CN111486655A - Constant temperature control method for semiconductor constant temperature box and semiconductor constant temperature box - Google Patents
Constant temperature control method for semiconductor constant temperature box and semiconductor constant temperature box Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/006—General constructional features for mounting refrigerating machinery components
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2400/00—General features of, or devices for refrigerators, cold rooms, ice-boxes, or for cooling or freezing apparatus not covered by any other subclass
- F25D2400/02—Refrigerators including a heater
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2600/00—Control issues
- F25D2600/06—Controlling according to a predetermined profile
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Abstract
The application discloses a semiconductor thermostat and a thermostatic control method. The method comprises the following steps: acquiring the current temperature in the box body; determining the absolute value of the difference between the current temperature and the set constant temperature target temperature; if the current temperature is higher than the constant temperature target temperature and the absolute value of the difference is lower than the set refrigeration mode selection threshold, adopting a first refrigeration mode to work, reducing the absolute value of the difference by controlling the semiconductor refrigeration piece to refrigerate, and controlling the refrigeration power of the semiconductor refrigeration piece to be reduced in the process of reducing the absolute value of the difference; if the current temperature is lower than the constant temperature target temperature and the absolute value of the difference is lower than the set heating mode selection threshold, the first heating mode is adopted to work, the absolute value of the difference is reduced by controlling the semiconductor chilling plates to heat, and the heating power of the semiconductor chilling plates is reduced in the process of reducing the absolute value of the difference. According to the semiconductor thermostat, the temperature can approach from a higher temperature or a lower temperature until the constant temperature target temperature is reached, and accurate temperature control of the semiconductor thermostat is achieved.
Description
Technical Field
The application relates to the technical field of semiconductor refrigerators, in particular to a constant temperature control method for a semiconductor thermostat and the semiconductor thermostat.
Background
Semiconductor refrigerators, also known as electronic refrigerators. The refrigerator is a product which is completely different from a common refrigerator in the refrigeration principle, and the refrigeration is realized by a semiconductor refrigeration piece through a high-efficiency annular double-layer heat pipe heat dissipation and conduction technology.
In the prior art, after the semiconductor refrigerator is started, the semiconductor refrigerating sheet can be automatically controlled to work and refrigerate at high power, so that the temperature is reduced to a normal working temperature preset by a manufacturer, and the semiconductor refrigerator is convenient for a user to use.
However, in practical applications, the above-mentioned working mode of the semiconductor refrigerator often causes the actual working temperature to oscillate at a large amplitude above or below the normal working temperature, thereby affecting the actual use effect of the semiconductor refrigerator.
Disclosure of Invention
The embodiment of the application provides a constant temperature control method for a semiconductor incubator and the semiconductor incubator, which are used for solving the following technical problems in the prior art: the working mode of the existing semiconductor refrigerator often enables the actual working temperature to vibrate in a large amplitude above and below the normal working temperature, so that the actual using effect of the semiconductor refrigerator is influenced.
The embodiment of the application adopts the following technical scheme:
the utility model provides a thermostatic control method for semiconductor incubator, semiconductor incubator includes the box, is used for sealing the chamber door of box, is used for detecting temperature sensor of temperature in the box, locate be used for the semiconductor refrigeration piece that refrigerates and heat in the box, control the semiconductor refrigeration piece refrigerate or the controller of work of heating, the method includes:
acquiring the current temperature in the box body;
determining the absolute value of the difference between the current temperature and the set constant temperature target temperature;
if the current temperature is higher than the constant temperature target temperature and the absolute value of the difference is lower than a set refrigeration mode selection threshold, adopting a first refrigeration mode to work, reducing the absolute value of the difference by controlling the semiconductor refrigeration piece to refrigerate in the first refrigeration mode, and controlling the refrigeration power of the semiconductor refrigeration piece to reduce in the process of reducing the absolute value of the difference;
if the current temperature is lower than the constant temperature target temperature and the absolute value of the difference is lower than a set heating mode selection threshold, adopting a first heating mode to work, reducing the absolute value of the difference by controlling the semiconductor chilling plates to heat in the first heating mode, and controlling the heating power of the semiconductor chilling plates to reduce in the process of reducing the absolute value of the difference.
Optionally, after determining an absolute value of a difference between the current temperature and the set constant temperature target temperature, the method further includes:
if the current temperature is higher than the constant temperature target temperature and the absolute value of the difference is not lower than the refrigeration mode selection threshold, adopting a second refrigeration mode to work, and reducing the absolute value of the difference by controlling the semiconductor refrigeration sheet to work at a fixed refrigeration power in the second refrigeration mode;
and if the current temperature is lower than the constant temperature target temperature and the absolute value of the difference is not lower than the heating mode selection threshold, adopting a second heating mode to work, and reducing the absolute value of the difference by controlling the semiconductor refrigerating sheet to work at a fixed heating power in the second heating mode.
Optionally, the fixed refrigeration power is the maximum refrigeration power which the controller can currently control the semiconductor refrigeration piece to reach;
the fixed heating power is the maximum heating power which can be currently controlled by the controller and reached by the semiconductor refrigeration sheet.
Optionally, in a process of decreasing the absolute value of the difference, controlling the cooling power of the semiconductor cooling plate to decrease includes:
in the process of reducing the absolute value of the difference, controlling the refrigerating power of the semiconductor refrigerating sheet to be reduced in a certain proportion with the absolute value of the difference;
in the process of reducing the absolute value of the difference value, controlling the heating power of the semiconductor chilling plate to be reduced, and the method comprises the following steps:
and in the process of reducing the absolute value of the difference, controlling the heating power of the semiconductor refrigerating sheet to be reduced in a certain proportion with the absolute value of the difference.
Optionally, the cooling power and the heating power are reduced by the controller controlling the operating voltage of the semiconductor cooling plate to be reduced.
Optionally, the controller controls the operating voltage of the semiconductor chilling plate to decrease, including:
the controller obtains the working voltage of the semiconductor refrigerating sheet;
controlling the working voltage according to the following formula to control the working power of the semiconductor refrigeration piece to be reduced in proportion to the absolute value of the difference value:
VCC represents the working voltage, VDD represents the maximum voltage which can be currently input into the semiconductor refrigeration chip, DeltaT represents the absolute value of the difference, and T represents the absolute value of the differencethresholdRepresents the cooling mode selection threshold or the heating mode selection threshold.
Optionally, the method further comprises:
the semiconductor refrigeration piece thermostat comprises a single key used for setting the constant temperature target temperature, and the semiconductor refrigeration piece thermostat enters a state in which the constant temperature target temperature can be set in response to a first operation on the single key, switches and selects between different selectable values in response to a second operation on the single key in the state, and sets the constant temperature target temperature according to the selected selectable value; or,
the semiconductor refrigeration piece thermostat comprises a plurality of keys for setting the constant temperature target temperature, responds to the appointed operation of a first key in the keys, enters a state in which the constant temperature target temperature can be set, responds to the appointed operation of a second key in the keys in the state, switches and selects between different selectable values, and sets the constant temperature target temperature according to the selected selectable value.
The utility model provides a semiconductor refrigeration piece thermostated container, includes the box, is used for sealing the chamber door of box, be used for detecting temperature sensor of temperature in the box, set up in be used for the semiconductor refrigeration piece that refrigerates and heat in the box, control the controller of semiconductor refrigeration piece work, semiconductor refrigeration piece thermostated container is used for carrying out foretell constant temperature control method.
Optionally, the temperature sensor is arranged opposite to the semiconductor refrigeration piece, and the refrigeration surface or the heating surface of the semiconductor refrigeration piece is arranged in a manner of being attached to the box body.
Optionally, the temperature sensor is disposed in the box body and located between a surface of the box door facing the inside of the box body and a horizontal center line of the box body in a top view.
The embodiment of the application adopts at least one technical scheme which can achieve the following beneficial effects: the temperature in the box body of the semiconductor thermostat can smoothly approach from a higher temperature or a lower temperature until reaching a constant temperature target temperature, so that the situation of temperature oscillation is favorably prevented, and the accurate temperature control of the semiconductor thermostat is realized; moreover, two user temperature control modes of single-key setting and multi-key setting are provided, so that the user can flexibly and conveniently set the constant temperature target temperature independently.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic diagram of a semiconductor incubator according to some embodiments of the present application;
FIG. 2 is a schematic flow chart of a method for thermostat control of a semiconductor incubator according to some embodiments of the present application;
fig. 3a is a detailed flowchart of the thermostatic control method of fig. 2 in an application scenario provided by some embodiments of the present application;
FIG. 3b is a schematic diagram illustrating a fine-tuning temperature control process of the process of FIG. 3a in an application scenario provided by some embodiments of the present application;
fig. 4 is a schematic single-key setting flow chart of the thermostat control method of fig. 2 in an application scenario according to some embodiments of the present disclosure;
fig. 5 is a schematic view of a multi-key setting flow chart of the thermostat control method of fig. 2 in an application scenario according to some embodiments of the present application;
FIG. 6 is a schematic diagram illustrating a position of a temperature sensor of the semiconductor incubator of FIG. 1 in an application scenario provided by some embodiments of the present application;
in the figure, 1 outer shell, 2 inner container, 3 temperature sensor, 4 heat-conducting metal block, 5 semiconductor refrigeration piece.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 is a schematic structural view of a semiconductor oven according to some embodiments of the present application. The semiconductor thermostat comprises a box body, a box door used for sealing the box body, a temperature sensor used for detecting the temperature in the box body, a semiconductor refrigerating sheet arranged in the box body for refrigerating and heating, and a controller used for controlling the semiconductor refrigerating sheet to refrigerate or heat. The semiconductor thermostat can realize refrigeration and heating by controlling the work of the semiconductor refrigerating piece, and is not just refrigeration like a semiconductor refrigerator in the prior art, so that the semiconductor thermostat provided by the application can actively and efficiently adjust and change the constant temperature target temperature no matter which end of the upper end and the lower end (namely the end with higher temperature and the end with lower temperature) of the constant temperature target temperature is, and is beneficial to more reliably reaching and keeping the constant temperature target temperature as far as possible.
The problem of temperature oscillation is mentioned in the background art, and one specific reason is that: at present, a Negative Temperature Coefficient (NTC) thermistor is often adopted for a Temperature sensor to realize Temperature detection, and the NTC-based detection mode has obvious hysteresis, so that the problem of Temperature overshoot is easily caused, and the actual Temperature oscillates above and below a target Temperature in a large amplitude. In order to solve the problems of the background art, the scheme of the application utilizes the semiconductor refrigerating sheet for refrigerating and heating, and a strong regulation mode and a fine regulation mode can be adopted no matter which end is used for regulating the temperature from the upper end and the lower end of the constant temperature target temperature, so that the actual temperature is efficiently and smoothly approached until the constant temperature target temperature is reached. In the following examples, the solution of the present application is explained in detail mainly based on the semiconductor oven of fig. 1.
Fig. 2 is a schematic flow chart of a method for controlling a temperature of a semiconductor oven according to some embodiments of the present disclosure.
The process in fig. 2 comprises the following steps:
s200: and acquiring the current temperature in the box body. The current temperature, i.e. the actual temperature mentioned above, is determined by the temperature sensor detection.
S202: and determining the absolute value of the difference between the current temperature and the set constant temperature target temperature.
S204: if the current temperature is higher than the constant temperature target temperature and the absolute value of the difference is lower than a set refrigeration mode selection threshold, a first refrigeration mode is adopted for working, in the first refrigeration mode, the absolute value of the difference is reduced by controlling the semiconductor refrigeration piece to refrigerate, and in the process of reducing the absolute value of the difference, the refrigeration power of the semiconductor refrigeration piece is controlled to be reduced.
S206: if the current temperature is lower than the constant temperature target temperature and the absolute value of the difference is lower than a set heating mode selection threshold, adopting a first heating mode to work, reducing the absolute value of the difference by controlling the semiconductor chilling plates to heat in the first heating mode, and controlling the heating power of the semiconductor chilling plates to reduce in the process of reducing the absolute value of the difference.
In some embodiments of the present application, the semiconductor chilling plates are actively controlled to cool or heat accordingly according to the magnitude relationship between the current temperature and the constant temperature target temperature, so as to efficiently adjust towards the constant temperature target temperature. The first cooling mode and the first heating mode both belong to the above-described fine adjustment method, and the cooling power or the heating power of the semiconductor cooling fins is controlled to be reduced in the process of reducing the absolute value of the difference, so that the change speed of the current temperature can be slowed down, the adverse effect caused by the hysteresis of the temperature detection can be reduced, and the possibility of temperature overshoot can be reduced.
Further, under the condition that the current temperature is far away from the constant temperature target temperature (namely the absolute value of the difference is large), if the whole course adopts a fine adjustment mode, the temperature adjustment efficiency can be influenced, on the basis, the threshold is selected in a refrigeration mode and a heating mode to accurately define whether the current temperature is far away from the constant temperature target temperature, if the absolute value of the difference is larger than the corresponding threshold, the current temperature is considered to be far away, under the condition, a powerful adjustment mode can be adopted, the semiconductor refrigeration piece is controlled to rapidly change the current temperature, the absolute value of the difference is rapidly reduced to reach the corresponding threshold, and then the fine adjustment mode can be switched.
Based on this, for step S202, if the current temperature is greater than the constant temperature target temperature and the absolute value of the difference is not less than the refrigeration mode selection threshold, the second refrigeration mode is adopted, and in the second refrigeration mode, the absolute value of the difference is reduced by controlling the semiconductor refrigeration sheet to operate at a fixed refrigeration power; and if the current temperature is lower than the constant temperature target temperature and the absolute value of the difference is not lower than the heating mode selection threshold, adopting a second heating mode to work, and reducing the absolute value of the difference by controlling the semiconductor refrigerating sheet to work at a fixed heating power in the second heating mode. The fixed cooling power and the fixed heating power may be relatively large power to improve the temperature regulation efficiency, and in this case, the second cooling mode and the second heating mode may be operated in the above-described forced regulation manner. For example, the fixed refrigeration power is the maximum refrigeration power that the controller can currently control the semiconductor refrigeration chip to reach; the fixed heating power is the maximum heating power which can be currently controlled by the controller.
From the actual temperature change effect, in the strong regulation mode, the current temperature changes faster or even steeply, while in the fine regulation mode, the current temperature may slowly and smoothly change slowly.
The specific mode of fine adjustment mode is various, can control the refrigeration power or the heating power of semiconductor refrigeration piece and reduce in succession, also can step-like reduction, and specific decrement is also variable.
In order to make the change curve of the current temperature in the fine adjustment mode smoother, the reduction amount may be adjusted in proportion to a reference, based on a parameter having a reference function, such as the absolute value of the difference or the current temperature. For example, in the first refrigeration mode, in the process of reducing the absolute value of the difference, the refrigeration power of the semiconductor refrigeration sheet is controlled to be reduced in a certain proportion to the absolute value of the difference; in the first heating mode, in the process of reducing the absolute value of the difference, the heating power of the semiconductor refrigerating sheet is controlled to be reduced in a certain proportion to the absolute value of the difference.
The control of power is also diversified, and mainly includes controlling the operating voltage and/or the operating current. For example, in an application scenario, in consideration of convenience of voltage regulation and low cost, the controller mainly controls the reduction of the working voltage of the semiconductor chilling plate, so that the cooling power or the heating power of the semiconductor chilling plate is reduced.
For convenience of understanding, some embodiments of the present application further provide a detailed flow chart of the thermostatic control method in fig. 2 and a detailed flow chart of a fine adjustment temperature control in the detailed flow chart in an application scenario, which are respectively shown in fig. 3a and fig. 3 b. The following is an exemplary description of the steps of the flow in fig. 3a, 3 b.
The controller reads the set constant temperature target temperature T1And Tthreshold，TthresholdIndicates the cooling mode selection threshold (denoted as Δ T)1Positive number) or heating mode selection threshold (denoted as Δ T)2Positive number) detected by the temperature sensor, and recorded as T2。
The maximum voltage which can be input into the semiconductor refrigerating chip at present is recorded as VDD, and the current working voltage of the semiconductor refrigerating chip is recorded as VCC.
Δ T represents the absolute value of the difference. More specifically: let T be2Greater than T1Taking T2-T1Is denoted as Δ T3If Δ T3＞ΔT1Then, a strong regulation mode is adopted to carry out strong refrigeration, and if delta T is adopted3＜ΔT1A fine adjustment mode is adopted, and the refrigeration is more gradual; let T be1Greater than T2Taking T1-T2Is denoted as Δ T4If Δ T4＞ΔT2Then, a strong regulation mode is adopted to perform strong heating, and if delta T is adopted4＜ΔT2A fine adjustment is used to more gently heat.
In fig. 3b, the current operating voltage of the semiconductor chilling plate is specifically controlled (for example, the operating voltage is controlled to be high or low or to be turned on or off according to the temperature control ratio) according to the following formula, so that the current operating power of the semiconductor chilling plate is controlled to be reduced by a certain ratio with the absolute value of the difference value:
continuing to both the cooling and heating cases, equation one is illustrated.
The scheme of temperature unlimited approximation is adopted in the figure according to delta T1、ΔT2、ΔT3、ΔT4Calculating the temperature control ratio of refrigeration and heating, and recording the ratio as
During the fine adjustment phase, Δ T3＜ΔT1，ΔT4＜ΔT2Thus, 0 < t1＜1，0＜t2Is less than 1. The closer the current temperature is to the constant temperature target temperature, the more the Δ T3、ΔT4The smaller the temperature control ratio t1、t2The smaller the sum, the smaller the formula one is substituted into VCC ═ t1*VDD、VCC＝t2VDD, VCC change is correspondingly controlled according to a formula, then VCC is smaller and smaller, and when the difference value is delta T3、ΔT4Infinite approximation to 0, t1、t2And also infinitely approaches 0, and VCC also infinitely approaches 0. The continuously-variable control scheme enables the temperature to approach the constant-temperature target temperature smoothly as far as possible, and the problem of temperature overshoot is not easy to occur.
It should be noted that, based on the temperature control ratio, a formula one may be further improved, for example, an offset coefficient term is added, a quadratic term of the temperature control ratio is adopted, and the like, so that the temperature change curve translates or the curvature changes, and the like, as long as the idea of the present application is met, and the effect required in practical application can be achieved.
In some embodiments of the present application, the constant temperature target temperature may be set autonomously by the user on the semiconductor incubator, and in fig. 3a, the step of detecting a key is also exemplarily illustrated, on the basis of which the user may set T1And then resetting T1. The single-key setting mode and the multi-key setting mode are provided, the single-key setting mode has the advantages of material saving, low cost and contribution to improving the simplicity of the control panel of the semiconductor incubator, and the multi-key setting mode has the advantages of convenience for user operation and difficulty in misoperation.
In the single-key setting mode, the semiconductor chilling plate thermostat comprises a single key for setting a constant temperature target temperature, and in response to a first operation on the single key, a state in which the constant temperature target temperature can be set is entered, in which a selection is switched between different selectable values in response to a second operation on the single key, and the constant temperature target temperature is set according to the selected selectable value.
For example, fig. 4 is a schematic single-key setting flow chart of the thermostat control method in fig. 2 in an application scenario provided by some embodiments of the present application. In fig. 4, a single key is a temperature setting key, the first operation is a long-time pressing operation, the second operation is a pressing operation, after the long-time pressing of the temperature setting key, the temperature setting key is pressed each time within a certain time (within a set temperature time, corresponding indication can be performed through an indicator lamp), that is, each temperature can be selected in a preset temperature range in a circulating manner, and if the time is up, the setting is completed, and the set constant temperature target temperature is the currently selected temperature.
In the multi-key setting mode, the semiconductor chilling plate thermostat comprises a plurality of keys for setting a constant temperature target temperature, and in response to a specified operation of a first key of the plurality of keys, a state in which the constant temperature target temperature can be set is entered, in which a selection is switched between different selectable values in response to a specified operation of a second key of the plurality of keys, and the constant temperature target temperature is set according to the selected selectable value.
For example, fig. 5 is a schematic view of a multi-key setting flow chart of the thermostat control method in fig. 2 in an application scenario provided by some embodiments of the present application. In fig. 5, the first button is a temperature setting button, the designated operation is a pressing operation, the second button is a temperature increasing and decreasing button, the temperature increasing and decreasing button at least comprises two buttons for increasing and decreasing the temperature, the temperature increasing and decreasing button is pressed within a certain time (within a set temperature time, corresponding indication can be provided through an indicator lamp) each time after the temperature setting button is pressed, the temperature is increased or decreased, if the time is up, the setting is completed, and the set constant temperature target temperature is the temperature where the temperature is increased or decreased.
In practical application, the reliability of the current temperature measured by the temperature sensor has a large influence on the temperature control effect, and on the basis, in some embodiments of the application, the setting position of the temperature sensor is selected to detect more reliable temperature. Specifically, the temperature sensor and the semiconductor refrigerating sheet can be arranged oppositely, and the refrigerating surface or the heating surface of the semiconductor refrigerating sheet is arranged in a manner of being attached to the box body, so that the temperature sensor can detect the heating or heating effect change of the semiconductor refrigerating sheet more quickly, and the hysteresis of the temperature sensor is reduced; in addition, it is not suitable if the temperature sensor is too close to the semiconductor refrigeration piece, because, other spaces in the box body are farther from the semiconductor refrigeration piece, the refrigeration and heating effects brought by the semiconductor refrigeration piece are reduced, and the temperature detected by the temperature sensor is difficult to reflect the temperature condition of the whole box body.
More intuitively, some embodiments of the present application provide a schematic diagram of the location of the temperature sensor of the semiconductor oven of fig. 1 in an application scenario, as shown in fig. 6.
Fig. 6 is a plan view of the semiconductor oven, in which some parts of the semiconductor oven are marked, and includes a housing 1, an inner container 2, a temperature sensor 3, a heat-conductive metal block 4, and a semiconductor cooling plate 5. The box door is on the left side in the drawing, the semiconductor refrigeration piece 5 is on the right side in the drawing and is arranged behind the box body, a heat conduction metal block 4 (such as an aluminum block) is further arranged on the left side of the semiconductor refrigeration piece behind the box body in the drawing and is used for conducting temperature for the semiconductor refrigeration piece 5 more efficiently, the oblique line shadow part is a setting area of the temperature sensor 3, h represents the height of the setting area, l represents the horizontal central line of the box body, and it can be seen that the positions of the temperature sensor 3 and the semiconductor refrigeration piece 5 are opposite and are specifically positioned in the left side of the central line of the box body in the drawing and the right side of the seam of the shell.
The embodiments in the present application are described in a progressive manner, and the same and similar parts among the embodiments can be referred to each other, and each embodiment focuses on the differences from the other embodiments.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. The utility model provides a thermostatic control method for semiconductor incubator, semiconductor incubator includes the box, is used for sealing the chamber door of box, is used for detecting temperature sensor of temperature in the box, locate be used for the semiconductor refrigeration piece that refrigerates and heat in the box, control the semiconductor refrigeration piece refrigerates or heats the controller of work, its characterized in that, the method includes:
acquiring the current temperature in the box body;
determining the absolute value of the difference between the current temperature and the set constant temperature target temperature;
if the current temperature is higher than the constant temperature target temperature and the absolute value of the difference is lower than a set refrigeration mode selection threshold, adopting a first refrigeration mode to work, reducing the absolute value of the difference by controlling the semiconductor refrigeration piece to refrigerate in the first refrigeration mode, and controlling the refrigeration power of the semiconductor refrigeration piece to reduce in the process of reducing the absolute value of the difference;
if the current temperature is lower than the constant temperature target temperature and the absolute value of the difference is lower than a set heating mode selection threshold, adopting a first heating mode to work, reducing the absolute value of the difference by controlling the semiconductor chilling plates to heat in the first heating mode, and controlling the heating power of the semiconductor chilling plates to reduce in the process of reducing the absolute value of the difference.
2. A method of thermostatic control for a semiconductor chilling plate oven as set forth in claim 1, wherein upon determining an absolute value of a difference between said current temperature and a set constant temperature target temperature, said method further comprises:
if the current temperature is higher than the constant temperature target temperature and the absolute value of the difference is not lower than the refrigeration mode selection threshold, adopting a second refrigeration mode to work, and reducing the absolute value of the difference by controlling the semiconductor refrigeration sheet to work at a fixed refrigeration power in the second refrigeration mode;
and if the current temperature is lower than the constant temperature target temperature and the absolute value of the difference is not lower than the heating mode selection threshold, adopting a second heating mode to work, and reducing the absolute value of the difference by controlling the semiconductor refrigerating sheet to work at a fixed heating power in the second heating mode.
3. The thermostatic control method for semiconductor chilling plate thermostats as claimed in claim 2, characterized in that the fixed refrigeration power is the maximum refrigeration power that the controller can currently control the semiconductor chilling plates to;
the fixed heating power is the maximum heating power which can be currently controlled by the controller and reached by the semiconductor refrigeration sheet.
4. The method of claim 1, wherein controlling the cooling power of the semiconductor chilling plate to decrease during the decrease in the absolute value of the difference comprises:
in the process of reducing the absolute value of the difference, controlling the refrigerating power of the semiconductor refrigerating sheet to be reduced in a certain proportion with the absolute value of the difference;
in the process of reducing the absolute value of the difference value, controlling the heating power of the semiconductor chilling plate to be reduced, and the method comprises the following steps:
and in the process of reducing the absolute value of the difference, controlling the heating power of the semiconductor refrigerating sheet to be reduced in a certain proportion with the absolute value of the difference.
5. A thermostat control method for a semiconductor chilling plate thermostat according to claim 4, wherein the cooling power and the heating power are reduced by the controller controlling the operating voltage of the semiconductor chilling plate to be reduced.
6. The method of claim 5, wherein the controller controlling the operating voltage of the semiconductor chilling plate to decrease comprises:
the controller obtains the working voltage of the semiconductor refrigerating sheet;
controlling the working voltage according to the following formula to control the working power of the semiconductor refrigeration piece to be reduced in proportion to the absolute value of the difference value:
VCC represents the working voltage, VDD represents the maximum voltage which can be currently input into the semiconductor refrigeration chip, DeltaT represents the absolute value of the difference, and T represents the absolute value of the differencethresholdRepresents the cooling mode selection threshold or the heating mode selection threshold.
7. A method of thermostatically controlling as claimed in any of claims 1 to 6, characterized in that the method further comprises:
the semiconductor refrigeration piece thermostat comprises a single key used for setting the constant temperature target temperature, and the semiconductor refrigeration piece thermostat enters a state in which the constant temperature target temperature can be set in response to a first operation on the single key, switches and selects between different selectable values in response to a second operation on the single key in the state, and sets the constant temperature target temperature according to the selected selectable value; or,
the semiconductor refrigeration piece thermostat comprises a plurality of keys for setting the constant temperature target temperature, responds to the appointed operation of a first key in the keys, enters a state in which the constant temperature target temperature can be set, responds to the appointed operation of a second key in the keys in the state, switches and selects between different selectable values, and sets the constant temperature target temperature according to the selected selectable value.
8. A semiconductor refrigeration piece incubator comprises a box body, a box door used for sealing the box body, a temperature sensor used for detecting the temperature in the box body, a semiconductor refrigeration piece arranged in the box body and used for refrigerating and heating, and a controller used for controlling the semiconductor refrigeration piece to work, and is characterized in that the semiconductor refrigeration piece incubator is used for executing the constant temperature control method in any one of the claims 1-7.
9. The semiconductor chilling plate incubator according to claim 8, wherein the temperature sensor is disposed opposite to the semiconductor chilling plate, and the chilling surface or the heating surface of the semiconductor chilling plate is disposed in close contact with the oven body.
10. The semiconductor chilling plate incubator of claim 9, wherein the temperature sensor is disposed within the enclosure between a surface of the door facing the enclosure and a horizontal centerline of the enclosure from a top view.
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