is a schematic structural diagram of a pressing cavity for forming a lead of a resistor element;
FIG. 2 is a schematic cross-sectional view of an embodiment of the present invention;
FIG. 3 is a view A-A of FIG. 2;
FIG. 4 is a perspective view of one embodiment of the present invention;
FIG. 5 is a schematic view of the device of the present invention in use.
In the figure:
description of reference numerals:
1. a base; 2. molding a pressing plate; 3. briquetting; 4. a side plate; 5. a bolt; 6. a pin; 7. a screw; 8. a resistance element placement groove; 9. a lead slot; 10. a first resistor element positioning groove; 11. a second resistor element positioning groove; 12. a resistance element; 13. a lead wire; 14. a bump; 15. a profiled groove; 16. a step; 17. a pin hole; 18. screw holes; 19. a pin hole.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
In the present invention, the upper, lower, left and right in the drawings are regarded as the upper, lower, left and right of the resistance element lead wire forming device described in the present specification.
The exemplary embodiments of the present invention will now be described with reference to the accompanying drawings, however, the present invention may be embodied in many different forms and is not limited to the embodiments described herein, which are provided for complete and complete disclosure of the present invention and to fully convey the scope of the present invention to those skilled in the art. The terminology used in the exemplary embodiments illustrated in the accompanying drawings is not intended to be limiting of the invention. In the drawings, the same units/elements are denoted by the same reference numerals.
Unless otherwise defined, terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Further, it will be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense.
Example 1:
the embodiment provides a resistor element lead forming device which comprises a base 1, two press blocks 3, two forming press plates 2 and two side plates 4, wherein the press blocks 3 are arranged above the base 1, the two forming press plates 2 are respectively symmetrically arranged along two sides of the length direction of the base 1, and the two side plates 4 are respectively arranged on two end sides of the base 1;
be equipped with resistance element standing groove 8 between clamp plate and the base 1, 8 levels of resistance element standing groove set up, resistance element standing groove 8 is a plurality of and sets up along 1 length direction of base, the bottom plate bilateral symmetry is equipped with lead wire groove 9, the vertical setting of lead wire groove 9, lead wire groove 9 is the multiunit and sets up along 1 length direction of base, and a set of lead wire groove 9 corresponds a resistance element standing groove 8. As shown in fig. 1.
The resistance element lead forming device provided by the invention forms a pressing cavity of the resistance element lead forming device through the structural shapes and sizes of the base 1, the forming press plate 2 and the pressing block 3. The size of the cavity formed by the base 1, the forming press plate 2 and the press block 3 during pressing is matched with the forming size of the element, so that the body and the lead 13 of the resistance element 12 are not damaged in the pressing process, the resistance element 12 can be fixed in a certain range, and the lead 13 of the resistance element can be formed into the required size and shape.
The invention relates to a preparation process of a selective wave soldering front end of a through hole plug-in component (resistor) in the field of electronic assembly, and designs a resistor component lead 13 forming device which can be used for quickly, stably, efficiently and safely in order to meet the requirements of product installation characteristics and selective wave soldering quality, so that the problem of selective wave soldering of resistor components 12 which are used in large quantities in a certain series of products is solved, and the productivity of a company is improved.
The invention is also suitable for forming other high-power axial resistance elements 12 using selective wave soldering, and the formed resistance elements 12 can effectively solve poor soldering caused by deflection, floating and the like of the elements in the selective wave soldering process.
Example 2:
the embodiment provides a resistor element lead forming device which comprises a base 1, two press blocks 3, two forming press plates 2 and two side plates 4, wherein the press blocks 3 are arranged above the base 1, the two forming press plates 2 are respectively symmetrically arranged along two sides of the length direction of the base 1, and the two side plates 4 are respectively arranged on two end sides of the base 1;
be equipped with resistance element standing groove 8 between clamp plate and the base 1, 8 levels of resistance element standing groove set up, resistance element standing groove 8 is a plurality of and sets up along 1 length direction of base, the bottom plate bilateral symmetry is equipped with lead wire groove 9, the vertical setting of lead wire groove 9, lead wire groove 9 is the multiunit and sets up along 1 length direction of base, and a set of lead wire groove 9 corresponds a resistance element standing groove 8.
The resistor element placing groove 8 comprises a first resistor element positioning groove 10 and a second resistor element positioning groove 11, the first resistor element positioning groove 10 is arranged at the bottom end of the pressing block 3, the second resistor element positioning groove 11 is arranged at the top end of the base 1, and two sides of the pressing block 3 are respectively connected with the two forming pressing plates 2.
The top of base 1 is equipped with resistance element constant head tank two 11, the lead wire groove is including straight groove and type groove 15, the bottom width of base 1 is less than the width at top. As shown in fig. 1, in this embodiment, the groove 15 is a semicircular groove, and the arc of the semicircular groove faces inward, and cooperates with the bump 14 to form a V-shape under the pressing action of the lead.
As shown in fig. 1, the first resistor positioning groove 10 and the second resistor positioning groove 11 cooperate to form a resistor placement groove 8, which is a positioning groove for the resistor 12, so that the body of the resistor 12 is not damaged during the pressing process, and the resistor 12 can be fixed within a certain range.
Example 3:
the embodiment provides a resistor element lead forming device which comprises a base 1, two press blocks 3, two forming press plates 2 and two side plates 4, wherein the press blocks 3 are arranged above the base 1, the two forming press plates 2 are respectively symmetrically arranged along two sides of the length direction of the base 1, and the two side plates 4 are respectively arranged on two end sides of the base 1;
be equipped with resistance element standing groove 8 between clamp plate and the base 1, 8 levels of resistance element standing groove set up, resistance element standing groove 8 is a plurality of and sets up along 1 length direction of base, the bottom plate bilateral symmetry is equipped with lead wire groove 9, the vertical setting of lead wire groove 9, lead wire groove 9 is the multiunit and sets up along 1 length direction of base, and a set of lead wire groove 9 corresponds a resistance element standing groove 8.
The resistor element placing groove 8 comprises a first resistor element positioning groove 10 and a second resistor element positioning groove 11, the first resistor element positioning groove 10 is arranged at the bottom end of the pressing block 3, the second resistor element positioning groove 11 is arranged at the top end of the base 1, and two sides of the pressing block 3 are respectively connected with the two forming pressing plates 2.
The top of the base 1 is provided with a second resistor element positioning groove 11, the lead grooves comprise a straight groove and a shaped groove 15, and the width of the bottom of the base 1 is smaller than that of the top.
Wherein, from last lug 14 and step 16 of being equipped with down on the shaping clamp plate 2, lug 14 and type groove 15 cooperation, step 16 meets with the less partial upper end of width of base 1.
As shown in fig. 1 and 5, the lead groove 9 is a placement groove for the lead 13, so as to ensure that the lead 13 is not damaged during the pressing process, and at the same time, the lead 13 can be molded into a desired size and shape. Wherein. The bump 14 is used for press-molding the lead 13 on both sides of the resistance element 12 when the molding platen 2 is pressed.
The invention has the advantages of simple and reasonable structure, accurate positioning, high forming efficiency, safe operation and convenient use, effectively reduces the forming problem of the resistance element lead 13 adopted by the product, and improves the forming efficiency of the resistance element 12. The forming device for the resistor element lead 13 can simultaneously perform synchronous, simultaneous and rapid forming on 10 resistor elements 12, the forming structure and the size are completely consistent, and the base 1 is provided with the resistor element lead 13 positioning groove which can fix the elements in a certain range to ensure the forming size and the forming structure of the resistor elements 12.
Example 4:
the embodiment provides a resistor element lead forming device which comprises a base 1, two press blocks 3, two forming press plates 2 and two side plates 4, wherein the press blocks 3 are arranged above the base 1, the two forming press plates 2 are respectively symmetrically arranged along two sides of the length direction of the base 1, and the two side plates 4 are respectively arranged on two end sides of the base 1;
be equipped with resistance element standing groove 8 between clamp plate and the base 1, 8 levels of resistance element standing groove set up, resistance element standing groove 8 is a plurality of and sets up along 1 length direction of base, the bottom plate bilateral symmetry is equipped with lead wire groove 9, the vertical setting of lead wire groove 9, lead wire groove 9 is the multiunit and sets up along 1 length direction of base, and a set of lead wire groove 9 corresponds a resistance element standing groove 8.
The resistor element placing groove 8 comprises a first resistor element positioning groove 10 and a second resistor element positioning groove 11, the first resistor element positioning groove 10 is arranged at the bottom end of the pressing block 3, the second resistor element positioning groove 11 is arranged at the top end of the base 1, and two sides of the pressing block 3 are respectively connected with the two forming pressing plates 2.
The top of base 1 is equipped with resistance element constant head tank two 11, and the both sides of base 1 are equipped with half slot 15, half slot 15's circular arc is inwards, and the bottom width of base 1 is less than the width at top. The forming press plate 2 is provided with a convex block 14 and a step 16 from top to bottom, the convex block 14 is matched with the semicircular groove 15 to form a V-shaped gap, and the step 16 is connected with the upper end of the part with smaller width of the base 1.
The lower part of the side plate 4 is fixedly connected with the base 1, and the upper part of the side plate 4 is connected with the pressing block 3 and the forming pressing plate 2.
The structural shapes and the sizes of the base 1, the forming press plate 2 and the pressing block 3 jointly form a cavity of the forming device of the lead 13 of the resistance element. The size of the cavity formed by the base 1, the forming press plate 2 and the press block 3 during pressing is matched with the forming size of the element, so that the body and the lead 13 of the resistance element 12 are not damaged in the pressing process, the resistance element 12 can be fixed in a certain range, and the lead 13 of the resistance element can be formed into the required size and shape. The overall structure of the resistor element 12 forming device is schematically shown in fig. 4.
The forming press plate 2 is connected with the press block 3 through the pin 6, the size between the forming press plate 2 and the base 1 is guaranteed by the connection and the limiting of the forming press plate 2 and the press block 3, and in consideration of the fact that a sufficient bending space is needed when the resistor element lead 13 is bent, the assembly size of the upper ends of the forming press plate 2 and the base 1 is designed to be slightly larger than the diameter of the lead 13.
The forming device of the resistance element 12 can simultaneously meet the requirement of one-step forming of the leads 13 of a plurality of resistance elements 12, and the formed structure and the formed size are completely the same. A resistor element 12 positioning groove is formed between the base 1 and the pressing block 3, so that the resistor element 12 can be fixed in a certain range, and the forming consistency of the resistor element 12 is ensured.
As shown in fig. 2 and 3, the side plate 4 is combined with the base 1 through a screw 7, and the side plate 4 and the pressing block 3 are positioned through a bolt 5, so that not only can the pressing block 3 and the base 1 be accurately aligned, but also the pressing positioning of the base 1 and the forming pressing plate 2 can be accurately ensured, and simultaneously, two modules can be smoothly and smoothly combined in the pressing process; just because two bolts 5 are as the location benchmark, effectively guaranteed by the shaping clamp plate 2 with base 1, briquetting 3 constitute resistance element 12 shaping cavity accurate, reliable all the time, can not be because dislocation damage component lead wire 13 or body.
Wherein, screw hole 18 is located the lower part of curb plate, and the bolt hole is located the upper portion centre of curb plate, and pin hole 19 is located the both sides in bolt hole.
Example 5:
the embodiment provides a method for forming a lead of a resistance element, which comprises the steps of forming a forming and pressing cavity of the lead 13 of the resistance element by using a forming device of the lead of the resistance element through a base 1, a forming press plate 2 and a press block 3, placing the resistance element 12 into the forming cavity of the lead 13 of the resistance element after accurate positioning, and pressing the forming press plate 2 to complete the forming of the lead 13 of the resistance element 12. The stitching process is shown in figure 5.
The operation is simple and safe, when in use, the resistor element 12 is only required to be placed into the lead 13 positioning groove, the forming assembly consisting of the pressing block 3 and the forming pressing plate is positioned by the bolts 5 at the two ends, the forming assembly is placed on the base 1, and the forming of the lead 13 of the resistor element 12 can be completed by pressing the forming pressing plate. The leads 13 on both sides of the resistor element 12 are formed in the same shape and size.
Example 6:
on the basis of embodiment 5, this embodiment provides a resistor element lead molding method, in which a resistor element 12 is placed in a resistor element placing groove 8, leads 13 at both ends of the resistor element 12 are placed in a lead groove 9, and a molding platen 2 is pressed to mold the leads 13 by compression.
During accurate positioning, the side plate 4 and the pressing block 3 are connected and positioned through the bolt 5, so that the pressing block 3 and the base 1 are aligned, and the pressing and positioning accuracy of the base 1 and the forming pressing plate 2 is ensured.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (10)
1. A resistance element lead wire forming device is characterized in that: the pressing device comprises a base (1), two pressing blocks (3), two forming pressing plates (2) and two side plates (4), wherein the pressing blocks (3) are arranged above the base (1), the two forming pressing plates (2) are respectively symmetrically arranged along the two sides of the length direction of the base (1), and the two side plates (4) are respectively arranged on the two end sides of the base (1);
be equipped with resistance element standing groove (8) between clamp plate and base (1), resistance element standing groove (8) level sets up, resistance element standing groove (8) just set up along base (1) length direction for a plurality of, the bottom plate bilateral symmetry is equipped with lead wire groove (9), lead wire groove (9) vertical setting, lead wire groove (9) just set up along base (1) length direction for the multiunit, and a set of lead wire groove (9) correspond one resistance element standing groove (8).
2. The resistance element lead wire forming apparatus according to claim 1, wherein: resistance element standing groove (8) include resistance element constant head tank one (10) and resistance element constant head tank two (11), briquetting (3) bottom is located in resistance element constant head tank one (10), base (1) top is located in resistance element constant head tank two (11), the both sides of briquetting (3) meet with two shaping clamp plates (2) respectively.
3. The resistance element lead wire forming apparatus according to claim 1, wherein: the top of base (1) is equipped with resistance element constant head tank two (11), the lead wire groove is including straight flute and type groove (15), the bottom width of base (1) is less than the width at top.
4. A resistance element lead wire forming apparatus according to claim 3, wherein: the forming press plate (2) is provided with a convex block (14) and a step (16) from top to bottom, the convex block (14) is matched with the groove (15), and the step (16) is connected with the upper end of the small width part of the base (1).
5. The resistance element lead wire forming apparatus according to claim 1, wherein: the lower part of the side plate (4) is fixedly connected with the base (1), and the upper part of the side plate (4) is connected with the pressing block (3) and the forming pressing plate (2).
6. A resistance element lead wire forming apparatus according to claim 3, wherein: the height of the profiled groove (15) is larger than 2.5 mm.
7. The resistance element lead wire forming apparatus according to claim 5, wherein: the forming press plate (2) is connected with the press block (3) through a pin (6), the side plate (4) is connected with the base (1) through a screw (7), and the side plate (4) is connected with the press block (3) through a bolt (5).
8. A method for forming a lead wire of a resistance element using the apparatus for forming a lead wire of a resistance element according to claim 4, wherein: a resistance element lead (13) forming pressing cavity is formed by the base (1), the forming pressing plate (2) and the pressing block (3), after accurate positioning, the resistance element (12) is placed into the resistance element lead (13) forming pressing cavity, the forming pressing plate (2) is pressed, and forming of the lead (13) of the resistance element (12) is completed.
9. The method of claim 8, wherein: the resistance element (12) is placed in the resistance element placing groove (8), the leads (13) at two ends of the resistance element (12) are placed in the lead groove (9), and the forming pressing plate (2) is pressed to enable the leads (13) to be pressed and formed.
10. The method of claim 8, wherein: during accurate positioning, the side plate (4) and the pressing block (3) are connected and positioned through the bolt (5), so that the pressing block (3) and the base (1) are aligned, and the pressing and positioning accuracy of the base (1) and the forming pressing plate (2) is ensured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010272975.5A CN111570661A (en) | 2020-04-09 | 2020-04-09 | Resistor element lead forming device and method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010272975.5A CN111570661A (en) | 2020-04-09 | 2020-04-09 | Resistor element lead forming device and method |
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| CN111570661A true CN111570661A (en) | 2020-08-25 |
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| CN202010272975.5A Pending CN111570661A (en) | 2020-04-09 | 2020-04-09 | Resistor element lead forming device and method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153643A (en) * | 1994-11-29 | 1996-06-11 | Matsushita Electric Ind Co Ltd | Lead wire forming device of foil-wound transformer |
| KR20090003658A (en) * | 2007-07-03 | 2009-01-12 | 주식회사 거성정밀 | Method for forming metalic linear member and mold assembly |
| CN204892802U (en) * | 2015-08-20 | 2015-12-23 | 张伟鑫 | Resistance pin line forming device |
| CN109500292A (en) * | 2018-12-29 | 2019-03-22 | 杭州易正科技有限公司 | A kind of molding machine of pin of ceramic capacitor |
| CN110961550A (en) * | 2019-12-30 | 2020-04-07 | 洛阳隆盛科技有限责任公司 | Axial component pin former |
-
2020
- 2020-04-09 CN CN202010272975.5A patent/CN111570661A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153643A (en) * | 1994-11-29 | 1996-06-11 | Matsushita Electric Ind Co Ltd | Lead wire forming device of foil-wound transformer |
| KR20090003658A (en) * | 2007-07-03 | 2009-01-12 | 주식회사 거성정밀 | Method for forming metalic linear member and mold assembly |
| CN204892802U (en) * | 2015-08-20 | 2015-12-23 | 张伟鑫 | Resistance pin line forming device |
| CN109500292A (en) * | 2018-12-29 | 2019-03-22 | 杭州易正科技有限公司 | A kind of molding machine of pin of ceramic capacitor |
| CN110961550A (en) * | 2019-12-30 | 2020-04-07 | 洛阳隆盛科技有限责任公司 | Axial component pin former |
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Application publication date: 20200825 |